JPH10284853A - Housing for electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To earth a cover and a case surely by setting an acute bending angle at the fitting part of the cover and the case and setting the dimensions at the fitting part of the case smaller than the upper dimensions at the fitting part on the cover side but larger than the lower dimensions thereof thereby bringing the cover and the case into tight contact. SOLUTION: Bending angle A at the fitting part of a cover 9 is set at 90 deg. or less and deformation of the cover 9 after fitting is set within the elastic deformation of the material. The dimension L1 at the fitting part of a case 8 is set larger than the dimension L2 on the lower side at the fitting part of the cover 9 but smaller than the dimension L3 on the upper side thereof. The cover 9 is inserted while being enlarged along the case 8 to generate a spring force at the fitting part of the cover 9 and the cover 9 is fitted tightly to the case. Consequently, mechanical and electrical contact is attained stably between the cover 9 and the case 8 and a board 1 can be earthed surely to the cover 9 and the case 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device housing having a substrate on which an electronic circuit is mounted.

[0002]

2. Description of the Related Art FIG. 7 shows a conventional electronic device housing, in which a board on which an electronic circuit is mounted, a metal case having studs for holding the board, and a hole to be fitted in a half-opening of the case. FIG. 11 is an explanatory diagram of a housing configuration of an electronic device including a metal cover having a cover. In the figure, 1 is a substrate, 2 is a screw, 3 is a stud holding the substrate 1, 4 is a metal case, 5 is a half hole provided in the case 4, 6 is a hole to be fitted in the half hole 5,
Reference numeral 7 denotes a metal cover having a hole 6.

FIG. 8 is a cross-sectional view of FIG. 7 showing a conventional electronic device housing, wherein 1 to 7 are the same as those in FIG. 7, and L1 is the dimension of the case 4 fitting portion, L2 is the dimension of the cover 7 fitting portion. Here, the bending angle of the fitting portion of the case 4 and the bending angle of the fitting portion of the cover 7 are usually 90 °, and L1 ≦ L2.

Next, the operation will be described. The substrate 1 is grounded to the case 4 by being held on the stud 3 by screws 2. The hole 6 provided in the cover 7 is
The case 4 and the cover 7 are in electrical contact with each other by being fitted with the half blank 5 provided on the
And is grounded to the cover 7. Thereby, the substrate 1
Is mechanically and electrically protected by being covered by the case 4 and the cover 7.

[0005]

Since the conventional electronic device housing is constructed as described above, the substrate on which the electronic circuit is mounted is covered with a metal case and a metal cover to provide a mechanical structure. Had the function of being electrically protected. However, since the board affects electromagnetic noise from the outside, the board must be securely grounded to the cover and case that protects it. Since the electrical contact becomes unstable due to the gap, the grounding of the cover is not reliable, and the electrical characteristics are deteriorated due to the influence of external electromagnetic noise on the substrate. In order to solve this problem, the cover must be fixed to the case by soldering, conductive adhesive, or screws, etc., which significantly increases the number of manufacturing steps and lacks maintenance and other maintenance. Was. Furthermore, in order to fit the cover to the case, the cover must be inserted into the case while visually checking the holes provided in the cover and the positions of the half-open holes provided in the case so as not to deform the cover and the case. In order to remove the cover that has been fitted once by maintenance such as repair, insert a jig etc. into the slight gap between the cover and the case and push the cover open,
It is necessary to pay attention to the scratches and deformation of the cover and the case, and there is also a problem in the assembling workability. Further, in order to reliably protect the substrate from external electromagnetic noise, a cover or a case is manufactured by a processing method such as cutting or casting, but it is expensive and has a problem in cost.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and the grounding of the cover stabilizes the electric characteristics, enables easy fitting and removal, and is excellent in maintainability. It is intended to provide an inexpensive housing configuration.

[0007]

According to a first aspect of the invention, there is provided an electronic apparatus housing, wherein a bending angle of a fitting portion of the cover is set to 90 ° or less, a dimension L1 of the fitting portion of the case, and a lower side of the fitting portion of the cover. L2 and the dimension L3 above the fitting portion of the cover are L2
≦ L1 ≦ L3.

[0008] Further, the electronic device housing according to the second invention comprises:
A groove is formed in the case to guide the half-opening of the cover, the bending angle of the fitting part of the cover is set to 90 ° or less, the dimension L1 of the fitting part of the case, the dimension L2 below the fitting part of the cover, and the The dimension L3 on the upper side of the fitting portion is set to L2 ≦ L1 ≦ L3.

Further, the electronic device housing according to the third aspect of the present invention includes:
The case is provided with a slit through which a jig or the like for removing the cover can be inserted, the bending angle of the fitting portion of the cover is set to 90 ° or less, the dimension L1 of the fitting portion of the case, and the dimension L2 of the lower portion of the fitting portion of the cover. And the dimension L3 above the fitting portion of the cover are set to L2 ≦ L1 ≦ L3.

[0010] The electronic device housing according to a fourth aspect of the present invention includes:
A stud for holding the substrate is provided at a rising portion from the side of the case, and a bending angle of a fitting portion of the cover is set to 90 ° or less,
The dimension L1 of the fitting part of the case, the dimension L2 of the lower part of the fitting part of the cover, and the dimension L3 of the upper part of the fitting part of the cover are L2 ≦ L.
It is set so that 1 ≦ L3.

[0011] Further, an electronic apparatus housing according to a fifth aspect of the present invention includes:
A groove is provided in the case to guide the half-opening of the cover, a slit is provided in the case to insert jigs and the like for removing the cover, and a stud for holding the board is provided in the rising portion from the side of the case, and the cover is fitted. The bending angle of the part was set to 90 ° or less, and the dimension L1 of the fitting part of the case, the dimension L2 of the lower part of the fitting part of the cover, and the dimension L3 of the upper part of the fitting part of the cover were set to L2 ≦ L1 ≦ L3. Things.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 FIG. FIG. 1 is a perspective view showing a first embodiment of the present invention, in which 1 to 3 are the same as those of the above-mentioned conventional structure, 8 is a metal case, 9 is a metal cover,
Reference numeral 0 denotes a hole provided in the case 8, and reference numeral 11 denotes a half hole provided in the cover 9 fitted in the hole 10.

FIG. 2 is a sectional view of FIG. 1 for explaining the first embodiment of the present invention. In FIG. 2, reference numerals 1 to 3 and 8 to 11 are the same as those of the first embodiment. The bending angle of the fitting portion is set to 90 ° or less, for example, in the present embodiment, is set to 80 ° to 90 ° so that the deformation amount of the cover 9 after fitting is within the elastic deformation of the material. L1 is the dimension of the case 8 fitting portion, L2 is the dimension of the cover 9 below the fitting portion, L
Reference numeral 3 denotes the dimension of the upper part of the cover 9 where L2 ≦ L1 ≦ L3.
Is set to

Since the first embodiment of the present invention is configured as described above, at the time of fitting, the cover is pushed out and inserted along the case, and the case fitting portion is opened by the spring force of the cover fitting portion. In the state of being pressed, it is stuck and stable mechanical and electrical contact is obtained. This ensures that the substrate is grounded to the cover and the case, protects the substrate against external electromagnetic noise, and stabilizes the electrical characteristics. Furthermore, it is not necessary to fix to the case by soldering, conductive adhesive, screwing, or the like, so that an inexpensive housing configuration in which the cover can be attached and detached can be provided.

Embodiment 2 FIG. 3 is a perspective view showing Embodiment 2 of the present invention.
1 is the same as that of the first embodiment, and 12 is a hole 1
Reference numeral 13 denotes a groove provided in the case 12 into which the half blank 11 is guided.

Since the second embodiment of the present invention is configured as described above, the same effects as in the first embodiment can be obtained. Further, when the cover is fitted, the half-opening of the cover is guided to the groove of the case, so that the positioning of the cover is facilitated and the assembling workability is improved.

Embodiment 3 FIG. 4 is a perspective view showing a third embodiment of the present invention.
1 is the same as that of the first embodiment, and 14 is the hole 1
0 is a case provided, and 15 is a slit provided in the case 14.

Since the third embodiment of the present invention is configured as described above, the same effects as in the first embodiment can be obtained. Also, since the jigs and tools for removing the cover can be easily inserted into the slits provided in the case, the cover can be removed without damaging or deforming the cover and the case, and the maintainability such as repair is excellent. .

Embodiment 4 FIG. 5 is a perspective view showing Embodiment 4 of the present invention.
1 is the same as that of the first embodiment, and 16 is the hole 1
The case 17 provided with 0 is the rising provided on the side surface of the case 16, and the stud 3 for holding the substrate is provided at the rising 17.

Since the fourth embodiment of the present invention is configured as described above, the same effects as in the first embodiment can be obtained. In addition, by screwing the board to the studs provided at the rise from the side of the case, both sides of the case and the board are integrated, increasing the strength of the side of the case against the force in the cover pressing direction. Since deformation can be prevented, the adhesion between the case and the cover is improved.

Embodiment 5 FIG. 6 is a perspective view showing a fifth embodiment of the present invention.
1 is the same as the first embodiment, and
Reference numerals 5 and 17 are the same as those in the second, third, and fourth embodiments, and reference numeral 18 is a case provided with a hole 10, a groove 13, a slit 15, and a riser 17.

Since the fifth embodiment of the present invention is configured as described above, the same effects as those of the first to fourth embodiments can be obtained.

[0023]

According to the first invention, the bending angle of the fitting portion of the cover with the case is set to 90 ° or less, and the dimension L1 of the fitting portion of the case and the dimension L2 of the lower portion of the fitting portion of the cover are reduced. By setting the dimension L3 on the upper side of the fitting portion of the cover to L2 ≦ L1 ≦ L3, the cover is pushed and spread along the case at the time of fitting, and the case is fitted by the spring force of the cover fitting portion. In the state where the parts are pressed, the parts are in close contact with each other, and stable mechanical and electrical contacts are obtained. This ensures that the substrate is grounded to the cover and the case, protects the substrate against external electromagnetic noise, and stabilizes the electrical characteristics. Furthermore, it is not necessary to fix to the case by soldering, conductive adhesive, screwing, or the like, so that an inexpensive housing configuration in which the cover can be attached and detached can be provided.

According to the second aspect, the same effects as those of the first aspect can be obtained. In addition, when the cover is fitted, the cover is guided to the groove of the half-blanked case, so that the positioning of the cover is facilitated and the assembling workability is improved.

According to the third aspect, the same effects as those of the first aspect can be obtained. Also, since the jigs and tools for removing the cover can be easily inserted into the slits provided in the case, the cover can be removed without damaging or deforming the cover and the case, and the maintainability such as repair is excellent. .

According to the fourth aspect, the same effects as those of the first aspect can be obtained. Also, by screwing the board to the stud provided at the rise from the side of the case,
Since the both side surfaces of the case and the substrate are integrated, the strength of the case side surface against the force in the cover pressing direction is increased, and the case is prevented from being deformed by the cover pressing force, so that the adhesion between the case and the cover is improved.

According to the fifth aspect, the same effects as those of the first to fourth aspects can be obtained.

In the above description, a case in which a metal cover and a metal case are used has been described. However, a cover or case using another material such as a resin material subjected to a conductive surface treatment is described. The same effect can be expected.

In the above description, the case where the stud for holding the substrate is used is shown. However, the case itself is subjected to drawing or screw processing to have the same function as the stud, and the same effect is obtained when the stud is omitted. The effect can be expected.

[Brief description of the drawings]

FIG. 1 is a first embodiment of an electronic device housing according to the present invention;
FIG.

FIG. 2 is a first embodiment of an electronic device housing according to the present invention;
It is sectional drawing explaining.

FIG. 3 is an electronic device housing according to a second embodiment of the present invention;
FIG.

FIG. 4 is an electronic device housing according to a third embodiment of the present invention;
FIG.

FIG. 5 is an electronic device housing according to a fourth embodiment of the present invention;
FIG.

FIG. 6 is an electronic device housing according to a fifth embodiment of the present invention.
FIG.

FIG. 7 is a diagram illustrating a conventional electronic device housing.

FIG. 8 is a cross-sectional view illustrating a conventional electronic device housing.

[Explanation of symbols]

1 board, 2 screws, 3 studs, 4 cases, 5
Half blanking, 6 holes, 7 covers, 8 cases, 9 covers,
10 holes, 11 half blanking, 12 cases, 13 grooves, 1
4 cases, 15 slits, 16 cases, 17 rising, 18 cases.

Claims (5)

[Claims] A substrate having an electronic circuit, a stud holding the substrate, a case having the stud,
In a case of an electronic device composed of the case and a cover fitted with the case, a bending angle of a fitting portion of the cover with the case is set to 90 ° or less, and a dimension L1 of the fitting portion of the case is set.
And a dimension L2 below the fitting portion of the cover and a dimension L3 above the fitting portion of the cover are set to L2 ≦ L1 ≦ L3. 2. A board on which an electronic circuit is mounted, a stud for holding the board, a case having the stud,
In the electronic device housing configured by the case and the cover that fits, a groove provided in the cover and through which half-blanking is guided is provided in the case, and a bending angle of a fitting portion of the cover with the case is adjusted. 90 ° or less, a dimension L1 of the fitting portion of the case, a dimension L2 of a lower portion of the fitting portion of the cover,
The dimension L3 above the fitting portion of the cover is L2 ≦ L1 ≦ L
3. An electronic device housing set to 3. 3. A board on which an electronic circuit is mounted, a stud for holding the board, a case having the stud,
In a case of an electronic device composed of the case and a cover fitted with the case, a slit for inserting a jig or the like for removing the cover is provided in the case, and a bending angle of a fitting portion of the cover with the case is provided. 90 ° or less, and the dimension L1 of the fitting part of the case, the dimension L2 of the lower part of the fitting of the cover, and the dimension L3 of the upper part of the fitting of the cover are set to L2 ≦ L1 ≦ L3. Electronic equipment housing characterized by the above-mentioned. 4. A board on which an electronic circuit is mounted, a stud for holding the board, a case having the stud,
In an electronic device housing composed of the case and a cover fitted with the case, the stud is provided at a rising portion from a side surface of the case, and a bending angle of the fitting portion between the cover and the case is set to 90 ° or less. , Dimension L of the fitting portion of the case
1. An electronic device housing, wherein a dimension L2 below the fitting portion of the cover and a dimension L3 above the fitting portion of the cover are set to L2 ≦ L1 ≦ L3. 5. A board on which an electronic circuit is mounted, a stud for holding the board, a case having the stud,
In an electronic device housing composed of a cover fitted with the case, a groove provided in the cover is provided in the case, and a slit through which a jig for removing the cover can be inserted. The case is provided, the stud is provided at a rising portion from a side surface of the case, a bending angle of a fitting portion of the cover with the case is 90 ° or less, and a dimension L1 of a fitting portion of the case and An electronic device housing, wherein a dimension L2 below the fitting portion of the cover and a dimension L3 above the fitting portion of the cover are set to L2 ≦ L1 ≦ L3.