JPH10284650A - Ic heat dissipating structure - Google Patents
Ic heat dissipating structureInfo
- Publication number
- JPH10284650A JPH10284650A JP8278197A JP8278197A JPH10284650A JP H10284650 A JPH10284650 A JP H10284650A JP 8278197 A JP8278197 A JP 8278197A JP 8278197 A JP8278197 A JP 8278197A JP H10284650 A JPH10284650 A JP H10284650A
- Authority
- JP
- Japan
- Prior art keywords
- package
- heat
- buffer sheet
- housing
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＩＣ放熱機構に関
し、更に詳しくは、特にチューナの構成部品に最適で、
ＩＣパッケージに生じる熱を放散してＩＣの所定性能を
維持するようにしたＩＣ放熱機構に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipating mechanism for an IC, and more particularly, to a heat dissipating mechanism for an IC.
The present invention relates to an IC heat radiation mechanism that dissipates heat generated in an IC package to maintain predetermined performance of the IC.
【０００２】[0002]
【従来の技術】衛星放送波や地上放送波を受信するチュ
ーナは、通常、ＩＣパッケージを実装した実装基板と、
実装基板を格納している筐体とからなるＩＣ実装機器を
内蔵している。ＩＣ実装機器を動作させることにより、
ＩＣ内で電気エネルギーが熱エネルギーに変換して発熱
する。熱が筐体内に放散されと、ＩＣやＩＣパッケージ
近傍の他の電子部品の特性が劣化し、ＩＣ実装機器の所
定性能を維持することが困難になる。このため、ＩＣ実
装機器には、一般に、ＩＣの熱を筐体外部に放散するＩ
Ｃ放熱機構が設けられており、代表的なものは、対流に
より放熱させる対流放熱型ＩＣ放熱機構と、熱伝導によ
り外部に放熱させる熱伝導放熱型ＩＣ放熱機構とであ
る。ＩＣ放熱機構に代えて、ＩＣの温度が上昇しても所
定の性能を維持するようにした補償回路をＩＣに設ける
こともあるが、コストが嵩みすぎ、好ましくない。2. Description of the Related Art A tuner for receiving a satellite broadcast wave or a terrestrial broadcast wave usually includes a mounting board on which an IC package is mounted,
It has built-in IC mounting equipment consisting of a housing that houses the mounting board. By operating IC mounting equipment,
Electric energy is converted into heat energy in the IC and generates heat. When the heat is dissipated into the housing, the characteristics of the IC and other electronic components near the IC package deteriorate, and it becomes difficult to maintain the predetermined performance of the IC mounted device. For this reason, IC mounting equipment generally has an IC that dissipates heat of the IC to the outside of the housing.
A C heat radiation mechanism is provided, and a typical one is a convection heat radiation type IC heat radiation mechanism that dissipates heat by convection and a heat conduction heat radiation type IC heat radiation mechanism that dissipates heat to the outside by heat conduction. In place of the IC heat dissipation mechanism, a compensation circuit that maintains a predetermined performance even when the temperature of the IC rises may be provided in the IC, but the cost is too high, which is not preferable.
【０００３】図２は、従来の対流放熱型ＩＣ放熱機構の
構成の一例を示す部分断面図である。対流放熱型ＩＣ放
熱機構を有するＩＣ実装機器１０は、ＩＣパッケージ１
１を実装したプリント基板１２と、プリント基板１２を
格納している比較的小型の矩形状のケース１４とを備え
ている。プリント基板１２の表側に対向しているケース
１４の表板１６は、ＩＣパッケージ１１に対向する位置
に開口１８を有している。開口１８の寸法は、ＩＣパッ
ケージ１０の寸法に比べ、同程度又はやや大きい程度で
あり、空気の対流により、ＩＣパッケージ１０の熱は、
開口１８を介してケース１４の外部に放熱される。FIG. 2 is a partial cross-sectional view showing an example of the configuration of a conventional convection heat radiation type IC heat radiation mechanism. The IC mounting device 10 having the convection heat radiation type IC heat radiation mechanism is the IC package 1
1 and a relatively small rectangular case 14 storing the printed circuit board 12. The front plate 16 of the case 14 facing the front side of the printed board 12 has an opening 18 at a position facing the IC package 11. The size of the opening 18 is the same or slightly larger than the size of the IC package 10, and the heat of the IC package 10 is reduced by the convection of air.
The heat is radiated to the outside of the case 14 through the opening 18.
【０００４】また、図３は、従来の熱伝導放熱型ＩＣ放
熱機構の構成の一例を示す部分断面図である。熱伝導放
熱型ＩＣ放熱機構を有するＩＣ実装機器２０は、対流放
熱型ＩＣ実装機器１０に加えて、表板１６が、開口１８
の一縁からＩＣパッケージ１１に向かって延び、端部で
ＩＣパッケージ１１の表面１３に面接触している熱伝導
性の良い接触片２２を有している。接触片２２は、表面
１３に面接触する平板状の接触板部２４を端部に有して
いる。ＩＣで発生した熱は、接触片２２を介して表板１
６に熱伝導し、ケース１４の外部に放散される。FIG. 3 is a partial cross-sectional view showing an example of the configuration of a conventional heat conduction / radiation type IC heat radiation mechanism. The IC mounting device 20 having the heat conduction / radiation type IC heat radiating mechanism includes the convection heat radiation type IC mounting device 10,
A contact piece 22 having good thermal conductivity extends from one edge toward the IC package 11 and is in surface contact with the surface 13 of the IC package 11 at the end. The contact piece 22 has a flat plate-like contact plate portion 24 at the end thereof, which is in surface contact with the surface 13. The heat generated by the IC is transmitted to the top plate 1 via the contact piece 22.
6 and is dissipated outside the case 14.
【０００５】[0005]
【発明が解決しようとする課題】しかし、対流放熱型Ｉ
Ｃ放熱機構では、ＩＣで発生した熱が筐体外部に充分に
放熱されず、このため、ＩＣの所定性能を充分に維持す
ることはできないという問題があった。また、熱伝導放
熱型ＩＣ実装機構では、接触片がＩＣパッケージ表面を
押圧しており、実装基板を筐体に格納するときや、組立
後に筐体に衝撃が加わったときに、接触片を介してＩＣ
パッケージ表面に衝撃が加わり、ＩＣパッケージにクラ
ックがしばしば発生するという問題があった。However, the convection heat dissipation type I
In the C heat radiation mechanism, heat generated in the IC is not sufficiently radiated to the outside of the housing, and therefore, there is a problem that predetermined performance of the IC cannot be sufficiently maintained. Also, in the heat conduction and heat dissipation type IC mounting mechanism, the contact piece presses the surface of the IC package, and when the mounting board is stored in the housing or when the housing is subjected to an impact after assembly, the contact piece is used. IC
There is a problem that an impact is applied to the package surface and cracks often occur in the IC package.
【０００６】以上のような事情に照らして、本発明の目
的は、衝撃によりＩＣパッケージが損傷する虞がなく、
かつ、ＩＣの所定性能が維持されるようにしたＩＣ放熱
機構を提供することである。[0006] In view of the above circumstances, an object of the present invention is to eliminate the possibility that an IC package will be damaged by an impact.
Another object of the present invention is to provide an IC heat radiation mechanism that maintains predetermined performance of the IC.
【０００７】[0007]
【課題を解決するための手段】本発明者は、ＩＣの熱を
充分に放熱し、かつ、衝撃によりＩＣパッケージにクラ
ックが発生する虞のないＩＣ放熱機構の構成を検討し
た。そして、熱伝導放熱型ＩＣ実装機構を有するＩＣ実
装機器で、ＩＣパッケージ表面と接触片との間に熱伝導
性の良い緩衝材を設けることを考え付き、本発明を完成
するに至った。上記目的を達成するために、本発明に係
るＩＣ放熱機構は、ＩＣパッケージを実装した実装基板
を上から覆うようにして格納する筐体に設けられたＩＣ
放熱機構であって、筐体の少なくとも一部を金属板で形
成してヒートシンクとして機能させ、熱伝導性が良好で
弾性が高い緩衝シートをＩＣパッケージ上に装着し、一
端で筐体の金属板部分に連続又は接触し、他端で緩衝シ
ートに面接触する金属製接触片により、ＩＣで発生した
熱を緩衝シートを介して筐体に伝導させるようにしたこ
とを特徴としている。筐体の少なくとも一部を形成して
いる金属板については、ヒートシンクとして作用するた
めに、金属板の大きさは、ＩＣの発熱量を充分に吸熱し
て筐体外部に放熱する大きさであることが望ましい。金
属板や金属製接触片の材質は、スズめっき鋼板（ブリ
キ）等の熱伝導性の良いものである。SUMMARY OF THE INVENTION The present inventor has studied a configuration of an IC heat radiation mechanism that sufficiently dissipates heat of an IC and does not cause a crack in an IC package due to an impact. The inventors of the present invention have conceived of providing a cushioning material having good thermal conductivity between the surface of the IC package and the contact piece in an IC mounting apparatus having a heat conduction / radiation type IC mounting mechanism, and have completed the present invention. In order to achieve the above object, an IC heat radiation mechanism according to the present invention is provided in an IC provided in a housing that stores a mounting board on which an IC package is mounted so as to cover the mounting board from above.
A heat dissipation mechanism, in which at least a part of the housing is formed of a metal plate to function as a heat sink, a buffer sheet having good thermal conductivity and high elasticity is mounted on the IC package, and one end of the metal plate of the housing is provided. The heat generated by the IC is conducted to the housing via the buffer sheet by a metal contact piece which is continuous or in contact with the portion and is in surface contact with the buffer sheet at the other end. With respect to the metal plate forming at least a part of the housing, the size of the metal plate is a size that sufficiently absorbs the heat generated by the IC and radiates heat to the outside of the housing in order to function as a heat sink. It is desirable. The material of the metal plate or the metal contact piece is a material having good thermal conductivity, such as a tin-plated steel plate (tin).
【０００８】接触片は、筐体に一体成形されていてもよ
いし、別個の部材であってもよい。別個の部材である場
合、接触片は、一端で筐体に面接触していることが望ま
しい。好適には、筐体を構成する金属板にＩＣパッケー
ジの上方の位置で開口を設け、開口の開口縁の一部から
下方に延在させ、緩衝シートに面接触させるようにした
金属板片を接触片としている。これにより、ＩＣで発生
した熱は、ＩＣパッケージから、空気対流によって筐体
外部に更に放熱される。[0008] The contact piece may be formed integrally with the housing or may be a separate member. When it is a separate member, it is desirable that the contact piece is in surface contact with the housing at one end. Preferably, a metal plate piece is provided in the metal plate constituting the housing at a position above the IC package, extends downward from a part of the opening edge of the opening, and comes into surface contact with the buffer sheet. It is a contact piece. Thereby, the heat generated in the IC is further radiated from the IC package to the outside of the housing by air convection.
【０００９】ＩＣパッケージを実装した実装基板は、例
えば、衛星放送波や地上放送波を受信するチューナを構
成する部品の一つである。A mounting board on which an IC package is mounted is, for example, one of components constituting a tuner for receiving satellite broadcast waves and terrestrial broadcast waves.
【００１０】本発明により、ＩＣに発生した熱は、緩衝
シート及び接触片を介して筐体に充分に熱伝導し、筐体
の外部へ放散される。よって、ＩＣパッケージは、ＩＣ
実装機器の動作中でも充分に冷却され、ＩＣの特性は充
分に安定しており、所定性能が維持される。更に、ＩＣ
実装機器の製造時や運搬時に筐体に衝撃が加わっても、
衝撃は緩衝シートに充分に吸収されるので、ＩＣパッケ
ージにクラックが発生する虞がない。According to the present invention, heat generated in the IC is sufficiently conducted to the housing via the buffer sheet and the contact piece, and is radiated to the outside of the housing. Therefore, the IC package is
The IC is sufficiently cooled even during the operation of the mounting device, the characteristics of the IC are sufficiently stable, and the predetermined performance is maintained. Furthermore, IC
Even if a shock is applied to the housing when manufacturing or transporting mounting equipment,
Since the shock is sufficiently absorbed by the cushioning sheet, there is no possibility that cracks will occur in the IC package.
【００１１】[0011]
【発明の実施の形態】以下に、実施例を挙げ、添付図面
を参照して、本発明の実施の形態を具体的かつより詳細
に説明する。実施例 本実施例は、本発明に係るＩＣ放熱機構を有するＩＣ実
装機器の一例である。図１（ａ）及び（ｂ）は、それぞ
れ、本実施例のＩＣ実装機器の側面断面図及び部分断面
拡大図である。本実施例のＩＣ放熱機構を有するＩＣ実
装機器２６は、接触片２２の接触板部２４とＩＣパッケ
ージ１１の表面１３との間に、緩衝材として熱伝導の良
いシリコンゴムからなる緩衝シート２８を備えているこ
とが、従来のＩＣ実装機器２０に比べて異なる。図１で
は、図３と同じ部位、部品には同じ符号を付してその説
明を省略する。ケース１４及び接触片２２は、熱伝導性
の良いスズめっき鋼板からなり、ケース１４は、ヒート
シンクとして充分な容量を有している。Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Embodiment This embodiment is an example of an IC mounting device having an IC heat radiation mechanism according to the present invention. FIGS. 1A and 1B are a side cross-sectional view and an enlarged partial cross-sectional view, respectively, of an IC mounting apparatus according to the present embodiment. In the IC mounting apparatus 26 having the IC heat radiation mechanism of the present embodiment, a buffer sheet 28 made of silicon rubber having good thermal conductivity is provided between the contact plate 24 of the contact piece 22 and the surface 13 of the IC package 11 as a buffer. This is different from the conventional IC mounting device 20. In FIG. 1, the same parts and components as those in FIG. 3 are denoted by the same reference numerals, and description thereof will be omitted. The case 14 and the contact piece 22 are made of a tin-plated steel sheet having good heat conductivity, and the case 14 has a sufficient capacity as a heat sink.
【００１２】緩衝シート２８の上面は接触板部２４の下
面に、緩衝シート２８の下面はＩＣパッケージ１１の表
面１３に、何れも両面テープ（図示せず）を介して面接
触するように接着されており、接触板部２４の下面と緩
衝シート２８との接触面積は、２５mm2である。緩衝シ
ート２８の厚みｔは０．４５mm、熱伝導率は１．３W/(m
・℃)である。表板１６の開口１８は、長辺が約１６m
m、短辺が約９mmの矩形状である。緩衝シート２８から
開口１８までの距離ｄ1は、７．５mmである。表板１６
の接触片２２は、表板をパンチングして形成したもので
あり、矩形状の薄板をくの字状にしたものから構成され
る。接触片２２の接触板部２４は、一辺の長さｄ2が５m
mの正方形状である。The upper surface of the buffer sheet 28 is adhered to the lower surface of the contact plate portion 24, and the lower surface of the buffer sheet 28 is adhered to the surface 13 of the IC package 11 via a double-sided tape (not shown). The contact area between the lower surface of the contact plate 24 and the buffer sheet 28 is 25 mm 2 . The thickness t of the buffer sheet 28 is 0.45 mm, and the thermal conductivity is 1.3 W / (m
· ° C). The opening 18 of the front plate 16 has a long side of about 16 m
m, rectangular shape with a short side of about 9 mm. The distance d 1 from the buffer sheet 28 to the opening 18 is 7.5 mm. Front plate 16
The contact piece 22 is formed by punching a front plate, and is formed by making a rectangular thin plate into a V shape. The contact plate portion 24 of the contact piece 22 has a side length d 2 of 5 m.
m square shape.
【００１３】また、ケース１４は、図１（ａ）に示すよ
うに、表板１６と、裏板１７と、表板１６及び裏板１７
に嵌合する枠体１９とから構成される。プリント基板１
２は、ＩＣパッケージ１１の近傍に電子部品２１を実装
している。As shown in FIG. 1A, the case 14 includes a front plate 16, a back plate 17, a front plate 16 and a back plate 17,
And a frame body 19 that fits into the frame. Printed circuit board 1
2 has an electronic component 21 mounted near the IC package 11.
【００１４】ＩＣ実装機器２６を動作することにより発
生するＩＣパッケージ１１の熱は、表面１３から緩衝シ
ート２８及び接触片２２を介して表板１６に充分に熱伝
導し、ケース１４の外部へ放散される。よって、ＩＣパ
ッケージ１１内のＩＣは充分に冷却されるので、ＩＣの
特性は、動作中でも安定しており、また、電子部品２１
が、ＩＣの発熱により特性が劣化することはない。更
に、ケース１４に衝撃が加わり、接触片２２の接触板部
２４に衝撃が伝達されても、衝撃は緩衝シート２８に充
分に吸収されので、ＩＣパッケージ１１に損傷を与える
虞がない。また、ＩＣパッケージ１１の表面１３、及び
接触板部２４の下面に、それぞれ、緩衝シート２８の下
面及び上面を両面テープにより接着しており、簡易に接
着している。The heat of the IC package 11 generated by operating the IC mounting device 26 is sufficiently conducted from the surface 13 to the front plate 16 via the buffer sheet 28 and the contact piece 22 and is radiated to the outside of the case 14. Is done. Therefore, since the IC in the IC package 11 is sufficiently cooled, the characteristics of the IC are stable even during operation.
However, the characteristics do not deteriorate due to the heat generated by the IC. Further, even if an impact is applied to the case 14 and the impact is transmitted to the contact plate portion 24 of the contact piece 22, the impact is sufficiently absorbed by the buffer sheet 28, so that there is no possibility of damaging the IC package 11. Further, the lower surface and the upper surface of the buffer sheet 28 are respectively adhered to the front surface 13 of the IC package 11 and the lower surface of the contact plate portion 24 with a double-sided tape, so that they are easily adhered.
【００１５】[0015]
【発明の効果】本発明に係るＩＣ放熱機構によれば、Ｉ
Ｃパッケージの表面に熱伝導性が良好で弾性が高い緩衝
シートを装着し、一端で筐体の金属板部分に連続又は面
接触し、かつ、他端で緩衝シートに面接触する金属製接
触片により、ＩＣで発生した熱を筐体に伝導させるよう
にしている。これにより、ＩＣの熱は、筐体の外部へ充
分に放散される。よって、本発明に係るＩＣ放熱機構を
有するＩＣ実装機器の性能は、動作中でも充分に維持さ
れ、安定している。更に、ＩＣ実装機器の製造時や運搬
時にケースに衝撃が加わっても、衝撃は緩衝シートに充
分に吸収されるので、ＩＣパッケージにクラックが発生
する虞がない。よって、装置構成を複雑にすることなく
信頼性の高いＩＣ実装機器を実現することができる。According to the IC heat radiation mechanism according to the present invention, I
A metal contact piece that has a buffer sheet having good thermal conductivity and high elasticity attached to the surface of the C package, and has a continuous or surface contact with the metal plate portion of the housing at one end and a surface contact with the buffer sheet at the other end. Thereby, the heat generated in the IC is conducted to the housing. Thereby, the heat of the IC is sufficiently dissipated to the outside of the housing. Therefore, the performance of the IC mounting device having the IC heat radiation mechanism according to the present invention is sufficiently maintained and stable even during operation. Further, even if an impact is applied to the case during the manufacture or transportation of the IC mounted device, the impact is sufficiently absorbed by the buffer sheet, and there is no possibility that cracks will occur in the IC package. Therefore, a highly reliable IC mounted device can be realized without complicating the device configuration.
【図１】図１（ａ）及び（ｂ）は、それぞれ、実施例の
ＩＣ放熱機構を示す側面断面図及び部分断面拡大図であ
る。FIGS. 1A and 1B are a side cross-sectional view and an enlarged partial cross-sectional view showing an IC heat radiation mechanism of an embodiment, respectively.
【図２】対流による放熱対策が施された従来のＩＣ放熱
機構の構成の一例を示す部分断面図である。FIG. 2 is a partial cross-sectional view showing an example of a configuration of a conventional IC heat radiation mechanism in which a heat radiation measure by convection is taken.
【図３】熱伝導による放熱対策が施された従来のＩＣ放
熱機構の構成の一例を示す部分断面図である。FIG. 3 is a partial cross-sectional view showing an example of a configuration of a conventional IC heat radiation mechanism in which a heat radiation measure by heat conduction is taken.
１０……ＩＣ実装機器、１１……ＩＣパッケージ、１２
……プリント基板、１３……表面、１４……ケース、１
６……表板、１７……裏板、１８……開口、１９……枠
体、２０……ＩＣ実装機器、２１……電子部品、２２…
接触片、２４……接触板部、２６……ＩＣ実装機器、２
８……緩衝シート。10: IC mounting equipment, 11: IC package, 12
... printed circuit board, 13 ... surface, 14 ... case, 1
6 front plate, 17 back plate, 18 opening, 19 frame, 20 IC mounting equipment, 21 electronic components, 22
Contact piece, 24 Contact plate part, 26 IC mounting equipment, 2
8 ... A buffer sheet.
Claims (3)
から覆うようにして格納する筐体に設けられたＩＣ放熱
機構であって、 筐体の少なくとも一部を金属板で形成してヒートシンク
として機能させ、熱伝導性が良好で弾性が高い緩衝シー
トをＩＣパッケージ上に装着し、一端で筐体の金属板部
分に連続又は接触し、他端で緩衝シートに面接触する金
属製接触片により、ＩＣで発生した熱を緩衝シートを介
して筐体に伝導させるようにしたことを特徴とするＩＣ
放熱機構。An IC heat radiation mechanism provided in a housing for storing a mounting board on which an IC package is mounted so as to cover the mounting substrate from above, wherein at least a part of the housing is formed of a metal plate and functions as a heat sink. Then, a buffer sheet having good thermal conductivity and high elasticity is mounted on the IC package, and one end is continuously or in contact with the metal plate portion of the housing, and the other end is a metal contact piece which is in surface contact with the buffer sheet. An IC characterized in that heat generated in the IC is conducted to a housing via a buffer sheet.
Heat dissipation mechanism.
の上方の位置で開口を設け、開口の開口縁の一部から下
方に延在させ、緩衝シートに面接触させるようにした金
属板片を接触片とすることを特徴とする請求項１に記載
のＩＣ放熱機構。2. A metal plate piece provided with an opening at a position above an IC package in a metal plate constituting a housing, extending downward from a part of an opening edge of the opening, and making surface contact with a buffer sheet. The IC heat radiation mechanism according to claim 1, wherein the contact piece is a contact piece.
衛星放送波や地上放送波を受信するチューナを構成する
部品の一つであることを特徴とする請求項１又は２に記
載のＩＣ放熱機構。3. A mounting board on which an IC package is mounted,
The IC heat radiation mechanism according to claim 1, wherein the IC heat radiation mechanism is one of components constituting a tuner that receives a satellite broadcast wave or a terrestrial broadcast wave.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8278197A JPH10284650A (en) | 1997-04-01 | 1997-04-01 | Ic heat dissipating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8278197A JPH10284650A (en) | 1997-04-01 | 1997-04-01 | Ic heat dissipating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10284650A true JPH10284650A (en) | 1998-10-23 |
Family
ID=13783969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8278197A Pending JPH10284650A (en) | 1997-04-01 | 1997-04-01 | Ic heat dissipating structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10284650A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006319008A (en) * | 2005-05-11 | 2006-11-24 | Kyocera Mita Corp | Heat sink |
| CN102906870A (en) * | 2010-06-18 | 2013-01-30 | 夏普株式会社 | Heat dissipation structure for electronic device |
| CN104308420A (en) * | 2014-10-10 | 2015-01-28 | 深圳市航盛电子股份有限公司 | Fixing device and fixing method of car audio power amplifier chip |
-
1997
- 1997-04-01 JP JP8278197A patent/JPH10284650A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006319008A (en) * | 2005-05-11 | 2006-11-24 | Kyocera Mita Corp | Heat sink |
| CN102906870A (en) * | 2010-06-18 | 2013-01-30 | 夏普株式会社 | Heat dissipation structure for electronic device |
| EP2584604A1 (en) * | 2010-06-18 | 2013-04-24 | Sharp Kabushiki Kaisha | Heat dissipation structure for electronic device |
| EP2584604A4 (en) * | 2010-06-18 | 2014-09-10 | Sharp Kk | Heat dissipation structure for electronic device |
| CN104308420A (en) * | 2014-10-10 | 2015-01-28 | 深圳市航盛电子股份有限公司 | Fixing device and fixing method of car audio power amplifier chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5071558B2 (en) | Circuit module | |
| JP4218184B2 (en) | Mounting structure of semiconductor device | |
| US20050083646A1 (en) | Display apparatus having heat dissipating structure for driver integrated circuit | |
| US20030021310A1 (en) | Method and apparatus for cooling electronic or opto-electronic devices | |
| JP2007305761A (en) | Semiconductor device | |
| JP3675607B2 (en) | Heat dissipation structure of electronic equipment | |
| EP1178594B1 (en) | Electronic apparatus provided with an electronic circuit substrate | |
| JP4710683B2 (en) | Heat dissipation device | |
| US20060274500A1 (en) | Heat radiating structure for CPU | |
| US20100110641A1 (en) | Power supply apparatus | |
| JPH10284650A (en) | Ic heat dissipating structure | |
| JP3330893B2 (en) | Heat dissipation structure for electronic components surrounded by a metal housing | |
| JPH0730280A (en) | Shield case | |
| JP2003017879A (en) | Heat radiating device | |
| JPH11298177A (en) | Radiation structure of heating part and electrodeless lamp using it | |
| KR100674856B1 (en) | Module for receiving digital signals having improved heat radiation | |
| JP2000216582A (en) | Shield unit and satellite broadcast receiving tuner employing it | |
| US6580612B2 (en) | Electric circuit | |
| JP4770518B2 (en) | High power amplifier | |
| JP2004031854A (en) | Heat radiation structure | |
| CN220402210U (en) | Radiating assembly and phased array radar | |
| JP4657972B2 (en) | Electronics | |
| JP2002290091A (en) | Electronic circuit device having heat dissipation structure | |
| JP2008226890A (en) | Electronic device | |
| JP2001244672A (en) | Electronic component cooling device |