JPH10268979A - Disk system mounting structure and housing device using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize the mounting arrangement of a unit where respective signal wires do not cross with each other by integrating the rear face wiring substrates of the respective units in one body and executing a signal processing route through the rear face wiring substrates. SOLUTION: A unit AC BOX 2 supplying an AC power source is mounted to a lower part within a housing 1, a power source unit P/S BOX 3 is mounted to its upper stage and a fan motor unit P/S FAN UNIT 4 for circulating air warmed by a heater within the P/S BOX 3 is mounted to its upper stage. A logical substrate unit L/G BOX 5 is mounted at the opposed face of the P/S BOX 3 in order to read data by a logical substrate by being supplied with a DC power source from P/S BOX 3. In order to circulate air warmed by a heater within L/G BOX 5, L/G FAN UNIT 6 is mounted on it. Thereby pattern arrangement without crossing within B/B integrating a power source and a signal line in a body is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a disk drive, and more particularly, to an arrangement of units constituting a disk drive used as an external storage device of a computer, and a housing device using the same.

[0002]

2. Description of the Related Art Generally, a recent disk device has an AC_BOX, P / S_BOX, and L / G_BO inside a single housing.
It is configured as a collective disk device containing X, HDU_BOX, and FUN_UNIT. Due to such a configuration, it is difficult to perform signal processing (especially signal pattern check and insufficient noise margin) and mounting arrangement of units.

As shown in FIG. 5, each unit has its own B / B
Since the signal processing and power supply between the units are transferred by cable relay, erroneous wiring during maintenance or disconnection of the cable has become a problem.

[0004] In the power supply system, each unit is equipped with a PS, and the size of each unit increases due to the mounting of the PS, and an area of a power cable route for supplying AC power from the A / C_BOX. Securing,
There has been a problem of increasing the size of the entire device for mounting the cable duct to protect the power cable.

In the cooling system, since the units are independently mounted, a gap is generated between the units. As shown by an arrow in FIG. 5, air sucked from the floor leaks from the gap and re-enters the same unit. Circulation, a lot of air flows into the unit with low resistance, and not enough air flows into the unit with high resistance.
The problem has been that the cooling efficiency has decreased.

As another technique, as described in Japanese Patent Application No. 5-181078, a large number of units are mounted in a single device in a simplified state, and a cable including a power supply cable to an extension unit is a cable duct. It is structured to be mounted vertically.

[0007]

However, in the above-mentioned conventional example, as shown in FIG.
OX, P / S_BOX, L / G_BOX, HDU_BO
Since X and FAN_UNIT are individually mounted on the housing, the signal processing and power supply between the B / B are relayed by cables, and the wiring becomes complicated vertically and horizontally, and maintenance by hot-swapping is performed. The problem was that it was easy to cause erroneous wiring at the time and increase in maintenance time.

Further, when the mounting arrangement between the B / Bs is remote, the transfer distance becomes longer and the signal processing becomes slower.

In the power supply system, at least one P / S is mounted on each unit so that each unit supplies power. As a result, there has been a problem that each unit for mounting the P / S becomes large, and that the entire apparatus becomes large due to the securing of the power cable route.

[0010] In the cooling supply system, there is a problem that a gap is generated between the units mounted vertically and a unit mounted facing each other because the units are independent from each other, and the cooling efficiency is reduced. Had become.

[0011]

The apparatus includes an AC_BOX for receiving an AC from the outside, a P / S_BOX for receiving an AC of the AC_BOX and converting the AC to a DC, and an L / L for controlling the stored data by a DC power supply. / G_BOX,
An HDU_BOX that transmits and receives stored data to and from the L / G_BOX and stores data. The HDU_BOX performs power processing and mutual processing for performing signal processing and power supply by mounting units from the bottom in the order along the signal flow. 3 can be close to each other, and a route where the power supply and signal lines do not cross can be performed in a pattern in B / B as shown in FIG. 3, so that the power supply and signal cables can be reduced,
Elimination of problems such as erroneous wiring during maintenance due to hot-swap insertion and disconnection of cables, and the like are eliminated.

Similarly, by changing the signal processing transfer from the signal cable to the signal connector between the mutual HDU_BOXes, the number of cables can be reduced, and erroneous wiring during maintenance due to hot swapping and disconnection of the cable, disconnection of the cable, and the like can be achieved. The problem goes away.

The transfer distance is shortened and the signal processing is speeded up because the mutual units for performing the signal processing can be brought close to each other and the signal cable is changed to the signal connector and the pattern in the B / B.

Further, AC_BOX, P / S_BOX, H
DU_BOX, FAN_UNIT B / B and L / G
_BOX, HDU_BOX, FAN_UNIT B /
By combining B with one and connecting them with BUS_BAR, all power can be supplied from P / S_BOX, and power can be supplied without mounting P / S in each unit.

Therefore, the size of each unit can be reduced because the P / S is no longer mounted, and the size of the device itself can be reduced.

In the cooling supply system, as shown in FIG. 4, the B / B is integrated into a single sheet, so that the gaps on the rear surface between the units mounted on the upper and lower sides and the facing surface are closed by the B / B, Part is closed by the side wall of FUN_UNIT,
By closing the front part with the P / L_COVER of each unit, there is no gap between the units, and the unit is discharged straight from the floor to the ceiling as shown by the arrows. Irrespective of the above, the air flows evenly through each unit, so that the cooling efficiency can be increased.

[0017]

1 to 4 show an embodiment of the present invention.
This will be described with reference to FIG.

FIG. 1 is a perspective view of an embodiment of the present invention. In FIG. 1, an AC_BOX (2) is mounted in the lower portion of a housing (1), and a P / S_BOX (3) is mounted on an upper stage thereof.
(3) P / S_FAN_UNIT (4) for circulating the air whose temperature has been increased by the heating element in (3) is mounted on the upper stage thereof. L / G_BOX (5) is P / S_BOX
Since DC power is supplied from (3) and data is read / written by the logic board, it is mounted on the face of P / S_BOX (3). In order to circulate the air whose temperature has been increased by the heating element in the L / G_BOX (5), L / G_FAN_
Implement UNIT (6). The data read and written by the L / G_BOX (5) is transferred to the HDU_BOX-A (7) and H
P / S_FA to save as DU_BOX-B (7 ')
N_UNIT (4) and L / G_FAN_UNIT (6)
Each is mounted on the upper stage. HDU_BOX-A (7) and H
HDU-A_FAN_UNIT to circulate the air whose temperature has been increased by the heating element of DU_BOX-B (7 ')
(8) and HDU-B_FAN_UNIT (8 ') are respectively mounted on the upper stage.

FIG. 2 is an exploded perspective view in which B / B is integrated, and AC_BOX (2) to P / S_FAN_UNIT.
(4) and the HDU_BOX-
The signal processing of B (7 ') and HDU-B_FAN_UNIT (8') is performed by transferring the pattern in B / B-B (9), and the L / G_BOX (5) to HDU-A mounted on the opposite side.
_FAN_UNIT (8) signal processing is B / B-A
Transfer is performed with the pattern in (10). Then, in order to energize between B / B, power is supplied by connecting with BUS_BAR (11).

FIG. 3 is a pattern diagram of B / B power supply lines and signal lines.
The power supplied from (3) is distributed to each unit through the BUS_BAR (11) and supplied to the B / BA (10) like the power line (13).

L / G_BOX (5) to HDU_BOX
-A (7) and the signal processing to HDU_BOX-B (7 ') are performed by B / B-A (10) like the signal line (14).
The signal is transferred to the inside, and signal processing to the HDU_BOX-B (7 ') is performed by mating male and female signal connectors (12).
Is mounted on the back side of each other and transferred.

FIG. 4 is an exploded perspective view showing the air flow paths on the front side and the rear side of the apparatus.
By mounting (9) and B / B-A (10), the gap on the rear surface is closed, and the side surface is FUN_UNIT.
(4) Close the gap with the side walls of (6), (8), and (8 '), and close the gap with the P / L_COVER (15) of each unit on the front, so that the air sucked up from the floor does not leak and is linear. Exhausted to the ceiling.

As described above, by arranging the units as shown in FIG. 1, the power supply and the signal lines can be arranged in a pattern that does not cross within the integrated B / B as shown in FIG. In addition, since the number of signal cables can be reduced, erroneous wiring at the time of maintenance due to hot wire insertion / removal, disconnection of cables, and the like are also eliminated.

Further, as shown in FIG. 5, when the connection between the units is relayed by a power supply and a signal cable, the cables cross each other to cause EMI noise.
EMI noise can be reduced by reducing the number of cables and the pattern arrangement that does not cross the power supply and signal lines.

By integrating the B / B, there is no leakage of cooling air, and the cooling efficiency can be improved. Therefore, the reliability of the logic P / K or PS that generates a large amount of heat is improved.

[0026]

As described above, the units are mounted from the lower part of the disk drive in the order of transferring the signal processing of the disk drive according to the present invention, and the B / B is integrated into the B / B.
EMI noise can be reduced by performing the signal processing within the circuit.

In addition, signal processing is performed in the B / B, signal processing between units mounted on the opposite side is transferred by a connector, and in power supply, the units are assembled without mounting the P / S_BOX on a single unit. By supplying electric power from the P / S_BOX to all the units through the bus bar, the number of cables can be reduced and the size of the apparatus can be reduced.

Further, in terms of maintenance, there is also an effect of improving workability by reducing cables and an effect of reducing EMI noise.

In the cooling system, the recirculation of the air is prevented by eliminating the leakage of the air whose temperature has risen by integrating the B / B, and the cooling effect is enhanced.

[Brief description of the drawings]

FIG. 1 is a perspective view of one embodiment of the present invention.

FIG. 2 is a partially exploded perspective view of the same.

FIG. 3 is a pattern diagram of B / B power supply lines and signal lines.

FIG. 4 is an exploded perspective view showing air flow paths on the front and rear sides of the apparatus.

FIG. 5 is a perspective view of a conventional disk device.

[Explanation of symbols]

1 ... housing, 2 ... AC_BOX, 3 ... P / S_BOX,
4 ... P / S_FAN_UNIT, 5 ... L / G_BOX,
6 ... L / G_FAN_UNIT, 7 ... HDU_BOX-
A, 7 ': HDU_BOX-B, 8: HDU-A_
FAN_UNIT, 8 '... HDU-B_FAN_UNI
T, 9 ... B / BB, 10 ... B / BA, 11 ...
BUS_BAR, 12: signal connector, 13: power line, 14: signal line, 15: P / L_COVE
R, 16 ... PS.

Claims (5)

[Claims] An AC power supply unit (hereinafter referred to as AC power supply).
_BOX) and a power supply that converts AC to DC (hereinafter, referred to as _BOX)
P / S unit (hereinafter abbreviated as P / S)
S_BOX), a unit for mounting a plurality of logical boards (hereinafter abbreviated as L / G_BOX), and a BOX on which a plurality of magnetic disk units (hereinafter abbreviated as HDU) are mounted.
(Hereinafter abbreviated as HDU_BOX), a unit having an operation switch mounted on a board (hereinafter abbreviated as OP_PANEL), and a unit having a plurality of fan motors for cooling a heating element inside the device (hereinafter abbreviated as FAN_UNIT).
) Is mounted in the same housing, the rear wiring board (hereinafter abbreviated as B / B) of each unit is integrated, and a signal processing route is set to a signal line (hereinafter abbreviated) in the B / B.
A disk device characterized by being able to mount and arrange units in which signal lines do not cross each other, and a housing device using the same. 2. The disk drive according to claim 1, wherein B / B
In the case where a plurality of are used, the signal line connection between the B / Bs is provided with a signal connector in the B / B, and the processing is performed only by the connection of the signal connector. Housing device. 3. The power supply system for a disk device according to claim 1, wherein the power supplied from the grouped P / S_BOXs is supplied to a unit mounted on the B / B on the same surface in the B / B. Supply in a pattern, face-to-face B
A disk device characterized by relaying a metal member (hereinafter abbreviated as BUS_BAR) capable of connecting between B / B to a unit mounted on / B, and supplying the unit, and a housing device using the same. 4. A cooling supply system in a disk drive according to claim 1, wherein the upper and lower units are mutually sealed so that the two units have a closed structure in order to enhance the cooling effect of the FUN_UNIT mounted in the center. The rear surface of the unit is closed with integrated B / B, the side surface is closed with the side wall of FAN_UNIT between the units, and the front surface is a cover (hereinafter, P / L_COV) covering each unit.
A disk device characterized by increasing the cooling efficiency by closing the disk device with an ER, and a housing device using the disk device. 5. A cooling supply system in a disk drive according to claim 1, wherein the front side P / S_BOX side and the rear side L / S_BOX side.
A disk device having a blower on the / G_BOX side for discharging cooling air linearly from the floor surface to the ceiling of the device through two lines of flow paths with B / B as a wall, and a housing device using the same.