JPH10323985A - Ink jet head, manufacture thereof, ink jet head cartridge, and ink jet recorder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform hermetic seal of a common liquid chamber easily and stably even for a reduced silicon substrate by making a groove for sealing the face being bonded to a substrate by internally filling with a sealant in the walls of the common liquid chamber located at the opposite ends in the arranging direction thereof. SOLUTION: A recess 180 in a grooved top plate 200 provides a common liquid chamber when the grooved top plate 200 is bonded to a silicon substrate 190 and an orifice plate 160 is provided with a plurality of jet ports 105 communicated through respective ink channels 100 with the recess 180. On the other hand, a sealing groove 312 extending from the forward end to the rear end of the orifice plate 160 is made in the face of a common liquid chamber wall 310 being bonded to the silicon substrate 190. When a sealant 171 is applied onto the silicon substrate 190, the sealant intrudes into the sealing groove 312 from a sealant injection port at the rear end of the grooved top plate 200 and being held in a through hole 120 thus sealing the common liquid chamber wall 310 and the silicon substrate 190 hermetically.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink-jet head used in an ink-jet apparatus for performing recording by ejecting a recording liquid (ink or the like) from an ejection port as flying droplets and attaching the liquid to a recording medium. The present invention relates to a method of manufacturing the same, an ink jet head cartridge using the same head, and an ink jet recording apparatus using the same cartridge, and more particularly to an ink jet head for color printing, a method of manufacturing the same, an ink jet head cartridge, and an ink jet recording apparatus.

[0002]

2. Description of the Related Art A conventional ink jet head is shown in FIG.
Ink is ejected as shown in FIG. 15 (a perspective view of the same head viewed from the side opposite to the ink ejection port) and FIG. 15 (a perspective view of the grooved top plate in FIG. 1 seen from the bonding surface side with the silicon substrate). A plurality of discharge ports (not shown) and a concave portion 180 serving as a common liquid chamber for temporarily holding ink supplied to each discharge port
And a groove (ink flow path) that communicates the common liquid chamber with each discharge port
The silicon substrate 191 on which an electrothermal converter (not shown) for applying ejection energy to the ink in the ink flow path is formed corresponding to each ink flow path is joined to the grooved top plate 200 in which is formed. It is configured. Reference numeral 260 denotes an ink supply port for supplying ink to the common liquid chamber;
Is an orifice plate.

Further, a drive circuit for driving the electrothermal transducer is built in the silicon substrate 191, and the drive circuit includes an electric connection portion (wire bonding pad) formed at an end of the silicon substrate 191. 22
0). And silicon substrate 1
Reference numeral 91 is bonded to an aluminum plate 210 for radiating heat of the silicon substrate 191 with an adhesive having good thermal conductivity. A wiring board 250 for relaying signals between the drive circuit and the ink jet recording apparatus is fixed to the aluminum plate 210. The terminals of the wiring board 250 and the wire bonding pads 2 of the silicon substrate 191 are fixed.
20 is electrically connected through a bonding wire (connection member) 230.

The ink jet head thus configured can be mass-produced at low cost and stably. However, the silicon substrate 191 formed mainly by using a semiconductor process has a high cost ratio, and thus is particularly noted as a cost reduction target. Therefore, as shown in FIG. 17, a silicon substrate 190 smaller than 191 of FIG.
Recently, recording heads using the same have begun to be mass-produced.

This is because the drive circuit and the like formed on the silicon substrate 190 can be greatly reduced by recent device design technology and manufacturing process technology. For example, in the example in which the electrothermal converter is arranged as shown in FIG. 18, the width D of the silicon substrate in FIG. 18A is reduced to the width E in FIG. 18B, and the length L is also shown in FIG. Length A determined by the printing resolution and the number of printing nozzles shown in (a)
Are the same, but the lengths B1,
B2 is reduced to marginal lengths C1 and C2, respectively, as shown in FIG. As a result, 5
The number of silicon substrates taken from an inch-size wafer has more than doubled, and the cost of the silicon substrate 190 can be reduced to half or less.

[0006]

As described above, a silicon substrate in which an electrothermal converter or the like is formed as an ink discharge energy generating element can be considerably reduced in size.

However, in the ink jet head of the above-described form, that is, a recording head of a form in which a grooved top plate is joined to a silicon substrate, the silicon substrate and the silicon substrate are formed in order to be inexpensive and stably mass-produced. After aligning the grooved top plate, mechanically fixing it with a holding spring, etc., filling the gap between the silicon substrate and the grooved top plate with a sealant, and sealing to prevent ink from leaking out It is carried out.

Conventionally, in this sealing process, the coating protection of the bonding wires 230 connecting the silicon substrate 191 and the wiring substrate 250 and the orifice plate 160
To collectively seal the gap between the back surface of the aluminum plate 210 and the aluminum plate 210 and the sealing of the connection between the ink supply port 260 provided in the grooved top plate 200 and the upstream ink supply member. It is common to inject an amount of 0.5 g of sealant (silicone sealant) after assembling the head.

[0009] However, the above sealing process has the following problems.

That is, in the conventional silicon substrate 191 as shown in FIG. 18A, due to the drive circuit in which the lengths B1 and B2 from the substrate side surface to the effective element are formed,
There is at least 1.5 mm. Therefore, the length from the common liquid chamber wall 310 of the grooved top plate 200 joined to the silicon substrate 191 to the ink flow path 100 is also equivalent to the lengths B1 and B2 as shown in FIG. For this reason, wall 3
A dummy nozzle 110 not directly involved in ejection is provided between the ink jet flow path 10 and the ink flow path 100.

However, in the reduced silicon substrate 190 as shown in FIG. 18B, the lengths C1 and C2 are 0.5 m.
m or less. For this reason, when the sealing agent such as 0.1 g to 0.5 g is injected as described above, the sealing agent cannot be used unless the process environment such as the physical properties, temperature, and humidity of the sealing agent is precisely controlled. In some cases, the sealant has flowed into the flow channel and filled reliably between the silicon substrate 190 and the common liquid chamber wall 310, and the sealant cannot be sealed.

When the sealant flows into the ink flow path, normal ink discharge is not performed, and in the worst case, the ink flow path is blocked and ink is not discharged. In order to avoid this, a method of ensuring the sealing between the common liquid chamber wall and the silicon substrate with a small amount of a sealing agent may be considered. However, the common liquid chamber wall 310 is
0, there is a step of about 0.5 mm between the aluminum plate 210 and the thickness of the silicon substrate 190. For this reason, the sealing agent may flow out of the substrate and cannot enter between the wall 310 and the silicon substrate 190 and may not be sealed.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the related art, and has a form in which a joint surface between a substrate and a common liquid chamber wall of a grooved top plate is close to an ink discharge port.
For example, even in the case of a form using a reduced silicon substrate, the common liquid chamber can be easily and stably and reliably sealed. It is an object of the present invention to provide a manufacturing method thereof, an ink jet head cartridge having the same head, and an ink jet recording apparatus provided with the cartridge.

[0014]

The ink jet head provided by the present invention is as described in the following (1) to (10).

(1) A substrate on which a plurality of energy generating elements for generating energy for discharging ink are arranged in parallel, an orifice plate having a plurality of discharge ports for discharging ink, and supply to each of the discharge ports At least one recess forming a wall of at least one common liquid chamber for temporarily holding the ink to be applied, and each of the discharge ports and the at least one recess are disposed at a position corresponding to each of the energy generating elements. And a grooved top plate having a plurality of ink flow paths for communicating with the common liquid chamber. The walls of the common liquid chamber located at both ends in the direction in which the common liquid chambers are arranged have a sealant inside the joint surface with the substrate. An ink jet head having a sealing groove for sealing the joining surface by filling the space.

(2) In the ink jet head according to the above (1), the common liquid chamber and the sealing groove each have a dummy nozzle group which reaches the orifice plate in communication with each other. An ink jet head, wherein at least a height of a portion of the dummy nozzle communicating with the sealing groove, which is in contact with the sealing groove, is substantially equal to a height of the sealing groove.

(3) In the ink jet head according to the above (1), the common liquid chamber and the sealing groove have a dummy nozzle group which reaches each of the orifice plates in communication with the common liquid chamber and the sealing groove. The difference between the height, width, and cross-sectional area of the portion of the communicating dummy nozzle that contacts the sealing groove, and the difference between the height, width, and cross-sectional area of the tip portion of the sealing groove are each 20.
% Of the ink jet head.

(4) In the ink jet head according to any one of the above (1) to (3), among the dummy nozzles, an area of a cross section of a dummy nozzle in contact with the wall is adjacent to the ink flow path side. An ink jet head having a smaller cross-sectional area than a dummy nozzle.

(5) In the ink jet head according to any one of the above (1) to (4), at a boundary surface between the dummy nozzle contacting the wall and the wall, at least a common liquid among the dummy nozzles contacting the wall is provided. Between the inner wall of the dummy nozzle on the side where the chamber is located and the inner wall on the side where the common liquid chamber is located among the walls forming the sealing groove;
An ink jet head having a gap of 0 μm or more.

(6) In the ink jet head according to any one of the above (1) to (5), a fluid resistance element is provided in the ink flow path, and the dummy nozzle communicating with the sealing groove includes: An inkjet head having no structure corresponding to a fluid resistance element.

(7) In the ink jet head according to the above (6), the dummy nozzle adjacent to the ink flow path side does not have a structure corresponding to the fluid resistance element.

(8) In the ink jet head according to any one of (1) to (7), the orifice plate has a through hole communicating with the sealing groove via the dummy nozzle, and a through hole. And a groove communicating with the dummy nozzle.

(9) The ink jet head according to any one of the above (1) to (8), wherein the number of the common liquid chamber is only one.

(10) The ink jet head according to any one of the above (1) to (9), wherein the energy generating element is an electrothermal converter.

The method of manufacturing an ink jet head provided by the present invention is as described in the following (1) to (14).

(1) A substrate on which a plurality of energy generating elements for generating energy for discharging ink are arranged in parallel, an orifice plate having a plurality of discharge ports from which ink is discharged, and supplied to each of the discharge ports And at least one recess forming a wall of at least one common liquid chamber for temporarily holding ink, and disposed at a position corresponding to each of the energy generating elements; In a method of manufacturing an ink jet head for bonding a grooved top plate having a plurality of ink flow paths for communicating with a common liquid chamber, a common liquid chamber wall is provided on a joint surface of the common liquid chamber wall and a substrate located at both ends in the direction of arrangement of the common liquid chamber. The portion of the dummy nozzle communicating with the sealing groove, which is in contact with the sealing groove,
So that its height is almost equal to the height of the sealing groove,
A method for manufacturing an ink jet head, wherein the method is performed by laser engraving.

(2) In the method of manufacturing an ink jet head according to the above (1), the dummy communicating with the sealing groove provided on the joint surface with the substrate of the wall located at both ends in the direction in which the common liquid chambers are arranged. A height, a width, and a cross-sectional area of a portion of the nozzle in contact with the sealing groove, and a difference between a height, a width, and a cross-sectional area of a tip portion of the sealing groove within 20%, respectively. Method.

(3) In the method of manufacturing an ink jet head according to the above (1) or (2), among the respective dummy nozzles, the area of the cross section of the dummy nozzle in contact with the wall is adjacent to the ink flow path side. Forming a dummy nozzle having a smaller cross-sectional area than a cross-sectional area of the dummy nozzle.

(4) In the method for manufacturing an ink-jet head according to any one of the above (1) to (3), at a boundary surface between the dummy nozzle contacting the wall and the wall, the dummy nozzle contacting the wall may be used. A gap of 10 μm or more is provided between at least the inner wall of the dummy nozzle on the side where the common liquid chamber is located and the inner wall on the side where the common liquid chamber is located among the walls forming the sealing groove. Of manufacturing an inkjet head.

(5) In the method of manufacturing an ink jet head according to any one of the above (1) to (4), a dummy nozzle provided with a fluid resistance element in the ink flow path and communicating with the sealing groove is provided. And a method for manufacturing an ink jet head, wherein a structure corresponding to the fluid resistance element is not provided.

(6) The method for manufacturing an ink jet head according to the above (5), wherein the dummy nozzle in contact with the ink flow path does not have a structure corresponding to the fluid resistance element. .

(7) In the method of manufacturing an ink jet head according to any one of the above (1) to (6), the orifice plate includes a through hole communicating with the sealing groove through the dummy nozzle. A method for manufacturing an ink jet, comprising forming the through hole and a groove communicating with a dummy nozzle.

(8) The method for manufacturing an ink jet head according to any one of the above (1) to (7), wherein a plurality of common liquid chambers are provided, and inks of different densities or colors are supplied to each of the common liquid chambers. Of manufacturing an inkjet head.

(9) The method for manufacturing an ink jet head according to any one of the above (1) to (8), wherein an electrothermal transducer is used as the energy element.

(10) In the method for manufacturing an ink jet head according to any one of the above (5) to (9),
A method for manufacturing an ink jet head, wherein a structure corresponding to the fluid resistance element is removed by a laser.

(11) In the method of manufacturing an ink jet head according to any one of the above (1) to (10), the laser processing is performed simultaneously with the laser processing for forming the discharge port performed on the orifice plate. A method for manufacturing an ink jet head.

(12) In the method of manufacturing an ink jet head according to any one of the above (7) to (11), the through hole and the ink flow path are processed using a laser and correspond to the fluid resistance element. A method for manufacturing an ink-jet head, wherein the method is performed simultaneously with the removal of the structure or the formation of the discharge port.

(13) The method for manufacturing an ink jet head according to any one of the above (1) to (12), wherein the laser processing uses an excimer laser.

(14) The method for manufacturing an ink jet head according to any one of the above (1) to (13), wherein the top plate is formed by injection molding.

Further, an ink jet head cartridge provided by the present invention includes the above ink jet head and a liquid storage container for holding ink to be supplied to the ink jet head.

An ink jet recording apparatus provided by the present invention includes the above ink jet head cartridge, and performs recording by discharging ink from the discharge port of the ink jet head based on a recording signal.

[0042]

In the ink jet head of the present invention configured as described above, the joint surface with the substrate of the grooved top plate in which the concave portion and the ink flow path connecting the discharge port and the concave portion are formed as the common liquid chamber. A sealing groove is provided in the common liquid chamber and at least a side end of the common liquid chamber is sealed by filling the inside of the sealing groove with a sealing agent after joining the grooved top plate and the substrate. Since the height of the rear part of the dummy nozzle communicating with the sealing groove of the grooved top plate is almost the same as the height of the sealing groove, the height from the sealant inlet at the rear end of the grooved top plate to the orifice plate at the front end Entrance of the sealant is performed smoothly all the way.

Thereafter, if a conventional sealing process for protecting the covering of the bonding wire and sealing the back surface of the orifice plate and the aluminum plate is performed, the space between the common liquid chamber wall and the silicon substrate is already sealed. As described in the related art, the problem that the sealant reaches the ink flow path and the ink is not normally ejected or the ink is not ejected at all is essentially a problem. Will be resolved.

Further, in an ink jet head in which the ink flow path length is set to be short for performing high-speed recording and the fluid resistance element is provided in the latter half of the ink flow path, the sealing near the connecting portion between the sealing groove and the dummy nozzle is performed. Since the fluid resistance element structure, which is a major factor in inhibiting the entry of the blocking agent, is removed by using an excimer laser, the sealing agent can be smoothly entered.
In addition, by using the same excimer laser as that used to form the discharge port on the orifice plate, simultaneous processing is performed with one positioning operation, so that there is no increase in cost. Since the sealing performance between the common liquid chamber wall and the substrate is controlled in the part where the pressure is maintained, there is no need to maintain new mold precision management and molding precision, and the total productivity is greatly improved and the yield is improved. Can be achieved.

[0045]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings by way of examples.

In the embodiment, an ink jet head having one common liquid chamber is shown for convenience. However, it goes without saying that the same applies to a head having a plurality of common liquid chambers. Further, the ink flow paths communicating with the respective common liquid chambers may be a combination in which the arrangement pitch of the ink flow paths is different, or may be a combination in which the same arrangement pitch and the volume of the ink discharge droplets are different.
Such an example will be described in a third embodiment.

(Embodiment 1) FIG. 1 is a perspective view of a main part of an ink jet head of Embodiment 1. The ink jet head of this embodiment is an ink jet head for monochrome printing having a resolution of 360 dpi, and a plurality of electrothermal transducers (non-heat converting members) for generating energy for ink ejection are provided on an aluminum plate 210 as a heat radiation member. (Illustration) is formed, and a silicon substrate 190 to which a grooved top plate 200 described later is joined is bonded with an adhesive having good heat conductivity. A drive circuit for driving the electrothermal transducer is built in the silicon substrate 190,
This drive circuit is electrically connected to a wire bonding pad 220 which is a terminal formed at a rear end of the silicon substrate 190 (an end opposite to the orifice plate 160 where the discharge port is formed). Further, a wiring board 250 for relaying the driving circuit and the driving circuit of the ink jet apparatus is fixed to the aluminum plate 210, and the terminals of the wiring board 250 and the wire bonding pads 220 of the silicon substrate 190 are connected to a connecting member. Are electrically connected via a bonding wire 230.

Here, the grooved top plate 200 is shown in FIG.
This will be described with reference to FIG. FIG. 2 is a perspective view of the grooved top plate 200 of the ink jet head shown in FIG. 1 as viewed from the side of the bonding surface with the silicon substrate 190, and FIG. 3 is a common liquid chamber of the grooved top plate 200 shown in FIG. FIG. 3 is an enlarged perspective view near a wall 310.

As shown in FIG. 2, the grooved top plate 200 has an orifice plate 160, a concave portion 180, and an ink supply port 260. In this embodiment, the top plate 200 is formed integrally by injection molding using polysulfone as a molding resin at a plasticizing temperature of about 400 ° C. and a mold temperature of about 150 ° C. The method for forming the grooved top plate 200 integrally having the ink flow path 100, the common liquid chamber, and the like includes:
In addition to the injection molding method, a liquid casting method using a similar mold, a transfer molding method, and the like can be used. However, an object of the present invention is to provide an inexpensive inkjet head that can be mass-produced in a small size.
From such a viewpoint, an injection molding method having a short molding cycle is desirable.

The recess 180 of the grooved top plate 200 serves as a common liquid chamber for temporarily holding ink when the grooved top plate 200 is joined to the silicon substrate 190 (see FIG. 1). The ink is supplied to the liquid chamber through the ink supply port 260. In order to realize a three-dimensional shape required in terms of functional design as an ink jet head, a mold portion (piece 73, see FIG. 4) corresponding to the concave portion 180 of the common liquid chamber is obtained by electric discharge machining. FIG. 8 shows a molding die, 64 is a molding cavity, 65 is a nesting pin, 71 is a piece for forming an ink flow path and an ink flow path wall, and 73 is a common liquid chamber and a sealing groove. It is a piece for.

As shown in FIG. 3, the orifice plate 160 has a plurality of discharge ports 105, each of which communicates with the recess 180 via the ink flow path 100 as a groove. I have. The above-described electrothermal converter is provided for each ink flow path 100. By driving the electrothermal transducer based on the drive signal, the ink on the electrothermal transducer is rapidly heated and the ink flow path 100
Air bubbles are generated in the discharge port 105 due to the expansion of the air bubbles.
The ink is ejected from the printer. In order to realize the dimensional accuracy required for the function design of the ink jet head, a 70.5 μm
Mold portions (pieces 71, 72) corresponding to a plurality of groove shapes of the pitch (in the case of the 360 dpi inkjet head of this embodiment)
4 and 5) are obtained by cutting. 7
2 is a groove corresponding to the ink flow path.

Further, the ink flow paths 100 communicating with the recesses 180 are provided at both ends in the arrangement direction of the ink flow paths 100, respectively.
A plurality of dummy nozzles 110 formed in the same manner as 00 are formed. At least the central dummy nozzle 110 among them is wider than the ink flow path 100 and is about the width of the sealing groove 312. This dummy nozzle 1
10 is also formed by the piece 71. Each dummy nozzle 110 communicates with the outside through a through hole 120 formed in the orifice plate 160, and each through hole 12
0, at least the central through hole 120 is connected to a groove 125 formed on the back surface of the orifice plate 160.

On the other hand, the silicon substrate 1 on the common liquid chamber wall 310
The orifice plate 16
Sealing groove 312 extending from the 0-side end (front end) to the other end (rear end)
Are formed, and the tip of the dummy nozzle 11 is located at the center.
Communicates with 0. The rear end of the sealing groove 312 is provided with a sealant injection port 170 (FIG. 12) for injecting a sealant for sealing between the common liquid chambers after joining the grooved top plate 200 and the silicon substrate 190. See).

As described above, the dummy nozzle 110 communicating with the ink passage 100 of the grooved top plate 200 and the sealing groove 312 is both formed by the piece 71. In this embodiment, the height of the ink passage 100 is The grooved top plate 200 was formed using a piece 71 processed so that the height of the dummy nozzle 110 was 800 μm with respect to 40 μm. On the other hand, the piece 73 is provided with a female shape for forming the common liquid chamber sealing groove 312 communicating with the common liquid chamber and the dummy nozzle, but the common liquid chamber sealing groove is 80 μm wide and high. 80 μm
(See FIG. 4).

When the sealant is injected based on the above-described configuration, as shown in FIG. 6, the silicon substrate 19 behind the sealant injection port 170 is injected by an injection means such as a dispenser.
A sealant 171 is applied to the top of the seal. The applied sealant is
From the sealant injection port 170 at the rear end of the grooved top plate 200, the liquid enters the sealing groove 312 by capillary action, and further reaches the central dummy nozzle 110. Central dummy nozzle 1
Since 10 has the same width and the same height as the sealing groove 312, it smoothly enters the dummy nozzle without overflowing at the connection between the sealing groove 312 and the dummy nozzle 110. Further, since the dummy nozzle 110 communicates with the outside through the through hole 120, the sealant 171 becomes an air escape when entering the inside of the dummy nozzle and serves as an air escape.
Up to the sealant.

At this time, the sealant 171 is held in the through hole 120 by its surface tension, and the common liquid chamber wall 31 is
0 and the silicon substrate 190 are completely sealed, and the sealing agent 171 enters the ink flow path 100 from the side surface of the common liquid chamber wall in a sealing process for protecting the covering of the bonding wires 230 and the like thereafter. There is no. Furthermore, each through hole 1
Since the groove 125 connected to at least the center through hole 120 of the 20 is formed on the back surface of the orifice plate 160, when the sealant 171 enters a large amount, a large amount of the sealant escapes here. ing.

In this embodiment, a room-temperature-curable liquid silicone resin (T
SE-399) was used. Viscosity of about 3000 cP and 5
A tack-free property of about one minute was an optimal sealant for this example. Further, the amount of the sealant actually required to seal between the common liquid chambers is 0.0 mg or less per one sealing groove 312. Even when 3 mg to 10 mg that enables stable ejection in the mass production process, there was no danger of causing clogging of the ink flow path.

In the conventional example, even if the management of physical properties such as the viscosity of the sealant and the tack-free time, the management of the greenhouse degree of the dispensing environment, and the precise control of the injection position and the injection amount from the dispenser are performed, Due to the joint structure with the grooved top plate 200, the sealant overflowed toward the ink flow path (main nozzle).

However, in the embodiment, the sealing agent is
2, and the height of the dummy nozzle is made lower than the depth of the sealing groove 312 so that the sealing agent smoothly enters the dummy nozzle communicating with the sealing groove 312. Therefore, stable sealing between the common liquid chamber and the silicon substrate 190 can be reliably performed.

The configuration of this embodiment will be described in more detail.

As a material for sealing the sealing groove 312 of the common liquid chamber, the above-mentioned liquid silicone resin or the like is preferable from past studies, but such a material is supplied from the rear end of the common liquid chamber of the ink jet head to the orifice. It has been found that it is desirable to provide a groove having a cross-sectional shape such as approximately 80 μm wide and 80 μm high in the grooved top plate 200 in order to surely enter the plate side. The optimum value of this cross-sectional shape will be reset according to the size of the silicon substrate 190. This is because, if the cross-sectional shape is reduced, the capillary force increases, but the flow resistance increases as the sealant enters. On the other hand, the sealing is stopped halfway through the sealing groove 312 and the sealing is incomplete. On the other hand, if the cross section is enlarged, the capillary force is weak and the sealing also stops halfway.

Further, according to the examination in this embodiment, when the physical properties of the sealing agent, particularly the viscosity, are greatly reduced, the sealing groove 3
When the cross section of the dummy nozzle 110 is sharply reduced, the sealant that has entered the nozzle 12 is prevented from entering at the connection between the leading end of the common liquid chamber wall 310 and the dummy nozzle, and the ink flow A case was seen intruding into the road 100 side.

As a result of examining how much the cross-section can be reduced to be stable without a problem in mass production, the sealing groove 312
20% reduction in height, width and cross-sectional area of the sealing groove 31
It has been confirmed that the same effect can be obtained when the height of 2 is about 64 μm or more with respect to the height of 80 μm. Further, even if the entire dummy nozzle is not 64 μm or more, if the sealant can smoothly enter the vicinity of the connection portion with the sealing groove at 64 μm or more, the height of the dummy nozzle on the orifice plate side is
For example, it may be smoothly reduced to the conventional height of 40 μm.

The results of this study show that the ink flow path length was set to be as short as 300 μm in order to increase the refilling property in order to realize a system with the following ink flow path design, ie, to achieve high-speed printing at 10 kHz or more. On the other hand, in order to suppress meniscus vibration at the discharge port (orifice), the present invention can be applied to a system in which the fluid resistance element 90 is provided near the rear end of the ink flow path. It is well known that a fluid resistance element is used when designing a recording frequency to be higher.

The specific dimensions of each part in the ink jet head shown in FIG.
5 μm, the height of the fluid resistance element 90 is 20 μm, the ink flow path length is 300 μm, and the position of the fluid resistance element is 3 from the rear end of the flow path.
It was 0 μm. Also in this mode, the dummy nozzle portion communicating with the sealing groove by the laser is processed into a structure having no fluid resistance element structure, and the cross-sectional reduction within 20% is suppressed. 10 times or more.

As described above, the injection molding method is most preferable as the method of forming the grooved top plate when the grooved top plate 200 is bonded to the silicon substrate 190 to manufacture an ink jet head, from the viewpoint of mass productivity. In this case, the ink flow path 10
It is desirable to incorporate a part forming 0 into the mold as a piece 71 and a part forming a plurality of common liquid chambers into a mold as a piece 73 in terms of processing method selection and cost. However, in this case, it is very difficult to avoid forming the fluid resistance element 91 also in the dummy nozzle portion communicating with the sealing groove (see FIG. 7).

Therefore, in this embodiment, as shown in FIG. 7, even in the ink jet head having the fluid resistance element 90 in the ink flow path, the mass production is maintained in the groove piece processing method, that is, the dummy nozzle is formed at the time of molding. A manufacturing method for solving this problem while the fluid resistance element 91 is still formed is also proposed.

That is, the fluid resistance element 91 of the dummy nozzle and the nozzle ceiling near the dummy nozzle are removed using a laser capable of performing ablation processing such as an excimer laser. This process may be set as a single process.However, since the inkjet head manufactured using a top plate with a groove has a major feature that it can be manufactured stably at low cost with good mass productivity, the discharge port is formed in the orifice plate. It is most preferable to perform it simultaneously with the laser processing for forming.

Further, in order to sufficiently obtain the effect of the present embodiment, the dummy nozzle may be provided with the through hole 120,
As shown in FIG. 14, it is desirable to provide a dug groove 125 connected to the through hole 120 on the back surface of the orifice plate 160, and these processes are also performed by one positioning at the same time as laser processing for forming the discharge port 105. It can be performed, and is most desirable in terms of processing cost and processing accuracy. Hereinafter, the excimer laser processing method of this embodiment will be described.

The excimer laser processing apparatus has a configuration shown in FIG. In the figure, 32 is an excimer laser body, 33 is a half mirror and a power meter for monitoring laser power, that is, a power monitor section, and 34 is an optical lens for projecting an excimer laser beam 31 corresponding to a discharge port pattern onto a work. And 35, a mask portion for forming an ejection port corresponding to the ink flow path, a mask portion for forming a through hole corresponding to the dummy nozzle communicating with the common liquid chamber, and a groove communicating with the through hole. An optical mask (see FIG. 9 (a)) comprising a mask portion for removing the fluid resistance element 91 formed on the dummy nozzle and a mask portion for controlling the laser irradiation time (see FIG. 9A). 9 (b)), 36 is a work moving stage / mounting table, 37
Denotes an observation camera for performing image processing, and 38 denotes a control unit that controls laser oscillation timing, work positioning, and the like.

The processing conditions are as follows:
An rF excimer laser (wavelength: 248 nm) is irradiated for 2 seconds at a repetition frequency of 200 PPS and a pulse energy density of 800 mJ / cm ² perpendicularly to an orifice plate provided at an angle of 10 ° to the ink flow path. After irradiating for 5 seconds, the shutter was opened and the remaining 0.
100 pulses for 5 seconds were irradiated. FIGS. 7B and 10 show this processing. After removing the fluid resistance element, not only the fluid resistance element 91 is completely removed, but also the height of the dummy nozzle is cut down to the height of the sealing groove 312.

In this embodiment, the ablation process is performed by using an excimer laser. However, the ablation process is required from the viewpoint of the material of the top plate, the amount to be removed, the damage during the removal process, the amount of by-products generated, and the like. If so, it may be processed by a harmonic YAG laser, a TEA-CO ₂ laser capable of ablation processing, or the like.

(Embodiment 2) Embodiment 2 will be described with reference to FIG.

This embodiment is very similar to the first embodiment,
The width and height of the sealing nozzle 312 are set so that the capillary force of the sealing agent with respect to the dummy nozzle decreases from the dummy nozzle 110 communicating with the sealing groove 312 toward the ink flow path 100. That is, the dummy 71 is arranged such that the width of the piece 71 to be incorporated into the grooved top plate forming die is increased toward the ink flow path 100. In addition, the ink flow path 10
Excavation was performed by laser so that the height of the rear end of the nozzle was increased toward zero. Further, the common liquid chamber wall 310
A gap of at least 10 μm was provided between the two so as to prevent the dummy nozzle 110 from being blocked, thereby maintaining the capillary force.

According to this embodiment, an effect is obtained which is greatly improved as compared with the conventional example and is superior to that of the first embodiment, and the forming margin of the grooved top plate (incorporation variation of the pieces 71 and 73, etc.), silicon It was confirmed that the bonding margin with the substrate 190, the physical property margin of the sealing agent, the injection margin, and the like can be made large, and mass production can be performed more stably.

(Embodiment 3) Embodiment 3 will be described with reference to the drawings.

Although the ink jet head having one common liquid chamber has been described in the first and second embodiments, the same effect can be obtained with an ink jet head having a plurality of (four in the figure) common liquid chambers as in this embodiment. confirmed. In this case, in the step of separating and sealing the common liquid chambers, it is preferable in terms of process setting that the outermost liquid chamber side surface is also sealed.
In any of the first to third embodiments, the sealing agent enters the sealing groove 312 and the dummy nozzle 110 to perform stable and reliable sealing, protect the coating of the bonding wire 230, and protect the back surface of the orifice plate 160 and the aluminum plate. 21
It was confirmed that the problem in the batch sealing process such as sealing with 0 can be essentially solved. In the drawing, 130 is a common liquid chamber separation groove, and 150 is a common liquid chamber separation wall.

(Embodiment 4) An embodiment of the ink jet apparatus of the present invention will be described.

FIG. 13 is a schematic perspective view of the ink jet apparatus of the embodiment. In the figure, a lead screw 5004 in which a spiral groove 5005 is engraved is connected to a drive motor 5013.
The driving force transmission gears 5011 and 500
9 is driven to rotate. The carriage HC is engaged with the spiral groove 5005 by a pin (not shown), and is slidably guided by the guide rail 5003.
It can reciprocate in the directions indicated by arrows a and b. An ink jet head cartridge 4030 in which the ink jet head having the configuration shown in each of the above-described embodiments and a liquid storage container for holding ink to be supplied to the ink jet head are integrated is detachably mounted on the carriage HC. As a result, color printing can be performed with one inkjet head, and a small-sized inkjet device for color printing is realized.

The paper pressing plate 5002 applies the recording medium P to the platen roller 50 in the moving direction of the carriage HC.
Press against 00. Photocoupler 5007,500
Reference numeral 8 denotes a home position detecting means for confirming the presence of the lever 506 of the carriage HC in this area and performing reverse rotation of the drive motor 5013 in the rotation direction. A cap member 5022 for capping the front surface of the inkjet head cartridge 5030 is supported by a support member 5016, further includes a suction unit 5015, and performs suction recovery of the inkjet head cartridge 5030 via the opening 5023 in the cap. A support plate 5019 is attached to the main body support plate 5018.
Cleaning blade 50 slidably instructed at 19
17 is moved in the front-rear direction by a driving means (not shown). The configuration of the cleaning blade 5017 is not limited to the illustrated one, and it is needless to say that a known blade can be applied to this embodiment. The lever 5021 is used to perform a suction recovery operation, and moves with the movement of the cam 5020 that comes into contact with the carriage HC, and the driving force from the drive motor 5013 is moved by a known transmission means such as a gear 5010 or clutch switching. Controlled.

The capping, cleaning, and suction recovery processes are performed at corresponding positions by the action of the lead screw 5004 when the carriage HC reaches the home position side area. This example can be applied at any time if the desired operation is performed at a known timing.

The present invention provides an excellent effect particularly in an ink jet head or an ink jet apparatus of an ink jet type which performs recording by forming flying droplets by utilizing thermal energy among ink jet recording methods.

The typical configuration and principle are described in, for example, US Pat. Nos. 4,723,129 and 474.
It is preferable to use the basic principle disclosed in Japanese Patent Application No. 0796. This method can be applied to any of the so-called on-demand type and continuous type. In particular, in the case of the on-demand type, it is suitable for a sheet or a liquid path holding a liquid (ink). Applying at least one drive signal to the disposed electrothermal transducer to provide a rapid temperature rise exceeding the film boiling corresponding to the recorded information, thereby causing the electrothermal transducer to generate heat energy, This is effective because film boiling occurs on the heat-acting surface of the head, and consequently bubbles in the liquid (ink) can be formed corresponding to this drive signal on a one-to-one basis. The liquid (ink) is ejected through the ejection opening by the growth and contraction of the bubble to form at least one droplet.
When the drive signal is pulse-shaped, the growth and shrinkage of the bubbles are performed immediately and appropriately, so that the ejection of a liquid (ink) having particularly excellent responsiveness can be achieved, which is more preferable.

As the pulse-like drive signal, those described in US Pat. Nos. 4,463,359 and 4,345,262 are suitable. In addition,
US Patent No. 4 of the invention relating to the rate of temperature rise of the heat acting surface
If the conditions described in the specification of Japanese Patent No. 313124 are adopted, more excellent recording can be performed.

As the structure of the ink jet head, in addition to the combination structure (straight liquid flow path or right-angled liquid flow path) of the discharge port, liquid path, and electrothermal converter as disclosed in the above-mentioned respective specifications, The present invention also includes a configuration using U.S. Pat. No. 4,558,333 or U.S. Pat. No. 4,459,600, which discloses a configuration in which the heat acting portion is arranged in a bent region.

In addition, JP-A-59-123670 discloses a configuration in which a common slit is used as a discharge portion of an electrothermal converter for a plurality of electrothermal converters, or absorbs pressure waves of thermal energy. The effect of the present invention is effective even if the configuration is based on JP-A-59-138461, which discloses a configuration in which the apertures correspond to the discharge portions.

It is preferable to add recovery means for the ink jet head, preliminary auxiliary means, and the like provided as components of the ink jet apparatus of the present invention since the effects of the present invention can be further stabilized. To be more specific, capping means, cleaning means, pressurizing or suction means for the ink jet head, preheating means using an electrothermal transducer or another heating element or a combination thereof, and recording Performing a preliminary ejection mode for performing another ejection is also effective for performing stable printing.

In addition, the form of the ink jet apparatus according to the present invention is not limited to the one provided as an image output terminal of an information processing device such as a word processor or a computer as an integral or separate unit, a copying apparatus combined with a reader, and A facsimile apparatus having a transmission / reception function may be used. Further, the present invention may be applied to a printing apparatus that performs recording on a cloth or a thread.

[0089]

As described above, according to the present invention, the ink jet head and the ink jet head cartridge are arranged on the grooved top plate joined to the substrate and filled with the sealant to form a common liquid chamber. And a sealing groove that seals between the substrates, and a dummy nozzle that communicates with the sealing groove to prevent the sealing agent from entering the ink flow path by being filled with the sealing agent, Further, by setting the difference between the cross-sectional area of the dummy nozzle and the cross-sectional area of the sealing groove in the connecting portion between the sealing groove and the dummy nozzle to be within 20%, the sealing agent also smoothly flows in the orifice plate direction at the connecting portion. I tried to enter.

Further, by providing a through hole in the dummy nozzle connected to the sealing groove and communicating with the outside, the air in the sealing groove escapes from the through hole to the outside at the time of injection of the sealing agent. In addition to ensuring that the agent can be injected into the through-hole, even if the injection amount varies somewhat, it is absorbed by the groove connected to the through-hole so that the ink flow path is not clogged with the sealant.

Therefore, according to the ink-jet head and the ink-jet cartridge of the present invention, the sealing between the grooved top plate and the substrate can be easily performed even if a substrate having a reduced length in the arrangement direction of the energy generating elements is used. Moreover, it can be performed reliably, and stable mass production becomes possible.

The structure of the connecting portion is effective not only for the dummy nozzle at the center but also for the dummy nozzles arranged side by side. However, these structures are different from those of the ink jet head manufacturing method of the present invention. For example, by performing laser processing at the same time as forming the discharge port without embedding in the mold structure,
It is possible to process within the same time with the same positioning. Therefore, according to the inkjet head manufacturing method of the present invention, the inkjet head can be mass-produced at low cost.

Further, since the ink jet head cartridge and the ink jet recording apparatus of the present invention use the above ink jet head, stable mass production becomes possible.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part of an inkjet head using a reduced substrate according to a first embodiment, as viewed from a side opposite to a discharge port.

FIG. 2 is a perspective view of a grooved top plate of the inkjet head shown in FIG. 1 as viewed from a bonding surface side with a silicon substrate.

FIG. 3 is an enlarged perspective view of a main part of the inkjet head of FIG. 2;

FIG. 4 is a sectional view of a main part of a mold for injection-molding the grooved top plate in the first embodiment.

FIG. 5 is a perspective view of a piece 71 for forming an ink flow channel row in the first embodiment.

FIG. 6 is a cross-sectional view of a main part of the inkjet head according to the first embodiment for explaining a common liquid chamber side sealing step of the head.

FIG. 7 is a schematic processing diagram of the ink-jet head according to the first embodiment, for illustrating a method of manufacturing the same.

FIG. 8 is a configuration diagram of an excimer laser processing apparatus according to the first embodiment.

FIG. 9 is a view for explaining a laser processing mask and a shutter for controlling a laser irradiation time in Example 1.

FIG. 10 is a chart for explaining how laser processing is performed in Example 1.

FIG. 11 is a perspective view of a main part of an inkjet head according to a second embodiment, corresponding to FIG.

FIG. 12 is a perspective view of a main part of an inkjet head according to a third embodiment.

FIG. 13 is a schematic perspective view of an inkjet recording apparatus according to a fourth embodiment.

FIG. 14 is a perspective view of a main part of a conventional ink jet head viewed from a side opposite to a discharge port.

FIG. 15 is a perspective view of the grooved top plate of the inkjet head shown in FIG. 14 as viewed from the side of a bonding surface with a silicon substrate.

FIG. 16 is an enlarged perspective view of the vicinity of a common liquid chamber side wall of the grooved top plate shown in FIG. 14;

FIG. 17 is a perspective view showing another embodiment of the ink jet head shown in FIG.

FIG. 18 is a diagram illustrating a conventional substrate and a substrate designed to be reduced.

[Explanation of symbols]

 Reference Signs List 31 excimer laser beam 32 excimer laser main body 33 power monitor system 34 optical lens system 35 optical mask 36 work stage and mounting base 37 observation camera 38 control unit 42 mask shutter 51 through hole 52 through hole 53 groove through hole 54 dug Through hole 64 Molding cavity 65 Nesting pin 71, 73 Piece 72 Groove 90, 91 Fluid resistance element 100 Ink flow path 105 Discharge port 110 Dummy nozzle 120 Through hole 125 Groove 130 Common liquid chamber separation groove 150 Common liquid chamber separation wall 160 Orifice Plate 170 Sealant injection port 171 Sealant 180 Concave part 190, 191 Silicon substrate 200 Top plate with groove 210 Aluminum plate 220 Wire bonding pad 230 Bonding wire 250 Wiring board 260 Ink supply Mouth 310 common liquid chamber wall 311 auxiliary sealing wall 312 sealing groove 5030 ink jet head cartridge HC carriage P recording medium

Claims (26)

[Claims] 1. A substrate on which a plurality of energy generating elements for generating energy for discharging ink are arranged in parallel, an orifice plate having a plurality of discharge ports from which ink is discharged, and supplied to each of the discharge ports. And at least one recess forming a wall of at least one common liquid chamber for temporarily holding ink, and disposed at a position corresponding to each of the energy generating elements; A grooved top plate having a plurality of ink flow paths for communicating with each other, and the walls of the common liquid chambers located at both ends in the direction in which the common liquid chambers are arranged have a sealing agent inside the joint surface with the substrate. An ink jet head having a sealing groove that is filled to seal the joining surface. 2. The ink jet head according to claim 1, wherein the common liquid chamber and the sealing groove have a dummy nozzle group communicating with each other and reaching the orifice plate, and at least one of the dummy nozzles. The height of a portion of the dummy nozzle communicating with the sealing groove, which is in contact with the sealing groove, is substantially equal to the height of the sealing groove. 3. The ink jet head according to claim 1, wherein the common liquid chamber and the sealing groove each have a dummy nozzle group that communicates with the orifice plate and communicates with the sealing groove. An ink jet head, wherein a difference between a height, a width, and a cross-sectional area of a portion of the dummy nozzle in contact with the sealing groove and a difference between a height, a width, and a cross-sectional area of a tip portion of the sealing groove are each within 20%. . 4. The ink jet head according to claim 1, wherein, among the dummy nozzles, the area of the cross section of the dummy nozzle in contact with the wall is equal to that of the dummy nozzle adjacent to the ink flow path side. An ink jet head having a smaller area than a cross section. 5. The ink jet head according to claim 1, wherein at a boundary surface between the dummy nozzle contacting the wall and the wall, at least a common liquid chamber is located among the dummy nozzles contacting the wall. An ink jet head having a gap of 10 μm or more between an inner wall of a dummy nozzle on the side and at least an inner wall on a side where a common liquid chamber is located among walls forming the sealing groove. 6. The ink jet head according to claim 1, wherein a fluid resistance element is provided in the ink flow path, and a dummy nozzle communicating with the sealing groove is provided on the fluid resistance element. An ink-jet head having no equivalent structure. 7. The ink jet head according to claim 6, wherein the dummy nozzle adjacent to the ink flow path does not have a structure corresponding to the fluid resistance element. 8. The ink jet head according to claim 1, wherein the orifice plate has a through hole communicating with the sealing groove through the dummy nozzle, and a through hole and the dummy nozzle. An ink-jet head having a communication groove. 9. The ink jet head according to claim 1, wherein the number of said common liquid chambers is only one. 10. The ink jet head according to claim 1, wherein said energy generating element is an electrothermal converter. 11. A substrate on which a plurality of energy generating elements for generating energy for discharging ink are arranged in parallel, an orifice plate having a plurality of discharge ports from which ink is discharged, and supplied to each of the discharge ports. At least one recess forming a wall of at least one common liquid chamber that temporarily holds ink, and disposed at a position corresponding to each of the energy generating elements, wherein each of the ejection openings and the at least one recess is formed. In a method for manufacturing an ink jet head for bonding a grooved top plate having a plurality of ink flow paths to be communicated with each other, a common liquid chamber wall provided at both ends in a direction in which the common liquid chambers are arranged is provided on a bonding surface with a substrate. A portion of the dummy nozzle communicating with the sealing groove, which is in contact with the sealing groove, is engraved with a laser so that its height is substantially equal to the height of the sealing groove. A method for manufacturing an ink jet head, comprising: 12. The method of manufacturing an ink jet head according to claim 11, wherein the dummy nozzle communicates with a sealing groove provided on a joint surface of a wall located at both ends in the direction in which the common liquid chambers are arranged with a substrate. A method of manufacturing an ink jet head, wherein a difference between a height, a width, and a cross-sectional area of a portion in contact with the sealing groove and a difference between a height, a width, and a cross-sectional area of a tip portion of the sealing groove are each within 20%. 13. The method of manufacturing an ink jet head according to claim 11, wherein, among the dummy nozzles, the area of the cross section of the dummy nozzle in contact with the wall is equal to that of the dummy nozzle adjacent to the ink flow path. A method for manufacturing an ink-jet head, wherein the ink-jet head is formed to be smaller than an area of a cross section. 14. The method for manufacturing an ink jet head according to claim 11, wherein at a boundary surface between the dummy nozzle contacting the wall and the wall, at least a common liquid chamber among the dummy nozzles contacting the wall. Wherein a gap of 10 μm or more is provided between the inner wall of the dummy nozzle on the side where is located and the inner wall on the side where at least the common liquid chamber is located among the walls forming the sealing groove. Production method. 15. The method of manufacturing an ink jet head according to claim 11, wherein a fluid resistance element is provided in the ink flow path, and the dummy nozzle communicating with the sealing groove includes the fluid resistance element. A method for manufacturing an ink jet head, wherein a structure corresponding to an element is not provided. 16. The method for manufacturing an ink jet head according to claim 15, wherein the dummy nozzle in contact with the ink flow path does not have a structure corresponding to the fluid resistance element. 17. The method for manufacturing an ink jet head according to claim 11, wherein the orifice plate has a through hole communicating with the sealing groove via the dummy nozzle, and Forming a groove communicating with the dummy nozzle. 18. A method for manufacturing an ink jet head according to claim 11, wherein a plurality of common liquid chambers are provided, and inks of different densities or colors are supplied to each of the common liquid chambers. Production method. 19. The method for manufacturing an ink-jet head according to claim 11, wherein an electrothermal converter is used as said energy element. 20. The method for manufacturing an ink jet head according to claim 15, wherein a structure corresponding to the fluid resistance element is removed by a laser. 21. The method for manufacturing an ink jet head according to claim 11, wherein the laser processing is performed simultaneously with the laser processing for forming the discharge port performed on the orifice plate. Manufacturing method of an inkjet head. 22. The method for manufacturing an ink jet head according to claim 17, wherein the through hole and the ink flow path are processed by using a laser, and the structure corresponding to the fluid resistance element is removed. Alternatively, the method is performed simultaneously with the formation of the discharge port. 23. The method of manufacturing an ink jet head according to claim 11, wherein said laser processing uses an excimer laser. 24. The method according to claim 11, wherein the top plate is formed by injection molding. 25. An ink jet head cartridge comprising: the ink jet head according to claim 1; and a liquid storage container for holding ink to be supplied to the ink jet head. 26. An ink jet recording apparatus comprising the ink jet head cartridge according to claim 25, wherein the recording is performed by discharging ink from a discharge port of the ink jet head based on a recording signal.