JPH10305437A - Cavity temperature control device in mold - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an epoch-making cavity temperature control device in a mold of extremely quick responce properties for carrying out the ideal temperature control. SOLUTION: A cavity temperature control device is provided with a temperature control mechanism formed of a mold main body 2 constituted of heat transfer members 1 for transferring heat from one face sides 1A to the other face sides 1B by heating and controlling the temperature of cavity 3 sections in the mold main body 2. In that case, storing and providing sections 4 for storing and providing the heat transfer members 1 are provided on positions close to the cavities 3 in the mold main body 2, and cavity side providing inner faces for bringing one face sides of the heat transfer members 3 of the storing and providing sections 4 into contact with the cavities or bringing the same close to the cavities are so provided on positions close to the cavities as to be set along the inner faces of the cavities 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding die and, more particularly, to a temperature adjusting device for adjusting the temperature of a cavity in a die.

[0002]

2. Description of the Related Art In resin molding, temperature, resin flow velocity, and pressure are three major conditions for molding, and mold temperature control plays an important role in these conditions.

That is, the role of the mold temperature control is to adjust the temperature at which the resin that is melted and injected into the mold is completely filled without solidifying into the cavity in the mold, and solidifies quickly after filling. Is to do.

On the other hand, at present, molded products are also being required to be light and thin, and the need for thin products is particularly high.

[0005] The reason is that the resin is melted at a temperature of 200 ° C. or more, and when it enters the mold, solidification starts suddenly, the viscosity increases, and the resin hardly flows.

In order to avoid this reality, for example, the mold is slightly opened at the time of injection so that gas is released from the cavity so that the mold can be filled in the same manner as the thick molding, and after filling, the mold is closed and tightened. In order to increase the inflow pressure (injection pressure), the former requires a dedicated molding machine, which is expensive and difficult to control, and the latter also involves increasing the injection pressure. There is a limit, and molding under high pressure tends to generate burrs, and the injection molding conditions become unstable, resulting in an increase in the rejection rate, making it impossible to mass-produce uniform non-defective products.

If the resin plasticizing temperature and the mold temperature are always the same, smooth filling of the cavity is possible, but the cooling step and the reheating step in the refilling require time, Mass production is remarkably inferior and there is no reality.

Therefore, when the mold temperature is adjusted, the mold temperature is controlled by bringing the mold temperature close to the plasticizing temperature at the time of filling the cavity, thereby delaying the solidification, improving the flow of the resin, and cooling and solidifying after the filling is completed. To maintain a low temperature in order to increase mass productivity earlier.

Conventionally, for example, a temperature control liquid (water, oil) is passed through a mold body, and the liquid is heated and cooled to adjust the temperature of the mold, particularly the cavity, to achieve an optimum temperature. Something to keep.

Further, there is a type in which a heater rod is inserted and arranged in a mold to adjust and maintain the temperature. However, although the cost is high, the temperature response is remarkably poor, and the role of the temperature control is high. Cannot be fulfilled enough.

[0011] Accordingly, the applicant filed Japanese Patent Application Laid-Open No. 6-29746.
As shown in No. 1, a heat transfer member (thermo module) that transfers heat from one side to the other side by energizing
Is provided in the mold body, and has a better responsiveness than the conventional example,
We have invented and developed an innovative temperature control means that can be manufactured at low cost without manufacturing cost.

[0012]

The present invention is a further improvement of Japanese Patent Application Laid-Open No. 6-297461.

That is, the present inventor has found that the mold temperature to be controlled is not the mold itself, but the cavity therein, and the surface (inner surface) temperature of the cavity. It was.

In order to further improve the responsiveness of maintaining the temperature in the temperature control, the temperature of the cavity surface (inner surface) filled with the molten resin is directly heated and cooled. I found something.

Further, the present inventors have found a configuration for realizing this revolutionary idea and completed the present invention.

[0016]

The gist of the present invention will be described with reference to the accompanying drawings.

A temperature adjusting mechanism comprising a heat transfer member 1 for transferring heat from one surface side 1A to the other surface side 1B when energized is provided in the mold body 2, and a cabinet in the mold body 2 is provided. In a cavity temperature adjusting device in a mold configured to be able to adjust the temperature of the tee 3, an arrangement portion 4 for housing and disposing the heat transfer member 1 is provided in the cavity 3 of the mold body 2. An inner surface 4A provided on the cavity side, which is provided at a close position and makes one surface side of the heat transfer member 3 of the arrangement portion 4 contact or approach, is brought close to the inner surface 3A of the cavity 3. The present invention relates to a device for adjusting a cavity temperature in a mold, which is provided at a position.

Also, by energizing, one surface side 1A
The mold body 2 is provided with a temperature adjusting mechanism including a heat transfer member 1 that transfers heat from the mold body 2 to the other surface side 1B.
In the cavity temperature control device in the mold configured to be able to regulate the temperature of the cavity 3 in the mold, a plurality of the heat transfer members 1 are placed in a stacked state and the heat transfer members 1 are close to the cavity 3 of the mold body 2. The present invention relates to a cavity temperature adjusting device in a mold, wherein an arrangement portion 4 which can be arranged at a predetermined position is provided, and a plurality of heat transfer members 1 are arranged in the arrangement portion 4 in a stacked state.

Further, a plurality of mold plates 5 whose abutting surfaces are parting lines PL are provided so as to be movable toward and away from each other, and one or both of the mold plates 5 are recessed from the abutting surface side to form the cavity. The mold main body 2 is formed by providing a tee 3, and the mold plate 5 is dug down toward the cavity 3 side to provide the disposing portion 4. 3. The apparatus according to claim 1, wherein the inner surface is provided on the cavity side.

Further, a plurality of mold plates 5 whose abutting surfaces are parting lines PL are provided so as to be movable toward and away from each other, and both or any one of the mold plates 5 is recessed from the abutting surface side to form the cavity. A groove for forming a plurality of the heat transfer members 1 in the vicinity of the inner surface 3A of the cavity 3 of the mold plate 5 by providing a tee 3 and forming the mold main body 2. 3. The apparatus according to claim 2, wherein a hole is provided as an arrangement portion, and the heat transfer member is fitted and fixed in the groove.

The cavity 3 is entirely or partially formed by being recessed inward from the butting surface side of the one mold plate 5, and the other mold plate 5 opposed to this is brought into contact with the butting surface side. The disposing portion 4 is provided recessed inward from the surface on the opposite side to the inside, and the cavity-side disposing inner surface 4A of the disposing portion 4 is set to a size substantially matching the forming range of the cavity 3, 4. The heat transfer member 1 having a plate shape substantially conforming to the inner surface 4A provided on the cavity side is disposed in contact with the inner surface 4A provided on the cavity side.
The present invention relates to a device for adjusting a cavity temperature in a mold as described in the above.

Further, all or a part of the cavity 3 is formed by being recessed inward from the abutting surface side of the one mold plate 5, and the cavity 3 of the one mold plate 5 is brought into close proximity to the cavity 3. The apparatus according to claim 4, wherein a plurality of plate-like heat transfer members (1) are arranged in close proximity to each other at a position.

The inner surface 4A provided on the cavity side is provided so as to be as close as possible to the inner surface 3A of the cavity 3 from the viewpoint of strength or durability. The present invention relates to an apparatus for adjusting a cavity temperature in a mold according to any one of the preceding claims.

The cavity 3 is formed as a thin cavity 3 having a length in the parting line direction, not in the mold opening / closing direction, so that it is substantially parallel to the spreading direction of the cavity 3. The cavity temperature adjusting device according to any one of claims 1 to 7, wherein a substantially flat cavity-side inner surface 4A of the mounting portion 4 is disposed close to the mounting portion 4. It is related to.

[0025]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention (how to implement the invention) will be briefly described with reference to the drawings, showing the operational effects thereof.

The heat transfer member 1 (thermo module), which transfers heat from one surface 1A to the other surface 1B when energized, is connected to the inner surface 4A of the mounting portion 4 on the cavity side of the mounting portion 4. Abut on or close to

Since the inner surface 4A provided on the cavity side is provided at a position close to the inner surface 3A of the cavity 3, heating and cooling by the heat transfer member 1 are performed on the surface (inner surface) of the cavity 3. And the responsiveness of temperature adjustment by the heat transfer member 1 is remarkably superior to the conventional example.

Also, since the heat transfer member 1 is arranged in a plurality of layers at a position close to the cavity 3 of the mold body 2, when the heat transfer member 1 heats or cools the cavity 3, By using all the surfaces on the cavity 3 side of the heat transfer members 1 arranged in a multi-layered state as heat dissipation surfaces and all the opposite surfaces as cooling surfaces, compared with the case where one heat transfer member 1 is used. The cavity 3 can be heated much more efficiently by the synergistic effect of the arrangement of the plurality of layers, and at the time of cooling, all the surfaces on the cavity 3 side of the heat transfer members 1 arranged in the state of a plurality of layers are cooled. By using the entire surface on the opposite side as a heat-radiating surface, the cavity 3 can be cooled much more efficiently by the synergistic effect of arranging a plurality of heat transfer members 1 than in the case where one heat transfer member 1 is used. Heat transfer member 1 The responsiveness of the temperature control due can be very good.

Further, when one heat transfer member 1 is used at a position close to the cavity 3, for example, when the cavity 3 is cooled, the cavity 3 of the heat transfer member 1 is used.
It is necessary to cool the heat radiating surface on the side opposite to the side, but forced cooling is performed at a position close to the heat radiating surface of the heat moving member 1 on the side opposite to the cavity side of the mold main body 2 provided with the heat moving member 1. apparatus
In order to efficiently cool the heat radiating surface by installing 10, the forced cooling device 10 is moved to a position close to the heat transfer member 1 by excavating the mold body 2 to a position close to the heat transfer member 1. In such a case, it is necessary to perform complicated processing on the mold body 2, for example, so that the manufacturing cost of the mold body 2 becomes extremely high. Since a plurality of stacked units are arranged at positions close to the cavity 3 of the part 2, when the forced cooling device 10 is provided in the mold body 2, the forced cooling device 10 is provided in the mold body 2. In order to cool the cavity 3 by arranging the forced cooling device 10 on the side surface of the mold body 2 without performing processing for
A plurality of heat transfer members 1 arranged in a stacked state from a position close to the cavity 3 to a position close to the forced cooling device 10
To cool the cavity 3 more efficiently
The heat can be efficiently dissipated by the method 10, and the manufacture of the mold main body 2 can be extremely simplified, so that a cavity temperature adjusting device in the mold having excellent practicality can be obtained.
Therefore, depending on the shape of the mold body 2 and the position of the cavity 3, the heat transfer member 1 is appropriately placed on the inner surface of the mold body 2 from a position close to the cavity 3 to a position close to the forced cooling device 10. The cavity 3 can be reliably cooled by arranging the cavity 3 in a stacked state.
Regardless of the shape and position of the heat transfer member 1, the heat transfer member 1 is appropriately arranged in a plurality of stacked states in accordance with the shape of the mold body 2 and the shape and position of the cavity 3. 3 can be reliably cooled, and a cavity temperature control device in a mold having excellent practicality can be obtained.

Therefore, the cavity 3 is always kept at an appropriate temperature.
Can be adjusted and maintained with good responsiveness, and even a thin-walled molded product can be satisfactorily filled and quickly cooled, so that a good product can be mass-produced.

[0031]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of the present invention will be described with reference to the drawings.

FIGS. 1 and 2 show an embodiment of the present invention, in which a plurality of mold plates 5 whose abutting surfaces are parting lines PL are provided so as to be movable toward and away from one another. The mold plate 5 on the other side is recessed inward from the abutting surface side to form all or a part of the cavity 3, and the other fixed mold plate 5 and the one mold plate 5 facing the cavity 3 Are disposed inwardly from the surface opposite to the abutting surface side to form an arrangement portion 4, and the cavity-side arrangement inner surface 4 </ b> A serving as a concave bottom surface of the arrangement portion 4 is located within the cavity 3 formation range. The plate-shaped heat transfer member 1 which is set to have a size substantially matching and which is substantially in contact with the inner surface 4A provided on the cavity side is disposed in contact with the inner surface 4A provided on the cavity side.

That is, by energizing, one surface side 1A
The heat transfer member 1 from which heat moves to the other surface side 1B is housed in the arrangement portion 4 and provided at a position close to and along the inner surface 3A of the cavity 3.

The heat transfer member 1 of this embodiment employs a thermo module, and is formed on a flat plate. When a direct current is applied to the thermo module, heat is transferred from one side to the other side. Can be moved. That is,
The thermomodule is a semiconductor module having a Peltier effect. When a direct current flows in a specific direction between terminals, heat is transferred from one side to the other side. Therefore, by controlling the direction of the current supplied to the thermo module, the cavity 3 in the mold main body 2 is directly (closer to the extent that it can be said to be direct) due to the above-described configuration.
It becomes possible to heat and cool.

In this embodiment, the cavity-side inner surface 4A is provided so as to be as close as possible to the inner surface 3A of the cavity 3 from the viewpoint of strength or durability. In this sense as well, the arrangement structure as described above is optimal for the closest approach.

The cavity 3 is formed as a thin cavity 3 having a length not in the mold opening / closing direction but in the parting line direction so as to be substantially parallel to the spreading direction of the cavity 3. Thus, the substantially flat cavity-side inner surface 4A of the disposing portion 4 is disposed close to the disposing portion 4.

Therefore, in the present embodiment, one surface side 1A of the heat transfer member 1 (thermo module) is disposed in contact with the cavity-side inner surface 4A of the mounting portion 4.

Since the inner surface 4A provided on the cavity side is provided at a position close to the inner surface 3A of the cavity 3, heating and cooling by the heat transfer member 1 are performed on the surface (inner surface) of the cavity 3. And the responsiveness of temperature adjustment by the heat transfer member 1 is remarkably superior to the conventional example.

Therefore, the cavity 3 is always kept at an appropriate temperature.
Can be adjusted and held, and even a thin-walled molded product can be satisfactorily filled and quickly cooled, so that a good product can be mass-produced.

Further, in this embodiment, even in the thin-wall molding, the thermo-module is arranged so as to be in direct contact with the thin-walled surface. Heating the inner surface 1A of the cavity 3 directly by heating the one side 1A which is in contact with the inner surface 4A, makes it difficult for the resin to be filled in the mold to cool, and increases the viscosity without increasing the viscosity. After the filling is completed, the energization direction is reversed. This time, the one surface 1A is cooled, the solidification speed is increased, and the mass productivity is increased.

In this case, the opposite side 1B is heated, but in order to accelerate the cooling of the one side 1A, a cooling structure for cooling the opposite side 1B to be heated is added. May be.

For example, on the side opposite to the inner surface 4A provided on the cavity side, the other side 1B of the heat transfer member 1 is contacted.
A structure that allows a cooling medium such as water or oil to pass through may be provided.

Therefore, in the present embodiment, the temperature of the inner surface of the cavity 3 is immediately and quickly controlled with a simple operation by simply switching the direction of energization of the heat transfer member 1 (thermo module). As described above, in molding a thin product, the temperature control is reliably performed by disposing the one surface side 1A of the heat transfer member 1 close to the thin surface so as to cover the thin surface.
Good products can be mass-produced.

In addition, the structure as close as possible to the cavity 3 can be manufactured without adding cost, and the mold manufacturing cost is not required, so that it is extremely practical.

In this embodiment, the two mold plates 5 to be abutted are recessed in the direction of the parting line PL and are provided with the disposing portions 4 respectively. Is shown in the drawing, but may be arranged only on the fixed plate side for disposing an ejector device for projecting the molded product 6.

In order to improve the thermal efficiency of the four cavities 3 for taking four cavities, the cavities 3 are provided on each side.
Although the four heat transfer members 1 are provided corresponding to the above, the four large heat transfer members 1 may be provided so as to cover all four without excess or shortage.

In the figure, reference numeral 6 denotes a molded product, 7 denotes a runner,
Reference numeral 8 denotes an injection nozzle unit, and 9 denotes an energization control unit (thermocontroller unit) of a temperature adjustment mechanism for controlling the energization direction and energization amount of the heat transfer member 1.

Another embodiment of the present invention will be described with reference to FIGS.

Two mold plates 5 whose abutting surfaces are parting lines PL are provided so as to be movable toward and away from each other, and a cavity is formed by being recessed inward from the abutting surface side of the one fixed-side mold plate 5. 3 is formed in whole or in part, and the other movable-side mold plate 5 opposed thereto is combined with the one fixed-side mold plate 5 to form the mold main body 2, and the one fixed part is formed. The inner surface 3A of the cavity 3 is provided on the lower surface of the cavity 3 of the side mold plate 5.
A plurality of plate-shaped heat transfer members 1 are provided in close proximity to each other in a stacked state.

When the heat transfer member 1 is provided on the fixed mold plate 5, a plurality of heat transfer members 1 are provided in close proximity to the mold plate 5 in a stacked state. A predetermined slot is provided in the plate 5 as the arrangement portion 4,
The heat transfer member 1 is fitted into this slot.

It is to be noted that the cavity 3 may be provided so as to be recessed inward from the abutting surface side of the movable mold plate 5, and the movable mold is provided regardless of whether the cavity 3 is provided or not. A plurality of plate-like hot plate members 1 may be provided as appropriate on the upper surface of the cavity 3 at a position close to the inner surface 3A of the cavity 3 at the abutting surface of the plate 5.

In order to efficiently dissipate the heat radiated through the heat transfer member 1, communication is provided on the lower surface of the fixed mold plate 5 for passing a coolant (cooling water or cooling oil). A forced cooling device 10 having a plurality of holes 11 is provided.

FIG. 4 is an enlarged view of a portion where the heat transfer member 1 provided on the fixed mold plate 5 is formed.
The mechanism of heat transfer when cooling the cavity 3 is indicated by an arrow in the figure, and the direction of the current is controlled so that the lower surface side 1B of the heat transfer member 1 becomes a heat dissipation surface.

The reference numerals in FIGS. 3 and 4 showing another embodiment are the same as those having the same functions as those shown in FIGS. 1 and 2 showing one embodiment. .

[0055]

Since the present invention is constructed as described above, one surface side of the heat transfer member, which transfers heat from one surface side to the other surface side when energized, is connected to the cavity side of the disposition portion. The heat transfer member heats and cools the cavity because the heat transfer member is in contact with or near the disposition inner surface and the cavity-side disposition inner surface is located close to and along the inner surface of the cavity. This is an epoch-making cavity temperature control device in a mold that is immediately transmitted to the surface (inner surface) of the mold, and the response of the temperature control by the heat transfer member is remarkably superior to the conventional example.

Since a plurality of heat transfer members are arranged in a stacked state at a position close to the cavity of the mold body, when the cavity is heated or cooled by the heat transfer member, the plurality of heat transfer members are stacked during heating. All the cavity-side surfaces of the arranged heat transfer members are heat dissipation surfaces, and all the opposite surfaces are cooling surfaces. The cavity can be heated much more efficiently by the synergistic effect.At the time of cooling, all the surfaces on the cavity side of the heat transfer members arranged in multiple layers are used as cooling surfaces, and all the opposite surfaces are used as heat dissipation surfaces. By doing so, the cavity can be cooled much more efficiently due to the synergistic effect of the arrangement of a plurality of heat transfer members than when a single heat transfer member is used, and the responsiveness of temperature adjustment by the heat transfer member is greatly improved. It can be good.

Further, since a plurality of heat transfer members are arranged at a position close to the cavity of the mold main body in a stacked state,
When disposing the forced cooling device on the mold body, without performing the processing for disposing the forced cooling device on the mold body,
When a forced cooling device is arranged on the side surface of the mold body and the cavity is cooled, a plurality of heat transfer members are arranged in a stacked state from a position close to the cavity to a position close to the forced cooling device. The cavity can be cooled more efficiently, and the heat can be efficiently radiated by the forced cooling device.
The manufacture of the mold body can be made extremely simple, and a cavity temperature adjusting device in the mold having excellent practicality can be obtained. Therefore, depending on the shape of the mold body, the position of the cavity, etc., the heat transfer member may be appropriately laminated on the inner surface of the mold body from a position close to the cavity to a position close to the forced cooling device. By disposing the cavity, the cavity can be cooled reliably, and the heat transfer member can be cooled regardless of the shape of the mold body or the shape and position of the cavity. By properly arranging a plurality of layers according to the shape of the mold body and the shape and position of the cavity, the cavity can be reliably cooled, and the mold inside the mold with excellent practicality It can be a cavity temperature control device.

Therefore, the temperature of the cavity can always be adjusted and maintained at an appropriate temperature with good responsiveness, and even a thin molded product can be filled well, and can be cooled quickly so that good products can be mass-produced. It becomes a cavity temperature control device in the mold.

According to the third and fourth aspects of the present invention, there is provided an apparatus for controlling the temperature of a cavity in a mold, which is excellent in practicality and can easily realize the invention.

Further, in the inventions according to the fifth, sixth and seventh aspects, the responsiveness of the temperature adjustment in the mold temperature control is further excellent, and the mold is excellent in practicality which can be realized more easily. It becomes a cavity temperature control device inside.

According to the eighth aspect of the present invention, even in the case of a thin-walled molded product, the above-mentioned functions and effects can be more reliably exhibited, and a highly practical epoch-making mold is provided. It becomes a cavity temperature controller.

[Brief description of the drawings]

FIG. 1 is a schematic configuration explanatory perspective view showing one embodiment of the present invention.

FIG. 2 is a schematic configuration explanatory sectional view showing one embodiment of the present invention.

FIG. 3 is a schematic configuration explanatory sectional view showing another embodiment of the present invention.

FIG. 4 is an explanatory view showing the operation of another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat transfer member 1A One surface side 1B The other surface side 2 Mold main body 3 Cavity 3A Inner surface 4 Arrangement part 4A Cavity side arrangement inner surface 5 Mold plate PL Parting line

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tsutomu Matsuda 2-11-14 Kugahara, Ota-ku, Tokyo Sankyo Chemical Co., Ltd.

Claims (8)

[Claims] 1. A temperature adjusting mechanism comprising a heat transfer member that transfers heat from one surface side to the other surface side when energized is provided in a mold main body, and a temperature of a cavity portion in the mold main body is controlled. In the apparatus for adjusting the cavity temperature in a mold configured to adjust the temperature, an arrangement portion for housing and disposing the heat transfer member is provided at a position close to the cavity of the mold body, The inner surface of the cavity-side arrangement that abuts or approaches one surface side of the heat transfer member of the portion,
A cavity temperature control device in a mold, which is provided at a position close to and along the inner surface of the cavity. 2. A temperature adjusting mechanism comprising a heat transfer member for transferring heat from one surface side to the other surface side when energized is provided in the mold body, and a temperature of a cavity portion in the mold body is controlled. In the cavity temperature adjusting device in the mold configured to be able to adjust the temperature, a disposing portion is provided in which the heat transfer members can be disposed in a plurality of stacked states in a position close to the cavity of the mold main body. A plurality of heat transfer members are provided in a stacked state on the disposing portion, wherein a cavity temperature adjusting device in the mold is provided. 3. A plurality of mold plates, each having a mating surface serving as a parting line, are provided so as to be movable toward and away from each other, and the cavity is provided by recessing one or both of the mold plates from the mating surface side. The mold body is formed, and the mold plate is dug down toward the cavity side to provide the disposition portion, and the dug bottom surface of the disposition portion is the inner surface disposed on the cavity side. The apparatus for adjusting the temperature of a cavity in a mold according to claim 1, wherein 4. A plurality of mold plates, each having a mating surface serving as a parting line, are provided so as to be movable toward and away from each other, and both or one of the mold plates is recessed from the mating surface to form the cavity. The mold main body is formed, and at a position close to the inner surface of the cavity of the mold plate, a slot for providing a plurality of the heat transfer members in a stacked state is provided as an arrangement part. 3. The apparatus according to claim 2, wherein the heat transfer member is fitted and fixed in the slot. 5. The cavity of the one mold plate is recessed inward from the mating surface side to form all or a part of the cavity, and the other mold plate facing the cavity is opposite to the mating surface side. The arrangement portion is provided by being recessed inward from the surface of the cavity, and the inner surface of the arrangement portion on the cavity side is set to a size substantially matching the forming range of the cavity, and the inner surface of the cavity side is set. 4. The cavity temperature control device in a mold according to claim 3, wherein the plate-like heat transfer member substantially conforming to the above is disposed in contact with the inner surface provided on the cavity side. 6. The one or more mold plates are recessed inward from the abutting surface side to form all or a part of the cavity, and the plate shape is formed at a position close to the cavity of the one mold plate. 5. The apparatus for adjusting the temperature of a cavity in a mold according to claim 4, wherein a plurality of said heat transfer members are arranged in a stacked state in proximity to each other. 7. The cavity according to claim 1, wherein the inner surface provided on the cavity side is provided so as to be as close as possible to the inner surface of the cavity from the viewpoint of strength or durability. Item 5. A device for adjusting the temperature of a cavity in a mold according to the above item. 8. The cavities are formed as thin cavities having a length not in the mold opening / closing direction but in the parting line direction, and the cavities are arranged so as to be substantially parallel to the expanding direction of the cavities. The cavity temperature control device in a mold according to any one of claims 1 to 7, wherein the substantially flat inner surface of the installation portion on the cavity side is arranged close to the installation portion.