JPH10293206A - Formation of color filter, black matrix and spacer for controlling cell gap - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a color filter for which a photolithographic process is not used at all or restrained to the minimum by processing color layers one by one in turn with excimer laser to form the color filter. SOLUTION: The color filter 3R is electrodeposited on all the surface of a glass base plate 1 with a transparent electrode 16 as a feed terminal for electrodeposition (b). Next, the color filter 3R is formed by laser ablation with the excimer laser (c). Then, the color filter 3G is electrodeposited at an entire picture element part except the color filter 3R. Continuously, the excimer laser is radiated through an imaging mask for forming the color filter 3G so as to perform the laser ablation work to form a color filter 3B area (d). The color filter 3B is electrodeposited on the exposed electrode 16 (e). The back matrix forming area is laser-ablated (g) and a zinc oxide film 20 is formed at a part where the electrode 16 is exposed by a fusion electrolytic method (h).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of forming a color filter of a color flat display such as a liquid crystal display device, a thin film EL display device, a field emitter display device and the like, and a black matrix and a cell gap through the method of forming the color filter. The present invention relates to a method for forming a black matrix for forming a control spacer and a method for forming a cell gap control spacer, and in particular, a color filter for forming a black matrix or a cell gap control spacer without using a photolithography process. , A black matrix and a method for forming a cell gap controlling spacer.

[0002]

2. Description of the Related Art First, a general color liquid crystal display device is shown in FIG.
1 will be described.

In FIG. 11, a pair of glass substrates 1A and 1B are arranged at intervals. A polarizing plate 2A is adhered to the outside of one of the glass substrates 1A, and the three primary colors of light, red (R), green (G), and blue ( A number of color filters 3R, 3G, 3B of B) are provided. Further, a black matrix or black stripe 4 for light shielding is arranged between a pair of adjacent color filters 3 to make the color display clear. Among them, the black stripe is used only for the electrodeposition type color filter, and hence reference numeral 4 is hereinafter referred to as a black matrix. A transparent electrode 6 </ b> A is provided inside each of the color filters 3 and the black matrix 4 via a protective film 5.

On the other hand, a light guide plate 7 functioning as a backlight is disposed outside the other glass substrate 1B via a polarizing plate 2B, and the light guide plate 7 is provided near the end face of the light guide plate 7B. A fluorescent lamp 8 for emitting light from the light plate 7 is provided. An insulating layer 9 is provided inside the glass substrate 1B.
A plurality of gates 10 are arranged so as to be covered by the gate. Further, inside the insulating layer 9, a hydrogenated amorphous thin film transistor 11 as a switching element is disposed so as to be opposed to each of the gates 10 so as to be surrounded by a protective member 12. Further, a transparent electrode 6 </ b> B for supplying a current to each of the hydrogenated amorphous thin film transistors 11 is provided inside the insulating layer 9. A liquid crystal L is provided in a sealed space between the transparent electrodes 6A and 6B.
C is enclosed.

The function of the black matrix 4 in the above-described color liquid crystal display device will be described. The black matrix 4 is such that the green color filter 3G is ON, the adjacent red color filter 3R and the blue color filter 3R.
When B is OFF, the backlight from the surface emitting light guide plate 7 transmits only the green color filter 3G in the ON state and the red and blue color filters 3 in the OFF state.
It functions so as not to reach R and 3B.

As a material of the black matrix 4, a material which can not only shield the backlight but also has a low reflectance for the backlight is required. This is because when the reflectance of the black matrix 4 to the backlight is high when the color filter 3G is ON and the adjacent color filters 3R and 3B are OFF, the backlight reflected by the black matrix 4 O corresponding to the red and blue color filters 3R and 3B
The light enters the hydrogenated amorphous silicon thin film transistor 11 in the FF state, and this silicon thin film transistor 11 is
This is because there is a possibility of being in the N state.

[0007] By the way, in view of the demand for low reflectivity, the reflectivity of the case where resin black is used for the black matrix 4 is 0.5%. Although excellent, the black matrix 4 using resin black has an optical density (OD) of 2.3 which is an index indicating the light-shielding performance of the backlight.
Thus, there was a problem that the optical density was low as compared with 4 or more of metallic chromium and low reflection chromium. For this reason, low-reflection chrome in which chromium oxide is mounted on metal chromium is now becoming the mainstream of the black matrix 4.

Next, a method of forming the black matrix 4 will be described. In a method other than the electrodeposition method, first, the black matrix 4 is formed on the glass substrate 1,
After that, the color filters 3R, 3G, 3B of each color are formed. At present, as a method of forming the color filter 3, 4
Although two manufacturing methods are used, the pigment dispersion method and the electrodeposition method will be briefly described here for convenience of explanation.

First, the pigment dispersion method will be described.

The black matrix 4 shown in FIG.
As shown in FIG. 12B, a colored resist 13 for a red color filter 3R is applied to the entire surface of the glass substrate 1 by spin coating or roll coating as shown in FIG. Next, as shown in FIG.
A photoresist 14 is applied on the colored resist 13 by spin coating or roll coating, and is further exposed and developed through a photomask 15 as shown in FIGS. Color filter 3
Form R.

Thereafter, the same steps as described above are repeated for the green color filter 3G and the blue color filter 3B to form three color filters 3R, 3G, 3B as shown in FIG.

Next, the electrodeposition method will be described.

[0013] As shown in FIG.
After forming an ITO thin film 16 for electrodeposition by sputtering or vapor deposition, a photoresist 14 is coated on the ITO thin film 16. Next, FIGS. 13 (b), (c),
As shown in (d), exposure through the photomask 15
By performing development and etching, a stripe of the ITO thin film 16 is formed. Thereafter, as shown in FIG.
The glass substrate 1 on which the stripes of the ITO thin film 16 are formed is immersed in an electrodeposition solution in which the pigment of the red color filter 3R is dispersed, and a positive voltage is applied to the ITO thin film 16 with respect to a counter electrode. Then, the red pigment in the electrodeposition liquid has a submicron size and is negatively charged, and is electrodeposited by electrophoresis on the surface of the positively charged ITO thin film 16. Subsequently, the green and blue color filters 3G and 3B are respectively electrodeposited with the electrodeposition liquid of the green color filter 3G and the electrodeposition liquid of the blue color filter 3B.

Thus, as shown in FIG. 13 (f), the red, green and blue color filters 3 are formed on the glass substrate 1.
After a color matrix 17 composed of R, 3G, and 3B is formed, as shown in FIG. 13G, a photosensitive resin black 18 is applied onto the color matrix 17 by spin coating or roll coating. 13
As shown in (h), ultraviolet rays (U
V) back exposure is performed. Then, the photosensitive resin black 18 on the color matrix 17 becomes the color filter 3
Since the light passes through R, 3G, and 3B, it is not exposed, and is removed in the developing process. As a result, FIG.
As shown in (i), the adjacent color filters 3R, 3R
The resin black 18 remains only between G and 3B to form the black matrix 4.

[0015]

The color filter 3 differs from a semiconductor IC in that the outer dimensions are very large, and the required dimensional accuracy is a pixel pitch of 75 μm in VGA specification, a gap of 25 μm, and a pixel pitch of 7 in SVGA specification.
0 μm, the gap is 20 μm, and the positional accuracy in one panel is required to be ± 2 μm. Therefore, except for the printing method, most color filter manufacturing methods employ a manufacturing process that frequently uses a photo process.

It is considered that the printing method will not be able to cope with the demand for a larger mother glass and higher definition of pixels, which will be required in the future.

In the formation of a color filter according to the conventional method, there is a step between the color filter 3 and the black matrix 4 due to a difference in film thickness. In forming the ITO thin film 16 for display, a step is formed at the step. This could cause coverage problems. Therefore, conventionally,
A transparent resin was applied on the entire surface to fill the steps, and if necessary, further polishing was required, and the process was complicated.

In view of the foregoing, the present invention provides a color filter which does not use or minimizes a complicated photolithographic process which requires a high degree of cooling, and a black matrix having a high optical density and a low reflectance. It is an object of the present invention to provide a method for forming a columnar cell gap control spacer at an accurate position.

[0019]

According to a first aspect of the present invention, there is provided a color filter forming method for forming a color filter for each color by excimer laser processing. By adopting such a configuration, the triangle arrangement and the mosaic arrangement of the color filters, which have been impossible by the electrodeposition method, can be performed without using any complicated photoresist process.

A feature of the method for forming a color filter according to the present invention is that the color filter forming region of a specific color of the transparent ferroelectric film is partially polarized and charged, and the reverse is formed on the polarized and charged transparent ferroelectric film. A color filter pigment of a specific color which is polarized and charged to the polarity is adhered, and a color filter composed of R, B and G is formed by repeating the partial polarization charge of the transparent ferroelectric film and the adhesion of the color filter pigment of the opposite polarity. The point is that it is formed. By adopting such a configuration, a color filter can be formed without using a photoresist process at all.

According to a third aspect of the present invention, there is provided a black matrix forming method according to the second aspect, wherein a polarization antistatic film is formed in a black matrix forming region of a transparent ferroelectric film formed on a transparent electrode, and a color filter is formed. Is formed by forming a copper film on the polarization antistatic film by electroless copper plating, and oxidizing the copper of the copper film to form a black matrix. By adopting such a configuration, it is possible to prevent the formation of the color filter in the black matrix formation region beforehand and to form the black matrix clearly.

A feature of the method of forming a black matrix according to claim 4 is that one surface of the glass substrate is covered with a transparent electrode, a color filter is formed on the transparent electrode, and the transparent electrode without the color filter is formed. A zinc oxide film is formed on the exposed portion of the transparent electrode using a transparent electrode as a power supply terminal, a copper film is formed on the zinc oxide film by electroless copper plating, and copper of the copper film is oxidized to form a black matrix. It is in the point which did. By adopting such a configuration, a black matrix having a large numerical aperture can be easily formed without using a photo process.

According to a fifth aspect of the present invention, there is provided a method for forming a spacer for controlling a cell gap, wherein a photoresist pattern is formed on a transparent electrode on the uppermost layer of a glass substrate on which a color filter is formed by using a mask for forming a spacer. A plurality of columnar spacers made of transparent zinc oxide are formed by a solution electrolysis method, and the surface of each spacer is covered with a highly insulating zinc oxide film. By adopting such a configuration, the spacer can be formed at an accurate position by a photo process without using a spacer dispersing device.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a method for forming a color filter and a black matrix according to the present invention will be described with reference to the drawings.

FIG. 1 shows a first embodiment of the present invention in which a color filter is formed using a dyeing method, a pigment dispersion method, a film transfer method, and the like, and then a black matrix is formed.

First, as shown in FIG. 1A, a transparent electrode film (ITO) 1 is formed on a glass substrate 1 by a sputtering film forming method or the like.
6 is formed to a thickness of 500 to 1000 Å. Then, as shown in FIG. 1 (b), the R, G, B color filters are formed on the transparent electrode film (ITO) 1 by any of the above-described color filter forming methods.
6 is formed. The thickness of the color filter 3 is 1 to
It is about 2 microns.

Next, in FIG. 1C, R, G, B
Is formed on the transparent electrode (ITO) 16 corresponding to the black matrix having no silver oxide (Zn) by a solution electrolysis method.
O) The film 20 is formed. The zinc oxide constituting the film 20 is prepared by using zinc as an anode in an aqueous solution of zinc nitrate having a pH of 5.2.
Cathode deposition can be performed at 0.7 to -1.0 V.

The transparent electrode 16 functions as a power supply electrode for cathodically depositing zinc oxide. 0.15-
The time required for cathodic deposition of 0.3 micron zinc oxide is a few minutes.

Next, in FIG. 1D, the glass substrate 1 on which the color filter 3 is formed is immersed in a palladium chloride (PdCl ₂ ) solution having a catalytic action for 1 to 2 minutes, and Pd ions are adsorbed on the transparent electrode 16. Then, it is immersed in an electroless copper plating solution to deposit copper plating 23 corresponding to the thickness of the color filter 3. The palladium chloride solution is, for example, PdCl ₂ : 0.2 g, HC
l: 0.5ml, H ₂ O: used formulation of 500 ml.

In the electroless copper plating, the copper plating 23 is selectively deposited only on the portion where the zinc oxide film 20 is exposed, and is not deposited on the portion where the color filter 3 is formed. Absent. This is because the color filter 3 serves as a mask. Therefore, the black matrix 4 can be formed by self-alignment without using any photo process.

When viewed from the back side of the glass substrate 1, the copper plating 23 of the black matrix 4 looks black due to the appearance of surface plasmon polariton described later, but is viewed from the side where the color filter 3 is formed. It looks like copper itself with metallic luster. In other words, in this state, the reflectance with respect to the backlight is high, and practicality is lacking.

Therefore, as shown in FIG. 1E, the entire glass substrate 1 is immersed in a solution for oxidizing copper, for example, a hydrogen peroxide solution or a concentrated nitric acid solution, so that the surface of the copper plating 23 has a low reflectance. It is converted into a thin film 24 of copper oxide (CuO). The surface of the copper plating 23 may be converted to a copper oxide thin film 24 by performing a heat treatment in an oxygen atmosphere instead of the wet oxidation.

By the way, plasmons which are compression waves of free electrons exist in metals and semiconductors having a high free electron concentration.
Since this plasmon is a collective vibration of electrons, it naturally belongs to the class of polaritons (combination of particle vibration and electromagnetic wave vibration) accompanied by electromagnetic wave vibration. It is known that, since a vibration mode called plasmon polariton exists on the surface of a metal or a semiconductor, light having the same phase velocity can be absorbed.

Generally, in a metal having a smooth surface, light absorption does not occur because the phase velocities of the two are different, but when random irregularities exist on the surface, the phase velocity of the incident light changes. And light can be absorbed. Copper plating 23 on the black matrix 4
Observation of the interface between the substrate and the zinc oxide film 20 with an electron microscope confirmed that fine irregularities on the order of submicrons were formed. Therefore, the black matrix 4 formed according to the present embodiment allows the surface irregularities to excite the surface plasmon polariton by light in the visible light region, and as a result, the copper plating 23 and the zinc oxide 2
The interface of 0 'exhibits an excellent visible light absorbing ability such as an optical density (OD) of 5, and the black matrix 4 can be formed by self-alignment, so that the aperture is higher than the conventional method of forming a black matrix. A black matrix 4 having a ratio can be realized.

FIG. 2 illustrates an embodiment of the present invention in which a color filter is formed by laser ablation and no complicated photoresist is used.

The glass substrate 1 has a transparent electrode (ITO) in advance.
16 is coated by a method such as sputtering so as to have a film thickness of about 1000 angstroms. Transparent electrode 1
As a method of applying the color filter to 6, any of a pigment dispersion method, a dyeing method, and a film transfer method can be applied. Here, an electrodeposition method which is the simplest method will be described as an example.

In FIG. 2B, a color filter R is electrodeposited on the entire surface of the glass substrate 1 using the transparent electrode (ITO) 16 as a power supply terminal for electrodeposition. Next, a color filter R is formed by laser ablation using an excimer laser through the R formation pattern of the color filter.

Here, laser ablation will be briefly described with reference to FIGS.

An excimer laser is an ultraviolet laser, and can form a pattern on a workpiece by ablation via a photomask. The number of pulse shots can be controlled also in the processing depth direction. In recent years, this technique has been widely used for micro-perforation processing (via holes, through holes, etc.) of polyimide constituting flexible printed boards, thin-film multilayer boards, and the like.

In FIG. 4, a laser beam emitted from an excimer laser oscillator 30 passes through a laser shaping system 31, and the use efficiency of the laser beam is increased by a multi-reflection optical system 40 comprising a high reflection mask 33 and a high reflection mirror 32. The workpiece 36 is irradiated with the pattern of the reflection mask 37 by the imaging optical system 34, and ablation processing is performed while visually observing the monitor 35. The mask 37 and the workpiece 36 are scanned by the scanning system 38 under the control of the CNC controller 39 to increase the ablation processing speed, and ablation processing is performed on the entire surface of the workpiece 36.

FIG. 5 shows details of the ablation processing during scanning of the mask 37 and the workpiece 36.

First, as shown in FIG.
7 and the workpiece 36 are movably arranged, and the laser light that has passed through the pattern a of the mask 37 is applied to the workpiece 3 by the imaging optical system 34.
Then, the workpiece 36 is subjected to ablation processing a '. Thereafter, while the mask 37 and the workpiece 36 are intermittently moved in the order of FIGS. 5B, 5C, and 5D, the laser light that has passed the patterns b, c, d, and e of the mask 37 when the mask 37 was stopped. Is irradiated on the workpiece 36 by the imaging optical system 34, and the workpiece 36 is subjected to ablation processing b ', c', 'd, e'.

Next, returning to FIG. 2, as shown in FIG. 2D, a color filter 3G is electrodeposited on the entire pixel portion except for the color filter 3R by an electrodeposition method.

Subsequently, an excimer laser is irradiated through an imaging mask 37 for forming the color filter 3G.
Laser ablation processing is performed on the color filter 3B forming region.

As shown in FIG. 2E, a color filter 3B is electrodeposited on the exposed transparent electrode 16 by an electrodeposition method. At this stage, the color filters 3R, 3G, 3B are arranged on the glass substrate 1 without gaps (FIG. (F)). Next, as shown in FIG. 2G, the black matrix forming region is laser ablated using the black matrix forming mask 37. Next,
As shown in FIG. 2H, the color filter 3 is removed by laser ablation, and a zinc oxide film 20 is formed by a solution electrolysis method on a portion where the transparent electrode 16 is exposed. Further, as shown in FIG. 2I, a copper plating 23 is applied on the zinc oxide film 20 by electroless copper plating. Then, FIG.
As shown in (j), the surface of the copper plating 23 is oxidized to form copper oxide 24.

FIG. 3 shows the steps of the laser ablation method in which the arrangement of 3R, 3G, and 3B used for the color filter can be easily formed by changing the imaging mask even if the arrangement is a triangle arrangement or a mosaic arrangement. .

That is, first, as shown in FIG. 3A, a color filter 3R is electrodeposited on the entire surface of the transparent electrode 16. Next, as shown in FIG. 3B, the color filter 3R is removed by excimer laser processing except for the region where the color filter 3R is to be formed. Further, as shown in FIG. 3C, a color filter 3G is electrodeposited on the entire area of the transparent electrode 16 from which the color filter 3R has been removed. Thereafter, as shown in FIG. 3D, the color filter 3G in the area where the color filter 3B is formed is formed.
Is removed by an excimer laser, and a color filter 3B is electrodeposited as shown in FIG. Further, FIG.
As shown in (f), each color filter 3 in the black matrix forming region is removed by an excimer laser.

As described above, an extremely fine arrangement of the color filters 3 can be formed by the excimer laser.

FIGS. 6 to 8 show an embodiment of the present invention which is limited to the electrodeposition method. Until now, it has been difficult to form a black matrix other than a black stripe by the electrodeposition method. However, a manufacturing method for forming a black matrix while utilizing the advantages of the electrodeposition method will be described.

FIG. 6 is a plan view of a color filter formed by the electrodeposition method, FIG. 7 is a sectional view taken along line AA 'of FIG. 6, and FIG. 8 is a sectional view taken along line BB' of FIG. .

As shown in FIGS. 7A to 7C, a transparent electrode (ITO) 16 is formed on the glass substrate 1 to a thickness of about 0.1 μm by sputtering or the like, and a color filter is electrodeposited with a photoresist 14. Transparent electrode stripe 16 '
Form. With the photoresist 14 for forming the transparent electrode stripe 16 ′ left, the glass substrate 1 is heated to 50 ° C. containing zinc nitrate and dimethylaminoborane (DMAB).
Is immersed in an aqueous solution for about 20 minutes to form an insulating zinc oxide film 20 having a thickness of 0.2 μm. Next, the photoresist 14 is removed to form a state in which the transparent electrodes 16 and the zinc oxide 20 are alternately arranged as shown in FIG.

Thereafter, as shown in FIG. 7E, the color filters 3R, 3G, 3B are sequentially formed by the electrodeposition method. After the formation of the color filters 3R, 3G, 3B, as shown in FIG. 7F, copper 23 is deposited on the portion where the zinc oxide film 20 is formed by electroless copper plating. Finally, as shown in FIG. 7G, the surface of the copper 23 is oxidized to form copper oxide 24, thereby completing the black matrix 4.

FIG. 8 is a process drawing of a section taken along the line BB 'of FIG. 6, and FIGS. 8 (a) to 8 (d) are the same as FIGS. 7 (a) to 7 (d).

After FIG. 8D, as shown in FIG. 8E, a horizontal stripe is formed on the transparent electrode in the formation region of the black matrix 4 in order to prevent electrodeposition of the color filters 3R, 3G and 3B. Corresponding part is photoresist 14
To cover. Next, the color filters 3R, 3G,
3B, the color filter 3 is not electrodeposited where the photoresist 14 having the horizontal stripes is present.

After the electrodeposition process of the color filters 3R, 3G, 3B is completed, as shown in FIG.
4 is removed, and zinc oxide 20 'is electrodeposited on the exposed portions of the transparent electrodes 16 corresponding to the horizontal stripes by a solution electrolysis method.
Next, the color filter substrate 1 is immersed in an electroless copper plating solution, and as shown in FIG.
Precipitate on 0 '. Finally, as shown in FIG. 8H, the surface of the copper film 23 is oxidized to form copper oxide 24, and the black matrix 4 is completed.

Here, a method of forming a transparent zinc oxide film from an aqueous solution will be briefly described. In this method,
Unlike the formation of the zinc oxide film by the electrodeposition method described above, no electrode for power supply is required, and the reduction reaction of nitrate ions plays an important role in the formation of zinc oxide from the aqueous solution. The reaction formula is shown below.

[0057] _{ZnO (NO 3) 2 → Zn} 2+ + 2NO 3 - (1) (CH 3) 2 + H 2 O → BO 2+ (CH 3) 2 NH + 7H + + 6e - (2) NO 3 - + H 2 O + 2e ⁻ → NO ₂ ⁻ + 2OH ⁻ (3) Zn ²⁺ + 2OH− → Zn (OH) ₂ (4) Zn (OH) ₂ → ZnO + H ₂ O (5) After washing the glass substrate, a sensitizer solution (SnCl ₂ .2)
H ₂ O: 1 g / dm ⁻³ , 37% HCl: 1.0 ml / d
m ⁻³ ) for several minutes, then activator solution (PdC
l ₂ : 0.1 g / dm ^-3 , 37% HCl: 0.1 ml /
dm ⁻³ ) for several minutes. After the pre-processing is completed, about 50
0.05 mol / l of zinc nitrate and 0.001-0.15 mol of dimethylaminoborane (DMAB) heated to a temperature of C
The glass substrate 1 is immersed in an aqueous solution containing / l. In about 20 minutes, a 0.2 micron zinc oxide film 20 can be formed.

Unlike the formation of a zinc oxide film by a sputtering film forming method or an electrodeposition method, the zinc oxide film 20 according to the present method is characterized by having a high insulating property. When the zinc oxide film 20 is used as a transparent electrode, it is problematic that the resistance value is high. However, when forming a color filter in the electrodeposition method, a high resistance value is applied to the zinc oxide used as the base of the black matrix. As required, this feature is a welcome feature.

Next, a method of forming a color filter and a black matrix using no photoresist at all is shown in FIG.
This will be described with reference to FIG.

As shown in FIG. 9A, a transparent electrode (ITO) 16 is formed on the entire surface of the glass substrate 1 by a sputtering method or the like.
The film is formed to a thickness of 00 to 1000 angstroms. On this transparent electrode 16, a transparent ferroelectric film (PZT or the like) 25 for polarization charging is formed to a thickness of about 0.1 μm.
Next, a zinc oxide material having photosensitivity is applied to the entire surface of the ferroelectric film 25 by a spin coating method or a roll coating method, and prebaking is performed. Next, exposure and development are performed using a black matrix forming mask of a color filter, and as shown in FIG. 9B, the zinc oxide film 20 is left only in the black matrix forming region. After that, main firing is performed to obtain a dense zinc oxide film 20. Since the zinc oxide film 20 is a non-ferroelectric film, remnant polarization cannot be obtained even when poling by applying a DC electric field. Therefore, as shown in FIG. 9C, a minus is applied to the transparent electrode 16 on the glass substrate.
A DC electric field of plus several volts is applied to the formation region of the color filter 3R for several tens of nanoseconds, and positive remanent polarization is formed on the surface of the ferroelectric film 25 as shown in FIG. In the polling, the entire surface of the color filter may be polled with a two-dimensional stylus at one time or may be sequentially polled with a linear one-dimensional stylus.

Next, the glass substrate 1 on which the poling of the color filter 3R has been completed is immersed in a micelle electrolyte in which the organic pigment of the color filter 3R is dispersed. In the micelle electrolyte, the organic pigment of the color filter 3R is negatively charged by the micellizing material, and as shown in FIG. 9E, the color is applied to the ferroelectric film 25 whose surface is positively polarized by poling. The filter 3R precipitates. Similarly, the color filters 3G and 3B are deposited on the glass substrate 1. In FIG. 9F, the color filters 3R, 3G, 3
The glass substrate 1 on which the formation of B is completed is immersed in an electroless copper plating solution, and copper plating 23 is applied to a black matrix portion as shown in FIG. Finally, as shown in FIG. 9H, the surface of the copper film 23 is oxidized to
To form

FIG. 10 shows an embodiment of a method for forming a cell gap control spacer according to the present invention.

As shown in FIG. 10A, the glass substrate 1
Above, the black matrix 4 and the color filter 3 are formed by any of the above-described forming methods.
Furthermore, each color filter 3 is covered with a protective film 26.

In such a state, the protective film 26
An ITO thin film 16 serving as a transparent electrode is formed thereon by sputtering or vapor deposition, and a photoresist pattern 27 for forming a spacer is formed on the ITO thin film 16 using a mask for forming a spacer. Then, an ITO thin film 1 was formed on a portion having no photoresist pattern 27 by solution electrolysis.
A plurality of prismatic cell gap control spacers 28 made of transparent zinc oxide connected to 6 are formed at predetermined intervals. The upper part of each spacer 28 protrudes above the photoresist pattern 27. Then
The surface of each spacer 28 is coated with a highly insulating zinc oxide film 29 by an immersion method.

Next, as shown in FIG. 10B, by removing the photoresist pattern 27, a cell gap control spacer 28 is formed. This spacer 28 may be cylindrical.

Then, using each of the spacers 28,
Attach the glass substrate 1 on which the ITO thin film 16 and the like are laminated,
When the liquid crystal is sealed, a liquid crystal display device can be formed as shown in FIG.

As described above, according to the present embodiment, a spacer can be formed at an accurate position by a photo process without using a spacer dispersing device, and a liquid crystal display device having a predetermined thickness can be formed.

It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made as necessary.

[0069]

As described above, according to the color filter forming method of the first aspect of the present invention, color filters for each color are sequentially formed by excimer laser processing. Triangle arrangement and mosaic arrangement of color filters, which were impossible, can be made possible without using any complicated photoresist process.

Further, according to the color filter forming method of the present invention, the color filter forming region of a specific color of the transparent ferroelectric film is partially polarized and charged, and the polarized transparent transparent film is formed. A color filter pigment of a specific color polarized in the opposite polarity is deposited on the dielectric film, and R, B, G by repeating the partial polarization charging of the transparent ferroelectric film and the deposition of the color filter pigment of the opposite polarity. The color filter can be formed without using a photoresist step at all.

According to the third aspect of the present invention, a polarization preventing film is formed in a black matrix forming region of a transparent ferroelectric film formed on a transparent electrode to form a color filter. Later, a copper film is formed by electroless copper plating on the polarization antistatic film, and the copper of this copper film is oxidized to form a black matrix, so that the formation of a color filter in the black matrix formation region is prevented beforehand. , The black matrix can be clearly formed.

According to the method of forming a black matrix of the present invention, one surface of a glass substrate is covered with a transparent electrode, and a color filter is formed on the transparent electrode, and no color filter is formed. A zinc oxide film is formed on the exposed portion of the transparent electrode using the transparent electrode as a power supply terminal, a copper film is formed on the zinc oxide film by electroless copper plating, and copper of the copper film is oxidized to form a black matrix. Therefore, a black matrix having a large numerical aperture can be easily formed without using a photo process.

According to the method of forming a spacer for controlling a cell gap according to the present invention, a photomask is formed on a transparent electrode on the uppermost layer of a glass substrate on which a color filter is formed by using a mask for forming a spacer. A resist pattern is formed, a plurality of columnar spacers made of transparent zinc oxide are formed by a solution electrolysis method, and the surface of each spacer is coated with highly insulating zinc oxide. Spacers can be formed at precise positions.

[Brief description of the drawings]

FIG. 1 is a process chart showing an embodiment of a method for forming a color filter and a black matrix according to the present invention.

FIG. 2 is a process chart showing another embodiment of the method for forming a color filter and a black matrix of the present invention.

FIG. 3 is a process diagram showing formation of a complex array of color filters in the embodiment of FIG. 2;

FIG. 4 is a perspective view showing a specific example of an excimer laser.

FIG. 5 is a process chart showing excimer laser processing by the apparatus of FIG. 4;

FIG. 6 is a plan view showing an embodiment of a color filter formed by an electrodeposition method.

7 is a sectional view taken along the line AA ′ of FIG. 6;

FIG. 8 is a sectional view taken along the line BB ′ of FIG. 6;

FIG. 9 is a process chart showing another embodiment of the method for forming a color filter and a black matrix of the present invention.

FIG. 10 is a process diagram schematically showing an embodiment of a liquid crystal display device using a method for forming a cell gap control spacer of the present invention.

FIG. 11 is a longitudinal sectional view showing a general color liquid crystal display device.

FIG. 12 is a process chart showing a conventional method of forming a black matrix by a pigment dispersion method.

FIG. 13 is a process chart showing a method of forming a black matrix by a conventional electrodeposition method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Glass substrate 3, 3R, 3G, 3B color filter 4 Black matrix 14 Photoresist 15 Photomask 16 Transparent electrode (ITO thin film) 20 Zinc oxide film 23 Copper plating 24 Copper oxide thin film

Claims (5)

[Claims] 1. A color filter film of any one of R, B, and G is formed on one surface of a glass substrate, and this color filter film is divided into a plurality of color filters by excimer laser processing. Forming a color filter film of any one of R, B, and G, which is not used, on one surface of the glass substrate which is separated and exposed;
The color filter film is divided into a plurality of color filters by excimer laser processing, and the two color filters are separated and exposed on one surface of the exposed glass substrate to the last unused one of R, B and G. A color filter film of one color is formed, and the color filter film is divided into a plurality of color filters by excimer laser processing to form a color filter composed of R, B, and G. Forming method. 2. A surface of a glass substrate is covered with a transparent electrode, a transparent ferroelectric film is formed on the transparent electrode, and a color filter forming region of a specific color of the transparent ferroelectric film is partially polarized and charged. On the polarization-charged transparent ferroelectric film, a color filter pigment of a specific color polarized in the opposite polarity is attached, and the partial polarization charging of the transparent ferroelectric film and the adhesion of the color filter pigment in the opposite polarity are performed. A color filter comprising R, B, and G is formed by repeating the above method. 3. The polarization antistatic film according to claim 2, wherein a polarization antistatic film is formed in a black matrix forming region of the transparent ferroelectric film formed on the transparent electrode, and an electroless film is formed on the polarization antistatic film after forming a color filter. A method for forming a black matrix, comprising: forming a copper film by copper plating; and oxidizing copper of the copper film to form a black matrix. 4. A surface of a glass substrate is covered with a transparent electrode, a color filter is formed on the transparent electrode, and a zinc oxide film is formed on an exposed portion of the transparent electrode where no color filter is formed, using the transparent electrode as a power supply terminal. And forming a copper film on the zinc oxide film by electroless copper plating, and oxidizing copper of the copper film to form a black matrix. 5. A photoresist pattern is formed on a transparent electrode on the uppermost layer of a glass substrate on which a color filter is formed by using a mask for forming a spacer, and a plurality of columnar columns made of transparent zinc oxide are formed by solution electrolysis. A method for forming a cell gap controlling spacer, comprising: forming a spacer; and covering the surface of each spacer with a zinc oxide film having high insulating properties.