JPH10315116A - Surface grinder - Google Patents
Surface grinderInfo
- Publication number
- JPH10315116A JPH10315116A JP12227597A JP12227597A JPH10315116A JP H10315116 A JPH10315116 A JP H10315116A JP 12227597 A JP12227597 A JP 12227597A JP 12227597 A JP12227597 A JP 12227597A JP H10315116 A JPH10315116 A JP H10315116A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- turntable
- backing pad
- pad
- polishing cloth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、シリコンウエハな
どの平板状の被研磨材の表面の平坦化加工に使用される
平面研磨装置に係り、特に、被研磨材の平坦度を確保す
るための改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat surface polishing apparatus used for flattening the surface of a flat plate-like workpiece such as a silicon wafer, and more particularly to a flat polishing apparatus for ensuring the flatness of the workpiece. Regarding improvement.
【０００２】[0002]
【従来の技術】図３に、従来の平面研磨装置の概要を示
す。この平面研磨装置は、ターンテーブル１、研磨ヘッ
ド４、研磨剤供給ノズル９、ドレッシングヘッド１１な
どから構成される。ターンテーブル１は、その上面に研
磨布３が固着され、その下側に配置された回転駆動機構
２によって駆動される。研磨ヘッド４は、回転兼加圧機
構５、回転兼加圧機構５から下方に伸びるシャフト６、
シャフト６の下端に固定されたウエハ保持プレート７な
どから構成される。ウエハ保持プレート７の下面には、
バッキングパッド８が固着され、被研磨材であるウエハ
１０は、このバッキングパッド８に吸着されて研磨ヘッ
ド４にセットされる。ドレッシングヘッド１１は、研磨
布の目詰まりの除去のために使用される。2. Description of the Related Art FIG. 3 shows an outline of a conventional planar polishing apparatus. The planar polishing apparatus includes a turntable 1, a polishing head 4, an abrasive supply nozzle 9, a dressing head 11, and the like. The turntable 1 has a polishing cloth 3 fixed to the upper surface thereof, and is driven by a rotary drive mechanism 2 disposed below the polishing cloth 3. The polishing head 4 includes a rotating and pressing mechanism 5, a shaft 6 extending downward from the rotating and pressing mechanism 5,
It comprises a wafer holding plate 7 fixed to the lower end of the shaft 6, and the like. On the lower surface of the wafer holding plate 7,
The backing pad 8 is fixed, and the wafer 10 to be polished is attracted to the backing pad 8 and set on the polishing head 4. The dressing head 11 is used for removing clogging of the polishing pad.
【０００３】ウエハ１０の研磨加工は以下の様に行われ
る。ターンテーブル１上に研磨布３を固着し、ウエハ保
持プレート７にバッキング・パッド８を介してウエハ１
０を吸着する。次に、ターンテーブル１を回転するとと
もに、研磨布３の表面に、研磨剤供給ノズル９から研磨
剤を供給する。最後に、回転兼加圧機構５を起動して、
ウエハ保持プレート７を回転するとともに、ウエハ１０
を研磨布３の表面に押し付ける。The polishing of the wafer 10 is performed as follows. The polishing cloth 3 is fixed on the turntable 1 and the wafer 1 is attached to the wafer holding plate 7 via the backing pad 8.
Adsorb 0. Next, the turntable 1 is rotated, and the abrasive is supplied from the abrasive supply nozzle 9 to the surface of the polishing cloth 3. Finally, the rotation and pressure mechanism 5 is activated,
While rotating the wafer holding plate 7, the wafer 10
Is pressed against the surface of the polishing pad 3.
【０００４】（従来の装置の問題点）平面研磨装置を使
用してウエハ１０の研磨を行う際、ウエハの累積処理枚
数が増すに従ってウエハ表面の平坦度が低下して行く。
一定の枚数を越えると急速に平坦度が低下し、製品とし
ての仕様を満足できなくなる。このため、研磨後のウエ
ハの平坦度をモニターし、その値が所定の許容限界値ま
で低下した時点で、加工条件の設定を新たにやり直す。
このとき、適当な加工条件を見出すことができない場合
には、研磨布３あるいはバッキングパッド８の寿命と判
断し、新しい研磨布３あるいはバッキングパッド８との
交換を行う。これらの交換を行った後、改めて、最適な
加工条件を探す。この様な最適な加工条件を見出すため
の作業には、多大な時間を要するとともにウエハの犠牲
を伴うので、生産性を阻害し、且つランニングコストを
増大させるなどの問題がある。(Problems of Conventional Apparatus) When polishing a wafer 10 using a planar polishing apparatus, the flatness of the wafer surface decreases as the cumulative number of processed wafers increases.
If the number exceeds a certain number, the flatness rapidly decreases, and the product specification cannot be satisfied. Therefore, the flatness of the polished wafer is monitored, and when the value falls to a predetermined allowable limit value, the setting of the processing conditions is newly performed.
At this time, if no suitable processing conditions can be found, the life of the polishing pad 3 or the backing pad 8 is determined, and a new polishing pad 3 or backing pad 8 is replaced. After these exchanges, the optimum processing conditions are searched again. Such an operation for finding the optimum processing conditions requires a great deal of time and involves the sacrifice of a wafer, and thus has problems such as impairing productivity and increasing running costs.
【０００５】[0005]
【発明が解決しようとする課題】本発明は、上記の様な
問題点に鑑み成されたもので、本発明の目的は、ウエハ
の平坦度の測定結果を利用せずに、研磨加工の途中で研
磨布およびバッキングパッドの表面の状態を把握し、こ
れによって、研磨加工後のウエハの良品歩留まりを増大
させるとともに、研磨布およびバッキングパッドの交換
作業の段取りに要する時間を短縮することを目的とす
る。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to provide a method for performing polishing during a polishing process without using a measurement result of wafer flatness. The purpose of the present invention is to grasp the state of the surface of the polishing pad and the backing pad, thereby increasing the yield of non-defective wafers after polishing, and shortening the time required for the replacement work of the polishing pad and the backing pad. I do.
【０００６】[0006]
【課題を解決するための手段】本発明の平面研磨装置
は、上面に研磨布が固着されるターンテーブルと、ター
ンテーブルに対向してターンテーブルの上方に配置さ
れ、その下面に固着されたバッキングパッドで平板状の
被研磨材を吸着する研磨ヘッドとを備え、研磨布の上に
研磨剤を供給しながら、研磨ヘッドで被研磨材を回転さ
せるとともに研磨布に押し付けて研磨を行う平面研磨装
置において、前記研磨布の弾性率を測定する測定手段を
備えたことを特徴とする。According to the present invention, there is provided a planar polishing apparatus comprising: a turntable having an upper surface to which a polishing cloth is fixed; and a backing disposed above the turntable opposite to the turntable and fixed to the lower surface. A polishing head for adsorbing a plate-shaped material to be polished with a pad, and a polishing machine for rotating the material to be polished with the polishing head and pressing against the polishing cloth while supplying the abrasive onto the polishing cloth to perform polishing. , Characterized by comprising a measuring means for measuring an elastic modulus of the polishing cloth.
【０００７】なお、好ましくは、前記測定手段は、研磨
布の表面の複数箇所の弾性率を同時に測定できる様に、
複数のセンサを備える。また、本発明の平面研磨装置
は、上面に研磨布が固着されるターンテーブルと、ター
ンテーブルに対向してターンテーブルの上方に配置さ
れ、その下面に固着されたバッキングパッドで平板状の
被研磨材を吸着する研磨ヘッドとを備え、研磨布の上に
研磨剤を供給しながら、研磨ヘッドで被研磨材を回転さ
せるとともに研磨布に押し付けて研磨を行う平面研磨装
置において、前記バッキングパッドの弾性率を測定する
測定手段を備えたことを特徴とする。[0007] Preferably, the measuring means is configured to simultaneously measure the elastic moduli at a plurality of locations on the surface of the polishing pad.
It has a plurality of sensors. In addition, the planar polishing apparatus of the present invention comprises a turntable on which an abrasive cloth is fixed on an upper surface, and a flat backing pad disposed on the turntable opposite to the turntable and fixed on the lower surface thereof. A polishing head for adsorbing a material, wherein the polishing head is rotated while the polishing head is supplied while the polishing agent is supplied onto the polishing cloth, and is pressed against the polishing cloth to perform polishing. It is characterized by having a measuring means for measuring the rate.
【０００８】なお、好ましくは、前記測定手段は、バッ
キングパッドの表面の複数箇所の弾性率を同時に測定で
きる様に、複数のセンサを備える。被研磨材の平坦度に
影響する因子には、装置自体のマシン精度、及び研磨
布、バッキングパッド、研磨剤などの研磨資材がある。
このうち、累積処理枚数の増加に従って平坦度が低下す
る現象に影響する因子は、研磨布及びバッキングパッド
の劣化である。これらの研磨資材は、ポリウレタン系の
高分子材料で作られているので、加圧下で長時間使用さ
れると劣化が起こる。劣化が進行すると、弾性率が低下
し、その結果、ウエハの平坦度の低下を招く。[0008] Preferably, the measuring means includes a plurality of sensors so that elastic moduli at a plurality of locations on the surface of the backing pad can be measured simultaneously. Factors that affect the flatness of the material to be polished include machine accuracy of the apparatus itself and polishing materials such as polishing cloths, backing pads, and abrasives.
Among these factors, the factor affecting the phenomenon that the flatness decreases as the cumulative number of processed sheets increases is deterioration of the polishing pad and the backing pad. Since these polishing materials are made of a polyurethane-based polymer material, they deteriorate when used for a long time under pressure. As the deterioration proceeds, the elastic modulus decreases, and as a result, the flatness of the wafer decreases.
【０００９】本発明に基づく平面研磨装置では、前記測
定手段を用いて、研磨布及びバッキングパッドの弾性率
をそれぞれ測定することによって、これらの研磨資材の
寿命の判定及び予測を、被研磨材の交換の際に短時間に
実施することができるので、研磨後の被研磨材の良品歩
留まりを高めるとともに、これらの研磨資材の交換作業
の段取りに要する時間を短縮することができる。In the planar polishing apparatus according to the present invention, the elasticity of the polishing pad and the backing pad are measured using the measuring means, so that the life of these polishing materials can be determined and predicted. Since the replacement can be performed in a short time, it is possible to increase the yield of the polished material after polishing and to shorten the time required for setting up the replacement operation of these polishing materials.
【００１０】[0010]
【発明の実施の形態】図１に、本発明に基づく平面研磨
装置の一例を示す。この平面研磨装置は、ターンテーブ
ル１、研磨ヘッド４、研磨剤供給ノズル９、ドレッシン
グヘッド（図示せず）、研磨布３の弾性率を測定する弾
性率測定装置２１、及びバッキングパッド８の弾性率を
測定する弾性率測定装置３１などから構成される。FIG. 1 shows an example of a planar polishing apparatus according to the present invention. This planar polishing apparatus includes a turntable 1, a polishing head 4, an abrasive supply nozzle 9, a dressing head (not shown), an elasticity measuring device 21 for measuring the elasticity of the polishing pad 3, and an elasticity of the backing pad 8. , And the like.
【００１１】ターンテーブル１は、その上面に研磨布３
が固着され、その下側に配置された回転機構２によって
駆動される。研磨ヘッド４は、回転兼加圧機構５、回転
兼加圧機構５から下方に伸びるシャフト６、シャフト６
の下端に固定されたウエハ保持プレート７から構成され
る。ウエハ保持プレート７の下面には、バッキングパッ
ド８が固着され、ウエハ１０は、このバッキングパッド
８に吸着されて研磨ヘッド４にセットされる。The turntable 1 has a polishing cloth 3 on its upper surface.
Is fixed, and is driven by the rotating mechanism 2 disposed below the fixed portion. The polishing head 4 includes a rotating and pressing mechanism 5, a shaft 6 extending downward from the rotating and pressing mechanism 5, a shaft 6.
And a wafer holding plate 7 fixed to the lower end of the wafer. A backing pad 8 is fixed to the lower surface of the wafer holding plate 7, and the wafer 10 is set on the polishing head 4 by being attracted to the backing pad 8.
【００１２】研磨布３の弾性率を測定する弾性率測定装
置２１は、複数のセンサ２２を備え、研磨布３の表面の
複数の箇所の弾性率を同時に測定できる様になってい
る。なお、各センサ２２は、それぞれ、後述の様に研磨
布３の表面を圧縮して、その弾性率を測定する。同様
に、バッキングパッド８の弾性率を測定する弾性率測定
装置３１は、複数のセンサ３２を備え、バッキングパッ
ド８の表面の複数の箇所の弾性率を同時に測定できる様
になっている。The elastic modulus measuring device 21 for measuring the elastic modulus of the polishing pad 3 has a plurality of sensors 22 so that the elastic moduli at a plurality of positions on the surface of the polishing pad 3 can be measured simultaneously. Each sensor 22 compresses the surface of the polishing pad 3 and measures its elastic modulus as described later. Similarly, the elastic modulus measuring device 31 that measures the elastic modulus of the backing pad 8 includes a plurality of sensors 32 so that the elastic modulus of a plurality of locations on the surface of the backing pad 8 can be measured simultaneously.
【００１３】なお、図２に示す様に、各センサ２２、３
２は、それぞれ、円柱状の軸４１、軸４１を駆動するエ
アシリンダ４２、軸４１の変位を検出する変位計４３、
軸４１の外周に取り付けられ、軸４１に作用する応力を
検出する歪みゲージ４４などから構成されている。エア
シリンダ４２を用いて、軸４１の先端を測定対象物（研
磨布３あるいはバッキングパッド８）の表面に押し付
け、その時の荷重及び変位の関係に基づいて、その弾性
率（圧縮方向）を測定する。As shown in FIG. 2, each of the sensors 22, 3
2, a cylindrical shaft 41, an air cylinder 42 for driving the shaft 41, a displacement meter 43 for detecting a displacement of the shaft 41,
A strain gauge 44 is attached to the outer periphery of the shaft 41 and detects a stress acting on the shaft 41. Using the air cylinder 42, the tip of the shaft 41 is pressed against the surface of the object to be measured (the polishing cloth 3 or the backing pad 8), and its elastic modulus (compression direction) is measured based on the load and displacement at that time. .
【００１４】次に、図１に示した構成を備えた平面研磨
装置を用いて、研磨布３及びバッキングパッド８の劣化
の度合いを判定する方法の一例について説明する。先
ず、弾性率測定装置２１は以下の様に使用される。ウエ
ハ１０を所定の枚数（例えば、２５枚）処理する度に、
弾性率測定装置２１を研磨布３の上に移動し、エアシリ
ンダ４２（図２）を駆動して各センサ２２をウエハ加工
時の圧力と同じ５００ｇｆ／ｃｍ2 の加圧力で加圧し、
その時の研磨布３の変位量を測定して弾性率を求める。
この弾性率の値と、予め求めておいた弾性率の値とを比
較して、研磨布３の劣化の度合いを判定する。Next, an example of a method for judging the degree of deterioration of the polishing pad 3 and the backing pad 8 by using the planar polishing apparatus having the configuration shown in FIG. 1 will be described. First, the elastic modulus measuring device 21 is used as follows. Each time a predetermined number (for example, 25) of wafers 10 are processed,
The elastic modulus measuring device 21 is moved onto the polishing pad 3, and the air cylinder 42 (FIG. 2) is driven to press each sensor 22 with the same pressure of 500 gf / cm 2 as the pressure during wafer processing.
The displacement of the polishing pad 3 at that time is measured to determine the elastic modulus.
The value of the elastic modulus is compared with a previously obtained value of the elastic modulus to determine the degree of deterioration of the polishing pad 3.
【００１５】同様に、弾性率測定装置３１は以下の様に
使用される。ウエハ１０を所定の枚数（例えば、２５
枚）処理する度に、バッキングパッド８にウエハ１０が
吸着されていない状態で、保持プレート７を弾性率測定
装置３１の上に移動し、各センサ２２を５００ｇｆ／ｃ
ｍ2 の加圧力で加圧し、その時のバッキングパッド８の
変位量を測定して弾性率を求める。この弾性率の値と、
予め求めておいた弾性率の値とを比較して、バッキング
パッド８の劣化の度合いを判定する。Similarly, the elastic modulus measuring device 31 is used as follows. A predetermined number of wafers 10 (for example, 25
Each time the processing is performed, the holding plate 7 is moved onto the elasticity measuring device 31 in a state where the wafer 10 is not adsorbed on the backing pad 8, and each sensor 22 is set to 500 gf / c.
Pressure is applied with a pressing force of m 2 , and the amount of displacement of the backing pad 8 at that time is measured to determine the elastic modulus. The value of this modulus,
The degree of deterioration of the backing pad 8 is determined by comparing the value of the elastic modulus obtained in advance.
【００１６】なお、弾性率測定装置２１、３１に、セン
サ２２、３２を複数個、取り付けることによって、同時
に複数箇所の弾性率を測定することが可能になり、測定
時間の短縮が可能になる。更に、研磨布及びバッキング
パッドの表面の不均一な劣化の状況を的確に把握するこ
とが可能になる。また、使用開始前の研磨布及びバッキ
ングパッドの表面の弾性率の分布を測定すれば、研磨布
及びバッキングパッドのロット間の変動を的確に把握す
ることも可能になる。By attaching a plurality of sensors 22 and 32 to the elastic modulus measuring devices 21 and 31, it is possible to simultaneously measure the elastic modulus at a plurality of locations, thereby shortening the measurement time. Furthermore, it is possible to accurately grasp the state of uneven deterioration of the surfaces of the polishing pad and the backing pad. Further, by measuring the distribution of the elastic modulus of the surfaces of the polishing pad and the backing pad before the start of use, it is possible to accurately grasp the variation between lots of the polishing pad and the backing pad.
【００１７】[0017]
【発明の効果】本発明の平面研磨装置によれば、被研磨
材の交換の際に研磨布及びバッキングパッドの劣化の状
態を短時間で的確に把握することが可能になるので、研
磨後の被研磨材の良品歩留まりを高めるとともに、研磨
布及びバッキングパッドの交換作業の段取りに要する時
間を短縮することができる。According to the planar polishing apparatus of the present invention, it is possible to accurately grasp the state of deterioration of the polishing pad and the backing pad in a short period of time when exchanging the material to be polished. The yield of non-defective products can be increased, and the time required for setting up the replacement work of the polishing pad and the backing pad can be reduced.
【図１】本発明の平面研磨装置の構成の概要を示す図。FIG. 1 is a diagram showing an outline of a configuration of a flat polishing apparatus of the present invention.
【図２】本発明の平面研磨装置を構成する弾性率測定装
置で使用されるセンサの構造を示す図。FIG. 2 is a diagram showing a structure of a sensor used in an elastic modulus measuring device included in the planar polishing device of the present invention.
【図３】従来の平面研磨装置の構成の概要を示す図。FIG. 3 is a diagram showing an outline of a configuration of a conventional planar polishing apparatus.
１・・・ターンテーブル、 ２・・・回転駆動機構、 ３・・・研磨布、 ４・・・研磨ヘッド、 ５・・・回転兼加圧機構、 ６・・・シャフト、 ７・・・保持プレート、 ８・・・バッキングパッド、 ９・・・研磨剤供給ノズル、 １０・・・ウエハ、 １１・・・ドレッシングヘッド、 ２１・・・弾性率測定装置、 ２２・・・センサ、 ３１・・・弾性率測定装置、 ３２・・・センサ、 ４１・・・円柱状の軸、 ４２・・・エアシリンダ、 ４３・・・変位計、 ４４・・・歪みゲージ。 DESCRIPTION OF SYMBOLS 1 ... Turntable, 2 ... Rotation drive mechanism, 3 ... Polishing cloth, 4 ... Polishing head, 5 ... Rotation and pressurization mechanism, 6 ... Shaft, 7 ... Holding Plate, 8 Backing pad, 9 Abrasive supply nozzle, 10 Wafer, 11 Dressing head, 21 Elastic modulus measuring device, 22 Sensor, 31 Elastic modulus measuring device, 32: sensor, 41: cylindrical shaft, 42: air cylinder, 43: displacement gauge, 44: strain gauge.
Claims (4)
ルと、 ターンテーブルに対向してターンテーブルの上方に配置
され、その下面に固着されたバッキングパッドで平板状
の被研磨材を吸着する研磨ヘッドとを備え、 研磨布の上に研磨剤を供給しながら、研磨ヘッドで被研
磨材を回転させるとともに研磨布に押し付けて研磨を行
う平面研磨装置において、 前記研磨布の弾性率を測定する測定手段を備えたことを
特徴とする平面研磨装置。1. A turntable having a polishing cloth fixed to an upper surface thereof, and a polishing device arranged above the turntable so as to face the turntable and adsorbing a plate-like material to be polished by a backing pad fixed to a lower surface of the turntable. A planar polishing apparatus comprising: a polishing head that rotates an object to be polished by a polishing head and presses the material against the polishing cloth while supplying an abrasive onto the polishing cloth; and a measurement for measuring an elastic modulus of the polishing cloth. A planar polishing apparatus characterized by comprising means.
数箇所の弾性率を同時に検出するための複数のセンサを
備えていることを特徴とする請求項１に記載の平面研磨
装置。2. The apparatus according to claim 1, wherein said measuring means includes a plurality of sensors for simultaneously detecting elastic moduli at a plurality of positions on the surface of said polishing pad.
ルと、 ターンテーブルに対向してターンテーブルの上方に配置
され、その下面に固着されたバッキングパッドで平板状
の被研磨材を吸着する研磨ヘッドとを備え、 研磨布の上に研磨剤を供給しながら、研磨ヘッドで被研
磨材を回転させるとともに研磨布に押し付けて研磨を行
う平面研磨装置において、 前記バッキングパッドの弾性率を測定する測定手段を備
えたことを特徴とする平面研磨装置。3. A turntable having a polishing cloth fixed to an upper surface thereof, and a polishing device arranged above the turntable opposite to the turntable and adsorbing a flat plate-like material to be polished by a backing pad fixed to the lower surface of the turntable. A flat polishing apparatus comprising: a head and a polishing head that rotates the material to be polished by the polishing head and presses the polishing material against the polishing cloth while supplying the polishing agent onto the polishing cloth. A planar polishing apparatus characterized by comprising means.
の表面の複数箇所の弾性率を同時に検出するための複数
のセンサを備えていることを特徴とする請求項３に記載
の平面研磨装置。4. The apparatus according to claim 3, wherein said measuring means includes a plurality of sensors for simultaneously detecting elastic moduli at a plurality of positions on the surface of said backing pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12227597A JPH10315116A (en) | 1997-05-13 | 1997-05-13 | Surface grinder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12227597A JPH10315116A (en) | 1997-05-13 | 1997-05-13 | Surface grinder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10315116A true JPH10315116A (en) | 1998-12-02 |
Family
ID=14831941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12227597A Pending JPH10315116A (en) | 1997-05-13 | 1997-05-13 | Surface grinder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10315116A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014076533A (en) * | 2012-09-24 | 2014-05-01 | Ebara Corp | Polishing method and polishing device |
-
1997
- 1997-05-13 JP JP12227597A patent/JPH10315116A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014076533A (en) * | 2012-09-24 | 2014-05-01 | Ebara Corp | Polishing method and polishing device |
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