JPH10313039A - Device for picking-up substrate and device for carrying-in substrate and device for picking-up and carrying-in substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a means for picking-up and carrying-in a substrate corresponding to a case specified, so that a substrate can be housed in a horizontal attitude. SOLUTION: In the case of picking up a wafer W from a case 2, the wafer W is picked up from the case 2 by a picking-up and carrying-in means 40 at first, and the wafer W is carried to a first position, while maintaining a horizontal attitude. Then, the wafer W is held, and the attitude of the wafer W is changed to a vertical attitude by an attribute-changing means 42, and the wafer W is carried to a second position. Next, the substrate is received, and held in the vertical attitude by a holding means 43. Also, in the case of carrying in the wafer W in the case 2, a process opposite t the process described is executed, and the wafer W is carried in the case 2 in the horizontal attitude. Also, a guide means 41 for operating the directional alignment of a substrate can be arranged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for removing a substrate for an object to be processed, such as a semiconductor wafer or a glass plate for an LCD, from a container and transferring it to a processing section, and performing processing and returning from the processing section. The present invention relates to an unloading / loading device for loading a substrate into a container.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, for example, a semiconductor wafer (hereinafter, referred to as a "wafer") is immersed in a cleaning liquid in a cleaning processing section to perform cleaning, thereby removing particles attached to the wafer. Is used. In a cleaning process using this cleaning system, a container containing a wafer is carried into the cleaning system, and wafers are exchanged between the container and the cleaning processing unit. For this reason, the cleaning system is provided with an unloading / unloading device for taking out the wafer from the container and loading the wafer into the container again, corresponding to the cleaning processing unit.

In the cleaning section, wafers are stored in a vertical position and are cleaned in batches using various chemicals. In this batch type cleaning, the cleaning efficiency is improved by forming a rising flow of the cleaning liquid between the wafers arranged in a vertical posture at a predetermined interval and supplying the cleaning liquid evenly to the wafer surface. .

[0004] In the cleaning system, a container is placed in front of the take-out / loading device, and the wafer contained in the container moves between the container and the cleaning section via the take-out / loading device. A conventional container is configured to store a wafer in a vertical position corresponding to a cleaning processing unit that stores and cleans the wafer in a vertical position. Therefore, the conventional unloading / unloading device takes out the wafer stored in the container in the vertical position from the container and transfers the wafer to the cleaning processing unit in the vertical position.
After the cleaning process is completed, the wafer returned from the cleaning processing unit is transported again into the container in the vertical posture.

[0005]

In order to further improve the productivity of semiconductor integrated circuits, the diameter of wafers has been increased from 8 inch wafers to 300 mm wafers. However, the thickness of a 300-mm wafer is less than that of an 8-inch wafer because the thickness of the 300-mm wafer is the same as that of an 8-inch wafer with an increase in weight and diameter. Therefore, if the wafer is housed in a container and transported in a vertical posture as usual, the lower end of the wafer may be damaged, chipped, or bent due to its own weight and vibration during the transport. Therefore, the standardization of containers for storing wafers in a horizontal position is being promoted so that the influence during transfer is suppressed as compared with the vertical position. However, since the conventional unloading and loading apparatus is configured to take out the wafer from the container in a vertical position and to load the wafer into the container in the vertical position, it is standardized to store the wafer in a horizontal position. Can not be used for containers

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an unloading and loading apparatus which can accommodate a container for storing a substrate such as a wafer in a horizontal posture.

[0007]

In order to achieve the above object, according to the present invention, there is provided an apparatus for removing a substrate from a container storing the substrate in a horizontal position, wherein the substrate is removed from the container and the substrate is placed in a horizontal position. Taking-out means for carrying the substrate to the first position while maintaining the position, and a posture for holding the substrate carried to the first position by the taking-out means, changing the posture of the substrate to a vertical posture, and carrying the substrate to the second position. A substrate unloading device is provided, comprising: a change unit; and a holding unit that receives the substrate transported to the second position by the position change unit and holds the substrate in a vertical position.

According to the first aspect of the present invention, first, the substrate is taken out of the container by the take-out means, and the substrate is transported to the first position while maintaining the horizontal posture. Next, the substrate is gripped by the posture changing means, the posture of the substrate is changed to the vertical posture, and the substrate is transported to the second position. Next, the substrate is received by the holding means, and the substrate is held in a vertical posture.

According to the first aspect of the present invention, the guide means for aligning the direction of the substrate is disposed at the first position, and the take-out means and the attitude changing means are provided. The transfer of the substrate between the two may be performed through the guide means. Then, in the unloading device, the posture of the substrate is changed from the horizontal posture to the vertical posture, and at the same time, the orientation of the substrate can be adjusted.

The specific structure of each means in the take-out device can be as follows. That is, as described in claim 3, the guide means includes a guide rotation mechanism for rotating the substrate in a horizontal posture, a height for receiving the substrate from the take-out means and a height for aligning the direction of the substrate, and the posture changing means. A structure including a guide elevating mechanism for elevating the substrate at a height at which the substrate is delivered can be employed.
According to a fourth aspect of the present invention, the take-out means includes a take-out arm for placing the substrate in a horizontal posture, and a take-out moving mechanism for moving the take-out arm between the inside of the container and the first position. It can be. Further, as described in claim 5, the posture changing means includes a posture changing gripping mechanism for gripping the substrate, a posture changing rotating mechanism for rotating the substrate to change from a horizontal posture to a vertical posture, and a posture changing holding mechanism. A configuration including a posture changing movement mechanism for moving between the first position and the second position can be provided. Further, as described in claim 6, the holding means can hold the substrate in the vertical position at the second position and can transfer the substrate to the third position. , A holding unit that holds the substrate in a vertical position, and a holding and moving mechanism that moves the holding unit between the second position and the third position. Furthermore, as described in claim 8, the container stores a plurality of substrates in a state where they are arranged in parallel in a horizontal position, and the holding unit operates in a state in which a plurality of substrates are arranged in parallel in a vertical position. It may be configured to hold.

According to a ninth aspect of the present invention, there is provided an apparatus for carrying a substrate into a container for storing the substrate in a horizontal position, the holding device holding the substrate in a vertical position, and the holding device in a second position in a vertical position. Holding the substrate, changing the posture of the substrate to a horizontal posture, receiving the substrate transported to the first position by the posture changing means for transporting the substrate to the first position, and receiving the substrate. There is provided an apparatus for carrying in a substrate, comprising a carrying-in means for carrying in a container while maintaining a horizontal posture.

In the loading device according to the ninth aspect, first, the substrate is held in a vertical posture by the holding means. Then the second
At this position, the substrate is gripped by the posture changing means, the posture of the substrate is changed to the horizontal posture, and the substrate is transported to the first position. Next, the substrate is received by the loading means, and is loaded into the container while maintaining the horizontal posture. According to the loading device of the ninth aspect, the substrate held in the vertical position by the holding means can be loaded into the container in the horizontal position.

In the loading device according to the ninth aspect, as described in the tenth aspect, the holding means can hold the substrate in the vertical position at the third position and transport the substrate to the second position. As described in claim 11, a holding portion for holding the substrate in a vertical posture, and the holding portion is positioned at a third position and at a second position.
And a holding and moving mechanism for moving between the positions. In addition, as described in claim 12, the container stores a plurality of substrates in a state of being arranged in parallel in a horizontal posture, and the holding unit operates in a state in which a plurality of substrates are arranged in parallel in a vertical posture. It can be configured to hold. Further, as described in claim 13, the attitude changing means includes an attitude changing gripping mechanism for gripping the substrate, an attitude changing rotating mechanism for rotating the substrate to change from a vertical attitude to a horizontal attitude, and an attitude changing gripping mechanism. May be provided with a posture change moving mechanism for moving the first position between the second position and the first position.

According to the present invention, there is provided a loading device.
As described in (1), guide means for aligning the direction of the substrate is arranged at the first position, and transfer of the substrate between the carrying-in means and the attitude changing means is performed via the guide means. It may be configured to be performed. Then, the posture of the substrate can be changed from the vertical posture to the horizontal posture during loading, and the orientation of the substrate can be adjusted at the same time. In this case, the guide means includes a guide rotation mechanism for rotating the substrate in a horizontal attitude, a height for receiving the substrate from the attitude changing means and a height for aligning the direction of the substrate, and a guide means for transferring the substrate to the loading means. A structure including a guide elevating mechanism for elevating the substrate at the transfer height can be provided.

Further, as set forth in claim 16, the carrying-in means comprises a take-out arm for placing the substrate in a horizontal posture, and a carry-in moving mechanism for moving the take-out arm between the first position and the inside of the container. Can be provided.

Next, in a seventeenth aspect, there is provided an apparatus for removing a substrate from a container storing the substrate in a horizontal position and loading the substrate into the container, wherein the substrate is removed from the container and the substrate is maintained in a horizontal position. Removing and carrying means for receiving the substrate carried to the first position by the posture changing means and carrying the substrate into the container while maintaining the horizontal posture, An operation of holding the substrate conveyed to the first position by the unloading / introducing means, changing the posture of the substrate to a vertical posture, conveying the substrate to the second position, and carrying the substrate conveyed to the second position by the holding means And a posture changing means for changing the posture of the substrate to a horizontal posture and carrying the substrate to the first position, and receiving the substrate conveyed to the second position by the posture changing means, and And a holding means for holding the substrate in a vertical position and transferring the substrate to a position changing means in a second position. Is done.

In the take-out / in device of claim 17, when taking out the substrate from the container, the substrate is first taken out from the container by the take-out / injection means, and the substrate is kept in the horizontal position to the first position. Transport. Next, the substrate is gripped by the posture changing means, the posture of the substrate is changed to the vertical posture, and the substrate is transported to the second position. Next, the substrate is received by the holding means, and the substrate is held in a vertical posture. When the substrate is carried into the container, the substrate is first held in a vertical position by the holding means. Then the second
At this position, the substrate is gripped by the posture changing means, the posture of the substrate is changed to the horizontal posture, and the substrate is transported to the first position. Next, the substrate is received by the unloading and loading means, and is loaded into the container while maintaining the horizontal posture.
As described above, according to the unloading and loading device of the seventeenth aspect, the substrate stored in the container in the horizontal position can be transferred to the second position and held in the vertical position, and vice versa. The substrate held in the vertical position by the holding means at the position 2 can be carried into the container in the horizontal position.

In the take-out / in device of claim 17,
19. A guide means for aligning a direction of a substrate is arranged at the first position, and the transfer of the substrate between the unloading / introducing means and the posture changing means is performed by the guide. It may be configured to be performed via means. Then, the posture of the substrate can be changed from the horizontal posture to the vertical posture in the unloading and carrying device, and at the same time, the orientation of the substrate can be adjusted.

The specific structure of each means in the take-out / in device can be as follows. That is,
20. The apparatus according to claim 19, wherein the guide means includes a guide rotation mechanism for rotating the substrate in a horizontal position, a height for receiving the substrate from the unloading means and a height for aligning the direction of the substrate, and a position changing means for the position changing means. A structure including a guide elevating mechanism for elevating the substrate at a transfer height can be employed. According to a twentieth aspect of the present invention, the unloading and loading means includes an unloading arm for placing the substrate in a horizontal posture and an unloading and loading moving mechanism for moving the unloading arm between the inside of the container and the first position. It can be provided with a configuration.
Further, as described in claim 21, the posture changing means includes a posture changing gripping mechanism for gripping the substrate, a posture changing rotating mechanism for rotating the substrate to change from a horizontal posture to a vertical posture, and a posture changing gripping mechanism. May be provided with a posture changing movement mechanism for moving the first position between the first position and the second position. In addition, as set forth in claim 22, the holding means holds the substrate in the vertical position at the second position and transports the substrate to the third position, and the substrate holds the substrate in the vertical position at the third position. And holding the substrate in a vertical position, and holding the substrate in the second position.
And a third moving mechanism for moving between the third position and the third position. Further, as described in claim 24, the container stores a plurality of substrates in a state where they are arranged in parallel in a horizontal position, and the holding unit stores the plurality of substrates in a state in which the substrates are arranged in parallel in a vertical position. It may be configured to hold.

[0020]

Embodiments of the present invention will be described below. The present embodiment relates to a cleaning system configured to consistently perform wafer loading, cleaning, drying, and unloading in a container unit in a unit of a container, and an unloading unit provided as a component of the cleaning system. The present invention relates to a configuration of a loading device. FIG. 1 is a perspective view of a cleaning system 1 provided with an unloading and carrying device according to a preferred embodiment of the present invention.

The cleaning system 1 includes a wafer W before cleaning.
The loading / unloading unit 3 for loading the container 2 containing the wafers W in a horizontal posture, storing the washed wafer W in the container 2 again, and carrying out the wafer W.
And a plurality of sheets (for example, 50 sheets for two containers 2)
The wafer W can be roughly divided into two portions of the cleaning processing section 4 for cleaning and drying the wafers W collectively in a batch system.

As shown in FIG. 2, the loading / unloading section 3 has a loading section 5 for positioning a container 2 containing, for example, 25 wafers W at a predetermined position and loading it. The wafer W stored in the mounted container 2 in a horizontal posture is taken out of the container 2 and inserted into the cleaning processing unit 4, and the wafer W returned from the cleaning processing unit 4 after the cleaning processing is completed is set on the mounting unit. A take-in / carry-in device 6 is provided for carrying the container 2 mounted on the container 5 in a horizontal posture again.

The cleaning unit 4 has a transfer device 10 arranged on the front side (the front side in FIG. 1), and the transfer device 10 is slidable along the longitudinal direction of the cleaning system 1. . The transfer device 10 is equipped with a wafer chuck 11. The wafer chuck 11 of the transfer device 10 collectively holds and moves two (for example, 50) wafers W of the container 2. Thus, it is possible to transfer the wafers W from the unloading and carrying-in device 6 to the cleaning processing unit 4 at a time. Further, after a predetermined cleaning process is completed in the cleaning processing unit 4, the unloading and loading device 6 is removed from the cleaning processing unit 4.
Can be returned to the wafer W again.

In the illustrated cleaning section 4, a wafer W is cleaned by using a cleaning liquid and a cleaning tank 12 for cleaning and drying the wafer chuck 11 of the transfer apparatus 10 in order from the left side, and further purified water. Cleaning tanks 13 to 15 for rinsing and cleaning, and drying tanks 16 for drying the wafer W from which impurities have been removed in each of the cleaning tanks 13 to 15 using, for example, isopropyl alcohol (IPA) vapor are arranged. ing.

The above arrangements and combinations of cleaning tanks can be arbitrarily combined depending on the type of processing and cleaning of the wafer W. For example, you can reduce a certain washing tank,
Conversely, another cleaning tank may be added.

Next, the configuration of the take-out / in device 6 of the cleaning system 1 according to the embodiment of the present invention will be described.

First, as shown in FIG. 2, slots 19 formed in steps are provided on the inner surface of the container 2 mounted on the mounting portion 5 to support the wafer W in a horizontal posture. An opening 20 is provided on the front surface of the container 2. Through the opening 20, an unloading and loading device 6 described later
Is configured to take out the wafer W from the container 2 while keeping the wafer W in a horizontal position, and re-load the wafer W into the container 2 in a horizontal position.

As shown in FIG. 3, convex portions 21 are arranged at three places on the upper surface of the mounting portion 5, and the convex portions 21 are provided on the bottom surface of the container 2.
Three concave portions (not shown) corresponding to 1 are arranged. Then, the concave portion arranged on the bottom surface of the container 2 is fitted from above onto the convex portion 21 arranged on the upper surface of the placing portion 5, thereby placing the container 2 at a predetermined position on the placing portion 5. It has become. In this way, when the container 2 is placed at a predetermined position on the placement unit 5, the opening 20 is configured to be at a front position with respect to the unloading / transporting conveyance 40 provided in the unloading / receiving device 6. ing.

As shown in FIG. 4, on both sides of the upper surface of the mounting portion 5, a column 22 a and a column 23 a are provided on one side (left side in FIG. 4), and a column 22 b and column 23 b are provided on the other side (right side in FIG. 4). Has been fixed. A light emitting portion 24a composed of a light emitting element or the like is provided at the upper ends of the support 22a and the support 23a.
And a light-emitting portion 25a, respectively. Similarly, a light-receiving portion 24b and a light-receiving portion 25b each composed of a light-receiving element and the like are provided at the upper ends of the columns 22b and 23b, respectively. The light emitting unit 24a and the light receiving unit 24b and the light emitting unit 25a and the light receiving unit 25b are configured to be a sensor set for detecting the positioning of the container 2 placed on the placing unit 5. When the container 2 is positioned and placed at a predetermined position on the mounting portion 5 by the above-described protrusion 21, the light emitted from the light emitting portion 24 a emits light from the side surface 27 of the container 2.
And is not detected by the light receiving unit 24b. Since the detection of the light receiving portion 24b is not performed, the container 2
Is placed on the placement unit 5. On the other hand, windows 26 are provided on both left and right side surfaces 27 of the container 2, respectively. When the container 2 is positioned at the predetermined position of the mounting portion 5 by the above-mentioned convex portion 21 and mounted,
The light emitted from the light emitting unit 25a passes through the window 26 and is detected by the light receiving unit 25b. By performing the detection by the light receiving section 25b, it is recognized that the container 2 is at a predetermined position. In this manner, the container 2 is recognized as being placed at a predetermined position on the placement unit 6 based on the presence or absence of detection by the two sensor sets.

As shown in FIG. 4, a sensor block 28a and a sensor block 28b are arranged on the upper surface of the mounting portion 5 with the opening 20 of the container 2 being interposed therebetween.
On the inner surface of the sensor block 28a, there are provided a light-emitting unit 29a and a light-emitting unit 30a composed of light-emitting elements and the like. On the other hand, on the inner surface of the sensor block 28b, a light-receiving unit 29b composed of a light-receiving element and the like is provided. And a light receiving section 30b. The light emitting section 29a and the light receiving section 29b and the light emitting section 30a and the light receiving section 30b constitute a sensor group. The light emitting section 29a and the light receiving section 29b sense the front end of the wafer W stored in the slot 19 of the container 2 as shown in FIG. When the wafer W is stored in the container 2, the light emitting unit 29
The light emitted from a is blocked by the wafer W, and the light receiving unit 29b cannot detect the light. Thus, the configuration is such that it is detected that the wafer W is stored in the slot 19. The light emitting unit 30a and the light receiving unit 30
“b” senses a portion slightly away from the front end of the wafer W stored in the slot 19 of the container 2. When the wafer W is projected from the slot 19, the light emitted from the light emitting unit 30a is blocked by the projected wafer W, and the light receiving unit 30b cannot detect the light. Thereby, it is configured to detect the protrusion of the wafer W from the slot 19.

As shown in FIG. 2, the sensor block 28a and the sensor block 28b are supported by an elevating member 32 which moves along a column 31 vertically provided below the mounting portion 5. The elevating member 32 is connected to a lifter 33 driven up and down by a stepping motor or the like. As the lifter 33 moves up and down, the sensor block 28a and the sensor block 28 supported by the upper end of the elevating member 32 are connected.
b moves up and down at the same time. In FIG. 2, the sensor blocks 28a and 28b indicated by solid lines have been moved to the lowest position as the lifter 33 descends. On the other hand, the sensor block 28 ′ and the sensor block 28 b ′ indicated by a dashed line in FIG. 2 have been moved to the highest position as the lifter 33 moves upward. By moving between them, the sensor block 28a and the sensor block 28b are reciprocated from below to above the container 2 by moving up and down the lifter 33 while maintaining the same height.
With this movement, the sensor blocks 28a and 28b move all the wafers W stored in the container 2 from the lowermost slot 19 to the uppermost slot 19.
Are scanned to detect the number of wafers W stored in the container 2 and the presence or absence of the wafer W jumping out of the container 2.

Next, as shown in FIG. 3, the take-out / transport device 6 according to the present embodiment comprises take-out and carry-in means 40, guide means 41, attitude changing means 42, and holding means 43.

The unloading and loading means 40 moves the wafer W from the container 2
Is taken out, and the wafer W is transported to the first position A while maintaining the horizontal attitude, and the wafer W transported to the first position A by the attitude changing means 42 described later is guided through the guide means 41. Then, an operation of receiving the wafer W in a horizontal posture and carrying the wafer W into the container 2 while maintaining the wafer W in the horizontal posture is performed.

As shown in FIG. 5, the take-out transport means 40
A motor 50, a casing 52 containing the motor 51,
A rotary disk 54 is provided on the upper portion of the casing 52 and is rotatable in the direction of an arrow 53. An arm body 55 is provided on the upper surface of the rotary disk 54.

As shown in FIG. 6, a bracket 56 is mounted below the casing 52. The bracket 56 is a screw shaft 58 which is rotated by the power of a motor 57.
Is screwed into. By the rotation of the motor 57, the bracket 56 screwed to the screw shaft 58 moves up and down. Thus, the casing 52 and the entire arm main body 55 installed on the upper surface of the casing 52 are configured to move up and down with the rotation of the motor 57. Arm body 55 shown by a solid line in FIG.
Indicates a state in which the motor 57 has been moved to the lowest position by rotational driving. On the other hand, the arm main body 55 'indicated by a two-dot chain line in FIG. 6 shows a state where the arm main body 55' has been moved to the highest position by the rotational driving of the motor 57. By moving between these, the main body 55 of the arm
The container 2 can be moved to a predetermined height corresponding to each slot 19 and to a height at which a wafer W is transferred between guide means 41 to be described later.

As shown in FIG. 5, this arm body 55
Is a first arm 60 installed on the upper surface of the rotating substrate 54.
A second arm 61 connected to the tip of the first arm 60, and an unloading arm 62 connected to the tip of the second arm 61 for mounting the wafer W in a horizontal posture. ing. When the wafer W is placed on the upper surface of the extraction arm 62 in a horizontal posture,
A holding pad 63 made of a PEEK material or the like is provided so that the back surface of the wafer W does not slip as much as possible. Further, when the take-out arm 62 is made of a material such as ceramic, even if the conveyance is repeated, the take-out arm 62 itself is less bent, and the generation of particles can be prevented.

The first arm 60 and the second arm 6
1, the take-out arm 62 is configured as a telescopic horizontal articulated robot. At the base end of the first arm 60,
A rotating shaft 64 that rotates forward and backward by the power of the motor 50 is connected, and the arm body 55 expands and contracts, and the take-out arm 62 moves forward and backward by switching the rotation drive of the motor 50.

The rotating shaft 65 of the motor 51 is
4 is connected to the center of the bottom surface. Thereby, the rotating disk 5
The motor 4 is rotated by the rotation of a motor 51. In this manner, the arm main body 55 installed on the upper surface of the rotary substrate 54 connects the take-out arm 62 to the container 2.
, And the take-out arm 62 is turned 180 ° between a position facing the first position A and a position facing the side.

In FIG. 7, the arm body 5 indicated by a solid line
5 shows a state in which the take-out arm 62 is directed toward the container 2 by the rotation of the motor 51, and the arm body 55 is most contracted by the rotation of the motor 50. On the other hand, the arm body 55 ′ shown by a two-dot chain line in FIG.
The state where the take-out arm 62 has entered the container 2 is shown. As described above, when the arm body 55 is extended with the take-out arm 62 facing the container 2, the take-out arm 62
Enters the inside of the container 2, and the wafer W can be transferred between each slot 19 of the container 2 and the take-out arm 62 while keeping the horizontal posture. When the arm main body 55 expands and contracts by switching the rotation drive of the motor 50, an operation of taking out the wafer W from the container 2 and an operation of carrying the wafer W into the container 2 are performed.

The arm body 55 ″ shown by a two-dot chain line in FIG.
゜ The arm 62 turns and the take-out arm 62 is turned to the first position a.
Further, a state is shown in which the arm main body 55 is extended to the first position A by the rotational drive of the motor 50. As described above, when the arm main body 55 extends with the take-out arm 62 facing the first position A, the take-out arm 62 enters the space above the guide means 41 described later in the horizontal direction, and The wafer W can be delivered and received between the guide means 41 and the horizontal posture. Thus,
The rotation of the motor 51 causes the arm body 55 to
When the arm body 55 expands and contracts by rotating by 80 ° and further rotating by the motor 50, the wafer W placed on the take-out arm 62 is moved horizontally between the container 2 and the first position A. Can be transported to

Next, the guide means 41 is configured to adjust the orientation of the wafer W using a notch provided on the wafer W at the first position A shown in FIG.

As shown in FIG. 8, the guide means 41 is provided with a guide section 80 on which the wafer W is placed and a guide drive section 81. The transfer of the wafer W during this period is performed via the guide unit 80.

As shown in FIG. 9, on a top surface of the guide portion 80, a support table 82 for supporting a peripheral edge of the back surface of the wafer W,
A pin 83 for guiding and positioning the periphery of the wafer W supported by the support table 82 and a sensor 84 for detecting the direction of the wafer W are provided. Note that the support base 82 and the pins 83 may be made as an integrated type. As shown in FIG. 8, the guide section 80 is supported by an upper end of an elevating member 85 provided in the guide driving section 81, and a bracket 86 is mounted on the elevating member 85.
The bracket 86 is screwed to a screw shaft 88 rotated by the rotation of the motor 87, and the guide 8 supported by the elevating member 85 with the rotation of the motor 87.
0 moves up and down.

The guide portion 80 shown by a solid line in FIG.
Indicates a state in which the motor 87 has been moved to the lowest position by rotational driving. On the other hand, the guide portion 80 'indicated by a two-dot chain line in FIG. 8 shows a state where the guide portion 80' is moved to the highest position by the rotational driving of the motor 87. The guide unit 80 moves up and down between them, so that the wafer W can be exchanged with the take-out arm 62 of the take-out / transport unit 40 described above. When the guide portion 80 receives the wafer W from the take-out arm 62, the guide portion 80 is raised by the rotation of the motor 87, and the back surface of the wafer W is pushed up by the support base 82 on the upper surface of the guide portion 80 during the ascent. The portion 80 rises as it is to the position of the guide portion 80 'shown by the two-dot chain line in FIG. Thus, the guide unit 80 is in a state of receiving the wafer W from the unloading arm 62.
On the other hand, when the wafer W is transferred from the guide section 80 to the take-out arm 62, the guide section 80 is initially at the position of the guide section 80 'shown by the two-dot chain line in FIG.
The guide section 80 starts descending by the rotational driving of the.
Then, during the lowering, the back surface of the wafer W is placed on the upper surface of the take-out arm 62, and the guide portion 80 is lowered as it is to the position of the guide portion 80 shown by the solid line in FIG. As a result, the wafer W is transferred from the guide portion 80 to the upper surface of the take-out arm 62. As shown in FIG. 9, the guide portion 80 has a U-shape as a whole, and a gap 88 formed at the center thereof is configured to have a size large enough to allow the take-out arm 62 to pass therethrough. Than this,
When transferring the wafer W between the guide section 80 and the take-out arm 62, the guide section 80 can be moved up and down quickly without causing collision between the guide section 80 and the take-out arm 62. Note that the wafer W is mounted on a support table 82 installed on the upper surface of the guide portion 80, and a predetermined space is formed between the wafer W and the upper surface of the guide portion 80. The wafer W may be lifted by causing the take-out arm 62 to enter the wafer W. In that case, the gap 88 as described above can be omitted.

A motor 90 is provided on the upper surface of the guide driving section 81, and a rotating shaft 91 rotated by the power of the motor 90 supports the center of the bottom surface of the rotating disk 92. As shown in FIG. 8, the upper surface of the turntable 92 has the guide portion 80 lowered to the lowest position by the rotation of the motor 87.
Is arranged at a position higher than the upper surface of the support base 82 by a predetermined distance. As a result, when the guide portion 80 on which the wafer W is placed is lowered to the position shown by the solid line in FIG. 8, the back surface of the wafer W is pushed up from the support table 82 and is placed on the upper surface of the turntable 92. State. Then, the wafer W is rotated by rotating the motor 90 as shown in FIG. 10 in a state where the wafer W is placed on the upper surface of the rotating disk 92 in this way. Along with this rotation, the notch Wa of the wafer W is detected by the sensor 84 so that the direction of the wafer W is aligned.

Next, the attitude changing means 42 holds the wafer W, the orientation of which has been adjusted by the guide means 41 described above, at the first position A shown in FIG. 3, and changes the attitude of the wafer W. 2nd while changing from horizontal posture to vertical posture
Is carried out to the position B, and the wafer W carried to the second position B is gripped by the holding means 43 described later, and the posture of the wafer W is changed from the vertical posture to the horizontal posture while the first posture is changed. It is configured to perform an operation of transporting to the position A.

As shown in FIG. 11, the posture changing means 42
Is provided with a pair of left and right grips 101a, 101b. Support frames 102a, 102b provided on the grips 101a, 101b are movably supported on the upper surface of a support table 103. A ball screw driving unit 104 is provided on the upper surface of the support 103, and ball screws 105a extending to the left and right of the ball screw driving unit 104 are provided.
105b is screwed to the support frames 102a and 102b, respectively. Then, the ball screw driving unit 104
By the operation of, the gripping portions 101a and 101b can be simultaneously symmetrically moved left and right so as to approach and separate from each other. In addition, such a ball screw driving unit 1
Instead of the operation of the cylinder 04, the grippers 101a and 101b may be moved closer to and away from each other by the operation of the cylinder.

As shown in FIG. 11, the support frame 102
Left and right symmetric chucks 106a and 106b for gripping the wafer W are provided at the tips of the a and 102b. The holding grooves 107a and 107b for fitting the peripheral portion of the wafer W into the chucks 106a and 106b.
Are formed in the longitudinal direction of the chucks 106a and 106b. Then, as shown in FIG. 12, by operating the ball screw driving unit 104, the gripping units 101a and 101b are simultaneously approached from the left and right, so that the chuck 106 is moved.
a and 106b move to the positions of the chucks 106a 'and 106b' shown by the two-dot chain line in FIG.
Of the chuck 106a, 106b with the gripping groove 107 of the chuck 106a, 106b.
a, 107b. With this operation, the posture changing means 42 grips the wafer W. On the other hand, when the grippers 101a and 101b are simultaneously separated from the left and right by the operation of the ball screw driving unit 104 in the reverse direction from the state in which the wafer W is gripped, the chucks 106a and 106b are not shown in FIG. Are moved to the positions of the chucks 106a and 106b indicated by the solid line, and the wafer W is released.

Here, as shown in FIG. 8, the guide means 41 described above is composed of the guide portion 80 and the posture changing means 4.
The wafer W can be moved to a height at which the wafer W can be transferred between the two. That is, the guide portion 8
When the motor 0 moves to the position of the two-dot chain line guide 80 'in FIG.
The chucks 106a and 106b perform an operation of holding the wafer W placed on the
An operation of receiving the wafer W held by the guide b by the guide unit 80 is performed.

Further, as shown in FIG.
a, 101b, covers 108a,
108b, these covers 108a,
The rotating shaft 110 of the motor 109 is passed through 108b. As shown in FIG. 13, the power of the motor 109 is transmitted to the rotation transmitting section 111 formed inside these, and the chucks 106a and 106b rotate simultaneously. Here, the rotation transmitting portion 111 formed inside the grip portion 101a and the rotation transmitting portion 111 formed inside the grip portion 101b have the same configuration. 111 will be described.

As shown in FIG. 13, pulleys 112, 113, and 114 are provided inside the holding portion 101a.
, And an endless belt 116 is wound around the pulleys 113 and 114. The rotational power of the rotating shaft 110 of the motor 109 described above is transmitted to the pulley 112, and the power of the motor 109 is transmitted to the pulley 11.
2, endless belt 115, pulley 113, endless belt 11
6, transmitted to the chuck 106a via the pulley 114, and the chuck 106a is configured to rotate. Since the rotation transmitting section 111 formed inside the grip section 101b has the same configuration, the chucks 106a and 106b are simultaneously rotated by the rotation of the motor 109.

The chuck 106 shown by a solid line in FIG.
A (106b) shows a state where the wafer W is gripped in a horizontal posture. On the other hand, the chuck 106a '(106b') shown by a two-dot chain line in FIG. 13 shows a state where the wafer W is gripped in a vertical posture. Then, the rotation of the motor 109 causes the chucks 106a, 1
06b is capable of converting the attitude of the wafer W into a horizontal attitude and a vertical attitude by rotating between them. In order to confirm the vertical posture of the wafer W, a light emitting unit 117 is provided at the tip of the support frame 102a as shown in FIG.
A light receiving unit 118 is installed at the tip of b. When the wafer W held by the posture changing unit 42 is in the vertical posture, the light emitted from the light emitting unit 117 is blocked by the wafer W, and the light receiving unit 118 cannot detect the light. Thereby, it is configured to detect that the wafer W is in the vertical posture.

As shown in FIG. 11, a ball screw shaft 121 of the motor 120 is screwed on the side surface of the support 103. The rotation of the motor 120 causes the support base 1 to rotate.
03 moves in the left-right direction along the partition wall 122, whereby the wafer W gripped by the posture changing means 42 is transferred between the first position A and the second position B shown in FIG. It can be made to be.

Here, FIG. 14 shows a state in which the wafer W indicated by a solid line is held in a horizontal position by the chucks 106a and 106b of the position changing unit 42 at the first position A. From this state, the posture changing means 42 can be moved to the second position B by the rotational driving of the motor 120, and the chucks 106a and 106b can be rotated from the horizontal posture to the vertical posture by the rotational driving of the motor 109. ing. A wafer W ′ indicated by a two-dot chain line in FIG. 14 indicates a state of the wafer W being moved to the second position B. During this transfer, the chuck 106 shown by a solid line in FIG.
a and 106b are chucks 1 indicated by two-dot chain lines in FIG.
06a 'and 106b'.
The attitude of the wafer W is obliquely inclined as shown by the two-dot chain line in FIG. Thereafter, the posture changing means 42 arrives at the second position B, and the chuck 106
The rotation of a and 106b ends. At this time, the wafer W is a wafer W ″ indicated by a two-dot chain line in FIG.
The chucks 106a and 106 of the posture changing means 42 as shown in FIG.
By b, it is held in the vertical posture and is transported to the second position b. When the wafer W is transported in the vertical position from the first position A to the second position B, the wafer W can be transferred between the position changing unit 42 and a holding unit 43 described later. On the other hand, the attitude changing means 42 moves from the state of the wafer W ″ indicated by the two-dot chain line in FIG. The chucks 106a and 106b can also be rotated from a vertical position to a horizontal position, and when the wafer W is transferred from the second position B to the first position B in a horizontal position. The wafer W can be transferred between the attitude changing unit 43 and the guide unit 41 described above.
Although the case where the attitude of the wafer W is changed while transferring the wafer W has been described, the wafer W may be transferred after the attitude of the wafer W is changed, or the wafer W may be transferred. After that, the attitude of the wafer W may be changed.

Next, the holding means 43 is connected to the second
At the position b, the operation of receiving the wafer W carried by the posture changing means 42 described above, holding the wafer W in the vertical posture, and carrying the wafer W to the third position c is performed.
An operation of holding the wafer W in the vertical position at the third position C and carrying the wafer W to the second position B is performed.

As shown in FIG. 15, the holding means 43 includes a holding portion 130 for holding the wafer W, a second position B, and a third position B.
Moving unit 13 for moving the holding unit 130 between the position c
1 is provided.

As shown in FIG. 15, the holding section 130 has
A predetermined number of holding grooves 132 into which the peripheral portion of the wafer W is fitted,
For example, there are provided about 50 holding stands 133. The holding table 133 is supported on the upper end of a lifting member 134.
It is supported by a lift 136 that moves up and down along 35. The elevating table 136 is screwed to a ball screw shaft 138 that is rotated by the rotation of a motor 137. The holding table 133 supported on the upper end of the elevating member 134 moves up and down with the rotation of the motor 137. Has become. The holding table 133 is connected to a rotating mechanism (not shown), and the wafer W held by the holding table 133 is held.
Can be changed 180 ° by the rotation of the rotation mechanism.

The moving section 131 has a guide wall 140.
And a motor 141 attached to the guide wall 140,
The ball screw shaft 142 is rotated by the rotation of the motor 141. A bracket (not shown) attached to the back surface of the holding member 135 is screwed to the ball screw shaft 142, and the rotation of the motor 141 causes the entire holding portion 130 to move to the second position B and the third position B. It moves between c and c.

In FIG. 16, the holding table 13 indicated by a solid line
Reference numeral 3 denotes a state in which the motor 137 has been moved to the lowest position in the second position B with the operation of the motor 137.
On the other hand, the holding table 133 'indicated by a two-dot chain line in FIG. 16 shows a state where the holding table 133' has been moved to the highest position with the operation of the motor 137 at the second position b. And
As the holding table 133 moves up and down between them,
The wafer W can be exchanged between the attitude changing unit 42 and the holding unit 43 described above. That is,
At the second position b, the holding means 43 is
When the wafer W is received from the wafer 2, the holding table 133 is moved up to the position of the holding table 133 ′ shown by a two-dot chain line in FIG.
A peripheral portion of the lower portion of the wafer W is fitted into a predetermined holding groove 132 of the holding table 133. The driving of the ball screw driving unit 104 of the attitude changing means 42 described above causes the chucks 106a and 106b of the attitude changing means 42 to move from the positions of the chucks 106a 'and 106b' indicated by the two-dot chain line in FIG. A chuck 106 indicated by a two-dot chain line in FIG.
a ", 106b". As a result, the chucks 106a and 106b release the wafer W, and the holding unit 43 receives the wafer W from the attitude changing unit 42. Thereafter, the holding table 133 is lowered to the position of the holding table 133 shown by a solid line in FIG. On the other hand, the second
In the position (b), the holding means 43 and the posture changing means 42
When the wafer W is transferred to the holding table 133 holding the wafer W by the rotation of the motor 137, as shown in FIG.
It rises to the position of the holding table 133 'shown by the two-dot chain line in the middle. Then, the chucks 106a, 106b of the posture changing means 42, which have been waiting at the second position B in advance, are driven by the ball screw driving unit 104, so that the two-dot chain line chucks 106a '', 106b shown by the two-dot chain line in FIG. From the position "", the chucks 106a ', 1 indicated by the two-dot chain line in FIG.
06b '. Then, the periphery of the wafer W is gripped by the holding grooves 107 of the chucks 106a and 106b.
a, 107b. As a result, the posture changing unit 42 holds the wafer W, and the wafer W is transferred from the holding table 133 to the posture changing unit 42. Thereafter, the holding table 133 is lowered to the position of the holding table 133 shown by the solid line in FIG.

In FIG. 17, the holding portion 130 indicated by a solid line has been moved to the second position B by the operation of the motor 141. On the other hand, the holding section 130 'indicated by a two-dot chain line in FIG. 17 shows a state in which the holding table 130 has been moved to the third position C by the operation of the motor 141. By moving the holding unit 130 between them, the wafer W can be moved to the second position B and the third position C in the vertical posture.

Now, the operation of the unloading and carrying-in device 6 according to the embodiment of the present invention configured as described above will be described based on the cleaning processing of the wafer W in the cleaning system 1 of FIG.

First, a transfer robot (not shown) mounts a container 2 containing, for example, 25 wafers W that have not been cleaned yet, at a predetermined position on the mounting portion 5 of the loading / unloading portion 3. As described above with reference to FIG. 2, the positioning with respect to the predetermined position corresponds to the three concave portions 21 provided on the bottom surface of the container 2 corresponding to the three convex portions 21 provided on the upper surface of the mounting portion 5. (Not shown) from above. The fact that the container 2 is placed at a predetermined position on the placement unit 5 is detected by the light receiving units 24b and 25b. After confirming the positioning, the sensor block 28a and the sensor block 2
8b moves up and down to scan the wafers W stored in the respective slots 19 of the container 2 and detect the number of wafers W stored in the container 2 and the presence or absence of the wafer W jumping out of the container 2. .

Next, the height of the arm main body 55 of the unloading / introducing means 40 oriented toward the container 2 is adjusted. That is, if the height of the upper surface of the take-out arm 62 is, for example,
The arm main body 55 is moved up so as to be located at a level just below the back surface of the wafer W stored in the arm. Thereafter, the arm main body 55 extends, and the take-out arm 62 is connected to the container 2.
Of the wafer W in the horizontal direction. Then, the arm body 55 slightly rises, and the back surface of the wafer W is placed on the upper surface of the take-out arm 62 with this rise, whereby the take-out arm 62 receives the wafer W from the container 2. Thereafter, the arm body 55 contracts again, and the wafer W
Is taken out of the container 2 in a horizontal posture. Then, the arm main body 55 is turned by 180 ° toward the first position A, and rises to a height at which the wafer W is transferred to the guide means 41. After that, the arm main body 55 is extended with the take-out arm 62 facing the first position A, and the take-out arm 62 on which the wafer W is placed is transferred to the first position A.
It is made to enter the space above the guide means 41 in the horizontal direction.

Next, the guide portion 80 of the guide means 42 moves up and receives the wafer W from the take-out arm 62. Thereafter, the arm body 55 contracts, and the take-out arm 62 retreats from the first position A. Then, the guide part 80 descends,
The wafer W is placed on the upper surface of the turntable 92. Then, as described above with reference to FIG. 10, the rotating plate 92 rotates, and the direction of the wafer W is adjusted by the sensor 84. After the completion of the alignment, the guide portion 80 moves up again to receive the wafer W from the rotating disk 92 and rises to a height at which the attitude changing means 42 can grip the wafer W.

Next, the posture changing means 42, which is in standby at the first position A, brings the chucks 106a and 106b closer to each other as described above with reference to FIG. And
The peripheral portion of the wafer W placed on the raised guide portion 80 is held by the holding grooves 107a of the chucks 106a and 106b.
The wafer W is held in the horizontal posture by the posture changing means 42. Thereafter, the guide section 80 descends again. Then, as described above with reference to FIG. 14, the posture changing means 42 starts moving from the first position A to the second position B, and the chucks 106a and 106b rotate 90 ° from the horizontal posture to the vertical posture. Will be. In this way, the wafer W held by the posture changing means 42 at the first position a is changed to the vertical posture, and is conveyed to the second position b.

Next, when the wafer W is transported to the second position B, the holding table 133 of the holding means 43 moved to the predetermined position of the second position B as described above with reference to FIG.
Rises. Then, the periphery of the wafer W is fitted into a predetermined, for example, the rightmost holding groove 132. Thereafter, the chucks 106a and 106b release the wafer. Then, the holding table 133 is lowered, the wafer W is held by the holding means 43, and the attitude changing means 42 returns to the first position A again. In this way, the holding means 43 receives the wafer W from the attitude changing means 42 at the second position B, and the wafer W is held on the holding table 133 in a vertical attitude.

Next, the second slot 1 from the bottom of the container 2
Similarly, a series of operations are performed on the wafer W stored in the horizontal position at 9, and the wafer W is held in the vertical position in the second holding groove 132 from the right of the holding table 133 at the second position b. Will be done. Thus, one after another the container 2
The wafers W stored in the slots 19 are sequentially fitted into the holding grooves 132, and all the wafers W stored in the container 2 in the horizontal position are held in the holding table 133 in the vertical position. become. Then, the empty first container 2 is unloaded from the cleaning system, and the second container 2 containing 25 wafers W that have not been cleaned yet is newly loaded into the cleaning system 1. All the wafers W stored in the second container 2 are similarly sequentially transported to the second position B and fitted into the holding grooves 132. Then, when a total of 50 wafers W are held on the holding table 133, the holding unit 130 holding the 50 wafers W is moved from the second position B to the third position as described above with reference to FIG. Move to Ha. Thus, the fifty wafers W held by the holding means 43 are transferred to the third position c in a vertical posture. In addition,
By rotating the holding table 133 by 180 °, the wafer W
May be freely changed for each number of wafers W or for each number of wafers W in a carrier unit. As described above, when the wafer W is transferred to the holding unit 43, the processing can be performed with the surfaces of the wafer W facing each other. The holding unit 13
By moving 0, the pitch of the wafer W held by the holding table 133 can be freely changed.

Subsequently, the wafer chuck 11 of the transfer apparatus 10 which has been already cleaned and dried in the chuck cleaning / drying tank 12 of the cleaning processing unit 4 is held at the third position C on the holding table 133. Is moved above the wafer W, and the held wafers W are collectively gripped by the wafer chuck 11 in units of 50 wafers. Then, the wafers W are maintained in the vertical posture, and the cleaning tanks 13, 14, 1 are maintained.
The cleaning is performed to remove impurities such as organic contaminants and particles attached to the surface of the wafer W sequentially. And finally, the wafer W is dried in the drying tank 16,
By being gripped and transported by the wafer chuck 11 of the transport device 10, the wafers are collectively returned to the holding table 133 in units of 50 sheets. Thus, the wafer W that has been subjected to the predetermined cleaning processing in the cleaning processing unit 4 is carried into the holding unit 43 again.

Next, as described above with reference to FIG.
The holding unit 130 holding the wafers W moves from the third position C to the second position B. Then, the holding means 43, which has moved to the predetermined position in the second position b, is
Rises to a height at which the wafer W can be delivered to the wafer.

Next, the attitude changing means 42, which has been waiting at the second position B, brings the chucks 106a and 106b closer to each other as described above with reference to FIG. And
For example, the leftmost holding groove 132 of the raised holding table 133
The peripheral portion of the wafer W fitted into the
a, 106b into the holding grooves 107a, 107b,
The wafer W is held by the posture changing means 42 in the vertical posture. Thereafter, the holding table 133 descends. Then, as described above with reference to FIG. 14, the posture changing means 42 starts moving from the second position B to the first position A, and the chucks 106a and 106b rotate 90 ° from the vertical posture to the horizontal posture. . Thus, the wafer W gripped by the posture changing means 42 at the second position B is changed to a horizontal posture, and is conveyed to the first position A.

Next, as described above, the wafer W
Is carried, the guide portion 80 of the guide means 41 rises as described above with reference to FIG. Then, the back surface of the wafer W is supported by the support 82. Then, chuck 10
6a and 106b release the wafer W, and the wafer W is placed on the guide portion 80. And the guide means 41
The take-out arm 55 that has risen to a predetermined height
The take-out arm 62 is extended in a posture facing the first position A,
The take-out arm 62 is caused to enter the horizontal direction below the raised guide portion 80. Then, as described earlier with reference to FIG.
The guide 80 descends, and the wafer W is placed on the upper surface of the take-out arm 62. Thus, the guide means 41
, The wafer W is delivered to the take-out arm 62. Note that, even after the processing, the alignment of the wafer W may be performed as needed.

Next, the extended arm main body 55 contracts, whereby the wafer W placed on the take-out arm 62 is
From the first position A in the horizontal direction. Then, the arm body 55 is rotated by 180 ° toward the container 2 and the arm body 5 is moved to a position where the wafer W moves to a height above the lowermost slot 19 of the container 2, for example.
5 moves up and down. After that, the arm body 55 extends,
The take-out arm 62 is advanced horizontally above the lowermost slot 19 of the container 2. Then, the arm main body 55 slightly descends, and with this descending, the back surface of the wafer W is placed on the upper surface of the slot 19, and the wafer W is transferred from the upper surface of the take-out arm 62 to the slot 19. As a result, the wafer W is stored in the container 2 in a horizontal posture. After that, the arm body 55 contracts again and withdraws from the container 2.

Next, a series of operations are similarly performed on the wafer W inserted vertically into the second holding groove 132 from the left of the holding table 133, and the second slot 19 Is carried in a horizontal posture. In this way, the wafers W inserted into the holding grooves 132 one after another are sequentially stored in the slots 19, and
Half of the wafer W held by 33 is carried into the container 2 in a horizontal posture. Then, the first container 2 filled with the wafer W subjected to the cleaning process is carried out of the cleaning system, and another empty container 2 is newly carried into the cleaning system 1. After that, the other half of the wafers W held by the holding table 133 are similarly sequentially loaded into the container 2. Then, the second container 2 which is full of the wafer W subjected to the cleaning process is carried out of the cleaning system.

Thus, according to the cleaning system 1 of the present embodiment, the wafer W stored in the container 2 in the horizontal position is taken out of the container 2 by the unloading / transporting device 6 and converted into the vertical position to convert the wafer W into the vertical position. 4 and the wafer W returned from the cleaning unit 4 after the completion of the cleaning process.
The posture can be changed to the horizontal posture and can be carried into the container 2 again. Therefore, it is possible to deal with the container 2 standardized so as to store the wafer W in a horizontal posture as the diameter of the wafer W increases. As a result, cleaning processing of the large wafer W becomes possible, and productivity in manufacturing semiconductor devices can be improved. As an example, the main description of the cleaning system for cleaning wafers has been given.
The present invention can also be applied to a system that handles other substrates such as an LCD substrate, or various types of unloading and carrying devices that perform other processing and the like. Further, in the example of the embodiment, the case where the loading / unloading device is installed on one side with respect to the processing unit has been described. However, the loading / unloading device for removing the substrate from the container and the loading device for loading the substrate into the container are separately configured. Even if the unloading device is installed on one side of the processing unit and the unloading device is installed on the other side, the same effect as the transport unloading device can be obtained.

[0075]

According to the unloading apparatus of the present invention, a substrate taken out of a container standardized so as to store a substrate in a horizontal position corresponding to a recently large-diameter substrate is placed in a vertical position. Can be smoothly carried into a processing unit that performs processing such as cleaning processing. Accordingly, it is possible to manufacture a semiconductor device having a large diameter.

Further, according to the loading apparatus of the present invention, the substrate unloaded from the processing section which performs the processing in the vertical position is set to the horizontal position, and the substrate is stored in the horizontal position corresponding to the recently enlarged substrate. It is possible to carry smoothly into a container standardized as described above.

Further, according to the unloading and loading apparatus of the present invention, a substrate taken out of a container standardized so as to store a substrate in a horizontal position corresponding to a substrate having a large diameter recently is placed in a vertical position. The substrate can be smoothly carried into the processing section that performs processing such as substrate cleaning processing, and the substrate unloaded from the processing section that performs processing in the vertical posture can be carried into the container in a horizontal posture.

[Brief description of the drawings]

FIG. 1 is a perspective view of a cleaning system.

FIG. 2 is a side view of a mounting portion and a container.

FIG. 3 is a plan view of a loading / unloading section.

FIG. 4 is a perspective view of a container.

FIG. 5 is a perspective view of a take-out / convey means.

FIG. 6 is a cross-sectional view illustrating a state in which the take-out / conveying means is moved up and down.

FIG. 7 is a plan view illustrating a state in which the arm body expands and contracts and turns between a container and a first position.

FIG. 8 is a side view of the guide means.

FIG. 9 is a perspective view illustrating a state of wafer transfer performed between a guide unit and a take-out arm.

FIG. 10 is a perspective view of a main part of a guide unit for performing alignment.

FIG. 11 is a perspective view of a posture changing unit.

FIG. 12 is a plan view of a posture changing unit.

FIG. 13 is a cross-sectional view of a grip.

FIG. 14 shows a state in which the wafer W held by the posture changing means is
FIG. 6 is a front view illustrating a state where the wafer W is transported between a first position and a second position and the attitude of the wafer W is changed.

FIG. 15 is a perspective view of a holding unit.

FIG. 16 is a front view illustrating a state of wafer transfer performed between the attitude changing unit and the holding unit.

FIG. 17 is an explanatory diagram illustrating a state in which the holding unit moves between a second position and a third position.

[Explanation of symbols]

 W Wafer 2 Container 6 Unloading and loading device 40 Unloading and loading unit 41 Guide unit 42 Attitude change unit 43 Holding unit 54 Extraction arm 130 Holding unit i First position b Second position c Third position

Claims (24)

[Claims] 1. An apparatus for taking out a substrate from a container storing the substrate in a horizontal position, the device taking out the substrate from the container and transporting the substrate to a first position while maintaining the substrate in a horizontal position. Gripping the substrate transferred to the first position, changing the posture of the substrate to the vertical position, and transferring the substrate to the second position, and the substrate transferred to the second position by the position changing device. A holding unit for receiving the substrate and holding the substrate in a vertical posture. 2. The method according to claim 1, wherein the transfer of the substrate between the unloading unit and the posture changing unit is performed via a guide unit disposed at a first position for aligning the direction of the substrate. The substrate unloading device according to claim 1. 3. A guide rotating mechanism for rotating the substrate in a horizontal posture, a height for receiving the substrate from the extracting unit, a height for aligning the substrate, and a height for transferring the substrate to the posture changing unit. 3. The apparatus according to claim 2, further comprising a guide elevating mechanism for elevating the substrate. 4. The take-out means includes a take-out arm on which the substrate is placed in a horizontal posture, and a take-out moving mechanism for moving the take-out arm between the inside of the container and the first position. An apparatus for removing a substrate according to claim 1. 5. A posture changing gripping mechanism for gripping a substrate, a posture changing rotation mechanism for rotating a substrate to change from a horizontal posture to a vertical posture, and a posture changing gripping mechanism for moving the posture changing gripping mechanism to a first position. 4. The apparatus according to claim 1, further comprising a posture changing movement mechanism for moving between the first position and the second position.
An apparatus for removing a substrate according to any one of items 3 and 4. 6. The apparatus according to claim 1, wherein said holding means holds the substrate in a vertical position at a second position and transports the substrate to a third position. An apparatus for removing a substrate according to any one of the above. 7. The apparatus according to claim 1, wherein said holding means includes a holding portion for holding the substrate in a vertical posture, and a holding and moving mechanism for moving the holding portion between a second position and a third position. The substrate unloading device according to claim 6. 8. The container is configured to store a plurality of substrates in a state of being arranged in parallel in a horizontal posture, and the holding unit holds a plurality of substrates in a state of being arranged in parallel in a vertical posture. Claims 1, 2, 3, 4,
8. The apparatus for removing a substrate according to any one of 5, 6, and 7. 9. An apparatus for carrying a substrate into a container for storing the substrate in a horizontal position, comprising: holding means for holding the substrate in a vertical position; and a substrate held in a vertical position by the holding member in a second position. Posture changing means for grasping, changing the posture of the substrate to a horizontal posture, and transporting the substrate to a first position;
A substrate loading apparatus, comprising: loading means for receiving a substrate transported to a first position by a posture changing means, and loading the substrate into a container while maintaining the substrate in a horizontal posture. 10. The apparatus according to claim 9, wherein said holding means holds the substrate in a vertical position at a third position and transports the substrate to a second position. 11. The apparatus according to claim 11, wherein the holding unit includes a holding unit that holds the substrate in a vertical posture, and a holding and moving mechanism that moves the holding unit between a third position and a second position. The substrate loading device according to claim 10. 12. The container stores a plurality of substrates in a state of being arranged in parallel in a horizontal position, and the holding section holds a plurality of substrates in a state of being arranged in parallel in a vertical position. 12. The method according to claim 9, 10 or 11.
The substrate loading device according to claim 1. 13. A posture changing gripping mechanism for gripping a substrate, a posture changing rotation mechanism for rotating the substrate to change from a vertical posture to a horizontal posture, and a posture changing gripping mechanism for moving the posture changing gripping mechanism to a second position. 10. The apparatus according to claim 9, further comprising a posture changing movement mechanism for moving between the first position and the second position.
13. The substrate loading device according to any one of 0, 11 and 12. 14. The method according to claim 14, wherein the transfer of the substrate between the unloading unit and the posture changing unit is performed through a guide unit disposed at a first position for aligning the direction of the substrate. 14. The substrate loading device according to claim 9, 10, 11, 12, or 13. 15. A guide rotating mechanism for rotating the substrate in a horizontal posture, a height for receiving the substrate from the posture changing unit, a height for aligning the direction of the substrate, and a height for transferring the substrate to the extracting unit. 15. The apparatus according to claim 14, further comprising a guide elevating mechanism for elevating the substrate.
The substrate loading device according to claim 1. 16. The apparatus according to claim 16, wherein said carrying means includes a take-out arm for placing the substrate in a horizontal posture, and a carry-in moving mechanism for moving the take-out arm between the first position and the inside of the container. The substrate loading device according to any one of claims 9, 10, 11, 12, 13, 14, and 15. 17. An apparatus for removing a substrate from a container storing the substrate in a horizontal position and carrying the substrate into the container, wherein the substrate is removed from the container and the substrate is kept in a first position while maintaining the horizontal position. To the first position by the attitude changing means, receiving the substrate transferred to the first position by the attitude changing means, and loading the substrate into the container while maintaining the horizontal attitude, and the first loading / unloading means. Holding the substrate transferred to the position, changing the posture of the substrate to the vertical position, transferring the substrate to the second position, and holding the substrate held in the vertical position by the holding means at the second position. Change the posture of the board to the horizontal posture,
An attitude changing means for performing an operation of transporting the substrate to the first position, an operation of receiving the substrate transported to the second position by the attitude changing means and holding the substrate in a vertical attitude; 2. An apparatus for unloading and carrying a substrate, comprising: holding means for performing an operation of transferring the substrate to the attitude changing means at the position of (2). 18. The method according to claim 18, wherein the transfer of the substrate between the unloading unit and the posture changing unit is performed via a guide unit disposed at a first position for aligning the direction of the substrate. An apparatus for unloading and carrying a substrate according to claim 17. 19. A guide rotating mechanism for rotating the substrate in a horizontal position, a guide rotating mechanism for rotating the substrate in a horizontal position, and a height for aligning the substrate with the unloading / introducing device, and a transfer between the position changing device and the substrate. 2. The apparatus according to claim 1, further comprising a guide elevating mechanism for elevating the substrate at a predetermined height.
9. The apparatus for unloading and carrying a substrate according to item 8. 20. An unloading arm for mounting a substrate in a horizontal posture, wherein the unloading and loading means includes an unloading arm in the container and a first unloading arm.
20. The apparatus according to claim 17, further comprising a take-out / carrying movement mechanism for moving the substrate to / from the position. 21. A posture changing / holding mechanism for holding the substrate, a posture changing / rotating mechanism for changing the posture from a horizontal posture to a vertical posture by rotating the substrate, and changing the posture from a vertical posture to a horizontal posture. Changing the gripping mechanism between the first position and the second position
21. The substrate taking-in / carrying device according to claim 17, further comprising a posture changing / moving mechanism for moving the substrate between the positions. 22. An operation for holding the substrate in the vertical position at the second position and transporting the substrate to the third position, and holding the substrate in the vertical position at the third position. 22. The apparatus according to claim 17, wherein an operation of transporting the substrate to a position is performed. 23. The apparatus according to claim 23, wherein the holding means includes a holding portion for holding the substrate in a vertical posture, and a holding and moving mechanism for moving the holding portion between a second position and a third position. 23. The apparatus for unloading and carrying a substrate according to claim 22. 24. The container stores a plurality of substrates in a state of being arranged in parallel in a horizontal position, and the holding unit holds a plurality of substrates in a state of being arranged in parallel in a vertical position. 18. The method according to claim 17, wherein:
24. The substrate take-out / in device according to any one of 9, 20, 21, 22, and 23.