JPH10284671A - Curing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently preheat a lead frame in a curing device and reduce the size and operation cost of the device by a method, wherein a lead frame receiving part is provided in the upper part of the heat-curing chamber of a curing device and a means which conveys the received lead frame to the entrance side of the heat-curing chamber is provided. SOLUTION: A lead frame receiving part 21, which receives a lead frame after a die-bonding treatment, is provided in the upper part of the box-type tunnel-shaped heat-curing chamber 11 of a curing device. A lead frame elevator 31 which is vertically movable is provided on the entrance side of the heat- curing chamber 11. As the lead frame sent out of a die-bonder is received in the upper part of the heat curing chamber 11 and preheated by radiant heat and high temperature air flow from the heat-curing chamber 11, the lead frame conveyed to the entrance side of the heat-curing chamber 11 can be heated immediately to a predetermined temperature. Therefore, it is not necessary to provide a heat block for preheating in the heat-curing chamber 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a curing apparatus, for example, a method of manufacturing a semiconductor device such as an LSI by bonding a chip to a lead frame by a die bonder (die bonding process), and then thermally curing the adhesive to form the chip. The present invention relates to a curing device used for fixing the fixing device to a lead frame.

[0002]

2. Description of the Related Art A curing apparatus used in a process of manufacturing a semiconductor device heats a lead frame die-bonded by a die bonder to a predetermined temperature and thermally cures an adhesive used in the die bonding process. As described in JP-A-4-135811 and JP-A-7-106348, a lead frame is sequentially placed on a plurality of heat blocks heated and held at a predetermined temperature and heated while being transported. The structure has

In the heating treatment of the lead frame, if the lead frame is suddenly heated to a predetermined temperature, a sudden change in heat causes a problem in a chip or the like. Therefore, the lead frame is heated to a predetermined temperature after being preheated to some extent. For this reason, in the conventional curing device, among the plurality of heat blocks provided in the heat-curing chamber, the temperature of some of the heat blocks on the inlet side is set to be low, and the lead frame is preheated in this portion.

[0004]

Therefore, in the conventional curing apparatus, it is necessary to arrange a heat block for preheating at the entrance side of the heat curing chamber, so that the number of heat blocks is increased, and the heater provided in the heat block is provided. In addition, the equipment cost and operating cost also increase, and the length of the heat-curing chamber increases, so that not only the equipment becomes large, but also the purge gas increases due to the large volume of the heat-curing chamber. There was an inconvenience of requiring it.

Accordingly, an object of the present invention is to provide a curing apparatus that can efficiently preheat a lead frame in a curing apparatus, and can reduce the size and operating cost of the apparatus.

[0006]

To achieve the above object, the present invention provides a curing apparatus for curing a lead frame die-bonded by a die bonder. A lead frame receiving unit for receiving a die-bonded lead frame from the die bonder is provided, and a lead frame transport unit for transporting the lead frame received by the lead frame receiving unit to the entrance side of the heat curing chamber is provided. It is characterized by.

[0007]

FIG. 1 is a schematic front view showing an example of a curing apparatus according to the present invention, FIG. 2 is a schematic plan view thereof, and FIG. 3 is a schematic perspective view for explaining the internal structure of the curing apparatus.

In the curing apparatus shown in this embodiment, a lead frame receiving portion 21 for receiving a lead frame die-bonded by a die bonder (not shown) is provided above a heat curing chamber 11 formed in a box-shaped tunnel shape. At the same time, a lead frame elevating device 31 that can move in the vertical direction is provided on the entrance side of the heat curing chamber 11.

As shown in FIG. 3, a plurality of heat blocks 12, 12 are provided in the heat curing chamber 11, and each heat block 12 is heated to a predetermined temperature by a heater inserted into a heater insertion hole 12a. Heated. Further, the heating and curing chamber 11 is provided with a plurality of transport members 13 for sequentially transporting the lead frames while placing them on each of the heat blocks 12 from the entrance side of the heating and curing chamber to the exit side. The transport member 13 is raised and moved forward by a driving device (not shown), and is lowered and moved backward.
The lead frame P is formed so as to sequentially carry the lead frames by performing a so-called box motion. The lead frame P slightly rises from the upper surface of the heat block 12 when the carrying member 13 moves up, and when the carrying member 13 descends and recedes, the heat block moves. 12 is placed on the upper surface. At the exit of the heat-curing chamber 11, a carry-out roller 14 for carrying out the lead frame after the curing treatment is provided. Usually, at the end of the carry-out roller 14, the lead frame is stored in a magazine. Devices are connected in series.

[0010] The lead frame receiving portion 21 is a slide member 23 supported movably in the horizontal direction by guide members 22, 22 installed horizontally in the longitudinal direction of the apparatus.
A plurality of transport rollers 25 at appropriate intervals
And a motor 26 for driving the transport roller 25 is provided.
5 is a lead frame receiving position R indicated by a solid line in FIGS. 1 and 2 corresponding to an exit of the die bonder by moving the slide member 23 by a driving means such as a motor or a cylinder (not shown); 1 and 2 is moved in a horizontal direction between a lead frame transfer position S indicated by an imaginary line in FIGS.

The lead frame elevating device 31 has a plurality of forks 35 provided on a support plate 34 of an elevating member 33 which is elevated and lowered by a cylinder 32 installed in a vertical direction at a position where the fork 35 does not interfere with the transport roller 25. The fork 35 is connected to the transport roller 2 shown by a solid line in FIG.
5 is vertically moved between a lead frame receiving position U above the lead frame 5 and a lead frame receiving position L shown by an imaginary line in FIG.

In the curing device thus formed,
First, the lead frame supplied from the die bonder is transferred onto the transport roller 25 of the lead frame receiving unit 21 provided above the heat curing chamber 11. And
At a predetermined timing, the slide member 23 moves rightward in FIG. 1 to advance the transport roller 25 from the lead frame receiving position R to the lead frame receiving position S. Next, the cylinder 32 of the lead frame lifting / lowering device 31 is raised, and the fork 35 is raised to the lead frame receiving position U above the transport roller 25. As a result, the lead frame is transferred from the transport roller 25 onto the fork 35.

Next, the cylinder 32 is lowered, and the fork 35 is lowered to a lead frame transfer position L below the conveying member 13 and indicated by an imaginary line in FIG. As a result, the lead frame on the fork 35 is transferred to the end of the transport member 13. Then, the transport member 13 performs a box motion once to place the lead frame on the first heat block 12 and transfer the final lead frame on the heat block 12 onto the unloading roller 14.

By receiving the lead frame sent out from the die bonder at the upper part of the heat-curing chamber 11, the received lead frame can be preheated by the radiant heat from the heat-curing chamber 11 and the airflow of high-temperature air. The lead frame transported to the inlet side of the curing chamber 11 can be immediately heated to a predetermined temperature. Therefore, it is not necessary to provide a heat block for preheating in the heat-curing chamber 11, so that energy conventionally required for preheating the lead frame can be saved and the heat-curing chamber 11 can be downsized. Further, the consumption of the purge gas can be reduced by downsizing the heat curing chamber 11. In addition, the processing time as a whole can be reduced.

In the above embodiment, the lead frame received by the lead frame receiving section 21 is transferred to the heat-curing chamber 1.
As a lead frame carrying means for carrying to the entrance side of No. 1,
The lead frame receiving unit 21 itself is configured to be moved in the horizontal direction, and the lead frame lifting / lowering device 31 having the fork 35 is used for the vertical movement. A wire conveyor or the like may be used as the moving means.

[0016]

As described above, according to the curing apparatus of the present invention, the preheating of the lead frame can be performed by effectively utilizing the heat energy released from the heat curing chamber. Blocks can be omitted, energy can be saved, and the size of the device can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic front view showing an example of a curing device of the present invention.

FIG. 2 is a schematic plan view similarly.

FIG. 3 is a schematic perspective view for explaining an internal structure of a curing device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 11 ... Heat hardening chamber, 12 ... Heat block, 13 ... Conveying member, 14 ... Unloading roller, 21 ... Lead frame receiving part, 22 ... Guide member, 23 ... Slide member, 24 ...
Support plate part, 25: transport roller, 26: motor, 31
… Lead frame lifting device, 32… cylinder, 33…
Elevating member, 34 ... Support plate, 35 ... Fork

Claims (1)

[Claims] In a curing apparatus for curing a lead frame die-bonded by a die bonder, a lead frame receiving portion for receiving a die-bonded lead frame from the die bonder is disposed above a heat curing chamber of the curing apparatus. And a lead frame transporting means for transporting the lead frame received by the lead frame receiving section to the entrance side of the heat curing chamber.