JPH10311782A - Method and device for regulating analyzed sample - Google Patents
Method and device for regulating analyzed sampleInfo
- Publication number
- JPH10311782A JPH10311782A JP9137815A JP13781597A JPH10311782A JP H10311782 A JPH10311782 A JP H10311782A JP 9137815 A JP9137815 A JP 9137815A JP 13781597 A JP13781597 A JP 13781597A JP H10311782 A JPH10311782 A JP H10311782A
- Authority
- JP
- Japan
- Prior art keywords
- sample
- cutting
- cooling
- cooled
- analysis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Sampling And Sample Adjustment (AREA)
- Investigating And Analyzing Materials By Characteristic Methods (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、製鋼等の金属内元
素を分析するため、製鋼現場から採取したサンプル(分
析試料)を調整する方法及びその装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for preparing a sample (analytical sample) collected from a steelmaking site for analyzing elements in a metal such as steelmaking.
【0002】[0002]
【従来の技術】従来、上記のようなサンプル(以下試料
という)は、製鋼現場から気送管等により搬送されてき
た試料を人手により気送管等から取り出し、グラインダ
ー方式の切断装置で切断し発光分光分析等(発光分析)
用の試料と、その後該試料をグラインダー方式の切断機
によりコイン状の試料片にスライス切断したのち、この
試料片をプレスにより打ち抜き加工し約1g程度の小片
としてガス分析用の試料を加工,調整して得るようにし
ている。然し、上記のような人手による分析試料の製作
は非能率であり、且つ切断等の精度を得難いことから、
本出願人は先に、実開平3ー115841号公報におい
て、試料の受入装置,砥石切断装置,砥石研摩装置,搬
送装置等を個別に平面的に配置し、これらを搬送コンベ
ア等のハンドリング装置で有機的に結合した分析試料加
工装置を提示した。2. Description of the Related Art Conventionally, the above-mentioned sample (hereinafter referred to as "sample") is obtained by manually removing a sample carried from a steelmaking site by a pneumatic tube or the like from the pneumatic tube or the like, and cutting the sample with a grinder type cutting device. Emission spectroscopy (emission analysis)
Sample, and then slice the sample into coin-shaped sample pieces with a grinder-type cutting machine, and then punch out this sample piece with a press to process and adjust a sample for gas analysis as a small piece of about 1 g. And try to get it. However, the production of an analysis sample by hand as described above is inefficient, and it is difficult to obtain precision such as cutting.
The present applicant previously disclosed in Japanese Utility Model Laid-Open No. 3-1155841, a sample receiving device, a grindstone cutting device, a grindstone polishing device, a transport device and the like were individually and planarly arranged, and these were handled by a handling device such as a transport conveyor. An organically coupled analytical sample processing device was presented.
【0003】[0003]
【発明が解決しようとする課題】然し、上記のような構
成による分析試料加工装置は、専ら単一の試料、例えば
発光分析試料のみを作成することを目的として開発され
たものであり、異なった種類の分析に用いる複数の分析
試料、例えば発光分析試料とガス分析試料を同時に作成
することが不可能であった。また一般的に、分析試料は
テーパ台形状に形成された試料の径大な湯口側を切断し
て使用するため、小径部側を確実に把持する必要がある
が、上記した分析試料加工装置はかかる配慮を何らなさ
れておらず、試料を不安定な状態で搬送し加工を行うも
ので試料精度に問題があった。However, the analytical sample processing apparatus having the above-described configuration has been developed exclusively for producing a single sample, for example, only an luminescence analysis sample. It has been impossible to simultaneously prepare a plurality of analysis samples used for various types of analysis, for example, an emission analysis sample and a gas analysis sample. In addition, in general, the analysis sample is used by cutting the large-diameter gate side of the sample formed in a tapered trapezoidal shape, so it is necessary to securely grip the small-diameter portion side. No consideration has been given to this, and the sample is transported and processed in an unstable state, and there is a problem in sample accuracy.
【0004】さらに、1000℃〜900℃の赤熱状態
で送られてくる試料の切断は赤熱温度域で鋸刃板カッタ
ー(又はグラインダーカッタ)によって切断する手段、
或いは上記温度域から250℃〜常温域に一挙に冷却し
てグラインダーカッターによって切断する等の切断手段
が行われるが、前者による場合には高温と高粘性によっ
てカッターの刃が早期に劣化したり目詰まりすると共
に、以後の徐冷によって粗大で不均一なパーライト組織
になり易く、分析時に照射されるレーザー光による成分
把握を正確に行うことができない等の欠点がある。また
後者による場合には、試料が焼入れ状態になり焼割れ等
を生じ易いと共に切断に時間を要すること、及びグライ
ンダーカッター切断時にコンタミを伴う等の欠点があ
る。[0004] Further, the cutting of a sample sent in a red heat state of 1000 ° C to 900 ° C is performed by means of a saw blade plate cutter (or a grinder cutter) in a red heat temperature range.
Alternatively, cutting means such as cutting at once from the above temperature range to 250 ° C. to a normal temperature range and cutting with a grinder cutter is performed. However, in the former case, the high temperature and high viscosity cause the blade of the cutter to be deteriorated at an early stage. In addition to clogging, there is a drawback that a coarse and uneven pearlite structure is liable to be formed by subsequent slow cooling, and it is not possible to accurately grasp the components by a laser beam irradiated at the time of analysis. In the case of the latter, there are disadvantages in that the sample is hardened and quenching cracks and the like are likely to occur, and it takes time to cut, and there is contamination in cutting the grinder cutter.
【0005】[0005]
【課題を解決するための手段】上記問題点を解決するた
めに本発明の分析試料の調整方法は、第1に、赤熱状態
で供給される試料Sを、第1冷却装置2aによって40
0℃〜600℃程度に急冷したのち切断装置4によって
湯口部を切離すると共に、切断後の試料S2を第2冷却
装置2bによって50℃〜20℃程度に冷却したのち研
削装置5によって試料面を研削することを特徴としてい
る。In order to solve the above-mentioned problems, the method for preparing an analysis sample according to the present invention is as follows.
After being rapidly cooled to about 0 ° C. to 600 ° C., the sprue is cut off by the cutting device 4 and the cut sample S2 is cooled to about 50 ° C. to 20 ° C. by the second cooling device 2b, and then the sample surface is cut by the grinding device 5. It is characterized by grinding.
【0006】第2に、1次冷却された試料Sを、第1搬
送装置3のチャック35で把持したまま切断及び冷却並
びに試料面の研削を行わせることを特徴としている。The second feature is that the primary cooled sample S is cut and cooled and the sample surface is ground while being held by the chuck 35 of the first transfer device 3.
【0007】第3に、試料Sを切断装置4で2次切断す
ることにより試料片S3を形成し、該試料片S3をパン
チャー7に移送してガス分析用の試料S4を形成するこ
とを特徴としている。Third, a sample S3 is formed by cutting the sample S secondarily by the cutting device 4, and the sample S3 is transferred to the puncher 7 to form a sample S4 for gas analysis. And
【0008】第4に、試料Sの切断を行う前工程で試料
Sを加熱装置9で加熱昇温させて切断することを特徴と
している。A fourth feature is that the sample S is heated and heated by the heating device 9 and cut in a pre-process in which the sample S is cut.
【0009】そして本発明の分析試料の調整装置は、赤
熱状態で送給される試料Sを受け入れて1次冷却を行う
冷却装置2aと、該冷却装置2aによって冷却された試
料Sを切断する切断装置4と、切断された試料S2の2
次冷却を行う第2冷却装置2bと、2次冷却が行われた
試料S2を研削する研削装置5とを、第1搬送装置3に
よる搬送経路中に設けると共に、該第1搬送装置3の搬
送経路に、試料Sを第2次切断することによって得られ
る試料片S3を第2搬送装置8を介して打ち抜くパンチ
ャー7を併設することを特徴としている。The apparatus for preparing an analysis sample according to the present invention includes a cooling device 2a for receiving a sample S sent in a red hot state and performing primary cooling, and a cutting device for cutting the sample S cooled by the cooling device 2a. Apparatus 4 and 2 of cut sample S2
A second cooling device 2b for performing the secondary cooling and a grinding device 5 for grinding the sample S2 subjected to the secondary cooling are provided in the transport path of the first transport device 3, and the transport of the first transport device 3 is performed. A puncher 7 for punching out a sample piece S3 obtained by secondarily cutting the sample S via a second transfer device 8 is provided along the path.
【0010】また、試料S2を研削する研削装置5を、
縦軸回転を行うカッタホルダ53の上部外周に一枚の円
弧状の切刃52を設けて構成することを特徴としてい
る。A grinding device 5 for grinding the sample S2 is
It is characterized in that a single arc-shaped cutting blade 52 is provided on the outer periphery of the upper part of a cutter holder 53 that rotates in the vertical axis.
【0011】[0011]
【発明の実施の形態】本発明の一実施形態を図面に基づ
いて説明する。図1〜図4に示す分析試料調整装置(調
整装置)Aは、機体1の左側から自動供給又は手差し等
による手動供給による試料Sを自在に受け入れる受入装
置(自動受入冷却装置)2と、この受入装置2内に形成
された後述する冷却部(第1冷却部)2a内から上記試
料Sを取り出して反転姿勢に変姿させる継送装置3a
と、該継送装置3aから変姿された試料Sを受け継いで
右方に搬送する第1搬送装置(X−Z軸ハンドリング装
置)3とを横方向に並設し、この第1搬送装置3は、横
フレーム3Fに横リニアガイド3Rを介し横方向(X
軸)に往復移動可能に支持すると共に縦リニアガイド3
Tを介し縦方向(Z軸)に往復移動可能に支持されてい
る。An embodiment of the present invention will be described with reference to the drawings. An analysis sample adjusting device (adjusting device) A shown in FIGS. 1 to 4 includes a receiving device (automatic receiving cooling device) 2 that freely receives a sample S from the left side of the machine body 1 by automatic supply or manual supply by manual feeding or the like. A transfer device 3a that takes out the sample S from a cooling unit (first cooling unit) 2a, which will be described later, formed in the receiving device 2 and transforms the sample S to an inverted posture.
And a first transporting device (XZ axis handling device) 3 that inherits the transformed sample S from the relaying device 3a and transports the sample S rightward, and is arranged side by side in the horizontal direction. Is connected to the horizontal frame 3F via the horizontal linear guide 3R in the horizontal direction (X
Shaft) and a vertical linear guide 3
It is supported so that it can reciprocate in the vertical direction (Z axis) via T.
【0012】そして、この第1搬送装置3の横フレーム
3Fの前面側には、該第1搬送装置3で搬送される試料
Sを第1切断及び第2切断との複数段の切断を行うこと
によって、発光分光分析用の試料S2並びにガス分析用
の試料片S3とを得る切断装置4と、第2切断後の発光
分光分析用の試料S2を再冷却する冷却部(第2冷却
部)2bと、第2冷却後の試料S2を表面切削(研磨し
てもよい)する研削装置5と、研削後の試料S2を第1
搬送装置3から受け継いで機外(例えば発光分光分析工
程等)に取り出し搬送する取出排出装置6等を横一列状
に配置している。On the front side of the horizontal frame 3F of the first transport device 3, the sample S transported by the first transport device 3 is cut in a plurality of stages including a first cut and a second cut. , A cutting device 4 for obtaining a sample S2 for emission spectroscopy and a sample piece S3 for gas analysis, and a cooling unit (second cooling unit) 2b for recooling the sample S2 for emission spectroscopy after the second cutting. A grinding device 5 for cutting (or polishing) the surface of the sample S2 after the second cooling;
The take-out / discharge devices 6 and the like that take over the transfer device 3 and take it out of the machine (for example, in an emission spectroscopic analysis process) are arranged in a horizontal row.
【0013】また横フレーム3の前面で研削装置5の上
手側には、第2切断で得られた試料片S3をガス分析用
の試料S4に打ち抜くパンチャー(プレス)7と、該試
料S4を取出収容する収容部7aと打ち抜き後の試料片
S3を排出するシュータ7bとを配置し、これらの間に
上記切断装置4によって切断された試料片S3を受け取
ってパンチャー7に渡すと共に、打ち抜き後の試料片S
3をシュータ7bに放出する第2搬送装置(ロボットハ
ンド)8を設けて構成している。On the front side of the horizontal frame 3 and on the upstream side of the grinding device 5, a puncher (press) 7 for punching a sample S3 obtained by the second cutting into a sample S4 for gas analysis, and the sample S4 are taken out. A housing section 7a for housing and a shooter 7b for discharging the punched sample piece S3 are arranged, and the sample piece S3 cut by the cutting device 4 is received and passed to the puncher 7 between them. Piece S
A second transfer device (robot hand) 8 that discharges 3 to the shooter 7b is provided.
【0014】また以上のようなレイアウトからなる本発
明に係わる調整装置Aは、図5に示すように受入装置2
と切断装置4との間において継送装置3aのチャック3
3のハンドリング軌跡内に、低温状態で供給される試料
Sに対し補助的に加熱昇温を行う加熱装置9を並設して
おり、これによって低温状態の試料Sをチャック33に
よって加熱装置9に移送し所定の温度に自在に昇温させ
て、以後に行われる切断等の加工を能率よく良好に行う
ことができるようにしている。The adjusting device A according to the present invention having the above-mentioned layout has a receiving device 2 as shown in FIG.
Between the cutting device 4 and the transfer device 3a
A heating device 9 for supplementarily heating and raising the temperature of the sample S supplied in a low temperature state is provided in the handling locus of No. 3 so that the sample S in the low temperature state is supplied to the heating device 9 by the chuck 33. It is transported and freely heated to a predetermined temperature so that the subsequent processing such as cutting can be performed efficiently and favorably.
【0015】この実施形態において上記加熱装置9は誘
導電流によって試料Sを加熱させる高周波加熱方式とし
ており、この加熱コイル90は試料Sを加熱間隙を有し
て上下方向に嵌挿可能とするようにリング状に形成して
いる。1cは上記各装置の以下に説明する動作を自動的
に行わせると共に、手動による任意動作を自在に操作す
ることができる操作盤である。In this embodiment, the heating device 9 is of a high-frequency heating type for heating the sample S by an induced current, and the heating coil 90 has a heating gap so that the sample S can be inserted vertically. It is formed in a ring shape. Reference numeral 1c denotes an operation panel capable of automatically performing the operation described below of each of the above devices and freely operating any manual operation.
【0016】そして、この調整装置Aは、図11の動作
フローチャート及び図13の工程図(動作タイムチャー
ト)で示す手順によって各装置が所要時間だけ作動され
ることによって、炉から取り出されて送給される赤熱状
態(赤熱鋼材等)の試料Sを、図12で示す各形状の試
料S2及びS4等を能率よく的確に得るように各調整加
工することができるようにしている。尚、図示例による
試料Sは、受入れ時に900℃程度に加熱されている円
錐台形状の赤熱綱ボンブ試料を示し、この標準的な大き
さは、小径部が直径33ミリ程度,径大部(湯口部)が
直径38ミリ程度,長さが55ミリ程度のものであり、
試料材質は炭素鋼、合金鋼、ステンレス鋼等からなる。The adjusting device A is taken out of the furnace and fed when the respective devices are operated for a required time according to the procedure shown in the operation flowchart of FIG. 11 and the process chart (operation time chart) of FIG. The sample S in a red-hot state (a red-hot steel material or the like) can be subjected to each adjustment processing so as to efficiently and accurately obtain the samples S2 and S4 of the respective shapes shown in FIG. The sample S in the illustrated example shows a frustoconical bomb sample in the shape of a truncated cone heated to about 900 ° C. at the time of receiving. The standard size is such that the small diameter part is about 33 mm in diameter and the large diameter part ( (Gate) is about 38 mm in diameter and about 55 mm in length,
The sample material is made of carbon steel, alloy steel, stainless steel, or the like.
【0017】次に、図1〜図3並びに図4〜図6を参照
し上記調整装置Aの各装置2〜8について詳細な構成及
び作用について説明する。 〔受入装置2について〕図4,図5に示すように受入装
置2は、気送管20の下方に所定間隙を有して第1冷却
装置2aを椀型の支持筒21の上部に設け、該支持筒2
1内の底壁の央部には押上シリンダ22と、その側方に
排水口21aとガス抜孔21bとを設けている。また上
記第1冷却装置2aは、冷却水を送給する冷却ノズル2
3,23aを上下段に有しており、その水路23bを環
状溝孔に形成した冷却筒23cの内部に、該水路23b
に通ずる複数のノズル孔25aを穿設し冷却室21cを
形成するガイド筒25を嵌挿しており、該ガイド筒25
の下部内には前記押上シリンダ22の頭部を上下動可能
に挿入している。Next, referring to FIGS. 1 to 3 and FIGS. 4 to 6, the detailed configuration and operation of each of the devices 2 to 8 of the adjusting device A will be described. [Receiving device 2] As shown in FIGS. 4 and 5, the receiving device 2 has a first cooling device 2a provided above a bowl-shaped support cylinder 21 with a predetermined gap below a pneumatic tube 20; The support cylinder 2
A push-up cylinder 22 is provided at the center of the bottom wall in 1, and a drain port 21a and a gas vent 21b are provided on the side. Further, the first cooling device 2a includes a cooling nozzle 2 for supplying cooling water.
3, 23a in the upper and lower stages, and a water passage 23b is provided inside a cooling cylinder 23c formed in an annular slot.
A plurality of nozzle holes 25a are formed, and a guide tube 25 that forms the cooling chamber 21c is fitted therein.
The head of the push-up cylinder 22 is inserted into the lower portion so as to be vertically movable.
【0018】この構成によって受入装置2は、気送管2
0或いは取出間隙を介して手差し供給される試料Sを、
冷却室21c内で押上シリンダ22が下降した位置にお
いて、径大な湯口部を上向きにした実線姿勢に受け止め
保持したのち、押上シリンダ22の上昇動作によって点
線で示す受渡し姿勢に持ち上げられる間において、冷却
室21cのノズル孔25aからシャワー状に噴出する冷
却水によって全周を均等に急冷するようにしている。こ
の1次冷却によって試料Sは、受入時の赤熱材状態の温
度900℃〜1000℃程度から400℃〜600℃程
度に良好に急冷されて、組織構成を微細なパーライト組
織にされるので、この調整装置Aによって得られた試料
の分析試験等を適正条件下で精度よくデーター把握する
ことができると共に、例えば900℃から100℃以下
程度に一挙に急冷すると、炭素(C)等一部の元素特性
により鋼の硬度が上昇し鋸刃カッターによる切断が不能
になる試料Sが発生するものであるが、上記冷却手段に
よれば後述するように鋸刃カッターによる切断を良好に
行うことができる等の利点を創出可能となる。尚上記冷
却を行う際に、試料Sを適宜な手段で縦軸中心に回転さ
せることによって冷却を均一に行うようにしてもよい。With this configuration, the receiving device 2 is connected to the pneumatic tube 2
0 or the sample S manually supplied through the removal gap,
At the position where the lifting cylinder 22 is lowered in the cooling chamber 21c, after receiving and holding the large-diameter gate section in the solid line posture with the upward facing, the cooling operation is performed while the lifting cylinder 22 is lifted to the delivery posture indicated by the dotted line by the ascending operation. The entire circumference is rapidly and uniformly cooled by the cooling water spouting from the nozzle hole 25a of the chamber 21c in a shower shape. By this primary cooling, the sample S is rapidly cooled from the temperature of about 900 ° C. to 1000 ° C. in the state of the glowing material at the time of receiving to about 400 ° C. to 600 ° C., and the microstructure becomes a fine pearlite structure. Analytical tests and the like of the samples obtained by the adjusting device A can be accurately grasped under appropriate conditions, and when quenched from 900 ° C. to 100 ° C. or less at once, some elements such as carbon (C) can be obtained. Although the hardness of the steel is increased due to the characteristics, a sample S that cannot be cut by the saw blade cutter is generated. However, according to the cooling unit, the cutting by the saw blade cutter can be performed well as described later. The advantage of can be created. When the cooling is performed, the cooling may be performed uniformly by rotating the sample S about the vertical axis by an appropriate means.
【0019】〔継送装置3aについて〕図4〜図5に示
すように、継送装置3aは縦軸を中心に略90度往復動
旋回可能なロータリアクチェータ30に継送シリンダ3
1を支持すると共に、該継送シリンダ31の進退動作用
ピストンの頭部に、受入装置2で取出姿勢にされた試料
Sを嵌挿するガイド筒32を取付杆32aを介して取付
けた状態で、該ガイド筒32内の試料Sを両側から把持
するチャック33を設け、且つ両者を反転機構34を介
し、図6に実線で示す取出姿勢から点線で示す継送姿勢
に反転変姿可能に構成している。[Relaying Device 3a] As shown in FIGS. 4 and 5, the relaying device 3a is provided with a rotary cylinder 3 which is capable of reciprocatingly rotating about 90 degrees about a vertical axis.
1 and a guide cylinder 32 into which the sample S, which has been taken out by the receiving device 2, is fitted via a mounting rod 32 a to the head of a piston for reciprocating operation of the transfer cylinder 31. A chuck 33 for gripping the sample S in the guide tube 32 from both sides is provided, and both of them can be inverted and transformed from a take-out posture shown by a solid line in FIG. doing.
【0020】これにより、継送装置3aは図4に示すよ
うに第1冷却装置2aで取出姿勢にされている試料S
を、ガイド筒32内に挿入した状態においてチャック3
3によって的確に把持し、且つ反転させながら縦軸旋回
させて後述する第1搬送装置3のチャック35の継送位
置Pに移送させて的確に定置させるようにしている。こ
の停止状態において試料Sはチャック33による把持が
解除されると、ガイド筒32の下方に待機している持上
シリンダ36が自由状態にある試料Sを持ち上げて、上
方に待機しているチャック35に小径部側を的確に把持
させて試料Sの継送を良好に行うことができるものであ
る。As a result, as shown in FIG. 4, the transfer device 3a moves the sample S which has been taken out by the first cooling device 2a.
With the chuck 3 inserted in the guide cylinder 32.
The first transporting device 3 is gripped precisely by the rotation of the first transporting device 3 and turned to the vertical position while being turned upside down to be transferred to a transfer position P of the chuck 35 of the first transporting device 3 to be accurately positioned. In this stopped state, when the gripping of the sample S by the chuck 33 is released, the lifting cylinder 36 waiting below the guide cylinder 32 lifts the sample S in the free state, and the chuck 35 waiting above. In this way, the small diameter portion can be properly grasped so that the sample S can be satisfactorily transferred.
【0021】〔第1搬送装置3について〕図1〜図3に
示すように、第1搬送装置3は、前記機台1の後方で略
全巾に立設された横フレーム3Fのリニアガイド3R及
び縦リニアガイド3Tを介し、横方向並びに縦方向往復
移動可能に支持されたヘッド部36に、既述のチャック
35を上下動可能で且つチャック中心の縦軸を中心に回
転可能に設けている。この第1搬送装置3は、チャック
35で継送装置3aから試料Sを受け継いだ径小部(試
料部)を把持した状態において、先ず切断装置4に移送
しカッター(鋸刃)40によって長さの中途部の第1切
断を行い、湯口部側を切離してこれを機外に排出させ
る。[First Transporting Apparatus 3] As shown in FIGS. 1 to 3, the first transporting apparatus 3 is a linear guide 3R of a horizontal frame 3F which is provided almost vertically over the back of the machine base 1. The chuck 35 described above is provided on the head portion 36 supported so as to be reciprocable in the horizontal and vertical directions via the vertical linear guide 3T so as to be vertically movable and rotatable about the vertical axis of the chuck center. . In a state where the small-diameter portion (sample portion) that has inherited the sample S from the transfer device 3 a is gripped by the chuck 35, the first transfer device 3 is first transferred to the cutting device 4 and lengthened by the cutter (saw blade) 40. The first cutting of the middle part is performed, the gate side is cut off, and this is discharged outside the machine.
【0022】次いで、湯口部側が切離された状態にある
試料S1(図12)を、第1搬送装置3の自動作動によ
って所定の厚さ(略3ミリ程度)に第2切断を行わせて
ガス分析用の試料片S3を切離し、下方に待機する後述
の第2搬送装置8によってパンチャー7に移送させると
共に、チャック35は試料片S3を切離した後の試料S
2を、第2冷却装置2b及び研削装置5に移送し各処理
を行わせたのち、試料調整が完了された試料S2を取出
装置6に継送させて機外に取出し排出を行い一連の動作
を完了する。Next, the sample S1 (FIG. 12) in a state where the gate side is cut off is cut by a second thickness to a predetermined thickness (about 3 mm) by the automatic operation of the first transfer device 3. The sample piece S3 for gas analysis is cut off and transferred to the puncher 7 by a second transfer device 8 described below, which stands by below, and the chuck 35 separates the sample S3 from the sample piece S3.
After the sample S2 is transferred to the second cooling device 2b and the grinding device 5 and subjected to each processing, the sample S2 for which the sample adjustment is completed is transferred to the extracting device 6, taken out of the machine and discharged, and a series of operations are performed. Complete.
【0023】〔切断装置4について〕図1,図2,図
7,図8に示すように切断装置4は、超硬丸鋸板からな
るカッター40を縦軸回転するモータ軸41の上部に取
付けると共に、該カッター40の上方を切断部42を切
欠形成したカッタカバー43で覆っている。この切断装
置4は、試料Sが1次冷却によって微細なパーライト組
織が生成される400℃〜600℃程度の温度で切断好
適状態にある間において、試料Sの第1及び第2切断を
行うこと、及びこの条件下で切断することにより鋸刃に
よる切断であっても大きな切削抵抗を生じさせないの
で、切断面の仕上がりもよく高能率な切断作業を良好に
行うと共に、在来のもののように赤熱状態の高温で切断
するものに比し鋸刃の耐久性の向上を格段に図りながら
コンタミの発生を防止することができる等の利点があ
る。[Regarding the Cutting Apparatus 4] As shown in FIGS. 1, 2, 7 and 8, the cutting apparatus 4 mounts a cutter 40 made of a carbide round saw plate on an upper part of a motor shaft 41 which rotates longitudinally. At the same time, the upper part of the cutter 40 is covered with a cutter cover 43 in which a cutout portion 42 is formed. The cutting device 4 performs the first and second cutting of the sample S while the sample S is in a cutting suitable state at a temperature of about 400 ° C. to 600 ° C. at which a fine pearlite structure is generated by primary cooling. , And by cutting under these conditions, even when cutting with a saw blade, a large cutting resistance is not generated, so that the cut surface finish is good and high efficiency cutting work is performed well, and red heat like conventional ones Compared to cutting at a high temperature in the state, there is an advantage that the generation of contamination can be prevented while significantly improving the durability of the saw blade.
【0024】〔第2冷却装置2bについて〕図9に示す
ように第2冷却装置2bは、第2冷却室を形成する上部
を開口した箱体26内に冷却水を噴出させる冷却ノズル
27を臨設してなり、第2次切断された試料S2をチャ
ック35で把持した状態で縦軸回転させながら冷却ノズ
ル27から噴出される冷却水を吹きつけることにより、
1次冷却後自然降温によって200℃〜300℃程度に
放冷された試料S2を30℃程度に冷却し、次位の研削
装置5による切削を良好に行わせることができるように
している。尚、上記試料S2の冷却は冷却ノズル27か
ら冷却気体を噴出させることによって行うようにしても
よい。[Second Cooling Apparatus 2b] As shown in FIG. 9, the second cooling apparatus 2b has a cooling nozzle 27 for jetting cooling water into a box 26 having an open upper portion forming a second cooling chamber. By rotating the vertical axis in a state where the second cut sample S2 is gripped by the chuck 35 and spraying the cooling water spouted from the cooling nozzle 27,
After the primary cooling, the sample S2, which has been cooled to about 200 ° C. to 300 ° C. by natural cooling, is cooled to about 30 ° C., so that the next grinding device 5 can perform cutting well. The cooling of the sample S2 may be performed by ejecting a cooling gas from the cooling nozzle 27.
【0025】〔研削装置5及び取出装置6について〕図
1,図2及び図10に示すように、研削装置5はミーリ
ングカッタ50を箱状のカッターボックス51内に縦軸
回転可能に軸装すると共に、該ミーリングカッタ50に
は円形状刃面を有する1枚の切刃(チップ)52をカッ
タホルダ53に取付ネジ55を介し、取付刃角を調節自
在で且つ着脱可能に取り付けて構成している。この構成
によって試料S2の試料面は、チャック35の右方移動
に伴って縦軸回転する1枚のチップ52によって所定の
削量だけ順次良好に切削されるものである。[Regarding the Grinding Apparatus 5 and the Extraction Apparatus 6] As shown in FIGS. 1, 2 and 10, the grinding apparatus 5 has a milling cutter 50 mounted in a box-shaped cutter box 51 so as to be rotatable in the vertical axis. At the same time, the milling cutter 50 is configured such that one cutting blade (tip) 52 having a circular blade surface is attached to a cutter holder 53 via a mounting screw 55 so that the mounting blade angle is adjustable and detachable. . With this configuration, the sample surface of the sample S2 is sequentially and satisfactorily cut by a predetermined cutting amount by one tip 52 that rotates in the vertical axis with the rightward movement of the chuck 35.
【0026】従って、上記切削手段によれば、カッタホ
ルダに複数枚のチップを有して切削を行う在来のミーリ
ングカッタは、各チップの取付け刃面高さが微小に異な
ることから、同図(C)の点線で示すような不均一な切
削跡高さの疎い切削面を形成せざるを得ないので、発光
分光分析等の計測を行う際にレーザー光の乱反射を不規
則に大きく生じデーター把握を正確に行うことができな
い等の問題があるが、本実施形態に係わるミーリングカ
ッタ50は、同図(C)の実線で示すような均一で精緻
な切削面になるように分析試料調整を平坦で精度のよい
試料面に仕上げることができて、発光分光分析等の計測
を行う際にレーザー光の乱反射等を抑制しデーター把握
を正確に行うことができる等の特徴がある。Therefore, according to the above-mentioned cutting means, the conventional milling cutter which performs cutting with a plurality of chips in the cutter holder has a slightly different mounting blade surface height of each chip. C) Since a cutting surface with a non-uniform cutting trace height as shown by the dotted line in C) has to be formed, irregular reflection of laser light is generated irregularly and largely at the time of measurement such as emission spectroscopy. Although the milling cutter 50 according to the present embodiment has a problem in that the analysis sample adjustment cannot be performed accurately, the analysis sample adjustment is flattened so as to obtain a uniform and precise cutting surface as shown by a solid line in FIG. In this way, it is possible to finish the sample surface with high accuracy and to suppress irregular reflection of laser light when performing measurement such as emission spectroscopic analysis, thereby enabling accurate data comprehension.
【0027】また上記の切削手段によればグラインダカ
ッターによる切削のようにコンタミを発生させることな
く、コンタミを防止した試料面の切削を能率よく良好に
行うことができる利点もある。即ち、グラインダー方式
の砥石研磨は、砥石を形成しているアルミナ等の研磨砥
粒と試料表面が接当することにより、砥粒を剥落としな
がら試料表面を掻取り表面研磨を行うので、この剥落と
し砥粒が試料表面に突き刺さった状態になり易く、これ
が発光分析の際に検出されることによって実成分との誤
差を生ずる欠点があると共に、この際に生ずる摩擦熱は
試料成分によって異なり、試料が20℃〜100℃程度
昇温するので以後の冷却(第2冷却等)に長時間を要し
非能率になる等の問題があるが、図示例の切削手段によ
れば10℃程度の昇温で済むと共にコンタミを簡単に防
止することができる等の利点がある。また取出装置6
は、上記仕上げが完了された試料S2をチャック35の
把持の解除によって良好に受け取るものであり、受け取
った試料S2を次位のカントバック装置(不図示)等へ
円滑に送給するようにしている。この際の試料S2は、
研削装置5の切削による切削熱で10℃程度昇降された
40℃程度の発光分光分析を行うための適正温度で排出
されるものである。According to the above-mentioned cutting means, there is also an advantage that the contamination can be efficiently and favorably cut on the sample surface without causing contamination unlike the cutting by the grinder cutter. That is, in the grindstone polishing of the grinder method, the polishing is performed by scraping off the sample surface while removing the abrasive particles by bringing the polishing abrasive particles such as alumina forming the grindstone into contact with the sample surface. Dropped abrasive grains tend to stick into the surface of the sample, which has the disadvantage of being detected at the time of luminescence analysis, causing an error with the actual component.Friction heat generated at this time differs depending on the sample component. However, since the temperature rises by about 20 ° C. to 100 ° C., it takes a long time for the subsequent cooling (second cooling or the like) and becomes inefficient. There are advantages such that the temperature can be kept low and contamination can be easily prevented. Also take-out device 6
Is to properly receive the finished sample S2 by releasing the grip of the chuck 35, and to smoothly send the received sample S2 to a next-order cantback device (not shown) or the like. I have. The sample S2 at this time is
It is discharged at an appropriate temperature for performing emission spectroscopy at about 40 ° C. raised and lowered by about 10 ° C. by cutting heat generated by the cutting of the grinding device 5.
【0028】〔パンチャー7について〕図7,図8に示
すように、パンチャー7は在来のものと同様な構成から
なる駆動部70と打抜部71の下方に、試料片3から直
径6ミリ程度に打ち抜かれた3〜4個分の試料S4を収
容する収容部7aを設けると共に、その側方に打ち抜き
後の試料片S3を排出するためのシュータ7bを併設し
ている。このパンチャー7は、1次冷却後切断時も含め
200℃〜300℃程度或いは材料によってそれ以上に
自然降温された状態の試料片S3を打ち抜くように設定
していることにより、打ち抜き時に試料S4に無理な内
部応力を生じさせることによる組織変化を伴わせること
なく、ガス分析を精度よく良好に行うことができるよう
にしていると共に、試料S4を能率よく打ち抜き成形す
ることができる等の特徴を有している。[Puncher 7] As shown in FIGS. 7 and 8, the puncher 7 has a diameter of 6 mm from the sample piece 3 below the driving unit 70 and the punching unit 71 having the same configuration as the conventional one. An accommodating portion 7a for accommodating three to four samples S4 punched out to a sufficient degree is provided, and a shooter 7b for discharging the punched sample pieces S3 is provided alongside the accommodating portion 7a. The puncher 7 is set so as to punch out the sample piece S3 at a temperature of about 200 ° C. to 300 ° C. or a temperature naturally lowered by the material, including the time of cutting after the primary cooling. Gas analysis can be performed accurately and satisfactorily without accompanying structural change due to generation of excessive internal stress, and the sample S4 can be stamped and formed efficiently. doing.
【0029】〔第2搬送装置8について〕図7,図8に
示すように第2搬送装置8は、上記パンチャー7の後側
に立設したガイドレール80と、該ガイドレール80に
横移動可能に支持されたヘッド部81と、該ヘッド部8
1にロータリアクチェータを切断部位置とパンチャー部
位置とに切換往復動可能に取付けられた第2チャック8
2とから構成している。この構成によって第2搬送装置
8は、前記チャック35が試料S2を切断部42におい
て切断完了させる際に、第2チャック82を該試料S2
の下方に図7の実線で示す待機位置に臨ませて切断され
た試料片S3を的確に把持すると共に、第2チャック8
2を点線で示すよう略90度回動させながらヘッド部8
1を介し左方に退動移動させて次の動作を行うことがで
きる。[Second Conveying Apparatus 8] As shown in FIGS. 7 and 8, the second conveying apparatus 8 has a guide rail 80 erected on the rear side of the puncher 7 and can move laterally on the guide rail 80. Head 81 supported by the head, and the head 8
A second chuck 8 in which a rotary chuck is switched between a cutting portion position and a puncher portion position so as to be able to reciprocate.
And 2. With this configuration, when the chuck 35 completes the cutting of the sample S2 in the cutting section 42, the second transfer device 8 moves the second chuck 82 to the sample S2.
7, the cut sample piece S3 is accurately grasped while facing the standby position shown by the solid line in FIG.
2 is rotated by approximately 90 degrees as shown by the dotted line,
1 to move leftward to perform the next operation.
【0030】即ち、第2チャック82に把持された試料
片S3はパンチ部71上に移送され把持を解除され、こ
の状態において試料片S3は既述したように試料S4の
打ち抜きが行われ、打ち抜き以後の試料片S3は再び第
2チャック82で把持されながら右方のシュータ7b上
に搬送移動され把持が解除されることによって、機外へ
円滑に排出されて第2搬送装置8の一連の動作を完了す
る。That is, the sample piece S3 gripped by the second chuck 82 is transferred to the punch 71 and released from being gripped. In this state, the sample piece S3 is punched out of the sample S4 as described above. The subsequent sample piece S3 is conveyed to the right chute 7b while being held again by the second chuck 82 and released from being held, whereby the sample piece S3 is smoothly discharged out of the apparatus and a series of operations of the second transfer device 8 is performed. Complete.
【0031】以上のように構成された分析試料調整装置
Aは、1つの装置中に受入装置2に試料Sの受入れ時に
第1切断を行う超硬鋸板による切断装置4と、1次冷却
を行う第1冷却装置2a並びに2次冷却を行う第2冷却
装置2bと、2次冷却された試料S2をミーリングカッ
タ50によってコンタミを防止しながら切削する研削装
置5等を一連に設けているので、試料Sの加工調整を以
下のように能率よく良好に行うことができる。即ち、図
示しない転炉等から取り出され気送管20を介して受入
装置2内に供給された900℃〜1000℃の赤熱状態
にある試料Sは、小径部を下向きで湯口部を上向きにし
た供給姿勢において既述のように第1冷却装置2aによ
って1次冷却が行われる。The analytical sample preparation apparatus A configured as described above has a cutting apparatus 4 using a cemented saw plate that performs the first cutting when the sample S is received in the receiving apparatus 2 in one apparatus, and performs primary cooling. Since the first cooling device 2a for performing the second cooling device 2b for performing the secondary cooling and the grinding device 5 for cutting the sample S2 subjected to the secondary cooling while preventing the contamination by the milling cutter 50 are provided in series, Processing adjustment of the sample S can be performed efficiently and favorably as follows. That is, the sample S in a red-hot state at 900 ° C. to 1000 ° C. which is taken out of a converter or the like (not shown) and supplied into the receiving device 2 through the pneumatic tube 20 has the small-diameter portion facing downward and the gate portion facing upward. In the supply position, primary cooling is performed by the first cooling device 2a as described above.
【0032】尚、この場合手差しで必要に応じて行う試
料Sの供給は上記気送管20とは別途に設けられる手差
しサンプル供給口(図示せず)から自由に行うことがで
きるものである。この1次冷却によって試料Sは400
℃〜600℃程度にシャワー冷却方式によって急冷され
るので、オーステナイト組織から微細なパーライト組織
に効率よく均質に変えられるものである。また、試料S
は比較的高い温度でパーライト変態が完了され粘性を有
する弾性体に維持されるので、変態膨張時の組織内での
無理が抑制され焼き割れ等の不具合を良好に防止される
と共に高精度の分析を可能にする利点がある。In this case, the supply of the sample S, which is performed by hand if necessary, can be freely performed through a manual sample supply port (not shown) provided separately from the air supply pipe 20. By this primary cooling, the sample S becomes 400
Since it is quenched by a shower cooling method to about 600C to about 600C, the austenite structure can be efficiently and uniformly changed to a fine pearlite structure. Sample S
Since the pearlite transformation is completed at a relatively high temperature and is maintained as a viscous elastic body, it is possible to suppress excessive force in the structure during the transformation expansion, to prevent problems such as burning cracks, and to perform high-precision analysis. There is an advantage that allows.
【0033】この後、試料Sは継送装置3aによって反
転変姿されながら持上シリンダ36上に移送され、この
持上シリンダ36の持ち上げによってチャック35に小
径部を把持されて切断装置4に移送される。そして、第
1搬送装置3によって接合部に移送された試料Sは、カ
ッター40によって第1次の切断が行われ湯口部が切り
落とされて機外に排出される。尚、この際チャック35
は自転することによってバリ等を生ずることなく良好な
切断作用が行われるものである。Thereafter, the sample S is transferred to the lifting cylinder 36 while being inverted and transformed by the transfer device 3a. The small diameter portion is gripped by the chuck 35 by lifting the lifting cylinder 36, and is transferred to the cutting device 4. Is done. Then, the sample S transported to the joining portion by the first transport device 3 is subjected to a primary cutting by the cutter 40, the gate portion is cut off, and discharged out of the machine. In this case, the chuck 35
Is to perform a good cutting action without causing burrs and the like by rotating.
【0034】次いで、第1搬送装置3は上記第1次の切
断を完了すると一端退動したのち、チャック35を試料
片S3の厚さ寸法代に下降させたのち、再び進動し第2
次の切断を開始させ、この第2次切断によって、切り落
とされた試料片S3をチャック35の下方に待機してい
る第2搬送装置8のチャック82に受け渡し把持させる
と共に、チャック35で把持している試料S2を第2冷
却装置2b内に移動降下させて、ノズル27から噴出さ
れる冷却水(又は冷却空気)によって、この時点で30
0℃〜400℃に自然降温温度にある試料S2を30℃
程度の温度となるように2次冷却を行う。Next, after the first cutting operation is completed, the first transfer device 3 once retreats, lowers the chuck 35 to the thickness dimension of the sample piece S3, and advances again to move to the second position.
The next cutting is started, and the sample piece S3 cut off by the secondary cutting is transferred to the chuck 82 of the second transporting device 8 waiting below the chuck 35 and is gripped by the chuck 35. The moving sample S2 is moved and lowered into the second cooling device 2b, and the cooling water (or cooling air) jetted from the nozzle 27 at this time causes
A sample S2 at a natural cooling temperature between 0 ° C. and 400 ° C. is placed at 30 ° C.
Secondary cooling is performed so that the temperature becomes about the same.
【0035】これにより、上記カッター40による切断
に当たり、本発明では試料Sを1次冷却の急冷手段によ
って400℃〜600℃程度に冷却することにより組織
を微細なパーライトにし、且つ硬化を抑制した弾性体と
なった状態で超硬鋸刃板で第1次と第2次の切断を一連
に行う切断方法としたので、鋸刃による切断を大きな切
断負荷を伴うことなく、且つ鋸刃の損耗を防止し能率よ
く円滑に切断することができるものであると共に、従来
のもののようなディスクグラインダ(グラインダカッタ
ー)による切断手段を必要とすることなく回避して行う
ので、コンタミの発生等も防止しながら切断刃の長寿命
化も図ることができる。According to the present invention, when cutting with the cutter 40, in the present invention, the sample S is cooled to about 400 ° C. to 600 ° C. by the rapid cooling means of the primary cooling so that the structure becomes fine pearlite and the elasticity which suppresses hardening is suppressed. Since the primary and secondary cuts are performed in a series using a carbide saw blade plate in the form of a body, cutting by the saw blade is not accompanied by a large cutting load, and wear of the saw blade is reduced. In addition to the above, the cutting can be performed efficiently and smoothly, and the cutting can be performed without the need for a cutting means using a disk grinder (grinder cutter) as in the conventional apparatus. The life of the cutting blade can be extended.
【0036】次いでこののち、第1搬送装置3は30℃
程度の安定組織状態になされた上記試料S2をチャック
35でその小径部を把持したまま研削装置5に移送し、
既述したようにカッタ50の1枚刃チップ52によって
良好に研削させることができるものである。これによっ
て試料S2は、研削面の仕上げ精度をコンタミ等を伴う
ことなく能率よく高精度に仕上げられると共に、上記研
削加工によって10℃程度自然昇温された略40℃程度
の発光分光分析に好適な温度になって、爾後に行われる
発光分光分析等の際に行われる加熱を補助し、データー
把握を省力化しながら良好に行うことを可能にすること
ができる等の利点がある。また一連の切断及び研削は試
料Sを持ち替えることなく同一のチャック35で把持し
て行われるので、持ち替えによる加工精度の低下を生ず
ることがない等の利点がある。Then, after this, the first transfer device 3 is set at 30 ° C.
The sample S2 having a stable tissue state is transferred to the grinding device 5 while holding the small diameter portion with the chuck 35,
As described above, the single-blade tip 52 of the cutter 50 can be satisfactorily ground. Thus, the sample S2 can be efficiently and highly accurately finished without a contaminant or the like on the finishing accuracy of the ground surface, and is suitable for emission spectroscopy at about 40 ° C. which is naturally raised by about 10 ° C. by the above-mentioned grinding. When the temperature reaches the temperature, there is an advantage that the heating performed at the time of emission spectroscopy or the like to be performed later can be assisted, and the data can be satisfactorily obtained while saving labor. Further, since a series of cutting and grinding are performed by holding the sample S with the same chuck 35 without holding, there is an advantage that the processing accuracy does not decrease due to holding.
【0037】以上の工程を経た試料S2は、第1搬送装
置3によって取出装置6の始端部に移送されてチャック
35の把持解除によって、この部に落下されると共に取
出装置6の搬送動作によって機外に取り出され、発光分
光分析等の分析作業が行われるものでる。この分析作業
において、試料S2は1次冷却によって受入時の赤熱材
状態の温度900℃〜1000℃程度から400℃〜6
00℃程度に均一に急冷されて、微細なパーライト組織
になっていると共に、2次冷却を行ったのち研削装置5
によって表面をコンタミを防止した平坦面に仕上げられ
ているので、分析試験等を適正条件下で精度よくデータ
ー把握することができるものである。The sample S2 having undergone the above steps is transferred to the starting end of the take-out device 6 by the first transfer device 3 and is dropped to this portion by releasing the grip of the chuck 35, and is transferred by the transfer operation of the take-out device 6. It is taken out and subjected to analysis work such as emission spectroscopy. In this analysis work, the temperature of the sample S2 in the state of the glowing material at the time of receiving from about 900 ° C. to 1000 ° C. to 400 ° C. to 6 ° C. by primary cooling.
After being quenched uniformly to about 00 ° C. to form a fine pearlite structure, and after secondary cooling, the grinding apparatus 5
As a result, the surface is finished to be a flat surface with no contamination, so that data such as analysis tests can be accurately grasped under appropriate conditions.
【0038】一方、前述の第2次切断によって得られた
試料片S3は第2搬送装置8のチャック82に把持され
てパンチャー7に移送され、チャック82が一旦把持を
解除している間に試料S4の打ち抜きが行われ、打ち抜
き後の孔あき試料片S3はチャック82によって再び把
持され、図7の点線で示すようにシュータ7bに移送さ
れ把持を解除されることにより落下し機外に排出され
る。上記試料片S3から試料S4の打ち抜き工程におい
て、試料片S3は300℃〜400℃に自然降温しなが
ら高温状態を維持した微細なパーライトで弾性体である
ので、ポンチによる直径6ミリ程度の小片3〜4ケ分の
打ち抜きを組織に無理を生じさせることなく低負荷でス
ムースに行うことができる等の利点がある。On the other hand, the sample piece S3 obtained by the above-mentioned secondary cutting is gripped by the chuck 82 of the second transfer device 8 and transferred to the puncher 7, and while the chuck 82 is once released from gripping, the sample piece S3 is released. S4 is punched out, and the punched sample piece S3 after punching is gripped again by the chuck 82, transferred to the shooter 7b as shown by the dotted line in FIG. 7, released by dropping, and discharged out of the machine. You. In the step of punching the sample S3 from the sample S3, the sample S3 is a fine pearlite and an elastic body which is maintained at a high temperature while being naturally cooled to 300 ° C to 400 ° C. There is an advantage that punching for up to 4 pieces can be performed smoothly with a low load without causing excessive force in the tissue.
【0039】従って、これによって得られた試料S4
は、収容部7aで回収されこの間に自然降温によって2
00℃〜300℃のガス分析好適温度にされた状態とな
って、以後のガス分析等の分析作業を良好に行うことが
できる等の利点がある。このように、本発明は一台の装
置に発光分光分析調整試料用の加工経路とガス分析調整
試料用の加工経路とを併設することにより、赤熱状態で
送給された試料Sを発光分光分析用の試料S2とガス分
析用の試料S4とを、従来のもののように個別の装置に
よって別個に行うことなく、同時的に調整加工するよう
にしたので加工調整時間を短縮できると共に、装置のコ
ンパクト化を図りながら能率よく高精度に行うことがで
きる等の特徴がある。Accordingly, the sample S4 thus obtained
Is collected in the storage section 7a and during this time, 2
There is an advantage that the temperature is set to a temperature suitable for gas analysis of 00 ° C. to 300 ° C., and that subsequent analysis operations such as gas analysis can be performed well. As described above, the present invention provides the processing path for the emission spectroscopic analysis adjustment sample and the processing path for the gas analysis adjustment sample in one apparatus, so that the sample S sent in the red-hot state can be subjected to the emission spectrometry. The sample S2 for gas analysis and the sample S4 for gas analysis are adjusted and processed at the same time without being separately performed by a separate device as in the prior art, so that the processing adjustment time can be shortened and the apparatus can be made compact. The feature is that it can be performed efficiently and with high accuracy while achieving the structure.
【0040】また上述のように赤熱状態の試料S以外に
例えば常温域にある試料Sを加工する際に、受入装置2
に供給された試料Sは、第1冷却装置2aによって冷却
することなく、継送装置3aのチャック33に把持させ
て加熱装置9に移送し、該加熱装置9によって400℃
〜600℃程度に昇温された状態で、以後は前述と同様
の動作によって切断装置4による第1次及び第2次切断
が円滑に行われ、これによって得られる試料S2を第2
冷却装置2bによって冷却し研削装置5で表面研削を行
って適切に仕上げると共に、試料片S3をパンチャー7
によって打ち抜き加工し試料S4を良好に得ることがで
きるものである。As described above, when processing a sample S in a normal temperature range, for example, in addition to the sample S in the red-hot state, the receiving device 2
Is supplied to the heating device 9 without being cooled by the first cooling device 2a, and is transferred to the heating device 9 by the chuck 33 of the transfer device 3a.
After the temperature is raised to about 600 ° C., the primary and secondary cutting by the cutting device 4 is smoothly performed by the same operation as described above, and the sample S2 obtained by this is cut into the second.
Cooling is performed by the cooling device 2b, surface grinding is performed by the grinding device 5, and the sample is appropriately finished.
The sample S4 can be satisfactorily obtained by punching.
【0041】このように調整装置Aに加熱装置9を設け
たことにより、炉から取り出された直後の試料以外の低
温状態にある試料に対しても、同一の調整装置Aを用
い、該試料を加工適切温度に昇温させることで試料組織
を調質した状態となして、切断を既述のものと同様に速
やかに行うと共に、打ち抜き等の加工を刃物等を早期に
損耗させることなく能率よく良好に行うことができて、
以後の各分析も良好に高精度に行うことを可能にするこ
とができる等の利点がある。By providing the heating device 9 in the adjusting device A as described above, the same adjusting device A can be used for the sample in a low temperature state other than the sample immediately after being taken out of the furnace. By raising the temperature to an appropriate temperature for processing, the sample structure is tempered, cutting is performed promptly in the same manner as described above, and processing such as punching is performed efficiently without early wear of the cutting tool etc. Can do well,
There is an advantage that each subsequent analysis can be satisfactorily performed with high accuracy.
【0042】[0042]
【発明の効果】本発明は以上のように構成したので、次
のような効果を奏するものである。請求項1の発明によ
り、赤熱状態で供給される試料は、1次冷却によって急
冷され微細なパーライト組織に効率よく均質に変えられ
ると共に、比較的高い温度でパーライト変態が完了され
た粘性を有する弾性体に維持されるので、変態膨張時に
おける組織内の無理な力の発生が抑制されて焼き割れ等
の不具合を良好に防止することができ、またカッターに
よる切断を円滑に行い該カッターの損耗等を良好に防止
することができる。また上記試料は2次冷却によって低
温で安定組織状態になされたのち、表面を精度よく研削
されるので、研削面の仕上げ精度をコンタミ等を伴うこ
となく能率よく高精度に仕上げられ、発光分光分析等の
データー把握を省力化しながら良好に行うことができ
る。As described above, the present invention has the following advantages. According to the first aspect of the present invention, a sample supplied in a red-hot state is rapidly cooled by primary cooling to be efficiently and uniformly converted to a fine pearlite structure, and has a viscous elasticity in which pearlite transformation is completed at a relatively high temperature. Since it is maintained in the body, the generation of excessive force in the tissue during transformation expansion can be suppressed, and problems such as burning cracks can be properly prevented. In addition, the cutter can be smoothly cut and the cutter can be worn, etc. Can be satisfactorily prevented. In addition, after the above sample is made into a stable structure at a low temperature by secondary cooling, the surface is ground precisely, so that the finishing accuracy of the ground surface can be efficiently and precisely finished without involving contamination etc., and emission spectroscopy Data can be satisfactorily grasped while saving labor.
【0043】請求項2の発明により、冷却後の試料を第
1搬送装置のチャックで把持したまま持ち替えることな
く、同一のチャックで把持して切断及び試料面の研削を
行わせることより、持ち替えによる加工精度の低下を防
止して能率よく高精度に加工することができる。According to the second aspect of the present invention, the cooled sample is not held while being held by the chuck of the first transfer device, but is held by the same chuck to perform cutting and grinding of the sample surface. It is possible to efficiently and highly accurately process by preventing a decrease in processing accuracy.
【0044】請求項3の発明により、1次切断された試
料を2次切断することによって得られる試料片S3は、
高温状態を維持した微細なパーライト組織の弾性体状態
にあるので、パンチャーによる打ち抜きを、組織に無理
を生じさせることなく低負荷でスムースに行うことがで
きると共に、以後に行われるガス分析等の分析作業を良
好に高精度に行うことができる。According to the third aspect of the present invention, the sample piece S3 obtained by secondary cutting the primary cut sample is
Since it is in an elastic state with a fine pearlite structure that maintains a high temperature state, punching with a puncher can be performed smoothly with a low load without causing excessive force in the structure, and analysis such as gas analysis performed later Work can be performed satisfactorily and with high accuracy.
【0045】請求項4の発明により、低温状態にある試
料に対しても同一の調整装置を用いて、併設された加熱
装置によって加工適切温度に簡単に昇温させることがで
き、切断等の加工をカッター等の損耗を防止して能率よ
く良好に行うと共に、以後の分析作業等も良好に行うこ
とができる等の利点がある。According to the fourth aspect of the present invention, it is possible to easily raise the temperature of a sample in a low temperature state to an appropriate processing temperature by using the same adjusting device and a heating device provided therewith. In addition, there is an advantage that, in addition to the above, the wear of the cutter or the like can be prevented and the analysis can be performed efficiently and satisfactorily, and the subsequent analysis work and the like can be performed satisfactorily.
【0046】請求項5の発明により、一つの試料調整装
置に発光分光分析調整試料用の加工経路とガス分析調整
試料用の加工経路とを併設することにより、赤熱状態で
送給された試料を発光分光分析用の試料とガス分析用の
試料とを、従来のもののように個別の装置によって別工
程で行うことなく、同時的に調整加工することができる
ので加工調整時間を短縮させることができると共に、装
置のコンパクト化を図りながら簡潔な構成で高精度に製
作することができる。According to the fifth aspect of the present invention, by providing a processing path for an emission spectroscopic analysis adjustment sample and a processing path for a gas analysis adjustment sample in one sample preparation apparatus, a sample fed in a red-hot state can be obtained. The sample for emission spectroscopy and the sample for gas analysis can be adjusted and processed simultaneously without using separate devices in separate steps as in the prior art, so that the processing adjustment time can be reduced. At the same time, the device can be manufactured with high accuracy with a simple configuration while reducing the size of the device.
【0047】請求項6の発明により、縦軸回転を行うカ
ッタホルダの上部外周に一枚の円弧状の切刃を設けた研
削装置にすることにより、研削面の仕上げ精度をコンタ
ミ等を伴うことなく高精度な平坦面に仕上げることがで
き、分析作業時のデーター把握を省力化しながら良好に
行うことができる。According to the sixth aspect of the present invention, by providing a grinding device in which a single arc-shaped cutting blade is provided on the upper outer periphery of a cutter holder that rotates in the vertical axis, the finishing accuracy of the grinding surface can be reduced without contaminants or the like. A highly accurate flat surface can be finished, and data can be grasped well during analysis work while saving labor.
【図1】本発明に係わる分析試料の調整装置を示す正面
図。FIG. 1 is a front view showing an apparatus for preparing an analysis sample according to the present invention.
【図2】図1の平面図。FIG. 2 is a plan view of FIG. 1;
【図3】(A)は図1の左側面図。(B)は図1の右側
面図。FIG. 3A is a left side view of FIG. (B) is a right side view of FIG.
【図4】第1冷却装置及び継送装置の態様を示す断面
図。FIG. 4 is a sectional view showing an embodiment of a first cooling device and a transfer device.
【図5】継送装置の平面図。FIG. 5 is a plan view of the transfer device.
【図6】図5の側面図。FIG. 6 is a side view of FIG. 5;
【図7】第2搬送装置とパンチャー部の態様を示す平面
図。FIG. 7 is a plan view illustrating aspects of a second transport device and a puncher unit.
【図8】図7の正面図。FIG. 8 is a front view of FIG. 7;
【図9】第2冷却装置の断面図。FIG. 9 is a sectional view of a second cooling device.
【図10】(A)は研削装置の正面図。(B)は研削装
置の研削作用を示す斜視図。(C)は研削面の拡大断面
図。FIG. 10A is a front view of a grinding device. (B) is a perspective view showing a grinding action of the grinding device. (C) is an enlarged sectional view of the ground surface.
【図11】調整装置の動作フローチャート図。FIG. 11 is an operation flowchart of the adjustment device.
【図12】試料の加工調整の態様を示す模式図。FIG. 12 is a schematic view showing a mode of processing adjustment of a sample.
【図13】調整装置の動作タイムチャート図。FIG. 13 is an operation time chart of the adjustment device.
A 調整装置(分析試料調整装置) 2 受入装置 2a 第1冷却装置(冷却部) 2b 第2冷却装置(冷却部) 2c 冷却室 3 第1搬送装置 3a 継送装置 3F 横フレーム 4 切断装置 5 研削装置 7 パンチャー 8 第2搬送装置 9 加熱装置 32 ガイド筒 33,35,82 チャック 40 カッター(鋸刃) 50 ミーリングカッタ 52 切刃(チップ) S,S1,S2,S4 試料 S3 試料片 Reference Signs List A adjustment device (analytical sample adjustment device) 2 receiving device 2a first cooling device (cooling unit) 2b second cooling device (cooling unit) 2c cooling chamber 3 first transport device 3a transfer device 3F horizontal frame 4 cutting device 5 grinding Apparatus 7 Puncher 8 Second transfer device 9 Heating device 32 Guide tube 33, 35, 82 Chuck 40 Cutter (saw blade) 50 Milling cutter 52 Cutting blade (chip) S, S1, S2, S4 Sample S3 Sample piece
Claims (6)
1冷却装置(2a)によって400℃〜600℃程度に
急冷したのち切断装置(4)によって湯口部を切離する
と共に、切断後の試料(S2)を第2冷却装置(2b)
によって50℃〜20℃程度に冷却したのち研削装置
(5)によって試料面を研削する分析試料の調整方法。1. A sample (S) supplied in a red-hot state is rapidly cooled to about 400 ° C. to 600 ° C. by a first cooling device (2a), and then a gate is cut off by a cutting device (4) and cut. The sample (S2) after the second cooling device (2b)
A method for preparing an analysis sample, wherein the sample surface is cooled to about 50 ° C. to 20 ° C. and then the sample surface is ground by a grinding device (5).
装置(3)のチャック(35)で把持したまま切断及び
冷却並びに試料面の研削を行わせる請求項1の分析試料
の調整方法。2. The method according to claim 1, wherein the primary cooled sample (S) is cut and cooled and the sample surface is ground while holding the chuck (35) of the first transfer device (3). Adjustment method.
することにより試料片(S3)を形成し、該試料片(S
3)をパンチャー(7)に移送してガス分析用の試料
(S4)を形成する請求項1又は2の分析試料の調整方
法。3. A sample piece (S3) is formed by subjecting the sample (S) to secondary cutting with a cutting device (4).
3. The method for preparing an analysis sample according to claim 1, wherein 3) is transferred to a puncher (7) to form a sample (S4) for gas analysis.
(S)を加熱装置(9)で加熱昇温させて切断する請求
項1又は2又は3の分析試料の調整方法。4. The method for preparing an analysis sample according to claim 1, wherein the sample (S) is heated and heated by a heating device (9) in a pre-process for cutting the sample (S).
入れて1次冷却を行う冷却装置(2a)と、該冷却装置
(2a)によって冷却された試料(S)を切断する切断
装置(4)と、切断された試料(S2)の2次冷却を行
う第2冷却装置(2b)と、2次冷却が行われた試料
(S2)を研削する研削装置(5)とを、第1搬送装置
(3)による搬送経路中に設けると共に、該第1搬送装
置(3)の搬送経路に、試料Sを第2次切断することに
よって得られる試料片(S3)を第2搬送装置(8)を
介して打ち抜くパンチャー(7)を併設してなる分析試
料の調整装置。5. A cooling device (2a) for receiving a sample (S) fed in a red hot state and performing primary cooling, and a cutting device for cutting the sample (S) cooled by the cooling device (2a). (4) a second cooling device (2b) for performing secondary cooling of the cut sample (S2), and a grinding device (5) for grinding the sample (S2) subjected to secondary cooling. A sample piece (S3) obtained by second-cutting the sample S is provided in the transport path of the first transport apparatus (3) in the transport path of the first transport apparatus (3). 8) A device for preparing an analysis sample, which is provided with a puncher (7) for punching through the sample.
を、縦軸回転を行うカッタホルダ(53)の上部外周に
一枚の円弧状の切刃(52)を設けて構成する請求項5
の分析試料の調整装置。6. A grinding device (5) for grinding a sample (S2).
6. An arc-shaped cutting blade (52) is provided on the outer periphery of an upper part of a cutter holder (53) that rotates on a vertical axis.
For adjusting the analysis sample.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13781597A JP3195564B2 (en) | 1997-05-12 | 1997-05-12 | Method and apparatus for preparing analysis sample |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13781597A JP3195564B2 (en) | 1997-05-12 | 1997-05-12 | Method and apparatus for preparing analysis sample |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH10311782A true JPH10311782A (en) | 1998-11-24 |
JP3195564B2 JP3195564B2 (en) | 2001-08-06 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13781597A Expired - Lifetime JP3195564B2 (en) | 1997-05-12 | 1997-05-12 | Method and apparatus for preparing analysis sample |
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JP (1) | JP3195564B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070067534A (en) * | 2005-12-23 | 2007-06-28 | 주식회사 포스코 | Fast-production method of sample for oxygen analysis |
WO2010125892A1 (en) | 2009-04-30 | 2010-11-04 | 住友金属工業株式会社 | Method for analyzing oxygen in steel |
JP2015219134A (en) * | 2014-05-19 | 2015-12-07 | 新日鐵住金株式会社 | Chemical-element-analysis sample preparation method and device |
JP2016047955A (en) * | 2014-08-28 | 2016-04-07 | Jfeスチール株式会社 | Method for refining carbon-containing steel |
-
1997
- 1997-05-12 JP JP13781597A patent/JP3195564B2/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070067534A (en) * | 2005-12-23 | 2007-06-28 | 주식회사 포스코 | Fast-production method of sample for oxygen analysis |
WO2010125892A1 (en) | 2009-04-30 | 2010-11-04 | 住友金属工業株式会社 | Method for analyzing oxygen in steel |
JP2015219134A (en) * | 2014-05-19 | 2015-12-07 | 新日鐵住金株式会社 | Chemical-element-analysis sample preparation method and device |
JP2016047955A (en) * | 2014-08-28 | 2016-04-07 | Jfeスチール株式会社 | Method for refining carbon-containing steel |
Also Published As
Publication number | Publication date |
---|---|
JP3195564B2 (en) | 2001-08-06 |
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