JPH10284684A - Semiconductor device and semiconductor chip mounting method - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To provide a semiconductor device such as a module or a card and a semiconductor chip mounting method capable of high-density mounting and improving the degree of freedom in wiring. SOLUTION: This is a flash memory card used as an external storage device such as a personal computer, a workstation, etc., comprising a plurality of semiconductor chips 1;
Mounting board 2 for mounting these semiconductor chips 1 on both sides
And two tape bases 3 for electrically connecting the semiconductor chip 1 and the mounting substrate 2. A predetermined range is sealed by the sealing body 4 and stored in the case 5. It is being handled. The semiconductor chip 1
It is composed of two types of semiconductor chips 6 and 7 cut and formed in block units and chip units, which are directly mounted on the mounting board 2 and connected between the semiconductor chips 6 and 7 and the mounting board 2. Is performed via the tape base material 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip mounting technique, and more particularly to a semiconductor device such as a module or a card and a semiconductor chip mounting method suitable for mounting a plurality of semiconductor chips on a mounting board. Regarding effective technology.

[0002]

2. Description of the Related Art Generally, a semiconductor device has a configuration in which dicing is performed from a wafer state to a semiconductor chip state, and the semiconductor chip is sealed with a sealing body made of resin. Outer leads for electrically connecting a plurality of connection terminals (bonding pads) arranged on the surface of the semiconductor chip and external wiring are connected to the sealing body.

For example, according to the study by the present inventor, when a semiconductor chip is sealed and high-density mounting such as a module or a card is required, a thin type of the above-mentioned sealed body is used. TSOP (Thin
Small-Outline Package) and TCP (Tape Carrier Pac)
It is conceivable to seal using a sealing body having a kage) structure.

A method for mounting a plurality of semiconductor devices thus sealed on a mounting substrate is described in, for example, Japanese Patent Application Laid-Open No.
As described in Japanese Patent No. 14980, a method of mounting semiconductor devices in parallel in an array, a method of stacking and mounting semiconductor devices in a stacked structure, and the like are given.

[0005] A module or a card configured as described above includes, for example, a DRAM used as a main storage device of a personal computer, a work station, or the like.
(Dynamic Random Access Memory) modules, flash memory cards used as external storage devices, and the like.

[0006]

By the way, in the above-described semiconductor device mounting technology, when the semiconductor devices are mounted in a configuration in which one semiconductor chip is sealed with a sealing body one by one, It is necessary to mount semiconductor devices at intervals so as not to short-circuit, and in the case of stacked mounting, thin mounting is impossible due to the sealing body, and small area and high density mounting are difficult. Is likely to occur.

That is, when a plurality of semiconductor devices are mounted on a module or a card by using a configuration in which a wafer state is changed to a one-chip state and each chip is sealed with a sealing body, adjacent semiconductor devices are short-circuited. It is necessary to mount them at a certain interval so that they cannot be mounted, and it is difficult to mount them in a limited space such as a module or a card.

Accordingly, an object of the present invention is to improve the mounting structure of a semiconductor chip on a mounting substrate, thereby enabling high-density mounting and improving the degree of freedom in wiring such as modules and cards. An object of the present invention is to provide a semiconductor device and a semiconductor chip mounting method.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0010]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, the semiconductor device according to the present invention comprises at least one semiconductor chip directly mounted on a mounting board such as a module or a card, and the semiconductor chip is formed by a plurality of chips. It is formed by being cut by a unit or a chip unit by one chip, and mounted on a mounting board by an arbitrary combination.

In particular, the connection between the connection terminal of the semiconductor chip and the external connection terminal of the mounting board is performed using a tape base having a wiring layer formed on a film tape, and the internal wiring of the wiring layer of the tape base is provided. Are connected to the connection terminals of the semiconductor chip, and the external wirings are connected to the external connection terminals of the mounting board.

Further, the semiconductor chip is configured to be mounted on at least one surface of the mounting substrate or to be mounted on at least one surface of the mounting substrate in a multi-layered manner.

Further, according to the method of mounting a semiconductor chip of the present invention, a semiconductor wafer is cut in blocks of a plurality of chips or in a chip of one chip, and directly mounted on a mounting substrate in any combination. The tape base having the wiring layer formed on the tape is superposed on the semiconductor chip, the internal wiring of the wiring layer of the tape base is connected to the connection terminal on the semiconductor chip, and the external wiring of the wiring layer of the tape base is connected. It includes each step of connecting to an external connection terminal on a mounting board.

According to the semiconductor device and the method of mounting the same, high-density mounting can be achieved by mounting the semiconductor chip directly on the mounting board. Since it is only fixed using bonding technology, it is not necessary to cut all of the semiconductor wafer in chip units.When mounting semiconductor chips cut in block units, or when mounting on both sides of the mounting board, In the case of mounting in multiple layers, the mounting density of semiconductor devices such as modules and cards can be further improved.

The connection between the connection terminals of the semiconductor chip and the external connection terminals of the mounting board is performed using a tape base, so that the mounting base and the tape base on which the wiring layer is formed are independent. This allows the wiring to be routed freely, so that the degree of freedom in wiring of semiconductor devices such as modules and cards can be improved.

Further, compared with a package structure in which a semiconductor chip is sealed with a sealing body, the semiconductor chip does not need to be sealed in a package, and a portion corresponding to a step after the sealing is omitted, so that a module is not required. Semiconductor devices, such as cards and cards, can be made thinner and smaller, the time required to complete a product can be shortened, and the product unit price can be reduced.

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings. In all the drawings for describing the embodiments, the same members are denoted by the same reference numerals, and the description thereof will not be repeated.

(First Embodiment) FIG. 1 is a schematic sectional view showing a semiconductor device according to a first embodiment of the present invention, and FIG. 2 is a flow chart showing a method of mounting a semiconductor chip in the semiconductor device according to the first embodiment. FIG. 3 is a schematic perspective view showing a mounting substrate on which a semiconductor chip is mounted and a tape base material, and FIG. 4 is a cross-sectional view showing a connection state between the semiconductor chip and the tape base material.

First, the schematic configuration of the semiconductor device of the first embodiment will be described with reference to FIGS. 1, 3 and 4. FIG.

The semiconductor device according to the first embodiment is a flash memory card used as an external storage device such as a personal computer or a workstation, and has a plurality of semiconductor chips 1 and these semiconductor chips 1 on both sides. Mounting board 2 to be mounted and semiconductor chip 1
And two tape bases 3 for electrically connecting the circuit board and the mounting board 2, and a predetermined range is sealed with a sealing body 4 and accommodated in a case 5 for handling. ing.

The semiconductor chip 1 is divided into two types: a semiconductor chip 6 formed by cutting a semiconductor wafer into blocks by a plurality of chips, and a semiconductor chip 7 formed by cutting a single chip into chips. For example, the semiconductor chip 6 formed by cutting in block units is composed of four chips.

Bonding pads are arranged on the surfaces of these semiconductor chips 6 and 7, and bumps 8 for connecting to the tape base 3 are provided on the bonding pads. In the semiconductor chip 7 cut in the unit of a chip, bumps 8 are arranged on the outer peripheral portions facing each other in the longitudinal direction, and the semiconductor chip 6 cut in the unit of the block has the same outer peripheral portion as the chip unit. The bumps 8 are arranged at the center and at the center.

Further, these semiconductor chips 6 and 7 include:
Integrated circuits such as storage circuits and logic circuits are formed, and the input / output portions of these integrated circuits are connected to the bumps 8 from the bonding pads on the front surface. For example, the semiconductor chip 6 mounted on one surface of the mounting substrate 2 , 7 are EEPROMs (Electrically Erasable) for storing data and programs.
The semiconductor chips 6 and 7 mounted on the other surface serve as a controller that controls the memory and controls the memory and the outside.

The mounting board 2 is made of, for example, an epoxy resin, and external connection terminals 9 made of wiring such as copper foil are provided on one short side of both surfaces thereof. 3 are electrically connected to the bumps 8 of the semiconductor chips 6 and 7 via the wiring layer 3.

The tape base 3 is formed by forming a wiring layer made of copper foil or the like on both sides of a film tape 10 made of, for example, a polyimide resin, and the internal wiring 11 of one of the wiring layers is used as a terminal area for a semiconductor chip. 6 and 7 and the external wiring 1 on the other wiring layer.
2 is connected to an external connection terminal 9 of the mounting board 2 as an external wiring area.

In the tape base material 3, the internal wiring 11 connected to the bumps 8 of the semiconductor chips 6, 7
An external wiring 12 corresponding to the internal wiring 11 is electrically connected through a through hole 13. In addition, the internal wiring 11 and the external wiring 12 may be formed on the same one side, and in this case, the corresponding wirings are connected by a wiring pattern.

The flash memory card configured as described above includes the internal wiring 11 of the wiring layer of the tape base 3, the bumps 8 of the semiconductor chips 6, 7, the external wiring 12 of the wiring layer of the tape base 3, and the mounting board. An electrically exposed portion such as a connection portion with the second external connection terminal 9 is sealed with a sealing body 4 made of, for example, epoxy resin, and further housed in a case 5 made of, for example, aluminum to be handled. ing.

For example, this flash memory card conforms to the PC Card Standard standard, and has 68 pins and 54.0 (width) × 85.6 (depth) × 3.3.
It is formed with an external dimension of (thickness) mm, is detachable from a personal computer, a workstation, or the like from the outside, and is used as an external storage device.

Next, the operation of the first embodiment will be described with reference to the flow chart of FIG.

First, in a semiconductor wafer bumping step, bumps 8 of projecting electrodes made of gold or the like are formed on the bonding pads of the semiconductor wafer after the wafer processing step is completed (step 201).

Further, in the dicing process of the semiconductor wafer, the semiconductor wafer having the bumps 8 formed on the bonding pads is cut into a block unit of a plurality of chips and a chip unit of one chip (step 20).
2).

Then, in the mounting process of the semiconductor chips 6 and 7, the semiconductor chip 6 cut and formed in block units as shown in FIG. It is mounted on the mounting substrate 2 using a bonding technique such as Au-Si eutectic bonding or a method of bonding using a resin (step 20).
3).

Subsequently, in the step of superposing the tape base material 3, the tape base material 3 having the wiring layer formed on the film tape 10 is replaced with the internal wiring 11 of the tape base material 3 on the semiconductor chips 6 and 7. Positioning is performed so as to be bonded to the corresponding bump 8 and superimposed on the semiconductor chips 6 and 7 (step 204).

Then, in the connection step of the internal wiring 11, as shown in FIG.
Are connected to the corresponding bumps 8 on the semiconductor chips 6 and 7 using, for example, TAB (Tape Automated Bonding) technology by melting the bumps 8 of the semiconductor chips 6 and 7 (step 205).

Further, in the step of connecting the external wiring 12, the external wiring 12 of the wiring layer of the tape base material 3 is melted by, for example, melting the solder on the external connection terminals 9 of the mounting board 2 to T
A connection is made to the corresponding external connection terminal 9 on the mounting board 2 using the AB technology (step 206).

Then, in the resin sealing step, the internal wiring 11 of the wiring layer of the tape base 3 and the bumps 8 of the semiconductor chips 6 and 7, the external wiring 12 of the wiring layer of the tape base 3 and the external connection of the mounting substrate 2 An electrically exposed portion such as a portion connected to the terminal 9 is sealed with a sealing body 4 made of epoxy resin or the like (Step 207).

In the above steps, the semiconductor chips 6, 7
Since the semiconductor chips 6 and 7 are mounted on both surfaces of the mounting substrate 2 from the mounting process to the resin sealing process, the semiconductor chips 6 and 7 mounted on one surface of the mounting substrate 2 by reversing the mounting substrate 2 Is performed for each of the semiconductor chips 6 and 7 mounted on the other surface.

Finally, the steps up to the resin sealing step are completed, and the mounting substrate 2 on which the semiconductor chips 6 and 7 are mounted is housed in a case 5 made of aluminum or the like. A flash memory card protected from the external environment can be completed (Step 2
08).

Therefore, according to the first embodiment, by mounting the semiconductor chips 6 and 7 directly on the mounting substrate 2, high-density mounting of the semiconductor chips 6 and 7 can be achieved. By mounting the semiconductor chips 6 cut in block units, the mounting density can be further improved.

Further, the connection between the semiconductor chips 6 and 7 and the mounting substrate 2 is performed via the tape substrate 3 independent of the mounting substrate 2, so that the wiring of the tape substrate 3 can be freely routed. Degree of freedom can be improved.

Further, as compared with the conventional package structure,
Since it is not necessary to seal the semiconductor chips 6 and 7 with resin, the flash memory card can be made thinner and smaller, and the sealing process of the semiconductor chips 6 and 7 becomes unnecessary. Time can be shortened, and the product unit price can be reduced.

(Second Embodiment) FIG. 5 is a schematic sectional view showing a semiconductor device according to a second embodiment of the present invention.

The semiconductor device according to the second embodiment is a DRAM module used as a main storage device of, for example, a personal computer or a workstation. As shown in FIG. 5, a plurality of semiconductor chips 1a and Mounting board 2a for mounting semiconductor chip 1a on both sides
And two tape bases 3a for electrically connecting the semiconductor chip 1a and the mounting substrate 2a, and a predetermined range is sealed with a sealing body 4a.

That is, the DRA in the second embodiment
The M module is, for example, a DIMM having an external connection terminal of 168 pins on one long side of both surfaces of the mounting board 2a.
(DualIn-line Memory Module) and the mounting substrate 2a
DRAM for storing data and programs on one side
The semiconductor chips 6a and 7a cut in blocks or chips are mounted on the other surface, and the semiconductor chips 6a and 7a cut in blocks or chips can be mounted on the other surface.

This DRAM module is different from the flash memory card of the first embodiment in the number of pins and the number of pins.
The mounting method is the same as that of the flash memory card except for the arrangement, position, external dimensions, and the like. For example, the flash memory card is mounted on a socket in a main body of a personal computer, a workstation, or the like, and is used as a main storage device.

In the DRAM module configured as described above, when the semiconductor chips 6a and 7a are mounted on the mounting substrate 2a, the semiconductor wafer is cut into blocks and chips, and then these semiconductor chips 6a and 7a are cut.
Is directly mounted on the mounting substrate 2a, and the internal wiring of the tape base material 3a is further connected to the bumps 8 of the semiconductor chips 6a and 7a.
a) The DRAM module can be completed by connecting the external wiring to the external connection terminals 9a of the mounting board 2a and then sealing the resin with resin.

Therefore, also in the second embodiment, the semiconductor chips 6a, 7a are directly mounted on the mounting substrate 2a, and the semiconductor chips 6a cut in blocks are mounted. The mounting density can be improved, and by connecting via the tape base 3a independent of the mounting substrate 2a, the wiring can be improved by freely routing and the DRAM module can be thinned. In addition, the size can be reduced, the time required for completion can be shortened, and the product unit price can be reduced.

The invention made by the present inventor has been specifically described based on the first and second embodiments.
The present invention is not limited to the above embodiment, and it goes without saying that various changes can be made without departing from the spirit of the present invention.

For example, in the above-described embodiment, the case where the semiconductor chips are mounted on both sides of the mounting board has been described. However, the present invention is not limited to this. It is widely applicable to implementation, etc.
Semiconductor chips formed by cutting in chip units are on both sides,
Any combination can be implemented on one side.

For example, as shown in the cross-sectional view of FIG. 6, when the semiconductor chip 1b is mounted on both sides of the mounting board 2b in a two-tiered manner, the first step on one surface of the mounting board 2b is On the other hand, semiconductor chips 6b and 7b cut and formed on the second stage in chip units and on the other side in the first stage are chip units and the second stage is mounted in block units.

At the time of this mounting, the bumps 8b of the semiconductor chips 6b and 7b and the external connection terminals 9b of the mounting board 2b are electrically connected via the tape base 3b. By sealing the portion with the sealing body 4b, the mounting density can be further improved.

When a semiconductor chip is cut and formed in block units, two, three, and even five or more chips can be formed in block units in addition to four chips in block units. is there.

Further, regarding the semiconductor chip, EEP
Not limited to ROM, DRAM, etc., EPR
It goes without saying that the present invention can be applied to other memories such as OM, PROM, ROM, SRAM, and RAM.

As a flash memory card,
For storage devices of small products such as PDA (Personal Digital Assistants) and mobile phones, for example, 36.4 (width) × 42.8 (depth) × 3.3, which is about ４ of the first embodiment. Small-sized flash memory cards having an outer shape of (thickness) mm are also used, and the mounting method of the present invention can be applied to them.

In the above description, the case where the invention made by the present inventor is mainly applied to a memory card and a memory module as a technical field to which the invention belongs is described. However, the present invention is not limited to this. , PC card with built-in hard disk, etc.
The present invention is widely applicable to other cards and modules having a structure in which a semiconductor chip (package) is mounted on a mounting board, such as an expansion module.

[0057]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1) By mounting the semiconductor chip directly on the mounting board, high-density mounting can be achieved. Particularly, when mounting a semiconductor chip cut in block units, It is possible to improve the packaging density in semiconductor devices such as modules and cards.

(2) Since the semiconductor chip is merely fixed to the mounting substrate by using a bonding technique, it is not necessary to cut the entire semiconductor wafer into chip units, and the semiconductor chip can be cut in block units. Can be simplified.

(3) Since the connection between the semiconductor chip and the mounting board is performed via the tape base material, the wiring of the tape base material can be freely routed. Therefore, the degree of freedom of wiring in a semiconductor device such as a module or a card can be improved. Can be improved.

(4) When the semiconductor chips are mounted on both sides of the mounting board,
Further, the mounting density in a semiconductor device such as a module or a card can be improved.

(5) Since the step of sealing the semiconductor chip is omitted by mounting the semiconductor chip directly on the mounting substrate, the semiconductor device such as a module or a card can be made thinner and smaller, and the product can be made thinner. This makes it possible to shorten the time required for completing the product and to reduce the unit cost of the product.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing a semiconductor device according to a first embodiment of the present invention.

FIG. 2 shows a semiconductor device according to the first embodiment of the present invention;
It is a flowchart which shows the mounting method of a semiconductor chip.

FIG. 3 shows a semiconductor device according to the first embodiment of the present invention;
FIG. 2 is a schematic perspective view showing a mounting substrate on which a semiconductor chip is mounted and a tape base material.

FIG. 4 shows a semiconductor device according to the first embodiment of the present invention;
It is sectional drawing which shows the connection state of a semiconductor chip and a tape base material.

FIG. 5 is a schematic sectional view showing a semiconductor device according to a second embodiment of the present invention;

FIG. 6 is a schematic sectional view showing a modification of the semiconductor device according to the embodiment of the present invention.

[Explanation of symbols]

 1, 1a, 1b Semiconductor chip 2, 2a, 2b Mounting substrate 3, 3a, 3b Tape base 4, 4a, 4b Sealing body 5 Case 6, 6, 6a, 6b Semiconductor chip (block unit) 7, 7a, 7b Semiconductor chip (Chip unit) 8, 8a, 8b Bump 9, 9a, 9b External connection terminal 10 Film tape 11 Internal wiring 12 External wiring 13 Through hole

Claims (6)

[Claims] 1. At least one or more semiconductor chips,
A semiconductor device having a mounting substrate on which the semiconductor chip is mounted, wherein the semiconductor chip is directly mounted on the mounting substrate such as a module or a card. 2. The semiconductor device according to claim 1, wherein the semiconductor chip is formed by being cut in block units of a plurality of chips or chip units of one chip, and is formed on the mounting substrate in the block unit or the chip unit. A semiconductor device, wherein the semiconductor chips cut and formed in chip units are mounted in any combination. 3. The semiconductor device according to claim 1, wherein the connection between the connection terminal of the semiconductor chip and the external connection terminal of the mounting board is performed using a tape base having a wiring layer formed on a film tape. The internal wiring of the wiring layer of the tape base is connected to the connection terminal of the semiconductor chip, and the external wiring of the wiring layer of the tape base is connected to the external connection terminal of the mounting board. A semiconductor device characterized by the above-mentioned. 4. The semiconductor device according to claim 1, wherein the semiconductor chip is mounted on at least one surface of the mounting substrate. 5. The semiconductor device according to claim 1, wherein said semiconductor chip is mounted on at least one surface of said mounting substrate in a multi-layered manner. 6. A mounting substrate is directly cut by an arbitrary combination of a step of cutting a semiconductor wafer in block units of a plurality of chips or a chip unit of one chip, and a semiconductor chip cut in block units or chip units. Mounting on the semiconductor chip, laminating a tape base having a wiring layer formed on a film-like tape on the semiconductor chip, and connecting the internal wiring of the wiring layer of the tape base to connection terminals on the semiconductor chip. A method of mounting a semiconductor chip, comprising: connecting the external wiring of a wiring layer of the tape base material to an external connection terminal on the mounting substrate.