JPH10294410A - Semiconductor mounting parts and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide semiconductor mounting parts on which a mounted semiconductor chip can be plated finely with high positional accuracy. SOLUTION: Positioning hole pairs 2 and 3 are formed in both edge sections of a thin metallic strip 1 at pitches which are (n) times (n=1, 2,...) as wide as the product pitch in the length direction and both surfaces of the strip 1 are coated with resist layers. Then recessed sections 14 which set the mounting position of parts are formed into the strip 1 based on a parts pattern formed on the basis of the holes 2 and plated layers 17 which are connected with the connecting terminals of semiconductor mounting parts are formed on the surfaces of the recessed sections 14 based on a plating pattern 16a formed in the resist layer 15 coating the strip 1 having the recessed sections 14 on the basis the positioning holes 3 and the connecting terminals are connected to the plated layers 17 with high accuracy. Therefore, the parts can be mounted on the semiconductor mounting parts with high accuracy by forming the recessed sections 14 and plated layers 17 on the strip 1 with high positional accuracy.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device formed of a thin metal strip, wherein connection terminals of a semiconductor chip to be mounted are connected to predetermined positions and the connection terminals are electrically connected to external terminals.
The present invention relates to a semiconductor mounting component such as a lead frame and a method for manufacturing the same.

[0002]

2. Description of the Related Art Semiconductor mounting parts, such as lead frames, in which connection terminals of a semiconductor chip formed and mounted from a thin metal strip are mounted at predetermined positions and which conduct the connection terminals to external terminals, are widely used. ing. This type of semiconductor mounted component is usually processed and formed by a stamping method or an etching method using a press die, and then is completed by performing electroplating at a predetermined location. At this time, when performing electroplating at a predetermined location, the electroplating is performed using a plating plate having holes formed corresponding to the predetermined location. However, in this method, the positional accuracy of the plating depends on the positional relationship between the plating plate and the portion to be plated of the semiconductor mounted component and the processing accuracy of the semiconductor mounted component itself, and it is difficult to perform plating with high precision positional accuracy. There is a problem.

[0003] In order to solve this problem, a resist layer is formed by electrodeposition on a semiconductor mounted component before plating.
A method of plating after forming a pattern at a predetermined position has also been proposed. However, even in this proposed method, the plating position accuracy is defined by the pattern mask and the external dimensions of the product, and a predetermined plating accuracy may not be obtained. In recent years, it has been required in some cases to perform a dimple-shaped half-etching process on a plate material of a semiconductor mounting component, and to accurately perform plating on the half-etched portion and a minute area around the half-etched portion.

[0004]

In order to meet this demand by the conventional method, problems arise in the adhesion, uniformity, and peelability of the resist layer electrodeposited on the half-etched portion.
Furthermore, with the recent demand for miniaturization and higher density of semiconductor chips mounted on semiconductor mounting parts, finer processing and higher density are also required for processing of semiconductor mounting parts,
It is necessary to increase the precision of the plating position.

The present invention has been made in view of the current situation of this type of semiconductor mounted component as described above.
An object of the present invention is to provide a semiconductor mounting component capable of performing fine plating with high positional accuracy on a mounted semiconductor chip.

It is a second object of the present invention to provide a method of manufacturing a semiconductor mounted component capable of performing fine plating with high positional accuracy on a semiconductor chip to be mounted.

[0007]

In order to achieve the first object, a first embodiment of the present invention is to form a thin metal strip and place a connection terminal of a semiconductor chip to be mounted at a predetermined position. In a semiconductor mounting component that connects and connects the connection terminal to an external terminal, the metal strip is provided at a predetermined repetition interval in a longitudinal direction of the metal strip at an edge of the metal strip. A first pair of positioning holes for performing positioning for forming a component pattern in a first resist layer provided so as to cover, and the metal band based on the component pattern formed in the first resist layer. A recess formed in the material, and setting the mounting position of the semiconductor chip, provided adjacent to the first positioning hole on the inner side in the width direction of the metal strip, and after forming the recess The metal strip A second pair of positioning holes for performing positioning for forming a plating pattern in a second resist layer disposed to cover the first resist layer; and a recess formed in the concave portion based on the plating pattern formed in the second resist layer. It is characterized by a semiconductor mounting component having a plating layer provided on the surface and connecting the connection terminal, and the thin metal strip is preferably in the shape of a strip or a hoop.

Next, in order to achieve the above-mentioned second object, a second embodiment of the present invention is directed to a second embodiment of the present invention, wherein a connection terminal of a semiconductor chip formed of a thin metal strip is mounted at a predetermined position, and In the method of manufacturing a semiconductor mounted component for connecting the connection terminal to an external terminal, a first pair of positioning holes are formed at predetermined repetition intervals in a longitudinal direction of the metal strip at an edge of the thin metal strip. And the first
Forming a second pair of positioning holes adjacent to an inner side of the metal strip in the width direction of the metal strip, and forming a second pair of positioning holes in the first resist layer provided so as to cover the metal strip. Forming a concave portion for setting a mounting position of the semiconductor chip in the metal strip based on a component pattern formed by patterning at a predetermined position positioned with reference to the first positioning hole; and forming the concave portion. The connection terminal is formed on the surface of the concave portion based on a plating pattern formed by patterning at a predetermined position positioned with reference to the second positioning hole in a second resist layer provided so as to cover the metal band material. And a step of forming a plating layer to be connected, characterized by a method of manufacturing a semiconductor mounted component. It is preferable that the looped.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for manufacturing a semiconductor mounted component according to the present invention will be described below with reference to FIGS. 1A and 1B are explanatory views of a step of forming a first positioning hole and a step of forming a second positioning hole in the method of the present invention, wherein FIG. 1A is a cross-sectional view, FIG.
Is the first method for the sheet metal strip in the method of the present invention.
4A is a cross-sectional view, FIG. 3B is a plan view, FIG. 3 is a cross-sectional view of exposure when forming a component pattern in the method of the present invention, and FIG. 5A and 5B are explanatory views of an exposure unit used in the method of the present invention, in which FIG. 5A is a side view, FIG. 5B is a plan view, FIG. 5 is a cross-sectional view of patterning a component pattern in the method of the present invention, and FIG. FIG. 7 is a cross-sectional view of a concave portion forming step in the method, and FIG. 7 is an explanatory view of a plating layer forming step in the method of the present invention.
(D) is a cross-sectional view for sequentially explaining the forming steps, and FIG. 8 is an explanatory view showing one embodiment of a state of mounting a semiconductor chip on a semiconductor mounted component according to the present invention.

In the method of the present invention, first, as shown in FIGS. 1A and 1B, a strip having a thickness of 0.125 mm and a width of 160 mm is formed by a first positioning hole forming step and a second positioning hole forming step. A first pair of positioning holes 2 and a second pair of positioning holes 3 are formed at both longitudinal sides of a copper thin metal strip 1 formed in the shape of a hoop, preferably a coil. Is done. That is, the first pair of positioning holes 2 have a diameter of 2 mm with the hole center at a position 3 mm from the edge, and the second pair of positioning holes 3 are made of metal with respect to the first positioning hole 2. Adjacent to the inside of the width direction of the band material 1 and having a diameter of 2 mm with the hole center at a position 8 mm from the edge, the first pair of positioning holes 2 and the second pair of positioning holes 2 A pair of positioning holes 3
Is formed simultaneously by press working at a repetition interval of 50 mm, which is the same as the product pitch or n times the product pitch (n = 1, 2,...) In the longitudinal direction of the metal strip 1.

The reason why the first positioning holes 2 and the second positioning holes 3 are formed at the same pitch as the product pitch or at a pitch n times the product pitch is merely to improve the product outer shape and the positional accuracy of the plating pattern. However, the positioning holes 2 and 3 can also be formed by etching.

Next, as shown in FIG. 2, the first positioning hole 2 is not blocked in a region between the first positioning holes 2 on both edges of the metal strip 1, and the second positioning hole 3 is A dry film having a width of 140 mm, preferably a photosensitive dry film, is stuck on both surfaces of the metal strip 1 as a resist layer 5 so as to cover it.

Then, as shown in FIG. 4, a mask 13 on which a component pattern is drawn is set, and a frame 12 composed of two upper and lower portions is arranged so as to sandwich the metal strip 1 on which the resist layer 5 is disposed. Pilot pins 10 and 11 can be mounted on the frame 12, and light sources 7 such as ultraviolet light sources are respectively arranged near masks 13 set on the upper and lower frames 12. .

Further, the metal strip 1 is sandwiched by the clipper 8 so that the pilot pin 10 mounted on the frame 12 is inserted into the first positioning hole 2 with respect to the frame 12. 1 is provided with a position adjusting tool (not shown) for adjusting the position of 1. In the illustrated embodiment, a mechanical method for detecting the position of the first positioning hole 2 by inserting the pilot pin 10 into the first positioning hole 2 is disclosed. However, an optical method such as a line sensor or the like is disclosed. It may be configured to detect the position by a magnetic method.

In the present invention, the light source 7 is turned on with the pilot pin 10 being inserted into the first positioning hole 2 while the metal strip 1 is being conveyed, and as shown in FIG. The pattern 13 is printed on the resist layer 5 as an exposed part 6 of the component pattern.

Then, development is performed with a 1% sodium carbonate solution to form a component pattern 6a as shown in FIG.
By etching with an iron chloride solution and removing the resist layer 5 with a 4% sodium hydroxide solution, a concave portion 14 is formed in the metal strip 1 as a component mounting pattern as shown in FIG.

Here, the process proceeds to the plating layer forming step, and FIG.
As shown in FIG. 3A, a photosensitive dry film having a width of 120 mm is used as a resist layer 15 inside the second positioning hole 3 so as not to cover the second positioning hole 3.
To both sides. Then, using a frame holding a mask on which a plating pattern of the same type as that shown in FIG. 4 is drawn and a position adjuster, with the pilot pin 11 inserted into the second positioning hole 3, the The light source 7 is turned on, and the exposed portion 16 of the plating pattern is printed on the resist layer 15 by the light beam from the light source 7 as shown in FIG. 7B. In the illustrated embodiment, the pilot pin 11
Is inserted into the second positioning hole 3 so that the second
Although the mechanical method of detecting the position of the positioning hole 3 has been disclosed, the position may be detected by an optical method or a magnetic method as in the case of the first positioning hole 2.

Then, development is performed with a 1% sodium carbonate solution to form a plating pattern 16a as shown in FIG.
Then, the exposed recesses 14 of the metal strip 1 are plated with Ag using a cyan silver bath, and the resist layer 15 is peeled off with a 4% sodium hydroxide solution, thereby forming the metal as shown in FIG. The plating layer 17 is formed in the concave portion 14 of the strip 1.

The connection terminals of the semiconductor chip are connected to the metal strip 1 on which the plating layer 17 is formed in this way by wire bonding, and the connection terminals are conducted to the external terminals.

As described above, the positional accuracy of the plating layer 17 formed according to the present invention was confirmed. The plating positional accuracy when using a conventional plating plate was ± 300 μm. Position accuracy is ± 50μ
m greatly improved. Further, in the present invention, the first positioning hole 2 and the second positioning hole 3 are simultaneously formed at the same pitch as the product pitch or n times the product pitch.
Processing of parts that require plating position accuracy becomes extremely easy, especially processing of parts that require high-precision plating on or around the half-etched part,
Further, since the product can be formed in a coil shape, it is possible to manufacture a high quality product at low cost without manual operation.

[0021]

As described above, according to the semiconductor mounting component of the present invention, the plating layer for connecting the connection terminal is formed on the surface of the concave portion based on the formed plating pattern, and the connection terminal of the semiconductor chip to be mounted is provided. Is connected to a predetermined position of the plating layer, and the connection terminal is electrically connected to the external terminal.
A concave portion and a plating layer are formed on a thin metal strip with high positional accuracy, and the connection terminals of the semiconductor chip mounted on the semiconductor mounting component with high precision are connected to the plating layer to connect the semiconductor chip to the semiconductor mounting component. It can be mounted with high accuracy.

Further, according to the method of manufacturing a semiconductor mounted component of the present invention, the second positioning is performed on the second resist layer provided so as to cover the thin metal strip having the concave portion formed by the plating layer forming step. A plating layer to which connection terminals are connected is formed on the surface of the concave portion based on a plating pattern formed by patterning at a predetermined position positioned with reference to the means, and connection terminals of a semiconductor chip to be mounted are fixed to predetermined positions of the plating layer. Since the connection terminals are connected to the external terminals and the connection terminals are connected to the external terminals, the concave portions and the plating layers are formed on the thin metal strip with high positional accuracy, and the semiconductor chips mounted on the semiconductor mounting parts with high accuracy are formed. It is possible to provide a method for connecting a connection terminal to a plating layer and mounting a semiconductor chip on a semiconductor mounting component with high accuracy.

[Brief description of the drawings]

FIG. 1 is an explanatory view of a step of forming a first positioning hole and a step of forming a second positioning hole in the method of the present invention;
(A) is a cross-sectional view, (b) is a plan view.

FIGS. 2A and 2B are explanatory views showing the disposition of a first resist layer on a thin metal strip in the method of the present invention, wherein FIG. 2A is a cross-sectional view and FIG. 2B is a plan view.

3A and 3B are explanatory views of exposure at the time of forming a component pattern in the method of the present invention, wherein FIG. 3A is a cross-sectional view and FIG. 3B is a plan view.

4A and 4B are explanatory views of an exposure unit used in the method of the present invention, wherein FIG. 4A is a side view and FIG. 4B is a plan view.

FIG. 5 is a cross-sectional view of the patterning of the component pattern in the method of the present invention.

6A and 6B are explanatory views of a recess forming step in the method of the present invention, wherein FIG. 6A is a cross-sectional view and FIG. 6B is a plan view.

FIG. 7 is an explanatory view of a plating layer forming step in the method of the present invention, and (a) to (d) are cross-sectional views sequentially explaining the forming step.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 thin metal strip 2 first positioning hole 3 second positioning hole 5, 15 resist layer 6, 16 exposure part 6 a component pattern 7 light source 8 clipper 10, 11 pilot pin 12 frame 13 mask 14 recess 16 a plating Pattern 17 plating layer

Claims (4)

[Claims] 1. A semiconductor mounting component formed from a thin metal strip, connecting a connection terminal of a semiconductor chip to be mounted at a predetermined position and conducting the connection terminal to an external terminal. At a peripheral portion of the band, a predetermined repetition interval is provided in the longitudinal direction of the metal band, and positioning for forming a component pattern is performed on a first resist layer provided over the metal band. A pair of positioning holes, a recess formed in the metal strip based on the component pattern formed in the first resist layer, and for setting a mounting position of the semiconductor chip, the first positioning To form a plating pattern on a second resist layer provided adjacent to the hole in the width direction of the metal strip and disposed over the metal strip after the formation of the recess. Position of A second pair of positioning holes for determining the position, and a plating layer provided on the surface of the concave portion based on the plating pattern formed on the second resist layer, and connecting the connection terminal. Characteristic semiconductor mounting parts. 2. The semiconductor mounting component according to claim 1, wherein said thin metal strip has a strip shape or a hoop shape. 3. A method for manufacturing a semiconductor mounted component formed from a thin metal strip and connecting terminals of a semiconductor chip to be mounted at predetermined positions and conducting the connection terminals to external terminals. Forming a first pair of positioning holes at a predetermined repetition interval in a longitudinal direction of the metal band at an edge portion of the metal band, and a width of the metal band with respect to the first positioning hole. Forming a second pair of positioning holes adjacent to the inside in the hand direction; and forming the first pair of positioning holes in the first resist layer disposed over the metal strip.
Forming a concave portion for setting a mounting position of the semiconductor chip on the metal band material based on a component pattern formed by patterning at a predetermined position positioned with reference to the positioning hole, and a metal band formed with the concave portion The connection terminal is connected to the surface of the concave portion based on a plating pattern formed by patterning at a predetermined position positioned with reference to the second positioning hole in a second resist layer provided to cover the material. Forming a plating layer. 4. The method according to claim 3, wherein the thin metal strip has a strip shape or a hoop shape.