JPH10303201A - Capillary, its use method and bump formation device - Google Patents

Capillary, its use method and bump formation device

Info

Publication number
JPH10303201A
JPH10303201A JP9093294A JP9329497A JPH10303201A JP H10303201 A JPH10303201 A JP H10303201A JP 9093294 A JP9093294 A JP 9093294A JP 9329497 A JP9329497 A JP 9329497A JP H10303201 A JPH10303201 A JP H10303201A
Authority
JP
Japan
Prior art keywords
wire
capillary
ball
bump
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9093294A
Other languages
Japanese (ja)
Other versions
JP3620213B2 (en
Inventor
Hirotaka Kobayashi
寛隆 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
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Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP09329497A priority Critical patent/JP3620213B2/en
Publication of JPH10303201A publication Critical patent/JPH10303201A/en
Application granted granted Critical
Publication of JP3620213B2 publication Critical patent/JP3620213B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L2224/1301—Shape
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    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13075—Plural core members
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13144—Gold [Au] as principal constituent
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    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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  • Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To improve stress relaxing effect of a bump formed on a pad without lowering producibility by forming an approximately bell-shaped recess in a lower edge face with a through hole for feeding a wire in a capillary. SOLUTION: An approximately bell-shaped recess 3 is formed in a part of a lower end part of a capillary 1a wherein a through hole 2 for feeding a wire is shaped to have a diameter ϕ and a height (h) in a lower end. The recess 3 is formed so that at least a part of a ball formed at a tip of a wire is put so that a size, mainly a height of a bump, is large. Furthermore, an enlarged part 4 whose diameter is large as it is down is provided to a lower end of the opening 3 of the capillary 1b. If not, a tapered part 5 whose diameter is large as it falls down is formed in an upper end of the opening 3 of the capillary 1c. A bump can be enlarged in this way.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、キャピラリー、特
に被ボンディング部材の被ボンディング面上に例えば金
等からなるバンプを形成するのに用いるキャピラリー
と、その使用方法と、バンプ形成装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a capillary, and more particularly to a capillary used for forming a bump made of, for example, gold on a surface to be bonded of a member to be bonded, a method of using the same, and a bump forming apparatus.

【０００２】[0002]

【従来の技術】ＩＣ、ＬＳＩ等の半導体チップのアルミ
ニウムパッド上に金バンプを形成する方法として、キャ
ピラリーを用い、該キャピラリーにより金ワイヤの先端
部をアルミニウムパッドに押しつけた状態にし、更に、
横方向（パッドの表面方向）の超音波振動をキャピラリ
ーに与えることによりワイヤの先端部をアルミニウムパ
ッドに接合し、その後、ワイヤを引っ張って該接合をし
た部分よりも上のネック部分にて切断することによりバ
ンプを形成するという方法がある。2. Description of the Related Art As a method of forming a gold bump on an aluminum pad of a semiconductor chip such as an IC or an LSI, a capillary is used, and the tip of a gold wire is pressed against the aluminum pad by the capillary.
The distal end of the wire is joined to the aluminum pad by applying ultrasonic vibration in the lateral direction (to the surface of the pad) to the capillary, and then the wire is pulled and cut at the neck portion above the joined portion. Then, there is a method of forming a bump.

【０００３】そして、キャピラリーとして従来用いられ
たものは、例えば図１１（Ａ）、（Ｂ）に示すような形
状を有していた。図において、ａはキャピラリー、ｂは
金等のワイヤを通す貫通孔、ｃは該貫通孔ｂのキャピラ
リーａ下端面に開口する部分で、キャピラリーａ下端面
に寄る程拡径している。図１２は形成されたバンプを示
し、ｄはシリコン半導体基板、ｅは層間絶縁膜、ｆはア
ルミニウムからなるパッド、ｇは金からなるバンプであ
る。従来において、径が約７０μｍ、高さが１５μｍ程
度の大きさのバンプを形成することはできた。[0003] Conventionally used capillaries have a shape as shown in FIGS. 11A and 11B, for example. In the figure, a is a capillary, b is a through hole through which a wire such as gold is passed, and c is a portion of the through hole b which opens to the lower end surface of the capillary a, and the diameter increases toward the lower end surface of the capillary a. FIG. 12 shows the formed bumps, d is a silicon semiconductor substrate, e is an interlayer insulating film, f is a pad made of aluminum, and g is a bump made of gold. Conventionally, a bump having a diameter of about 70 μm and a height of about 15 μm could be formed.

【０００４】また、図１３に示したように、バンプの頂
上より長くワイヤが突出し、それが適宜折り曲げられて
できるだけ他と接触しないようにされたスタッドバンプ
がある。Further, as shown in FIG. 13, there is a stud bump in which a wire protrudes longer than the top of the bump and is bent as appropriate so that it does not come into contact with others as much as possible.

【０００５】更には、バンプの形成後、ワイヤを引っ張
ることによりそのバンプの上で切断すると、図１４
（Ａ）に示すようにバンプの頂上からワイヤが針のよう
に延びた形状になるので、図１４（Ｂ）に示すようにバ
ンプを上から押し潰し、平坦化するということが行われ
る場合もあるが、このワイヤが横に変形した場合、とな
りのボールとショートする場合がある。Further, after the bump is formed, when the wire is pulled and cut on the bump, FIG.
Since the wire has a shape extending like a needle from the top of the bump as shown in FIG. 14A, the bump may be crushed from above and flattened as shown in FIG. 14B. However, if this wire is deformed laterally, it may be short-circuited with the next ball.

【０００６】また、バンプの高さを高くすることにより
バンプの応力緩和効果を高めるために、バンプの形成後
更にその上にバンプを形成し、更にそのバンプの上にバ
ンプを形成するというバンプを２重、或いは３重と複数
重形成するスタッドバンプ技術もある。図１５はそのよ
うな複数重構造のバンプｇを示す。Further, in order to increase the height of the bumps to enhance the stress relaxation effect of the bumps, a bump is formed on the bumps after the bumps are formed, and then the bumps are formed on the bumps. There is also a stud bump technology in which a plurality of double or triple layers are formed. FIG. 15 shows a bump g having such a multi-layer structure.

【０００７】[0007]

【発明が解決しようとする課題】ところで、図１１に示
すような従来のキャピラリーを用いた場合、形成される
バンプは径が７０μｍ、高さが１５μｍ程度が大きさの
上限であった。しかし、応力緩和効果をより強めるため
に径が７０μｍ、高さが３０μｍ程度の大きさのバンプ
を形成する必要のある場合もあり、そのような大きなバ
ンプを形成しようとすると、図１６に示すようにクレー
タリングが生じ、ボール剥がれが生じ易くなったり、リ
ーク電流が生じ易くなったりするという問題があった。When the conventional capillary as shown in FIG. 11 is used, the upper limit of the size of the formed bump is 70 μm in diameter and about 15 μm in height. However, in some cases, it is necessary to form a bump having a diameter of about 70 μm and a height of about 30 μm in order to further enhance the stress relaxation effect. If such a large bump is to be formed, as shown in FIG. In addition, there is a problem that cratering occurs and the ball is easily peeled off or a leak current is easily generated.

【０００８】クレータリングは、バンプを大きくしよう
とするためには接合時にキャピラリーによりかける荷重
を弱め（２０ｇ程度）る必要があり、そのため接合時の
荷重を弱めると、超音波が局部（中央部）に集中し、周
辺部に上下運動が生じることによって起きるのである。
そのため、大きなバンプを形成することにより応力緩和
効果を強めることは難しかった。In the crater ring, in order to increase the size of the bump, it is necessary to reduce the load applied by the capillary at the time of joining (about 20 g). Therefore, when the load at the time of joining is reduced, ultrasonic waves are locally (central). It is caused by vertical movement in the periphery.
Therefore, it was difficult to enhance the stress relaxation effect by forming a large bump.

【０００９】また、応力緩和効果を強める技術として図
１４（Ｂ）に示すようなスタッドバンプ技術があるが、
バンプの頂上から延びるワイヤ残りの形状のコントロー
ルが難しく、接触事故が生じ易い。また、図１５に示す
ように、バンプを多重構造にするには、１パッド当たり
複数個のボールを形成することが必要なので、バンプを
形成する時間が長くなり、生産性が低下するという問題
がある。ＬＳＩ、ＶＬＳＩ等の半導体装置には多ピン化
の傾向があるので、この問題は看過することができな
い。As a technique for enhancing the stress relaxation effect, there is a stud bump technique as shown in FIG.
It is difficult to control the shape of the remaining wire extending from the top of the bump, and a contact accident is likely to occur. In addition, as shown in FIG. 15, since a plurality of balls must be formed per pad in order to form a bump in a multiplex structure, the time required to form the bumps is lengthened and the productivity is reduced. is there. This problem cannot be overlooked because semiconductor devices such as LSIs and VLSIs tend to have more pins.

【００１０】本発明はこのような問題点を解決すべく為
されたものであり、被ボンディング側部材の被ボンディ
ング面上に形成するバンプの応力緩和効果を、生産性の
低下を伴うことなく強めることを目的とし、更にはパッ
ド形成後のワイヤの切断をパッドのすぐ上にて行うこと
ができるようにし、大きなワイヤ残りによりショート不
良が起きるおそれを簡単になくすことを目的とする。The present invention has been made in order to solve such a problem, and enhances the stress relaxation effect of a bump formed on a surface to be bonded of a member to be bonded without lowering productivity. Another object of the present invention is to make it possible to cut a wire immediately after a pad is formed immediately after the pad is formed, and to easily eliminate a possibility that a short circuit may occur due to a large wire residue.

【００１１】[0011]

【課題を解決するための手段】請求項１のキャピラリー
は、ワイヤを通す貫通孔が開口する下端面に略釣鐘状の
凹部を形成してなることを特徴とする。According to a first aspect of the present invention, there is provided a capillary, wherein a substantially bell-shaped concave portion is formed on a lower end surface where a through hole through which a wire passes is opened.

【００１２】従って、請求項１のキャピラリーによれ
ば、釣鐘状の凹部内を埋めるワイヤ材料もバンプの一部
を成すようにできるので、その分バンプを大きくするこ
とができる。Therefore, according to the capillary of the first aspect, the wire material filling the bell-shaped concave portion can also form a part of the bump, so that the bump can be enlarged accordingly.

【００１３】請求項２のキャピラリーの使用方法は、請
求項１記載のキャピラリーの使用方法であって、キャピ
ラリーを通したワイヤの下側に電極を一時的に位置させ
て該電極と該ワイヤ先端との間に高電圧を印加してスパ
ークさせることにより該ワイヤの先端部にボールを形成
し、該キャピラリーを下降させることにより該ボールを
被ボンディング面に押しつけ、それと共にキャピラリー
に該被ボンディング面と略平行な方向の超音波振動を加
えることによりワイヤの先端部のボールを、上記略釣鐘
状の凹部内に少なくとも一部が納まり上記パッドと接す
る部分が平らになる状態にし、その後、超音波振動をか
け続けて該ボールを該被ボンディング面に接合させ、し
かる後、上記ワイヤをボールの上にて切断することを特
徴とする。According to a second aspect of the present invention, there is provided a method of using a capillary according to the first aspect, wherein an electrode is temporarily positioned below a wire passing through the capillary, and the electrode and the tip of the wire are connected to each other. A ball is formed at the tip end of the wire by applying a high voltage during sparking, and the ball is pressed against the surface to be bonded by lowering the capillary. By applying ultrasonic vibration in a parallel direction, the ball at the tip of the wire is at least partially accommodated in the substantially bell-shaped concave portion, and the portion in contact with the pad is flattened. The ball is continuously bonded to the surface to be bonded, and thereafter, the wire is cut on the ball.

【００１４】従って、請求項２のキャピラリーの使用方
法によれば、ワイヤの先端にスパークによりボールを形
成するので、ボールをキャピラリーにより押し付けた際
にそのボールが釣鐘状の凹部を完全に埋めつくした上で
更にキャピラリーと被ボンディング面との間にも介在し
てバンプとなるので、バンプの大きさは従来よりも略そ
の釣鐘状の凹部の大きさ分大きくすることができる。Therefore, according to the method of using the capillary according to the second aspect, since the ball is formed by the spark at the tip of the wire, when the ball is pressed by the capillary, the ball completely fills the bell-shaped recess. Further, since the bump is further interposed between the capillary and the surface to be bonded, the size of the bump can be made larger than that of the related art by the size of the bell-shaped concave portion.

【００１５】依って、バンプを大きくしてその応力緩和
効果を高めることができる。Therefore, the size of the bump can be increased to enhance the stress relaxation effect.

【００１６】請求項３のキャピラリーの使用方法は、キ
ャピラリーの貫通孔を通したワイヤの先端部に形成した
ボールを被ボンディング面上に接合してバンプを形成し
た後、キャピラリに超音波振動を加えることにより上記
ワイヤの上記バンプ直上部に金属疲労を生ぜしめること
を特徴とする。According to a third aspect of the present invention, there is provided a method of using a capillary, wherein a ball formed at a tip portion of a wire passing through a through hole of a capillary is bonded on a surface to be bonded to form a bump, and then ultrasonic vibration is applied to the capillary. Thereby, metal fatigue is generated immediately above the bump of the wire.

【００１７】従って、請求項３記載のキャピラリーの使
用方法によれば、 バンプ形成後にキャピラリに加える
超音波振動によりワイヤのバンプ直上部に金属疲労を生
ぜしめるので、ワイヤのバンプ直上部での切断を生じ易
くすることができる。Therefore, according to the method of using the capillary according to the third aspect of the present invention, metal fatigue occurs just above the bump of the wire due to the ultrasonic vibration applied to the capillary after the formation of the bump. It can be easily caused.

【００１８】依って、ワイヤを引っ張っての切断が確実
にバンプ直上部にて為され、切断後にバンプ上に髭状の
ワイヤ残りが生じるのを防止することができる。Accordingly, the cutting by pulling the wire is reliably performed immediately above the bump, and it is possible to prevent a beard-like wire residue from remaining on the bump after the cutting.

【００１９】請求項４のキャピラリーの使用方法は請求
項３のキャピラリーの使用方法において、キャピラリー
を横方向に動かしてワイヤをバンプ直上部で切れ易くす
ることを特徴とする。According to a fourth aspect of the present invention, there is provided a method of using a capillary according to the third aspect, wherein the capillary is moved in a lateral direction so that the wire is easily cut just above the bump.

【００２０】従って、請求項４のキャピラリーの使用方
法によれば、キャピラリーを横に動かすことにより上記
ボールとの付け根部分にダメージを与え、且つキャピラ
リーと金属ワイヤーが確実に接触することにより、より
ワイヤのバンプ直上部での切断を生じ易くすることがで
きる。Therefore, according to the method of using the capillary according to the fourth aspect of the present invention, the capillary is moved sideways to damage the base of the ball, and the capillary and the metal wire are surely brought into contact with each other. Can be easily cut just above the bumps.

【００２１】請求項５のキャピラリーの使用方法は、ワ
イヤの先端部に形成したボールをパッドに接合した後、
キャピラリーを稍々上昇させ、キャピラリーを横方向に
移動させることにより上記ワイヤの上記ボールとの付け
根部分にダメージを与え、その後、該ワイヤを上に引っ
張ることによりボールの上にて切断することを特徴とす
る。According to a fifth aspect of the present invention, there is provided a method of using a capillary, comprising: bonding a ball formed at the tip of a wire to a pad;
Raising the capillary slightly, moving the capillary in the lateral direction damages the base of the wire with the ball, and then pulling the wire upward to cut on the ball And

【００２２】従って、請求項５のキャピラリーの使用方
法によれば、キャピラリーを横方向に移動させることに
よりワイヤのバンプとの付け根部分にテンションが集中
し、その部分が弱くなる。従って、その後該ワイヤを引
っ張ってこれを切断するとき確実にその付け根部分にて
切断されるようにすることができ、延いては大きなワイ
ヤ残りの生じるおそれがなくなるので、ショート不良が
起きるおそれをなくすことができる。Therefore, according to the method of using the capillary according to the fifth aspect, by moving the capillary in the lateral direction, the tension is concentrated on the base of the wire with the bump, and the part is weakened. Therefore, when the wire is subsequently pulled and cut, the wire can be surely cut at the base portion, and there is no longer a possibility that a large wire remains, thereby eliminating a risk of short-circuit failure. be able to.

【００２３】請求項６のキャピラリーの使用方法は、ワ
イヤの先端部に形成した第１のボールをパッドに接合し
た後、キャピラリーを稍々上昇させ、その後、該ワイヤ
を上記ボールよりも適宜上の部分において溶断すること
によりそのボールと一体のワイヤの上端に第２のボール
を形成することを特徴とする。According to a sixth aspect of the present invention, in the method of using a capillary, the first ball formed at the tip of the wire is joined to the pad, and then the capillary is slightly raised, and then the wire is appropriately raised above the ball. The second ball is formed at the upper end of the wire integral with the ball by fusing at the portion.

【００２４】従って、請求項６のキャピラリーの使用方
法によれば、ボール（第１のボール）と一体のワイヤを
切断する際その切断を溶断により行うことによりそのワ
イヤの先端に別のボール（第２のボール）を形成するの
で、該ボールもバンプの一部と成すことができ、一つの
バンプあたりの接合（ボンド）回数を増すことなく応力
緩和効果を高めることができる。Therefore, according to the method of using the capillary according to the sixth aspect, when cutting the wire integral with the ball (first ball), the cutting is performed by fusing so that another ball (first ball) is attached to the tip of the wire. 2), the ball can also form a part of the bump, and the stress relaxation effect can be enhanced without increasing the number of bonding (bonding) per bump.

【００２５】請求項９のバンプ形成装置は、被ボンディ
ング側部材と、ワイヤとの間に電気を流し、ワイヤの金
属疲労による抵抗の変化を検知する機構を有することを
特徴とする。According to a ninth aspect of the present invention, there is provided a bump forming apparatus having a mechanism for passing electricity between a member to be bonded and a wire and detecting a change in resistance due to metal fatigue of the wire.

【００２６】従って、請求項９のバンプ形成装置によれ
ば、抵抗の変化からワイヤの金属疲労の度合いを検知
し、所定の金属疲労に、換言すれば所定の切れ易さにな
っているか否かを判断することができ、ワイヤの切断に
移るべきタイミングを確実に検出することが可能にな
る。Therefore, according to the bump forming apparatus of the ninth aspect, the degree of metal fatigue of the wire is detected from the change in resistance, and it is determined whether or not the predetermined metal fatigue, in other words, the predetermined degree of breakage, has occurred. Can be determined, and it is possible to reliably detect the timing to shift to cutting the wire.

【００２７】[0027]

【発明の実施の形態】本発明の第１の実施の形態は、ワ
イヤを通す貫通孔が開口する下端面に略釣鐘状の凹部を
形成してなるキャピラリーである。この場合、通すワイ
ヤは、ワイヤボンディングに供されるワイヤであれば何
であっても良いが、金或いはアルミニウムからなる金属
細線が最適例である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention is a capillary in which a substantially bell-shaped concave portion is formed on a lower end surface where a through hole through which a wire passes is opened. In this case, the wire to be passed may be any wire as long as it is used for wire bonding, but a fine metal wire made of gold or aluminum is the optimal example.

【００２８】本発明の第２の実施の形態は、該キャピラ
リーの貫通孔に通したワイヤとその下側に一時的に位置
させた該電極との間に高電圧を印加してスパークさせる
ことにより該ワイヤの先端部にボールを形成し、被ボン
ディング側部材の被ボンディング面に該ボールを押しつ
けると共にキャピラリーに超音波振動を加えることによ
りワイヤの先端部のボールを、キャピラリーの略釣鐘状
の凹部内に少なくとも一部が納まり上記被ボンディング
面と接する部分が平になる状態にして接合するキャピラ
リーの使用方法である。被ボンディング側部材には、例
えば半導体チップやリードフレーム等があり、半導体チ
ップの場合における被ボンディング面の例としては例え
ばアルミニウム等からなるパッドがあり、リードフレー
ムの場合におけるそれとしてはリード先端部の表面があ
る。In the second embodiment of the present invention, a high voltage is applied between the wire passing through the through hole of the capillary and the electrode temporarily positioned below the capillary to cause sparking. A ball is formed at the distal end of the wire, and the ball at the distal end of the wire is pressed into the substantially bell-shaped concave portion of the capillary by pressing the ball against the surface to be bonded of the member to be bonded and applying ultrasonic vibration to the capillary. Is a method of using a capillary in which at least a part is accommodated and a portion in contact with the surface to be bonded is flattened. The member to be bonded includes, for example, a semiconductor chip and a lead frame. In the case of a semiconductor chip, there is, for example, a pad made of aluminum or the like. There is a surface.

【００２９】本発明の第３の実施の形態は、キャピラリ
ーの貫通孔を通したワイヤの先端部に形成したボールを
被ボンディング面上に接合してバンプを形成した後、キ
ャピラリに超音波振動を加えることにより上記ワイヤの
上記バンプ直上部に金属疲労を生ぜしめるキャピラリー
の使用方法である。According to a third embodiment of the present invention, after a ball formed at the tip of a wire passing through a through hole of a capillary is bonded to a surface to be bonded to form a bump, ultrasonic vibration is applied to the capillary. This is a method of using a capillary which causes metal fatigue just above the bumps of the wire by adding.

【００３０】本発明の第４の実施の形態は、ワイヤの先
端部に形成したボールを被ボンディング面に接合した
後、キャピラリーを稍々上昇させ、キャピラリーを横方
向に移動させることにより上記ワイヤの上記ボールとの
付け根部分にダメージを与え、その後、該ワイヤを上に
引っ張ることによりボールの上にて切断するキャピラリ
ーの使用方法である。ここで、キャピラリーを移動させ
る横方向というのは、完全に水平方向に限定されるもの
ではなく、横方向成分のある方向をいい、斜め横方向を
も含むのである。In the fourth embodiment of the present invention, after the ball formed at the distal end of the wire is bonded to the surface to be bonded, the capillary is slightly raised and the capillary is moved in the lateral direction to thereby move the wire. This is a method of using a capillary that damages the base of the ball and then cuts the ball by pulling the wire upward. Here, the horizontal direction in which the capillary is moved is not limited to the completely horizontal direction, but refers to a direction having a horizontal component, and includes an oblique horizontal direction.

【００３１】というのは、キャピラリーを横方向に動か
すのは、テンションをワイヤとバンプの付け根部分に集
中させるためであり、それは斜め横方向でも為すことが
できるからである。即ち、ワイヤを真上に引っ張った場
合、テンションはワイヤの捕まれた部分とバンプとの間
の部分全体に均等に加わり、バンプ直上部に集中される
ようにすることができない、ないしは難しいが、ワイヤ
の引っ張り方向に横方向成分が加わるとバンプ直上部に
テンションによる荷重を集中させることができ、延いて
はダメージを集中させることができるのであり、本実施
の形態はそれを為すことができるのである。The reason for moving the capillary in the horizontal direction is to concentrate the tension on the base of the wire and the bump, and this can be performed even in an oblique horizontal direction. That is, when the wire is pulled directly above, the tension is evenly applied to the entire portion between the caught portion of the wire and the bump, and it is difficult or impossible to concentrate the wire directly on the bump. When a lateral component is applied in the direction of pulling, the load due to the tension can be concentrated directly above the bump, and thus the damage can be concentrated, and this embodiment can do that. .

【００３２】本発明の第５の実施の形態は、ワイヤの先
端部に形成したボール（第１のボール）をパッドに接合
した後、キャピラリーを稍々上昇させ、その後、ワイヤ
を上記ボールよりも適宜上の部分において溶断すること
によりそのボールと一体のワイヤの上端に第２のボール
を形成するキャピラリーの使用方法である。According to a fifth embodiment of the present invention, after a ball (first ball) formed at the tip of a wire is joined to a pad, the capillary is raised slightly, and then the wire is moved up from the ball. This is a method of using a capillary in which a second ball is formed at the upper end of a wire integral with the ball by appropriately fusing the upper portion.

【００３３】本発明の第６の実施の形態は、被ボンディ
ング側部材と、ワイヤとの間に電気を流し、ワイヤの金
属疲労による抵抗の変化を検知する手段を有するバンプ
形成装置である。The sixth embodiment of the present invention relates to a bump forming apparatus having means for flowing electricity between a member to be bonded and a wire and detecting a change in resistance due to metal fatigue of the wire.

【００３４】[0034]

【実施例】以下、本発明を図示実施例に従って詳細に説
明する。図１（Ａ）乃至（Ｃ）は本発明キャピラリーの
各別の実施例１ａ、１ｂ、１ｃの下端部を示す断面図で
ある。図面において、２はワイヤを通す貫通孔（直径例
えば約３８μｍ）、３は該貫通孔２のキャピラリー１下
端面に開口する部分に形成された略釣鐘状の凹部で、下
端における直径φが例えば約５０μｍ、高さｈが例えば
２５〜３０μｍである。該凹部３はワイヤの先端にでき
たボールの少なくとも一部が納まってバンプの大きさ、
主として高さが大きくなるようにするためのものであ
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the illustrated embodiments. 1 (A) to 1 (C) are cross-sectional views showing the lower ends of different embodiments 1a, 1b and 1c of the capillary of the present invention. In the drawings, reference numeral 2 denotes a through hole (diameter of, for example, about 38 μm) through which a wire passes, and reference numeral 3 denotes a substantially bell-shaped concave portion formed in a portion of the through hole 2 which is opened at the lower end surface of the capillary 1. The height h is, for example, 25 to 30 μm. The concave portion 3 accommodates at least a part of a ball formed at the tip of the wire and has a size of a bump.
This is mainly for increasing the height.

【００３５】尚、貫通孔２と略釣鐘状の凹部３との境界
は金属ワイヤが切れないように表面を丸くする場合もあ
る。The boundary between the through hole 2 and the substantially bell-shaped concave portion 3 may have a rounded surface so as not to cut the metal wire.

【００３６】４はキャピラリー１ｂの釣鐘状開口３の下
端部に設けられた下に行く程拡径（径が大きくなる）す
る拡径部であり、５はキャピラリー１ｃの略釣鐘状開口
３の上端部に設けられた下に行く程拡径する拡径部であ
る。尚、キャピラリー１ａには拡径部４、５は設けられ
ていない。Reference numeral 4 denotes an enlarged diameter portion provided at the lower end of the bell-shaped opening 3 of the capillary 1b, the diameter of which increases (the diameter increases) as it goes down. Reference numeral 5 denotes the upper end of the substantially bell-shaped opening 3 of the capillary 1c. It is a diameter-enlarging part provided in the part, and the diameter increases as it goes down. Note that the capillary 1a is not provided with the enlarged diameter portions 4 and 5.

【００３７】本発明キャピラリーはこのように貫通孔の
下端部に略釣鐘状の凹部を有しているのであるが、その
凹部の形状には図１（Ａ）乃至（Ｃ）に示す以外にも種
々のバリエーションが有り得る。The capillary of the present invention has a substantially bell-shaped recess at the lower end of the through hole. The shape of the recess is not limited to those shown in FIGS. 1 (A) to 1 (C). There can be various variations.

【００３８】図２（Ａ）乃至（Ｅ）は本発明キャピラリ
ー、例えば図１（Ａ）乃至（Ｃ）に示したキャピラリー
の使用方法の一例（本発明キャピラリーの使用方法の第
１の実施例）を順に示す断面図である。FIGS. 2A to 2E show an example of the method of using the capillary of the present invention, for example, the capillary shown in FIGS. 1A to 1C (first embodiment of the method of using the capillary of the present invention). FIG.

【００３９】（Ａ）先ず、キャピラリー１に金からなる
ワイヤ６を通し、該ワイヤ６の下側に一時的にトーチ電
極７を位置させ、該トーチ電極７とワイヤ６との間に高
電圧（１０００〜２０００Ｖ）を加えることにより、図
２（Ａ）に示すように、トーチ電極７・ワイヤ６先端間
にスパーク８を生ぜしめる。尚、９は半導体基板の層間
絶縁膜、１０は該膜９上に形成されたパッドで、例えば
アルミニウムからなる。１１はワイヤ６に対するクラン
プである。(A) First, a wire 6 made of gold is passed through the capillary 1, a torch electrode 7 is temporarily positioned below the wire 6, and a high voltage is applied between the torch electrode 7 and the wire 6. By applying 1000 to 2000 V), a spark 8 is generated between the torch electrode 7 and the tip of the wire 6 as shown in FIG. Reference numeral 9 denotes an interlayer insulating film of the semiconductor substrate, and reference numeral 10 denotes a pad formed on the film 9, which is made of, for example, aluminum. 11 is a clamp for the wire 6.

【００４０】（Ｂ）上述の如くスパーク８を生ぜしめる
と、図２（Ｂ）に示すようにワイヤ６の下端にボール１
２が生じる。上記トーチ電極７は該ボール１２が生じる
と直ちに後退せしめられる。そして、ワイヤ６を上側に
引っ張り、ボール１２が上記釣鐘状の凹部３に引っ掛け
た状態にして、ワイヤ６に軽いテンション（例えば０．
１〜数ｇ）を加える。そして、その状態のままキャピラ
リー１を下降させる。図２（Ｂ）はそのキャピラリー１
の下降開始直後の状態を示す。(B) When the spark 8 is generated as described above, the ball 1 is attached to the lower end of the wire 6 as shown in FIG.
2 results. The torch electrode 7 is retracted as soon as the ball 12 is generated. Then, the wire 6 is pulled upward, so that the ball 12 is hooked on the bell-shaped concave portion 3.
1 to several g) are added. Then, the capillary 1 is lowered in that state. FIG. 2 (B) shows the capillary 1
Shows the state immediately after the start of the descent.

【００４１】（Ｃ）キャピラリー１を下降させてボール
１２をパッド１０に押し付け（尚、後の接合時における
荷重よりも適宜大きな値に設定する。）ながら、キャピ
ラリー１に左右方向の超音波振動（６０ｋ〜１２０ｋＨ
ｚ）を加える。図２（Ｃ）はそのときの状態を示してい
る。すると、ワイヤ６先端のボール１２は上部が上記釣
鐘状の凹部３に入り、パッド１０と接する下部は平らに
なる。(C) The capillary 1 is lowered and the ball 12 is pressed against the pad 10 (the load is set to an appropriate value larger than the load at the time of subsequent joining). 60k-120kHz
z) is added. FIG. 2C shows the state at that time. Then, the upper part of the ball 12 at the tip of the wire 6 enters the bell-shaped concave part 3 and the lower part in contact with the pad 10 becomes flat.

【００４２】（Ｄ）上述の如くワイヤ６のボール１２の
上部が凹部３内に納まり、凹部３から食み出た下部のパ
ッド６側の面が平らになると、超音波振動をかけた状態
を保ちつつキャピラリー１による押し付けの力を適宜弱
める。すると、ボール１２がパッド１０に接合した状態
になる。図２（Ｄ）は接合が済んだときの状態を示す。 （Ｅ）接合が済むと、クランプ１１をクランプ状態にし
て図２（Ｅ）に示すようにワイヤ６を上に引っ張ること
によりボール（バンプ）１２の直上にて切断する。(D) As described above, when the upper portion of the ball 12 of the wire 6 is accommodated in the concave portion 3 and the lower surface of the pad 6 protruding from the concave portion 3 becomes flat, the ultrasonic vibration is applied. The pressing force of the capillary 1 is appropriately reduced while maintaining the pressure. Then, the ball 12 is in a state of being bonded to the pad 10. FIG. 2D shows a state when the bonding is completed. (E) When the bonding is completed, the clamp 11 is clamped, and the wire 6 is pulled upward as shown in FIG.

【００４３】図３はできたバンプを示す断面図である。
出来上がったバンプには２１の符号を付与している。バ
ンプ形状は釣鐘状の凹部３の形状の違いにより微妙に相
違する。FIG. 3 is a sectional view showing the formed bump.
The reference numeral 21 is assigned to the completed bump. The bump shape is slightly different depending on the shape of the bell-shaped concave portion 3.

【００４４】このような図１に示すキャピラリー１を用
いての図２に示すようなバンプ形成法によれば、用いる
キャピラリー１の下端に略釣鐘状の凹部３があり、一
方、ワイヤ６の先端にスパーク８によりボール１２を形
成し、該ボール１２をキャピラリー１によりパッド１０
ヘ押し付けた際そのボール１２が略釣鐘状の凹部３を完
全に埋めつくした上で更にキャピラリー１とパッド１０
との間にも介在する状態にして、バンプとするので、バ
ンプの大きさを従来よりも略その略釣鐘状の凹部３の大
きさ分大きくすることができる。According to such a bump forming method as shown in FIG. 2 using the capillary 1 shown in FIG. 1, a substantially bell-shaped concave portion 3 is provided at the lower end of the capillary 1 to be used. The ball 12 is formed by the spark 8 and the ball 12 is
When the ball 12 is pressed, the ball 12 completely fills the substantially bell-shaped concave portion 3 and then the capillary 1 and the pad 10
In this case, the bumps are formed so as to be interposed between them, so that the size of the bumps can be made larger than that of the related art by the size of the substantially bell-shaped concave portion 3.

【００４５】従って、下部における直径が約７０μｍ
で、高さｈが２５〜３０μｍというような大きなバンプ
をつくることができ、バンプの応力緩和効果を強めるこ
とができる。Therefore, the diameter at the lower part is about 70 μm.
Thus, a large bump having a height h of 25 to 30 μm can be formed, and the effect of relaxing the stress of the bump can be enhanced.

【００４６】尚、上記実施例において、ボール１２がパ
ッド１０に接合された状態になった後、クランプ１１に
よりワイヤ６を上に引っ張ってこれを切断する前に、キ
ャピラリー１に超音波振動を加えることにより切断され
易くするプロセスを加えるようにしても良い。In the above embodiment, after the ball 12 is joined to the pad 10, ultrasonic vibration is applied to the capillary 1 before the wire 6 is pulled upward by the clamp 11 and cut. Thus, a process for facilitating cutting may be added.

【００４７】具体的には、ボール１２がパッド１０に接
合された状態になった後、少しキャピラリ１を上に上
げ、その状態でキャピラリー１に超音波振動を加えるの
である。すると、その超音波振動によりワイヤ６がボー
ル１２の直上部にて切断され、長い髭状のワイヤ残りが
生じるおそれがない。仮に、その超音波振動により切断
できなくてもそのボール１２直上部における切断が容易
な状態になり、クランプ１１により上方向へのテンショ
ンをかけての切断の際に容易かつ確実にボール１２直上
部にてワイヤ６を切断することができる。また、キャピ
ラリーを左右に動かすのに比較して短時間でボール直上
部で切れ易くすることができる。More specifically, after the ball 12 has been joined to the pad 10, the capillary 1 is raised slightly, and ultrasonic vibration is applied to the capillary 1 in that state. Then, the wire 6 is cut immediately above the ball 12 by the ultrasonic vibration, and there is no possibility that a long whisker-like wire remains. Even if the cutting is not possible due to the ultrasonic vibration, the cutting just above the ball 12 is in an easy state, and the cutting directly above the ball 12 can be easily and surely performed when the clamp 11 applies the tension in the upward direction. Can cut the wire 6. Further, compared to moving the capillary to the left or right, it is easier to cut just above the ball in a short time.

【００４８】このように、超音波振動によりワイヤ６の
切断をする、或いは切断をしやすくする意義について説
明をすると、次の通りである。The significance of cutting the wire 6 by ultrasonic vibration or facilitating the cutting will be described as follows.

【００４９】即ち、バンプ形成装置を用いて金（或いは
アルミニウム等）からなるバンプを形成する場合におい
て、バンプに髭状のワイヤ残りが長く形成される場合が
あり得る。というのは、バンプ形成後、ワイヤを真上に
引っ張って切断するのが普通であり、ワイヤを成す例え
ば金のボール（バンプ）直上部は、結晶粒径がバンプ形
成時において熱で大きくなり、最も切れやすくはなって
いる。しかし、単にワイヤを真上に引っ張った場合、結
晶粒が延びて高さにバラツキが生じてしまい、髭状にワ
イヤ残りが生じることになる。この場合は、ワイヤがバ
ンプの頭に髭状に長く残ることになり、その長さのバラ
ツキが大きい。これはバンプの高さのバラツキの原因と
なり、その結果、接合性のバラツキを招き、場合によっ
ては接合できない場合も生じる。That is, when a bump made of gold (or aluminum or the like) is formed using a bump forming apparatus, a long whisker-like wire residue may be formed on the bump. That is, after the bump is formed, it is normal to cut the wire by pulling the wire directly above. For example, the portion immediately above the gold ball (bump) that forms the wire has a crystal grain size that is increased by heat when the bump is formed, It is the easiest to cut. However, when the wire is simply pulled directly above, the crystal grains extend, causing a variation in height, and the wire remains in a whisker-like manner. In this case, the wire will remain on the head of the bump in a whisker-like manner, and the length of the wire varies greatly. This causes a variation in the height of the bumps. As a result, a variation in the bonding property occurs, and in some cases, the bonding cannot be performed.

【００５０】そこで、この髭状のワイヤ残りを、バンプ
の頭を叩くことによって潰していた。これによりバンプ
高さを一定に保つことができるからである。Therefore, the beard-shaped wire residue was crushed by hitting the head of the bump. Thereby, the bump height can be kept constant.

【００５１】しかし、このように、バンプを叩くように
することは工数増大に繋がるのである。このことに鑑み
て、バンプを叩かなくても髭状のワイヤ残りが生じない
ようにするため、バンプ形成後にキャピラリーを少し上
げてそれに超音波振動に加えることによりワイヤを切断
するようにする、或いは切断され易い状態にするのであ
る。However, hitting the bumps in this way leads to an increase in man-hours. In view of this, in order to prevent a beard-like wire residue from being generated without hitting the bump, the capillary is slightly raised after the bump is formed, and the wire is cut by applying ultrasonic vibration thereto, or It is in a state where it is easily cut.

【００５２】キャピラリーに超音波をかけると何故切断
され、或いは切断され易くなるかといえば、ワイヤを成
す金属、例えば金の結晶粒間が部分的に切れるからであ
る。即ち、キャピラリーに超音波振動を加えると、例え
ば金の結晶粒間が部分的に切れ、延いては結晶粒界面で
切れたり、或いは極めて切れやすい状態になる。謂わ
ば、激しい金属疲労が生じるのである。特に、この超音
波振動は振動の固定端であるボール直上部分、換言すれ
ば付け根部分に最も強く応力を生ぜしめ、金属疲労を生
ぜしめるので、ワイヤ残りをほとんどなくすことができ
得るのである。The reason why the ultrasonic wave is applied to the capillary to cut it or to make it easy to cut is that the metal, for example, gold crystal grains constituting the wire is partially cut. That is, when ultrasonic vibration is applied to the capillary, for example, the gap between gold crystal grains is partially cut, and subsequently, it is broken at the crystal grain interface or extremely easily cut. In other words, severe metal fatigue occurs. In particular, since the ultrasonic vibration generates the strongest stress on the portion just above the ball, that is, the root portion, which is the fixed end of the vibration, and generates the metal fatigue, the residual wire can be almost eliminated.

【００５３】尚、ワイヤ６はそのキャピラリー１に加え
た超音波振動により切れなくても、バンプ１２直上部に
おいて相当に切れやすい状態にはなっているので、その
後のクランパ１１による真上へのワイヤ６への引っ張り
により、バンプ１２直上部にて切断することができ、髭
状のワイヤ残りをなくすことができる。Incidentally, even if the wire 6 is not cut by the ultrasonic vibration applied to the capillary 1, the wire 6 is in a state of being easily cut just above the bump 12. By pulling the wire 6, the wire can be cut just above the bump 12, and the wire-like wire residue can be eliminated.

【００５４】その後は、即ち、切断後は、トーチ電極７
とワイヤ６との間に高電圧（１０００〜２０００Ｖ）を
加えることにより、図２（Ａ）に示すように、トーチ電
極７・ワイヤ６先端間にスパーク８を生ぜしめ、ボール
を形成することはいうまでもない。Thereafter, that is, after cutting, the torch electrode 7
By applying a high voltage (1000-2000 V) between the torch electrode 7 and the wire 6, a spark 8 is generated between the torch electrode 7 and the tip of the wire 6 to form a ball, as shown in FIG. Needless to say.

【００５５】図４（Ａ）乃至（Ｄ）は本発明キャピラリ
ーの使用方法の第２の実施例の要部を順に示す断面図で
ある。本実施例は、バンプ２１のパッド１０への接合後
のワイヤ６の切断がより確実にバンプ２１の付け根部分
にて為されるようにするためのものである。FIGS. 4A to 4D are cross-sectional views sequentially showing the main parts of a second embodiment of the method of using the capillary of the present invention. In the present embodiment, the cutting of the wire 6 after the bonding of the bump 21 to the pad 10 is performed more reliably at the base of the bump 21.

【００５６】即ち、ワイヤ６の切断は従来ワイヤ６を真
上に強い力で引っ張ることにより行われたが、これによ
れば、ワイヤ６のバンプ２１との付け根部分よりももっ
と上の部分で切断されることが少なくなかったこと前述
の通りである。That is, the cutting of the wire 6 is conventionally performed by pulling the wire 6 directly upward with a strong force. According to this, the cutting of the wire 6 is performed at a portion higher than the base of the wire 6 with the bump 21. As mentioned above, it is not uncommon for this to be done.

【００５７】つまり、ワイヤ６は引っ張ると弱い部分で
切断され、バンプ２１の形成によりワイヤ６のそれとの
付け根部分が弱くなっている場合が比較的多いので、そ
の付け根部分で切断される確率が多いが、しかし、バン
プ２１を形成してもその付け根部分の強度がほとんど弱
くならないケースも少なくなく、そのようなケースでは
その付け根部分と別の部分で、即ちもっと上の部分で切
断されるからである。そして、付け根部分よりも上の部
分でワイヤ６が切断されると、バンプ２１はその頂上に
長いワイヤ残りが生じ、それが隣接バンプ２１・２１間
のショート事故の発生原因になるおそれがある。そこ
で、ワイヤ６を大きなワイヤ残りが生じないように切断
する必要性が生じ、その必要性に応えるの技術の一つが
本実施例なのである。That is, when the wire 6 is pulled, it is cut at a weak portion, and the base of the wire 6 with the wire 6 is relatively weak due to the formation of the bump 21. Therefore, there is a high probability that the wire 6 is cut at the base. However, even if the bump 21 is formed, the strength of the root portion is hardly weakened in many cases. In such a case, the bump 21 is cut at a portion different from the root portion, that is, at a higher portion. is there. When the wire 6 is cut at a portion above the base portion, a long wire residue is formed on the top of the bump 21, which may cause a short circuit between the adjacent bumps 21. Therefore, it is necessary to cut the wire 6 so that a large wire residue does not occur, and this embodiment is one of techniques for meeting the need.

【００５８】（Ａ）先ず、例えば図２に示すキャピラリ
ーの使用方法の（Ａ）〜（Ｄ）と同じ方法でバンプ（ボ
ール１２）２１を接合した状態にする。図４（Ａ）は接
合した直後の状態を示している。(A) First, bumps (balls 12) 21 are brought into a bonded state by the same method as in (A) to (D) of the method of using the capillary shown in FIG. 2, for example. FIG. 4A shows a state immediately after joining.

【００５９】（Ｂ）次に、図４（Ｂ）に示すように、キ
ャピラリー１を例えば数十〜数百μｍ程度真っすぐに上
昇させる。(B) Next, as shown in FIG. 4B, the capillary 1 is raised straight, for example, by about several tens to several hundreds μm.

【００６０】（Ｃ）次に、図４（Ｃ）に示すように、キ
ャピラリー１を例えば数十〜数百μｍ程度横に動かしテ
ンションをかけてワイヤ６のバンプ２１の付け根部分に
ダメージを与える。尚、このときクランプ１１は締めた
状態にしていても良い。また、キャピラリー１の上昇と
横方向への移動とを同時に行っても良い。(C) Next, as shown in FIG. 4 (C), the capillary 1 is moved laterally, for example, by about several tens to several hundreds μm, and tension is applied to damage the root of the bump 21 of the wire 6. At this time, the clamp 11 may be in a tightened state. Further, the raising of the capillary 1 and the movement in the lateral direction may be performed simultaneously.

【００６１】（Ｄ）次に、（Ｃ）で動かした横方向とは
逆の横方向にキャピラリー１を数十〜数百μｍ程度動か
し、上記付け根部分へのダメージをより確実に与えるよ
うにする。(D) Next, the capillary 1 is moved about several tens to several hundreds μm in a lateral direction opposite to the lateral direction moved in (C) so as to more surely damage the base. .

【００６２】このように、キャピラリー１を横方向に動
かす場合、ワイヤ６のキャピラリー１と接する部分がダ
メージを受けるので、局部にダメージが集中するのを回
避すべく、キャピラリー１を徐々に例えば上にずらすよ
うにすると良い。As described above, when the capillary 1 is moved in the lateral direction, the portion of the wire 6 which is in contact with the capillary 1 is damaged, so that the capillary 1 is gradually moved upward, for example, in order to avoid concentration of the damage in a local area. It is good to shift.

【００６３】（Ｄ）次に、（Ｃ）で動かした横方向とは
逆の横方向にキャピラリー１を数十〜数百μｍ程度動か
し、上記付け根部分へのダメージをより確実に与えるよ
うにする。(D) Next, the capillary 1 is moved about several tens to several hundreds μm in the lateral direction opposite to the lateral direction moved in (C) so as to more surely damage the base portion. .

【００６４】このように、キャピラリー１を横方向に動
かす場合、ワイヤ６のキャピラリー１と接する部分がダ
メージを受けるので、局部にダメージが集中するのを回
避すべく、キャピラリー１を徐々に例えば上にずらすよ
うにすると良い。As described above, when the capillary 1 is moved in the lateral direction, the portion of the wire 6 which is in contact with the capillary 1 is damaged, so that the capillary 1 is gradually moved upward, for example, in order to avoid concentration of the damage locally. It is good to shift.

【００６５】その後は、図２（Ｅ）に示すようにキャピ
ラリー１を上昇させて切断する。すると、ワイヤ６は、
バンプ２１の付け根部分が図４（Ｃ）、（Ｄ）の動作で
大きなダメージを受けて金属疲労を起こした状態になっ
ているので、確実にその付け根部分にて切断される。Thereafter, the capillary 1 is raised and cut as shown in FIG. Then, the wire 6
Since the root portion of the bump 21 is in a state where metal damage has occurred due to the large damage in the operations of FIGS. 4C and 4D, the bump 21 is reliably cut at the root portion.

【００６６】尚、図４（Ｃ）に示したキャピラリー１の
横方向への移動によりワイヤ６のバンプ２１の付け根部
分に充分にダメージを与えることができる場合には、図
４（Ｄ）に示す動作は必要ではなく、すぐにキャピラリ
ー１をバンプ２１の真上に戻してワイヤ６を強く引っ張
って切断する動作に移るようにしても良い。If the lateral movement of the capillary 1 shown in FIG. 4C can sufficiently damage the root of the bump 21 of the wire 6, it is shown in FIG. 4D. The operation is not necessary, and the operation may be such that the capillary 1 is immediately returned to the position immediately above the bump 21 and the wire 6 is strongly pulled and cut.

【００６７】また、図４（Ｃ）、（Ｄ）に示すようにキ
ャピラリー１を左右に動かすことによりワイヤ６のバン
プ２１との付け根の部分にダメージを与えるのではな
く、ワイヤ６にテンションをかけながら上から視て円弧
を描くようにキャピラリー１を動かしてダメージを与え
るようにしても良い。また、キャピラリー１の移動方向
は完全な横方向ではなくても、斜め横方向であっても良
い。というのは、移動方向に横方向成分があれば、上記
付け根部分にダメージを与えられるからである。いずれ
の場合においても、キャピラリー１を横方向にずらして
テンションをかけるとワイヤ６のキャピラリー１と接す
る部分がダメージを受けるので、そこで切断されないよ
う同一箇所にダメージが集中し続けるのを回避すべく、
キャピラリー１を徐々に例えば上にずらすようにすると
良い。Also, as shown in FIGS. 4 (C) and 4 (D), by moving the capillary 1 left and right, the wire 6 is not damaged at the base of the wire 6 with the bump 21 but is tensioned. Alternatively, the capillary 1 may be moved so as to draw an arc when viewed from above, thereby causing damage. Further, the moving direction of the capillary 1 is not limited to the complete horizontal direction, but may be an oblique horizontal direction. This is because if there is a lateral component in the moving direction, the root portion can be damaged. In either case, if the capillary 1 is shifted in the lateral direction and tension is applied, the portion of the wire 6 that is in contact with the capillary 1 is damaged, so that in order to prevent the wire 6 from being cut therefrom, the damage is not concentrated on the same location.
It is preferable to gradually shift the capillary 1 upward, for example.

【００６８】キャピラリー１を横方向（例えば右へ或い
は左へ等一方向、或いは左右方向或いは上から視て円弧
を描くように）に動かしてワイヤ６のバンプ２１との付
け根部分にダメージを与える際、そのダメージを確実に
充分な大きさにするために、キャピラリー１に超音波振
動を与えるようにしてもよい。その場合、ワイヤ６のバ
ンプ２１とキャピラリー１との間の部分の長さを共振し
易い長さにすることが超音波振動をその付け根部分に有
効に伝達し、その部分のダメージをより強く与えること
ができるので好ましい。When the capillary 1 is moved in a lateral direction (for example, in one direction such as rightward or leftward, or in a horizontal direction or in an arc when viewed from above) to damage the root of the wire 6 with the bump 21. To ensure that the damage is sufficiently large, ultrasonic vibration may be applied to the capillary 1. In this case, setting the length of the portion between the bump 21 of the wire 6 and the capillary 1 to a length easily resonating effectively transmits the ultrasonic vibration to the base portion, and more strongly damages the portion. It is preferable because it can be used.

【００６９】また、超音波振動を与える場合において、
クランプ１１を締めた状態にすることが可能であり、そ
して、締めた状態にする場合には、キャピラリー１・バ
ンプ２１間はその超音波振動に対して共振する長さにす
ることが好ましいこと前述の通りであり、それに対して
キャピラリー１・クランプ１１間は共振しない長さにす
ることが必要である。そして、超音波振動はキャピラリ
ーを横方向に動かしてから与えるようにする方が、ワイ
ヤーに確実に超音波振動が伝わるので、ワイヤがバンプ
直上部でより一層切れ易くなる。When ultrasonic vibration is applied,
It is possible that the clamp 11 is in a tightened state, and when the clamp 11 is in a tightened state, it is preferable that the gap between the capillary 1 and the bump 21 has a length that resonates with the ultrasonic vibration. However, it is necessary to make the length between the capillary 1 and the clamp 11 non-resonant. When the ultrasonic vibration is applied after the capillary is moved in the lateral direction, the ultrasonic vibration is reliably transmitted to the wire, so that the wire is more easily cut immediately above the bump.

【００７０】図５は超音波振動によりワイヤに金属疲労
を与えて切断しやすくした場合における金属疲労の度合
いをワイヤと半導体チップとの間に電流を流して抵抗と
して検出できるようにしたバンプ形成装置の一例の概略
を示すものである。同図において、１５はワイヤ６と半
導体チップ１０との間に電流を流しながらその電流を検
出し、その電流とその電流を流すためにかけた電圧とか
ら抵抗値を検出する抵抗検出回路である。FIG. 5 shows a bump forming apparatus capable of detecting the degree of metal fatigue in the case where a metal is fatigued by ultrasonic vibration to make it easier to cut as a resistance by applying a current between the wire and the semiconductor chip. 1 schematically shows an example. In the figure, reference numeral 15 denotes a resistance detection circuit that detects a current while flowing a current between the wire 6 and the semiconductor chip 10, and detects a resistance value from the current and a voltage applied to flow the current.

【００７１】該抵抗検出回路１５によりワイヤ６と半導
体チップ１０との間に流した電流の変化によりその電流
経路の抵抗の変化を検出するのは、ワイヤ６の超音波振
動による金属疲労の度合いにより抵抗が変化し金属疲労
が大きくなる程抵抗が大きくなることを利用して金属疲
労の度合いを把握するためである。具体的には、金属疲
労が所定の度合いに達しワイヤを充分に切断しやすくな
ったときの抵抗値を基準抵抗値として設定しておき、該
抵抗検出回路１５により検出した抵抗値がその基準値を
越えたとき、超音波振動の印加を停止し、次の動作に移
るようにするのである。The reason why the resistance change of the current path is detected by the change in the current flowing between the wire 6 and the semiconductor chip 10 by the resistance detection circuit 15 depends on the degree of metal fatigue caused by the ultrasonic vibration of the wire 6. This is because the degree of the metal fatigue is grasped by utilizing the fact that the resistance increases as the resistance changes and the metal fatigue increases. Specifically, a resistance value when the metal fatigue reaches a predetermined degree and the wire is easily cut sufficiently is set as a reference resistance value, and the resistance value detected by the resistance detection circuit 15 is the reference value. When the value exceeds, the application of the ultrasonic vibration is stopped and the next operation is started.

【００７２】このようにすると、確実にワイヤ切断の前
提として必要な度合いの金属疲労を生ぜしめた状態で次
の切断動作に移行することができると共に、超音波振動
をかける時間が徒に長くなってバンプ形成サイクルが不
必要に長くなり生産性が低下するというおそれもなくす
ことができる。In this way, it is possible to shift to the next cutting operation in a state in which the necessary degree of metal fatigue is generated as a prerequisite for wire cutting, and the time for applying ultrasonic vibration becomes unnecessarily long. This eliminates the possibility that the bump formation cycle is unnecessarily lengthened and the productivity is reduced.

【００７３】図６（Ａ）乃至（Ｄ）は本発明キャピラリ
ーの使用方法の第３の実施例の要部を順に示す断面図で
ある。本実施例は、パッドに接合されてバンプ本体を成
すボール部分（第１のボール）と、該ボール部分にワイ
ヤを介して別のボール（第２のボール）を一体に形成さ
れた構成のバンプを形成しようとするものであり、それ
によりバンプの応力緩和効果をより高めようとするもの
である。FIGS. 6A to 6D are cross-sectional views sequentially showing the main parts of a third embodiment of the method of using the capillary of the present invention. In the present embodiment, a ball portion (first ball) which is joined to a pad to form a bump body and another ball (second ball) are integrally formed on the ball portion via a wire. Is formed to thereby further enhance the effect of relaxing the stress of the bump.

【００７４】（Ａ）図６（Ａ）に示すように、ボール１
２をパッド１０に接合した状態にする。(A) As shown in FIG.
2 is bonded to the pad 10.

【００７５】（Ｂ）次に、キャピラリー（釣鐘状凹部を
有するものであっても良いし、有しないものであっても
良い。）１を数十〜数百μｍ程度引き上げ、ワイヤ６の
ボール（第１のボール）１２から数十μｍ上へ離間した
位置を溶断すべく例えば図６（Ｂ）に示すようにレーザ
光を照射する。尚、溶断は必ずしもレーザ光によること
は不可欠ではなく、水素トーチ等他の手段を用いても良
い。(B) Next, the capillary (which may or may not have a bell-shaped concave portion) 1 is pulled up by about several tens to several hundreds μm, and the ball of wire 6 ( For example, as shown in FIG. 6 (B), a laser beam is irradiated to blow a position separated from the first ball (12) by several tens of μm. It is not essential that the fusing be performed by laser light, and other means such as a hydrogen torch may be used.

【００７６】（Ｃ）すると、図６（Ｃ）に示すように、
ワイヤ６はレーザ光により溶断され、溶断された部分に
はボールが形成される。ボールが形成されるのは、ワイ
ヤ６の第１のボール１２ａと一体の部分と、キャピラリ
ー１の貫通孔を通り、溶断によりボール１２ａ側から分
離された部分とであり、第１のボールには１２ａという
符号を、該ボール１２ａとワイヤ６を介して一体のボー
ル、即ち第２のボールには１２ｂという符号を与えた。
そして、ワイヤ６の溶断によりボール１２ａ側から分離
された部分の先端にできたボールにも次のバンプの第１
のボールになるので、１２ａという符号を与えた。ま
た、第１と第２のボール１２ａ、１２ｂ間に介在するワ
イヤには６ａという符号を与えた。Then, as shown in FIG. 6C,
The wire 6 is blown by the laser beam, and a ball is formed at the blown portion. The ball is formed at a portion of the wire 6 integral with the first ball 12a and at a portion that passes through the through hole of the capillary 1 and is separated from the ball 12a by fusing. The reference numeral 12a is given to the ball 12a and the integral ball via the wire 6, that is, the second ball is given the reference numeral 12b.
The ball formed at the tip of the part separated from the ball 12a by the fusing of the wire 6 also has the first bump of the next bump.
The ball was given a symbol of 12a. Further, the wire interposed between the first and second balls 12a and 12b is denoted by reference numeral 6a.

【００７７】（Ｄ）その後、図６（Ｄ）に示すように、
次のパッド１０上へキャピラリー１を移して第１のボー
ル１２ａをそのパッド１０に接合する。即ち、次のバン
プ形成に移るのである。以後、同じ動作が繰り返し行わ
れる。(D) Thereafter, as shown in FIG.
The capillary 1 is transferred onto the next pad 10 and the first ball 12a is bonded to the pad 10. That is, the process proceeds to the next bump formation. Thereafter, the same operation is repeatedly performed.

【００７８】図７は本キャピラリーの使用方法により形
成されたバンプ２１の断面図である。FIG. 7 is a sectional view of a bump 21 formed by using the present capillary.

【００７９】このようなキャピラリーの使用方法によれ
ば、バンプ２１が、パッド１０に接続された第１のボー
ル１２ａにワイヤ６ａを介して第２のボール１２ｂを形
成した構造になるので、バンプ２１を通常のバンプより
も高くすることができ、延いては応力緩和効果を高める
ことができる。According to such a method of using the capillary, the bump 21 has a structure in which the second ball 12b is formed on the first ball 12a connected to the pad 10 via the wire 6a. Can be made higher than a normal bump, and the stress relaxation effect can be enhanced.

【００８０】また、本方法によれば、図１５に示すよう
なスタッドバンプのように一つのバンプ当たり２〜３回
のボンドを行う必要はなく一つのバンプ当たりのボンド
回数は１回で済むので、生産性の低下を伴うことなくバ
ンプの応力緩和効果を高めることが出きる。Further, according to the present method, it is not necessary to perform bonding two or three times per one bump as in the case of a stud bump as shown in FIG. 15, and the number of times of bonding per one bump is only one. In addition, it is possible to enhance the effect of relaxing the stress of the bump without lowering the productivity.

【００８１】図８（Ａ）、（Ｂ）は本発明キャピラリー
の使用方法の第４の実施例を順に示す断面図である。本
実施例は、バンプ２１の第１と第２のボール１２ａ・１
２ｂ間を繋ぐワイヤ６ａの向きを垂直（図６に示した実
施例では垂直）ではなく、斜めにしようとするものであ
る。具体的には、第１のボール１２ａを接合後、図８
（Ａ）に示すように、キャピラリー１を斜め上方向に上
昇して例えばレーザ光による溶断を行う。すると、図８
（Ｂ）に示すように第１のボール１２ａからワイヤ６ａ
が斜め上方向に延びその上端に第２のボール１２ｂが形
成されたバンプ２１が形成される。図９はそのバンプ２
１を拡大して示す断面図である。FIGS. 8A and 8B are sectional views sequentially showing a fourth embodiment of the method of using the capillary of the present invention. In the present embodiment, the first and second balls 12a
The direction of the wire 6a connecting the wires 2b is not vertical (vertical in the embodiment shown in FIG. 6) but is inclined. Specifically, after bonding the first ball 12a, FIG.
As shown in FIG. 1A, the capillary 1 is raised obliquely upward to perform fusing by, for example, a laser beam. Then, FIG.
As shown in (B), the wire 6a is connected to the first ball 12a.
Extend obliquely upward, and a bump 21 having a second ball 12b formed on the upper end thereof is formed. FIG. 9 shows the bump 2
FIG. 2 is an enlarged sectional view of FIG.

【００８２】このように、バンプ２１の第１と第２のボ
ール１２ａ・１２ｂ間を繋ぐワイヤ６ａの向きを斜め上
向きにするのは、隣接バンプ２１が例えば第２のボール
１２どうしにて互いに接触するショート事故の発生する
おそれをなくすことができるようにするためである。As described above, the direction of the wire 6a connecting the first and second balls 12a and 12b of the bumps 21 is obliquely upward because the adjacent bumps 21 contact each other between the second balls 12, for example. This is because it is possible to eliminate the possibility of a short accident occurring.

【００８３】即ち、一つのバンプ２１についてはそのワ
イヤ６ａの向きを例えば右斜め上方向にし、その隣のバ
ンプ２１のそれを例えば左斜め上方向にすることにより
隣接バンプ２１・２１のワイヤ６ａ・６ａの向きを変え
ることにより第２のボール１２ｂ・１２ｂどうしの距離
を大きくすることができ、延いてはその間のショート不
良の発生を防止することができる。That is, with respect to one bump 21, the direction of the wire 6a is set to, for example, the upper right direction, and that of the adjacent bump 21 is set to, for example, the upper left direction. By changing the direction of 6a, it is possible to increase the distance between the second balls 12b, 12b, and to prevent the occurrence of short-circuit failure therebetween.

【００８４】図１０（Ａ）、（Ｂ）はバンプ２１のワイ
ヤ６ａの向きを、順に右斜め上、直上、左斜め上、右斜
め上、直上、左斜め上というように斜め上と直上とを交
え配列した例を示すもので、（Ａ）は平面図、（Ｂ）は
側面図である。FIGS. 10A and 10B show that the direction of the wire 6a of the bump 21 is in the order of diagonally upper right, diagonally upper right, diagonally upper left, diagonally upper right, diagonally upper right, diagonally upper left, and so on. (A) is a plan view and (B) is a side view.

【００８５】このように、ワイヤ６ａの向きに関しては
種々のバリエーションが考えられ得る。As described above, various variations can be considered for the direction of the wire 6a.

【００８６】[0086]

【発明の効果】請求項１のキャピラリーによれば、釣鐘
状の凹部内を埋めるワイヤ材料もバンプの一部を成すの
で、その分バンプを大きくすることができる。According to the first aspect of the present invention, the wire material filling the bell-shaped recess also forms a part of the bump, so that the bump can be enlarged accordingly.

【００８７】請求項２のキャピラリーの使用方法によれ
ば、ワイヤの先端にスパークによりボールを形成するの
で、ボールをキャピラリーにより押し付けた際そのボー
ルが釣鐘状の凹部を完全に埋めつくした上でキャピラリ
ーとパッドとの間に介在し、バンプとなるので、バンプ
の大きさは従来よりも略その釣鐘状の凹部の大きさ分大
きくすることができる。従って、バンプを大きく形成す
ることにより応力緩和効果を高めることができる。According to the method of using the capillary according to the second aspect, since a ball is formed at the tip of the wire by a spark, when the ball is pressed by the capillary, the ball completely fills the bell-shaped concave portion and then the capillary. Since the bump is interposed between the pad and the pad, the size of the bump can be made larger than that of the related art by the size of the bell-shaped recess. Therefore, the stress relaxation effect can be enhanced by forming the bumps large.

【００８８】請求項３のキャピラリーの使用方法によれ
ば、バンプ形成後にキャピラリに加える超音波振動によ
りワイヤのバンプ直上部に金属疲労を生ぜしめるので、
ワイヤのバンプ直上部での切断を生じやすくすることが
できる。According to the method of using the capillary according to the third aspect, since the ultrasonic vibration applied to the capillary after the formation of the bump causes metal fatigue immediately above the bump of the wire,
It is possible to easily cause the wire to be cut just above the bump.

【００８９】依って、ワイヤを引っ張っての切断が確実
にバンプ直上部にて為され、切断後にバンプ上に髭状の
ワイヤ残りが生じるのを防止することができる。また、
短時間でバンプ直上部の強度を落すことができる。Accordingly, the cutting by pulling the wire is reliably performed immediately above the bump, and it is possible to prevent the generation of a whisker-like wire residue on the bump after the cutting. Also,
The strength immediately above the bump can be reduced in a short time.

【００９０】請求項４のキャピラリーの使用方法によれ
ば、請求項３のキャピラリーの使用法においてキャピラ
リーに横方向に動かしてから超音波振動を与るので、ワ
イヤーに超音波振動が確実に伝わりワイヤがバンプ直上
部でより一層切れ易くなる。請求項５のキャピラリーの
使用方法によれば、キャピラリーを横方向に移動させる
ことによりワイヤのバンプとの付け根部分にテンション
を集中させて、その部分を弱くすることができる。従っ
て、その後ワイヤを引っ張って切断するとき確実にその
付け根部分にて切断されるようにすることができ、延い
ては大きなワイヤ残りの生じるおそれをなくし、ショー
ト不良が起きるおそれをなくすことができる。According to the method of using the capillary according to the fourth aspect, the ultrasonic vibration is applied after the capillary is moved in the lateral direction in the method of using the capillary according to the third aspect. Is more easily cut directly above the bumps. According to the method of using the capillary according to the fifth aspect, by moving the capillary in the lateral direction, the tension can be concentrated on the base of the wire with the bump, and the part can be weakened. Therefore, when the wire is subsequently pulled and cut, the wire can be surely cut at the base portion thereof, so that there is no longer a possibility that a large wire remains and a possibility that a short circuit occurs.

【００９１】請求項６のキャピラリーの使用方法によれ
ば、ボール（第１のボール）と一体のワイヤを切断する
際その切断を溶断により行うことによりそのワイヤの先
端に別のボール（第２のボール）を形成するので、該ボ
ールもバンプの一部と成すことができ、一つのバンプあ
たりの接合（ボンド）回数を増すことなく応力緩和効果
を高めることができる。According to the method of using the capillary according to the sixth aspect, when a wire integrated with the ball (first ball) is cut, the cutting is performed by fusing so that another ball (second ball) is attached to the tip of the wire. Since the ball is formed, the ball can also form a part of the bump, and the stress relaxation effect can be enhanced without increasing the number of bondings (bonding) per one bump.

【００９２】請求項７のキャピラリーの使用方法によれ
ば、ボール接合後のキャピラリの上昇方向を各隣接被ボ
ンディング部において異ならせたので、第１のボールと
第２のボールとの間を結ぶワイヤの向きを異ならせるこ
とができる。従って、隣接する第２のボール間の距離を
大きくすることができ、第２のボールどうしのショート
事故をなくすことができる。According to the method of using the capillary according to the seventh aspect, since the rising direction of the capillary after the ball bonding is made different at each of the adjacent bonded portions, the wire connecting the first ball and the second ball. Direction can be different. Therefore, the distance between adjacent second balls can be increased, and a short-circuit accident between the second balls can be eliminated.

【００９３】請求項８のキャピラリーの使用方法によれ
ば、水素トーチ又はレーザ光により第２のボールの形成
に不可欠なワイヤの溶断を行うので、ワイヤの溶断を充
分な熱により或は照射箇所の制御性良く行うことがで
き、延いては確実な溶断ができる。According to the method of using the capillary according to the eighth aspect, the wire which is indispensable for the formation of the second ball is blown by the hydrogen torch or the laser beam. It can be performed with good controllability, and can be reliably blown.

【００９４】請求項９のバンプ形成装置によれば、抵抗
の変化からワイヤの金属疲労の度合いを検知し、所定の
金属疲労に、換言すれば所定の切れ易さになっているか
否かを判断することができ、ワイヤの切断に移るべきタ
イミングを確実に検出することが可能になる。According to the bump forming apparatus of the ninth aspect, the degree of metal fatigue of the wire is detected from the change in the resistance, and it is determined whether or not the predetermined metal fatigue, in other words, whether or not the wire is easily broken. And it is possible to reliably detect the timing to shift to cutting the wire.

【図面の簡単な説明】[Brief description of the drawings]

【図１】（Ａ）乃至（Ｃ）は本発明キャピラリーの各別
の実施例の下端部を示す断面図である。FIGS. 1A to 1C are cross-sectional views showing a lower end portion of another embodiment of the capillary of the present invention.

【図２】（Ａ）乃至（Ｅ）は本発明キャピラリーの使用
方法の第１の実施例を順に示す断面図である。FIGS. 2A to 2E are sectional views sequentially showing a first embodiment of a method of using the capillary of the present invention.

【図３】図２に示す方法により形成されたバンプを示す
断面図である。FIG. 3 is a cross-sectional view showing a bump formed by the method shown in FIG.

【図４】（Ａ）乃至（Ｄ）は本発明キャピラリーの使用
方法の第２の実施例の要部を順に示す断面図である。FIGS. 4A to 4D are cross-sectional views sequentially showing main parts of a second embodiment of the method of using the capillary of the present invention.

【図５】本発明バンプ形成装置の第１の実施例を示す概
略図である。FIG. 5 is a schematic view showing a first embodiment of the bump forming apparatus of the present invention.

【図６】（Ａ）乃至（Ｄ）は本発明キャピラリーの使用
方法の第３の実施例の要部を順に示す断面図である。FIGS. 6A to 6D are cross-sectional views sequentially showing main parts of a third embodiment of the method of using the capillary of the present invention.

【図７】図５に示す方法により形成されたバンプを示す
断面図である。FIG. 7 is a sectional view showing a bump formed by the method shown in FIG. 5;

【図８】（Ａ）、（Ｂ）は本発明キャピラリーの使用方
法の第４の実施例の要部を順に示す断面図である。FIGS. 8A and 8B are cross-sectional views sequentially showing main parts of a fourth embodiment of the method of using the capillary of the present invention.

【図９】図７に示す方法により形成されたバンプを示す
断面図である。FIG. 9 is a cross-sectional view showing a bump formed by the method shown in FIG.

【図１０】（Ａ）、（Ｂ）はバンプの第１と第２のボー
ル間を繋ぐワイヤの向きに関する配置例の一つを示すも
ので、（Ａ）は平面図、（Ｂ）は側面図である。FIGS. 10A and 10B show one of arrangement examples regarding the direction of a wire connecting a first ball and a second ball of bumps, FIG. 10A is a plan view, and FIG. FIG.

【図１１】（Ａ）、（Ｂ）はキャピラリーの従来例の一
つを示すもので、（Ａ）は斜視図、（Ｂ）は下端部を拡
大して示す断面図である。FIGS. 11A and 11B show one conventional example of a capillary, where FIG. 11A is a perspective view and FIG. 11B is a cross-sectional view showing a lower end portion in an enlarged manner.

【図１２】従来の技術により形成されたバンプを示す断
面図である。FIG. 12 is a cross-sectional view showing a bump formed by a conventional technique.

【図１３】上記従来の技術とは別の従来の技術により形
成されたスタッドバンプを示す断面図である。FIG. 13 is a cross-sectional view showing a stud bump formed by a conventional technique different from the above-described conventional technique.

【図１４】（Ａ）、（Ｂ）はバンプの接合後ワイヤを引
張って切断し、その後、ワイヤ残り部分を押し潰すバン
プ形成技術を示す断面図で、（Ａ）は押し潰す前の状態
を示し、（Ｂ）は押し潰した後の状態を示す。14A and 14B are cross-sectional views showing a bump forming technique for pulling and cutting a wire after bonding a bump and then crushing the remaining portion of the wire, and FIG. 14A shows a state before the crushing. (B) shows the state after crushing.

【図１５】バンプを多重構造にしたスタッドバンプの従
来例を示す断面図である。FIG. 15 is a cross-sectional view showing a conventional example of a stud bump having a multiplex structure of bumps.

【図１６】図１１に示すような従来のキャピラリーを用
いた場合に生じる問題点を示す断面図である。FIG. 16 is a cross-sectional view showing a problem that occurs when the conventional capillary as shown in FIG. 11 is used.

【符号の説明】[Explanation of symbols]

１（１ａ、１ｂ、１ｃ）・・・キャピラリー、２・・・
貫通孔、３・・・釣鐘状凹部、６・・・ワイヤ、６ａ・
・・第１のボールと第２のボールとを繋ぐワイヤ、７・
・・電極（トーチ電極）、８・・・スパーク、１０・・
・パッド、１２・・ボール、１２ａ・・・第１のボー
ル、１２ｂ・・・第２のボール、２１・・・バンプ。1 (1a, 1b, 1c) ... capillary, 2 ...
Through hole, 3 ... bell-shaped recess, 6 ... wire, 6a
..Wires connecting the first ball and the second ball, [7]
..Electrode (torch electrode), 8 ... Spark, 10 ...
· Pad, 12 ··· Ball, 12a ··· First ball, 12b ··· Second ball, 21 ··· Bump.

Claims (9)

【特許請求の範囲】[Claims] 【請求項１】 ワイヤを通す貫通孔が開口する下端面に
略釣鐘状の凹部を形成してなることを特徴とするキャピ
ラリー。1. A capillary, wherein a substantially bell-shaped concave portion is formed on a lower end surface where a through hole through which a wire passes is opened. 【請求項２】 キャピラリーの貫通孔に上から金属から
なるワイヤを通し、該ワイヤの下側に電極を一時的に位
置させて該電極と該ワイヤの先端との間に高電圧を印加
してスパークさせることにより該ワイヤの先端部にバン
プとなるボールを形成し、 上記キャピラリーを下降させることにより被ボンディン
グ側部材の被ボンディング面に上記ボールを押しつけ、
それと共に該キャピラリーに上記パッド面と略平行な方
向の超音波振動を加えることにより上記ワイヤの先端部
のボールを、上記略釣鐘状の凹部内に納まり上記被ボン
ディング面と接する部分が平になる状態にし、 その後、超音波振動を掛け続けつつ上記被ボンディング
面に上記ボールを押しつける力を弱めることにより該ボ
ールを該被ボンディング面に接合させ、 しかる後、上記ワイヤをボールの上にて切断することを
特徴とする請求項１記載のキャピラリーの使用方法。2. A wire made of metal is passed through the through hole of the capillary from above, and an electrode is temporarily positioned below the wire, and a high voltage is applied between the electrode and the tip of the wire. A ball to be a bump is formed at the tip of the wire by sparking, and the ball is pressed against the surface to be bonded of the member to be bonded by lowering the capillary,
At the same time, by applying ultrasonic vibration to the capillary in a direction substantially parallel to the pad surface, the ball at the distal end of the wire is accommodated in the substantially bell-shaped concave portion, and the portion in contact with the surface to be bonded becomes flat. Then, the ball is bonded to the surface to be bonded by weakening the force pressing the ball against the surface to be bonded while continuously applying ultrasonic vibration, and then the wire is cut on the ball. The method according to claim 1, wherein the capillary is used. 【請求項３】 キャピラリーの貫通孔を通した金属から
なるワイヤの先端部に形成したボールを被ボンディング
側部材の被ボンディング面上に接合してバンプを形成し
た後、キャピラリに超音波振動を加えることにより上記
ワイヤの上記バンプ直上部に金属疲労を生ぜしめること
を特徴とするキャピラリーの使用方法。3. A bump formed by bonding a ball formed at the tip of a metal wire passing through a through hole of a capillary to a surface to be bonded of a member to be bonded, and then applying ultrasonic vibration to the capillary. A method of using a capillary, wherein metal fatigue is caused just above the bumps of the wire. 【請求項４】 キャピラリーに超音波振動を加えるに際
して該キャピラリーを横方向に動かしてワイヤをバンプ
直上部で切れやすくすることを特徴とする請求項３記載
のキャピラリーの使用方法。4. The method of using a capillary according to claim 3, wherein when applying ultrasonic vibration to the capillary, the capillary is moved in a lateral direction so that the wire is easily cut immediately above the bump. 【請求項５】 キャピラリーの貫通孔を通した金属から
なるワイヤの先端部に形成したボールをバンプが形成さ
れる、金属からなる被ボンディング側部材の被ボンディ
ング面に接合した後、キャピラリーを稍々上昇させ、 それと同時にあるいはその後、キャピラリーを横方向に
移動させて上記ワイヤにテンションをかけることにより
該ワイヤの上記ボールとの付け根部分にダメージを与
え、 しかる後、上記ワイヤを真上に引っ張ることによりボー
ルとの付け根部分にて切断することを特徴とするキャピ
ラリーの使用方法。5. After bonding a ball formed at the tip of a metal wire passing through a through hole of a capillary to a bonding surface of a metal-bonding-side member on which a bump is formed, the capillary is slightly moved. At the same time or thereafter, the capillary is moved laterally to apply tension to the wire, thereby damaging the root of the wire with the ball, and then pulling the wire straight up A method for using a capillary, characterized in that the capillary is cut at the base of the ball. 【請求項６】 キャピラリーの貫通孔を通した金属から
なるワイヤの先端部に形成した第１のボールを、バンプ
が形成される、被ボンディング側部材の被ボンディング
面に接合した後、該キャピラリーを稍々上昇させ、 その後、上記ワイヤを上記ボールよりも適宜上の部分に
おいて溶断することによりそのボールと一体のワイヤの
上端に第２のボールを形成して該ワイヤを介して連なる
第１と第２のボールからなるバンプを形成することを特
徴とするキャピラリーの使用方法。6. A first ball formed at a distal end portion of a metal wire passing through a through hole of a capillary is bonded to a bonding surface of a bonding-side member on which a bump is formed. Then, the wire is melted at a portion appropriately above the ball to form a second ball at the upper end of a wire integral with the ball, and the first and second balls are connected via the wire. A method of using a capillary, wherein a bump made of two balls is formed. 【請求項７】 ボールを被ボンディング面に接合した後
のキャピラリーの上昇を真っ直ぐな方向に或いは斜めの
方向にし、各隣接被ボンディング部に対するキャピラリ
ーの上昇の方向を異ならせてなることを特徴とする請求
項６記載のキャピラリーの使用方法。7. The method according to claim 7, wherein the capillary is raised in a straight or oblique direction after the ball is bonded to the surface to be bonded, and the directions of raising the capillary with respect to each adjacent bonded portion are made different. A method for using the capillary according to claim 6. 【請求項８】 ワイヤの溶断を水素トーチ又はレーザ光
により為すことを特徴とする請求項６又は７記載のキャ
ピラリーの使用方法。8. The method according to claim 6, wherein the wire is blown by a hydrogen torch or a laser beam. 【請求項９】 キャピラリーの貫通孔を通した金属から
なるワイヤの先端部に形成したボールをバンプが形成さ
れる被ボンディング側部材の被ボンディング面に接合し
た後、キャピラリーを上昇させ、上記ワイヤにテンショ
ンをかけることにより該ワイヤの上記ボールとの付け根
部分にダメージを与えて引っ張り力により上記ワイヤを
ボールとの付け根部分にて切断するバンプ形成装置にお
いて、 上記被ボンディング側部材と、上記ワイヤとの間に電気
を流し、ワイヤの金属疲労による抵抗の変化を検知する
手段を有することを特徴とするバンプ形成装置9. After bonding a ball formed at the tip of a metal wire passing through a through hole of a capillary to a surface to be bonded of a member to be bonded on which a bump is to be formed, the capillary is raised and the wire is connected to the wire. In a bump forming apparatus that applies tension to damage the base of the wire with the ball and cuts the wire at the base of the ball by a pulling force, the bonding side member and the wire Bump forming apparatus having means for detecting a change in resistance due to metal fatigue of a wire by passing electricity between the bumps
JP09329497A 1997-02-28 1997-04-11 Bump forming device Expired - Fee Related JP3620213B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP09329497A JP3620213B2 (en) 1997-02-28 1997-04-11 Bump forming device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9-45016 1997-02-28
JP4501697 1997-02-28
JP09329497A JP3620213B2 (en) 1997-02-28 1997-04-11 Bump forming device

Publications (2)

Publication Number Publication Date
JPH10303201A true JPH10303201A (en) 1998-11-13
JP3620213B2 JP3620213B2 (en) 2005-02-16

Family

ID=26384969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP09329497A Expired - Fee Related JP3620213B2 (en) 1997-02-28 1997-04-11 Bump forming device

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Cited By (7)

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Publication number Priority date Publication date Assignee Title
JP2006086324A (en) * 2004-09-16 2006-03-30 Matsushita Electric Ind Co Ltd Bump forming method and device thereof
JP2006278407A (en) * 2005-03-28 2006-10-12 Renesas Technology Corp Manufacturing method of semiconductor device
JP2006324553A (en) * 2005-05-20 2006-11-30 Renesas Technology Corp Semiconductor device and method of manufacturing same
JP2007294581A (en) * 2006-04-24 2007-11-08 Shinkawa Ltd Tail wire cutting method and program of bonding apparatus
JP2010105008A (en) * 2008-10-29 2010-05-13 Panasonic Electric Works Co Ltd Resistance welding machine
JP2010105006A (en) * 2008-10-29 2010-05-13 Panasonic Electric Works Co Ltd Resistance welding machine
CN116000511A (en) * 2022-12-26 2023-04-25 深圳市海志亿半导体工具有限公司 Cutter head for enhancing fine-pitch wire feeding forming effect

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006086324A (en) * 2004-09-16 2006-03-30 Matsushita Electric Ind Co Ltd Bump forming method and device thereof
JP2006278407A (en) * 2005-03-28 2006-10-12 Renesas Technology Corp Manufacturing method of semiconductor device
JP2006324553A (en) * 2005-05-20 2006-11-30 Renesas Technology Corp Semiconductor device and method of manufacturing same
JP2007294581A (en) * 2006-04-24 2007-11-08 Shinkawa Ltd Tail wire cutting method and program of bonding apparatus
JP4679427B2 (en) * 2006-04-24 2011-04-27 株式会社新川 Tail wire cutting method and program for bonding apparatus
JP2010105008A (en) * 2008-10-29 2010-05-13 Panasonic Electric Works Co Ltd Resistance welding machine
JP2010105006A (en) * 2008-10-29 2010-05-13 Panasonic Electric Works Co Ltd Resistance welding machine
CN116000511A (en) * 2022-12-26 2023-04-25 深圳市海志亿半导体工具有限公司 Cutter head for enhancing fine-pitch wire feeding forming effect
CN116000511B (en) * 2022-12-26 2024-04-09 深圳市海志亿半导体工具有限公司 Cutter head for enhancing fine-pitch wire feeding forming effect

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