JPH10251893A - Electroplating method for metallic strip and electrolytic cell for metallic strip - Google Patents

Electroplating method for metallic strip and electrolytic cell for metallic strip

Info

Publication number
JPH10251893A
JPH10251893A JP5815397A JP5815397A JPH10251893A JP H10251893 A JPH10251893 A JP H10251893A JP 5815397 A JP5815397 A JP 5815397A JP 5815397 A JP5815397 A JP 5815397A JP H10251893 A JPH10251893 A JP H10251893A
Authority
JP
Japan
Prior art keywords
metal strip
section
metallic strip
roll
anodizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP5815397A
Other languages
Japanese (ja)
Inventor
Michihiro Shimamura
美智広 嶋村
Katsumi Danbara
克己 段原
Masaharu Sanada
雅治 真田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP5815397A priority Critical patent/JPH10251893A/en
Publication of JPH10251893A publication Critical patent/JPH10251893A/en
Withdrawn legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To improve the adhesion property of a plating metal and a metallic strip by an anodic treatment prior to a plating treatment at the time of electroplating the metal on the metallic strip subjected to the activation treatment by degreasing, washing and pickling. SOLUTION: The metallic strip S previously subjected to degreasing and washing is subjected to the activation of the surfaces by the pickling treatment and is washed again. At the time of transporting the metallic strip S by means of rolls 2a, 2, 2b and electroplating the metal on the surfaces by passing the strip in a plating cell 1, the metallic strip S is first passed through an inlet side pass section 8 and is subjected to the anodic treatment by supplying the current between the strip as an anode and an electrode 3 as a cathode, by which the surfaces of the metallic strip S are reactivated. In succession, the metallic strip S is passed through an outlet side pass section 9 and the metal is electroplated on the surfaces of the metallic strip S by supplying the current between the roll 2b as the cathode and the electrode 3 facing the roll as the anode. The plating layers having the excellent adhesion property to the metallic strip are thus obtd.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、金属ストリップの
表面に錫、クロム等の電解メッキ方法及びその装置に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for electroplating tin or chromium on the surface of a metal strip.

【0002】[0002]

【従来の技術】図7は従来の金属ストリップ連続電解メ
ッキのライン図で、金属ストリップの表面に錫、クロ
ム、亜鉛等の金属を連続的に電解メッキする方法として
は、電気メッキを行なう前の予備処理として、脱脂工程
で金属ストリップの表面を洗浄して異物や付着油脂を除
去し、酸洗工程で金属ストリップの表面を活性化処理
し、洗浄後、電解メッキ工程で金属ストリップに電解メ
ッキを行なっている。
2. Description of the Related Art FIG. 7 is a line diagram of a conventional metal strip continuous electroplating. As a method of continuously electroplating a metal such as tin, chromium, zinc or the like on the surface of a metal strip, a method before electroplating is performed. As a preliminary treatment, the surface of the metal strip is washed in a degreasing process to remove foreign substances and adhered oils and fats, the surface of the metal strip is activated in an acid washing process, and after cleaning, the metal strip is subjected to electrolytic plating in an electrolytic plating process. I do.

【0003】図6は従来の金属ストリップ電解槽の概略
図で、電解槽1は複数のタンク1aに区画され、各タン
ク1aには、金属ストリップSを搬送するために上部と
下部にそれぞれロール2a,2b,2が配置され、上部
のロール2a,2bは、金属ストリップSを直流電源と
電気的に接続するために通電ロール2a,2bとなって
いる。電解メッキ液中には金属ストリップSの両側に鉛
あるいは鉛合金等からなる電極3を配置している。電解
メッキするため、直流電源4のマイナス極が各タンク1
a上部の通電ロール2a,2bに、プラス極が電解メッ
キ液中の電極にそれぞれ接続されている。
FIG. 6 is a schematic view of a conventional metal strip electrolytic cell. The electrolytic cell 1 is divided into a plurality of tanks 1a. Each tank 1a has a roll 2a at an upper part and a lower part for transferring a metal strip S. , 2b, 2 are arranged, and the upper rolls 2a, 2b are energizing rolls 2a, 2b for electrically connecting the metal strip S to a DC power supply. Electrodes 3 made of lead or a lead alloy are arranged on both sides of the metal strip S in the electrolytic plating solution. The negative pole of the DC power supply 4 is connected to each tank 1 for electrolytic plating.
The positive poles are connected to the electrodes in the electrolytic plating solution, respectively, on the upper conductive rolls 2a and 2b.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、従来の
脱脂、酸洗の予備処理を行なってもストリップ表面の活
性化が充分でない場合、あるいは金属ストリップの材質
によっては、酸洗から電解メッキをする間に金属ストリ
ップ表面が不活性化しやすい場合には、予備処理後に電
解メッキをしても、メッキの密着性が得られないなどで
充分なメッキ品質が得られない場合がある。また、メッ
キ品質の厳格化により、めっき品質の向上を図ることが
必要となっている。
However, if the activation of the strip surface is not sufficient even after the conventional pre-treatment of degreasing and pickling, or depending on the material of the metal strip, it may take a while to perform the plating from pickling to electrolytic plating. In the case where the surface of the metal strip is easily deactivated, sufficient plating quality may not be obtained even if electrolytic plating is performed after the pretreatment because adhesion of plating cannot be obtained. In addition, due to strict plating quality, it is necessary to improve the plating quality.

【0005】本発明は、充分なメッキ品質が得られる金
属ストリップの電解メッキ方法及び金属ストリップ電解
槽を提供するものである。
SUMMARY OF THE INVENTION The present invention provides a method for electroplating a metal strip and a metal strip electrolytic cell capable of obtaining sufficient plating quality.

【0006】[0006]

【課題を解決するための手段】本発明は、酸洗し洗浄し
た金属ストリップを陽極処理部及び電解メッキ処理部が
連設された電解槽内で、最初に陽極処理部で金属ストリ
ップを陽極にして陽極処理を行って金属ストリップ表面
の再活性化を行なった後、引き続いて電解メッキ処理部
で金属ストリップを陰極にして電解メッキする。
SUMMARY OF THE INVENTION According to the present invention, a metal strip which has been pickled and washed is first placed in an electrolytic cell provided with an anodizing section and an electrolytic plating section, and the metal strip is first anodized in the anodizing section. Then, the surface of the metal strip is reactivated by anodizing, followed by electrolytic plating using the metal strip as a cathode in an electrolytic plating section.

【0007】[0007]

【発明の実施の形態】図1は本発明の金属ストリップの
電解処理の説明図で、電解槽1は複数のタンク1aに区
画され、各タンク1aには、金属ストリップSを搬送す
るために上部と下部にそれぞれロール2a,2b,2が
配置され、上部のロール2a,2bは、金属ストリップ
Sを直流電源と電気的に接続するために通電ロール2
a,2bとなっている。電解メッキ液中には金属ストリ
ップSの両側に鉛あるいは鉛合金等からなる電極3を配
置している。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an explanatory view of the electrolytic treatment of a metal strip according to the present invention. An electrolytic cell 1 is divided into a plurality of tanks 1a, and each tank 1a has an upper portion for transporting a metal strip S. Rolls 2a, 2b, 2 are arranged at the bottom and at the bottom, respectively. Rolls 2a, 2b at the top are energized rolls 2 for electrically connecting the metal strip S to a DC power supply.
a and 2b. Electrodes 3 made of lead or a lead alloy are arranged on both sides of the metal strip S in the electrolytic plating solution.

【0008】本発明においては、最初に電解槽1の入側
パスの陽極処理部で陽極電解を行って金属ストリップ表
面の再活性化を行ない、引き続いて電解メッキ処理部で
電解メッキするために、陽極電解を行なう入側パス8の
タンク1a上部の通電ロール2a、即ち金属ストリップ
Sに直流電源のプラス極が接続され、電解メッキ液中の
電極3にはマイナス極が接続され、入側パス8を通過後
は出側パス9で電解メッキを行なうので、上部の通電ロ
ール2bは直流電源4のマイナス極に、電解メッキ液中
の電極はプラス極に接続される。
In the present invention, first, anodic electrolysis is performed in the anodizing section of the entrance path of the electrolytic cell 1 to reactivate the surface of the metal strip, and subsequently, electrolytic plating is performed in the electroplating section. The positive electrode of the DC power supply is connected to the energizing roll 2a, that is, the metal strip S, on the upper part of the tank 1a of the input path 8 for performing anodic electrolysis, and the negative electrode is connected to the electrode 3 in the electrolytic plating solution. After passing through, the electrolytic plating is performed in the exit path 9, so that the upper energizing roll 2b is connected to the negative pole of the DC power supply 4, and the electrode in the electrolytic plating solution is connected to the positive pole.

【0009】図2は本発明の金属ストリップの電解槽の
概略図で、電解槽1には、金属ストリップSを搬送する
ためにタンク1aの上部と下部にそれぞれロール2a,
2b,2が配置され、上部ロールは、金属ストリップS
を直流電源と電気的に接続するために通電ロール2a,
2bとなっている。電解液中にはストリップSの両側に
電極3を配置している。電極材料としては、例えば、鉛
あるいは鉛合金を用いる。
FIG. 2 is a schematic view of a metal strip electrolyzer according to the present invention. In the electrolyzer 1, rolls 2a and 2a are provided at the upper and lower portions of a tank 1a for transporting the metal strip S, respectively.
2b and 2 are arranged, and the upper roll is made of a metal strip S
Rolls 2a,
2b. The electrodes 3 are arranged on both sides of the strip S in the electrolytic solution. As the electrode material, for example, lead or a lead alloy is used.

【0010】また、本実施例では、陽極処理部となる入
側パス及び電解メッキ処理部となる出側パスのそれぞれ
の金属ストリップSの間に絶縁材からなる垂直仕切り板
5を設けるとともに、垂直仕切り板5の下部に金属スト
リップSが通る隙間6を開けた水平仕切り板7を設けて
タンク1aを陽極処理部になる入側パス部8と電解メッ
キ処理部になる出側パス部9とに区画して、入側パス部
8と出側パス部9との間の電気抵抗を大きくして、入側
パス部8と出側パス部9とが電気的に影響し合うのを少
なくする。
Further, in this embodiment, a vertical partition plate 5 made of an insulating material is provided between each metal strip S of an entrance path serving as an anodizing section and an output path serving as an electrolytic plating section, and a vertical partition plate 5 is provided. At the lower part of the partition plate 5, a horizontal partition plate 7 having a gap 6 through which the metal strip S passes is provided, and the tank 1a is provided with an inlet pass portion 8 serving as an anodizing portion and an outlet pass portion 9 serving as an electrolytic plating portion. By partitioning, the electrical resistance between the entrance-side path section 8 and the exit-side path section 9 is increased, and the influence of the entrance-side path section 8 and the exit-side path section 9 on each other is reduced.

【0011】入側パス部8では陽極処理するため、上部
の通電ロール2aは直流電源のプラス極が接続され、電
解メッキ液中の電極3にはマイナス極が接続され、出側
パス部9では電解メッキを行なうので、通電ロール2b
は直流電源4のマイナス極に、電解メッキ液中の電極は
プラス極に接続される。
In order to perform anodizing in the inlet pass section 8, the upper energizing roll 2 a is connected to the positive pole of a DC power supply, the electrode 3 in the electrolytic plating solution is connected to the negative pole, and in the outlet pass section 9. Since the electrolytic plating is performed, the current-carrying roll 2b
Is connected to the negative pole of the DC power supply 4, and the electrode in the electrolytic plating solution is connected to the positive pole.

【0012】以上の構成において、金属ストリップを陽
極として電解メッキ液を用いて陽極処理を行なって金属
ストリップの表面の再活性化を行なった後、直ちに金属
ストリップに電解メッキを行ない、金属ストリップの表
面が活性化した状態で電解メッキするので、金属ストリ
ップとメッキ金属の密着性が向上する。
In the above arrangement, the metal strip is anodized by using an electrolytic plating solution with the metal strip as an anode to reactivate the surface of the metal strip. Electroplating is performed in the activated state, so that the adhesion between the metal strip and the plated metal is improved.

【0013】図3は本発明の電解槽の別実施例の概略図
で、入側パス部8と出側パス部9とは、搬送用のロール
2が配置された下部タンク10で連通させる。入側パス
部8と出側パス部9はストリップSを挾んで電極3が配
置され、各パス部8,9の電極3がそれぞれ独立して配
置されるので、各パス部8,9が電気的に影響し合うの
を少なくできる。
FIG. 3 is a schematic view of another embodiment of the electrolytic cell according to the present invention. The entrance-side pass portion 8 and the exit-side pass portion 9 are communicated with each other through a lower tank 10 on which a transport roll 2 is disposed. The electrodes 3 are arranged on the entrance-side path portion 8 and the exit-side path portion 9 with the strip S interposed therebetween, and the electrodes 3 of the path portions 8 and 9 are arranged independently of each other. Influence can be reduced.

【0014】図4は本発明の電解槽の別実施例の概略図
で、入側パス部8と出側パス部9とを独立させ、各パス
部8,9は下部に絞りロール11を有するとともに、ス
トリップSを挾んで電極3が配置される。各パス部8,
9の下部には搬送用のロール2が配置されるとともに、
漏れた液の受槽12が配置される。各パス部8,9が完
全に独立しているので、各パス部8,9が電気的に影響
し合うことはほとんどない。
FIG. 4 is a schematic view of another embodiment of the electrolytic cell of the present invention, in which the inlet-side pass portion 8 and the outlet-side pass portion 9 are made independent, and each of the pass portions 8 and 9 has a squeezing roll 11 at a lower portion. At the same time, the electrodes 3 are arranged with the strip S interposed therebetween. Each pass unit 8,
At the lower part of 9, a transport roll 2 is arranged,
A receiving tank 12 for the leaked liquid is arranged. Since the path units 8 and 9 are completely independent, the path units 8 and 9 hardly influence each other electrically.

【0015】図5は本発明を横型電解槽に適用した実施
例を示す概略図で、電解槽1の金属ストリップ入側の通
電ロール2aをプラス極、電極3をマイナス極にして陽
極処理部8を構成し、これに連接して金属ストリップS
の出側の通電ロール2bをマイナス極、電極3をプラス
極にして陽極処理部9を構成し、金属ストリップSを挾
んで上下に設けられた給液ノズル13から各処理部を通
過する金属ストリップSに電気メッキ液を給液し、最初
に陽極処理部で金属ストリップSを陽極にして陽極処理
を行って金属ストリップ表面の再活性化を行なった後、
引き続いて電解メッキ処理部で金属ストリップSを陰極
にして電解メッキするものである。
FIG. 5 is a schematic view showing an embodiment in which the present invention is applied to a horizontal electrolytic cell. The anodizing section 8 has an energizing roll 2a on the metal strip entry side of the electrolytic cell 1 as a positive pole and an electrode 3 as a negative pole. Which is connected to the metal strip S
The anodizing section 9 is formed by setting the current-carrying roll 2b on the exit side to a negative pole and the electrode 3 to a positive pole to form a metal strip passing through each processing section from a liquid supply nozzle 13 provided above and below the metal strip S. S is supplied with an electroplating solution, and the metal strip S is first anodized in the anodizing section to perform anodization to reactivate the metal strip surface.
Subsequently, electrolytic plating is performed using the metal strip S as a cathode in an electrolytic plating section.

【0016】[0016]

【発明の効果】金属ストリップの表面が活性化した状態
で直ちに電解メッキするので、金属ストリップとメッキ
金属の密着性が充分確保でき、めっき品質の向上を図る
ことができる。
According to the present invention, since the electroplating is immediately performed in a state where the surface of the metal strip is activated, the adhesion between the metal strip and the plating metal can be sufficiently ensured, and the plating quality can be improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の金属ストリップの電解処理の説明図で
ある。
FIG. 1 is an explanatory view of an electrolytic treatment of a metal strip of the present invention.

【図2】本発明の金属ストリップの電解槽の概略図であ
る。
FIG. 2 is a schematic view of a metal strip electrolytic cell of the present invention.

【図3】本発明の電解槽の別実施例の概略図である。FIG. 3 is a schematic view of another embodiment of the electrolytic cell of the present invention.

【図4】本発明の電解槽の別実施例の概略図である。FIG. 4 is a schematic view of another embodiment of the electrolytic cell of the present invention.

【図5】本発明を横型電解槽に適用した実施例を示す概
略図である。
FIG. 5 is a schematic view showing an embodiment in which the present invention is applied to a horizontal electrolytic cell.

【図6】従来の金属ストリップ電解槽の概略図である。FIG. 6 is a schematic view of a conventional metal strip electrolytic cell.

【図7】従来の金属ストリップ連続電解メッキのライン
図である。
FIG. 7 is a line diagram of a conventional metal strip continuous electrolytic plating.

【符号の説明】[Explanation of symbols]

S 金属ストリップ 1 電解槽 1a タンク 2 ロール 2a,2b ロール(通電ロール) 3 電極 4 直流電源 5 垂直仕切り板 6 隙間 7 水平仕切り板 8 入側パス部(陽極処理部) 9 出側パス部(電解メッキ処理部) 10 下部タンク 11 絞りロール 12 受槽 13 給液ノズル S Metal strip 1 Electrolyzer 1a Tank 2 Roll 2a, 2b Roll (Electrified roll) 3 Electrode 4 DC power supply 5 Vertical partition plate 6 Gap 7 Horizontal partition plate 8 Inlet path part (anodic treatment part) 9 Outlet path part (electrolysis) Plating section) 10 Lower tank 11 Squeeze roll 12 Receiving tank 13 Liquid supply nozzle

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 酸洗し洗浄した金属ストリップを陽極処
理部及び電解メッキ処理部が連設された電解槽内で、最
初に陽極処理部で金属ストリップを陽極にして陽極処理
を行って金属ストリップ表面の再活性化を行なった後、
引き続いて電解メッキ処理部で金属ストリップを陰極に
して電解メッキすることを特徴とする金属ストリップの
電解メッキ方法。
1. An anodizing treatment is performed on an acid-washed and cleaned metal strip in an electrolytic bath provided with an anodizing section and an electroplating section. After reactivating the surface,
A method for electrolytic plating a metal strip, wherein the electrolytic plating is performed using the metal strip as a cathode in an electrolytic plating section.
【請求項2】 金属ストリップの入側に陽極処理部を設
け、陽極処理部に続いて電解メッキ処理部を連設したこ
とを特徴とする金属ストリップ電解槽。
2. An electrolyzer for a metal strip, comprising: an anodizing section provided on the entry side of a metal strip; and an electroplating section connected to the anodizing section.
【請求項3】 電解槽が金属ストリップの入側に陽極処
理部となる入側パス部と、金属ストリップの出側に電解
メッキ処理部となる出側パス部を区画し、各パス部に金
属ストリップを挾む位置に配置された電極、入側の通電
ロール、及び出側の通電ロールにそれぞれ直流電源が陽
極処理及び電解メッキする極性で電気的に接続されてい
ることを特徴とする請求項2記載の金属ストリップ電解
槽。
3. An electrolytic cell comprising an entrance pass section serving as an anodizing section on the entry side of the metal strip and an exit pass section serving as an electrolytic plating section on the exit side of the metal strip. A DC power source is electrically connected to the electrode, the energizing roll on the input side, and the energizing roll on the outgoing side, respectively, with a polarity for anodizing and electrolytic plating. 3. The metal strip electrolytic cell according to 2.
【請求項4】 入側パス部と出側パス部とを搬送用のロ
ールが配置された下部タンクで連通し、各パス部にスト
リップを挾む位置に電極が配置されていることを特徴と
する請求項2又は3記載の金属ストリップ電解槽。
4. An inflow path and an outflow path are communicated by a lower tank provided with a transport roll, and electrodes are arranged at positions sandwiching the strip between the paths. The metal strip electrolytic cell according to claim 2 or 3, wherein
【請求項5】 電解槽が独立した入側パス部と出側パス
部とからなり、各パス部の下部に絞りロールを有すると
ともに、金属ストリップを挾んで電極が配置され、さら
にその下部に搬送用のロールが配置されていることを特
徴とする請求項2、3又は4記載の金属ストリップ電解
槽。
5. An electrolytic cell comprising an independent inlet pass section and an independent outlet pass section. A narrowing roll is provided at a lower portion of each pass section, and an electrode is arranged with a metal strip interposed therebetween. 5. The metal strip electrolytic cell according to claim 2, wherein a roll is disposed.
JP5815397A 1997-03-12 1997-03-12 Electroplating method for metallic strip and electrolytic cell for metallic strip Withdrawn JPH10251893A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5815397A JPH10251893A (en) 1997-03-12 1997-03-12 Electroplating method for metallic strip and electrolytic cell for metallic strip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5815397A JPH10251893A (en) 1997-03-12 1997-03-12 Electroplating method for metallic strip and electrolytic cell for metallic strip

Publications (1)

Publication Number Publication Date
JPH10251893A true JPH10251893A (en) 1998-09-22

Family

ID=13076057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5815397A Withdrawn JPH10251893A (en) 1997-03-12 1997-03-12 Electroplating method for metallic strip and electrolytic cell for metallic strip

Country Status (1)

Country Link
JP (1) JPH10251893A (en)

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