JPH10241121A - Manufacture for magnetoresistance effect-type composite head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a manufacture for a composite head which further improves a lower limit of a track width and realizes recording with much higher density. SOLUTION: Before a magnetic pole P3 is formed by ion milling and etching of a non-magnetic layer G' to be a magnetic gap G and a magnetic layer P1' to be a magnetic pole P1 with using a magnetic pole P2 as a mask, a protecting film 19 is preliminarily layered on the magnetic pole P2 so as to restrict a reduction of a film thickness of the magnetic pole P2 by the ion milling. Since the reduction in film thickness of the magnetic pole P2 can be restricted greatly, it is not necessary to form a magnetic layer P2' thick and therefore frames 5, 6 can be thinned at the time of plating.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a magneto-resistive effect type head in which a reproducing head utilizing a magneto-resistive effect and a recording head utilizing a magnetic induction type effect are stacked.

[0002]

2. Description of the Related Art As the relative speed between a magnetic head for reading and a magnetic recording medium has become smaller as the size and capacity of a magnetic recording medium have become smaller, the magnetoresistive effect type whose reproduction output does not depend on the speed. Expectations for a head (hereinafter referred to as “MR head”) are increasing. Regarding this MR head, "IEEE Trans. On Magn. MAG (1970) 150"
`` A Magnetoresistivity Readout Transducer
".

[0003] The most practical MR head is a magnetoresistive effect element (hereinafter, referred to as an "MR element") that is provided with first and second magnetic shield films facing each other and a magnetic separation film interposed between these magnetic shield films. )), And one of the first and second magnetic shield films is used as a first magnetic pole, and an insulating surface is provided on the surface opposite to the first magnetic pole and the MR element. An inductive head in which a coil and a second magnetic pole sandwiched by a body are stacked in parallel with the first magnetic pole, and perform recording by a magnetic field generated in a magnetic gap provided between the first and second magnetic poles ( Hereinafter, referred to as an “ID head”), a magnetoresistive composite head (hereinafter, simply referred to as a “composite head”).

However, in this composite head, a considerably large side fringe magnetic field is generated during recording. This magnetic field is created by the leakage of magnetic flux to the portion of the first pole that exceeds the width defined by the width of the second pole because the first pole is wider than the second pole. This side fringe field limits the upper limit of track density in order to limit the minimum achievable track width. Therefore, in order to achieve high-density recording using the above composite head, it is necessary to reduce the side fringe magnetic field.

In a conventional ID head for performing recording and reproduction, each side defining a track width on a surface (air bearing surface, hereinafter referred to as an "ABS surface") of the first and second magnetic poles facing the medium is formed by: The side fringe magnetic field was minimized because it was formed so as to substantially match. However, in the above composite head, the width of the first magnetic pole is larger than that of the second magnetic pole because the width of the first magnetic pole requires a function for shielding the MR element. Has a very wide width. This difference in width causes a side fringe magnetic field that extends in the track width direction beyond the width of the second magnetic pole. The width of the magnetic pole is
It refers to the length in the lamination plane direction as viewed from the ABS plane.

A method for reducing the side fringe magnetic field like a conventional ID head is disclosed in Japanese Patent Application Laid-Open No. 7-262519. In this method, as shown in FIG.
In the composite head, between the first magnetic pole P1 and the magnetic gap G of the ID head, the surface of the magnetic pole P1 which is parallel to the film surface of the magnetic pole P1 and coincides with the side surface of the magnetic pole P2 defining the width of the second magnetic pole P2 And a third magnetic pole P3 magnetically continuous with the magnetic pole P1. As a result, a recording magnetic field is generated between the magnetic pole P2 and the magnetic pole P3, so that the side fringe magnetic field is suppressed to the level of a conventional ID head.

The method of forming the magnetic pole P3 is as shown in FIG. First, the magnetic layer S2 'to be one magnetic shield S2 of the MR head, that is, the magnetic layer P2 to be the magnetic pole P1
A non-magnetic layer G ′ serving as a magnetic gap G is formed on 1 ′;
Next, a magnetic layer P2 'which becomes a magnetic pole P2 having a predetermined width is formed by a frame plating process defined by the photoresist frames 5 and 6, and the magnetic layer P2' is used as a mask to make the magnetic pole P1 to a desired depth by ion milling. The magnetic pole P3 is formed by etching. At this time, the side surfaces of the magnetic pole P2 and the magnetic pole P3 can be formed so as to be perpendicular to the magnetic pole P1 surface by setting the incident angle of the ion beam optimally. By setting the height of the magnetic pole P3 to a desired height, the recording magnetic field is substantially defined between the magnetic pole P2 and the magnetic pole P3,
Side fringes are suppressed as in the conventional ID head.

[0008]

SUMMARY OF THE INVENTION Japanese Patent Application Laid-Open No. 7-26251
In the method of manufacturing a composite head disclosed in Japanese Patent Publication No.
Ion milling is used to form the magnetic pole P3. At this time, since the magnetic layer P2 'functions as a mask, the thickness of the magnetic layer P2' by ion milling decreases. That is, in order to obtain the desired magnetic pole P2 when the desired magnetic pole P3 is formed, it is necessary to form the initial magnetic layer P2 'in anticipation of a decrease in the thickness of the magnetic layer P2' by ion milling. That is, Japanese Patent Application Laid-Open No. 7-2625 shown in FIG.
In the method of manufacturing a composite head disclosed in Japanese Patent Publication No.
Because of the initial magnetic layer P2 'by the frame plating process, the height of the frame had to be greatly increased as compared with the conventional case. That is, the thickness of the magnetic pole P2 after milling is significantly reduced as compared with the thickness of the magnetic layer P2 ′ before milling, so that the thickness of the magnetic pole P2 after milling is secured before milling to ensure sufficient recording characteristics. Must be made thicker. Increasing the height of the frame means increasing the aspect ratio of the frame pattern, making it difficult to form a pattern with a narrow frame interval. In Japanese Patent Application Laid-Open No. Hei 7-262519, this limit is set to 2 μm. Therefore, it is difficult to realize a composite head that realizes high-density recording with a track width of 2 μm or less by this method.

[0009]

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a composite head which further improves the lower limit of the track width as described above and realizes higher density recording.

[0010]

According to the present invention, when ion milling is performed using the magnetic pole P2 as a mask, a considerable amount of the magnetic pole P2, which is reduced by ion milling, on the magnetic pole P2 in advance.
A protective film other than that described above is formed, and the protective film is etched by the ion milling to suppress a decrease in the thickness of the magnetic pole P2. As a result, the initially formed magnetic pole P2
It is not necessary to increase the film thickness, and by not increasing the frame height, a pattern with a narrow frame interval can be formed, and a narrow track width can be realized.

In the conventional manufacturing method shown in FIG. 5, the magnetic pole P3 is formed by ion milling using the magnetic layer P2 'as a mask.
Is formed, the nonmagnetic layer G ′ serving as the magnetic gap G is also etched by the ion milling. The non-magnetic layer G 'is usually formed of an alumina film. The etching rate of the alumina film by ion milling is the magnetic layer P2 '.
In the ion milling, most of the time was spent for etching the magnetic gap G. At this time, the thickness of the magnetic layer P2 ′, which decreases, is about 2.5 times the thickness of the nonmagnetic layer G ′.

According to the present invention, the magnetic layer P
By laminating in advance a protective film having a smaller etching rate by ion milling than 2 ′, the protective film laminated on the magnetic pole P2 is etched when the nonmagnetic layer G ′ is etched, and ion milling is performed. Magnetic pole P2
Is characterized by suppressing a decrease in film thickness.

That is, the opposing magnetic shield films S1,
S2, a reproducing head comprising an MR element interposed between the magnetic shield films S1 and S2 via a magnetic separation film made of an insulator, and a magnetic shield film S2 having one magnetic pole P1, and the magnetic pole P1 and the MR element On the opposite side, a coil narrowed by an insulator and another magnetic pole P2 are laminated in parallel with the magnetic pole P1, and a magnetic field generated in a magnetic gap G provided between the magnetic pole P1 and the magnetic pole P2 causes A composite head including a recording head for performing recording, having a surface parallel to the film surface of the magnetic pole P1 between the magnetic pole P1 and the magnetic gap G, and coinciding with a side surface of the magnetic pole P2 defining the width of the magnetic pole P2. In the method of manufacturing a composite head having a magnetic pole P3 magnetically continuous with the magnetic pole P1 having
A non-magnetic layer G 'serving as a magnetic gap G is formed on a magnetic layer P1' serving as a magnetic pole P1, a magnetic pole P2 having a predetermined width is formed, and a protective film having a smaller etching rate than the magnetic pole P2 by ion milling. Are continuously laminated, and the magnetic pole P2
The nonmagnetic layer G ′ and the magnetic layer P1 ′ are etched to a desired depth by ion milling using
The magnetic pole P3 is formed.

This method can also be applied to a case where a magnetic material having a large saturation magnetization is applied adjacent to the magnetic gap G to realize an ID head with high recording efficiency. That is,
In the composite head, the magnetic pole P1 has a surface parallel to the film surface of the magnetic pole P1 between the magnetic pole P1 and the magnetic gap G, and has a side surface coinciding with the side surface of the magnetic pole P2 defining the width of the magnetic pole P2. A magnetic pole P3 that is continuous and has a larger saturation magnetization than the magnetic pole P1, and has a side surface between the magnetic gap G and the magnetic pole P2 that coincides with the side surface of the magnetic pole P2 that defines the width of the magnetic pole P2. And a magnetic pole P4 having a saturation magnetization larger than that of the magnetic pole P2 and a non-magnetic layer G ′ that becomes a magnetic gap G on the magnetic layer P1 ′ that becomes the magnetic pole P1. A magnetic layer P4 ', which will later become a magnetic pole P4, is sequentially laminated, a magnetic pole P2 having a predetermined width is formed, and then a protective film having a smaller etching rate by ion milling than the magnetic pole P2 is continuously laminated. By ion milling 2 as a mask, the non-magnetic layer G 'and the magnetic layer P1', by etching to a desired depth P4 ', forming the pole P4 and the pole P3.

The width of the magnetic pole P2 of the above composite head can be as narrow as about 1 μm, which is smaller than the conventional lower limit of 2 μm, thereby realizing higher density recording. This is because a reduction in the film thickness of the magnetic pole P2 is suppressed by laminating a protective film having a smaller etching rate by ion milling than the magnetic pole P2 on the magnetic pole P2, which has caused a decrease in the film thickness in the ion milling step of forming the magnetic pole P3. Is possible,
This is because the height of the frame forming the magnetic pole P2 can be made lower than in the conventional method.

[0016]

1 and 3 are side views, as viewed from the ABS, showing a first embodiment of a method for manufacturing a composite head according to the present invention. Hereinafter, description will be made based on these drawings.

The feature of this embodiment is that a protective film having a thickness corresponding to the amount cut by ion milling is laminated on the magnetic pole P2 for defining the recording width, and the thickness of the magnetic pole P2 is reduced in the ion milling process. Accordingly, it is an object of the present invention to provide a novel composite head manufacturing method capable of reducing the height of the frame and forming a narrow frame interval by suppressing the height.

First, the structure of the composite head will be described with reference to FIG. The magnetic shield film S1 is a lower shield, and the magnetic shield film S2 is an upper shield. These are Ni
The magnetic shield film S1 is formed of an Fe alloy (permalloy) and has a thickness of 1 μm and the magnetic shield film S2 has a thickness of 3 μm. Between these magnetic shield films S1 and S2, an MR element including a central region 9 as a magnetically sensitive portion and end regions 10 and 11 for supplying a current and a vertical bias to the central region 9 is formed. The central region 9 has a thickness of 10 nm having an MR effect.
NiFe film 12, a 15-nm thick CoZrMo film 14 for applying a lateral bias to the NiFe film 12, and N
A 10 nm thick Ta film 13 for magnetically separating the iFe film 12 and the CoZrMo film 14 is laminated in the order of the magnetic shield film S2, the CoZrMo film 14, the Ta film 13, and the NiFe film 12. The width of the central region 9 (the track width of the MR head) is 1.0 μm. End regions 10, 1
1 is electrically connected to the central region 9,
CoC for applying a vertical bias to the NiFe film 12 of FIG.
rPt film 15 and Au film 1 for supplying current to central region 9
6 The thickness of the CoCrPt film 15 is 25 nm. The MR element including the central region 9 and the end regions 10 and 11 is electrically insulated from the magnetic shield films S1 and S2 by alumina films 17 and 18. Alumina film 1
The thicknesses of the layers 7 and 18 are 90 nm on the lower shield side and 80 nm on the upper shield side.

On the magnetic pole P1, which also serves as the magnetic shield film S2, is aligned well with the central region 9 of the MR element.
A magnetic pole P3 of NiFe magnetically continuous with the magnetic pole P3 is formed. One magnetic pole of the ID head is formed by the magnetic pole P3 and the magnetic pole P1, and the other magnetic pole P2 of NiFe is formed via the magnetic gap G of alumina. At this time, the width of each of the magnetic poles P2 and P3 is 1.1 μm, and the film thickness is 3.
5 μm and 0.5 μm, the thickness of the magnetic gap G is 0.2
5 μm. Further, a Cu coil insulated by a photoresist material is formed at a depth of 2 μm from the ABS of the magnetic poles P2 and P3, and a current flows through the coils to generate a recording magnetic field between the magnetic gaps G.

Next, a method of manufacturing the magnetic shield film S2 of the composite head will be described with reference to FIG.

First, the magnetic layer S serving as the magnetic shield film S2
On the 2 ′, that is, on the NiFe magnetic layer P1 ′ that becomes the magnetic pole P1, an alumina nonmagnetic layer G ′ that becomes the magnetic gap G is formed by sputtering. Subsequently, in order to form the magnetic pole P2 by frame plating, a photoresist frame 5,
6 (FIG. 1A). Here, although not shown in FIG. 1A, before forming the frames 5 and 6, it is located between the magnetic poles P1 and P2 and is about 2 μm from the ABS.
A Cu coil insulated by a photoresist material is formed at the back. Subsequently, NiF is applied by frame plating.
After forming the magnetic pole P2 of e, an alumina protective film 19 is formed by sputtering to a thickness of 0.3 μm (FIG. 1B).
Subsequently, after covering the magnetic pole portion with a photoresist and removing the alumina film and the plated NiFe film of the other portions, the photoresist of the frame pattern is removed (FIG. 1C). The etching of the alumina film at this time used ion milling. The angle of incidence of the ion beam was 45 degrees at which the etching rate of the alumina film was maximized. The etching rate at this time is as follows: acceleration voltage: 50
0 V, ion current density: 1.0 mA / cm ² , about 25
It was 0 A / min. Subsequently, using the magnetic pole P2 as a mask,
The nonmagnetic layer G ′ and the magnetic layer P1 ′ are etched by ion milling (FIG. 1D).

At this time, the ion milling is performed by the magnetic pole P3 having the same side surface as the side surface defining the width in the track width direction.
At this time, and at this time, it is necessary to suppress the re-sputtered layer due to ion milling on the side surface of the magnetic pole P3. For this purpose, first, the side face of the magnetic gap G and the magnetic pole P3 was formed by setting the incident angle of the ion beam to 30 degrees, and then the resputtered layer on the side face of the magnetic pole P3 was removed by setting the incident angle of the ion beam to 70 degrees. When the alumina film thickness of the magnetic gap G is 0.25 μm and the side wall thickness of the magnetic pole P3 is 0.5 μm, all the protective films 19 formed on the magnetic pole P2 by this ion milling disappear, and the NiFe of the magnetic pole P2 further disappears.
Decreased by about 0.8 μm. Therefore, the film thickness of the magnetic pole P2 is 3.
The initial magnetic layer P2 ′ for obtaining 5 μm is 4.3 μm. The thickness of the frames 5 and 6 for obtaining this film thickness is as follows:
The thickness of the magnetic layer P2 '+ 1.
5 μm. An alumina protective film 1 is formed on the magnetic pole P2.
9, the variation in film thickness is small because alumina is deposited by a sputtering method, and the increase in the frame pattern film thickness due to the lamination of alumina can be sufficiently covered by the increase in film thickness in consideration of the above-described plating film thickness variation. So there is no need to consider. That is, the film thickness of the frames 5 and 6 required in the present invention is about 5.8 μm. The film thickness of the frames 5 and 6 is 5.8μ
m, the distance between the frames 5 and 6 is 1.1
The formation of a pattern having a narrow width of μm has become possible. FIG. 1 (e)
Is a completed drawing in the above process.

Next, for comparison, a conventional method for manufacturing a composite head will be described with reference to FIG.

On the NiFe magnetic layer P1 'serving as the magnetic pole P1, a nonmagnetic alumina layer G' serving as the magnetic gap G is formed by sputtering. Subsequently, photoresist frames 5 and 6 are formed in order to form the other magnetic pole P2 by frame plating (FIG. 5A). Here, FIG.
Although not shown in (a), before the frames 5 and 6 are formed, C which is located between the magnetic poles P1 and P2 and is about 2 μm deep from the ABS plane and insulated by a photoresist material is used.
A u-coil is formed. Subsequently, a magnetic layer P2 ′ of NiFe to be the magnetic pole P2 is formed by frame plating (FIG. 5B). Subsequently, after covering the magnetic pole portion with a photoresist and removing the plated NiFe film in the other portions, the frames 5 and 6 are removed (FIG. 5C). Subsequently, using the magnetic layer P2 'as a mask, the nonmagnetic layer G' and the magnetic layer P1 'are etched by ion milling (FIG. 5D).

At this time, the ion milling is performed by the magnetic pole P3 having the same side surface as the side surface defining the width in the track width direction.
At this time, and at this time, it is necessary to suppress the re-sputtered layer due to ion milling on the side surface of the magnetic pole P3. For this purpose, first, the side face of the magnetic gap G and the magnetic pole P3 was formed by setting the incident angle of the ion beam to 30 degrees, and then the resputtered layer on the side face of the magnetic pole P3 was removed by setting the incident angle of the ion beam to 70 degrees. When the alumina thickness of the magnetic gap G was 0.25 μm and the side wall thickness of the magnetic pole P3 was 0.5 μm, NiFe of the magnetic pole P2 was reduced by about 3.0 μm by this ion milling. Therefore, the thickness of the magnetic pole P2 is 3.5.
The first magnetic layer P2 ′ for obtaining μm is 6.5 μm. The film thickness of the frames 5 and 6 for obtaining this film thickness is set to be +1.5 times the thickness of the magnetic layer P2 'in consideration of the variation in plating film thickness.
μm. That is, the required film thickness of the frames 5 and 6 is about 8.0 μm, and it is very difficult to obtain a pattern in which the interval between the frames 5 and 6 is 2.0 μm or less. FIG. 5E is a completed view of the above process.

FIGS. 2 and 4 are side views as viewed from the ABS, showing a first embodiment of the method of manufacturing a composite head according to the present invention. Hereinafter, description will be made based on these drawings. However, the same parts as those in FIGS. 1 and 3 are denoted by the same reference numerals, and redundant description will be omitted.

First, the structure of the composite head will be described with reference to FIG. On the magnetic pole P1, a magnetic pole P3 made of NiFe is formed, which is well aligned with the central region of the MR element and is magnetically continuous with the magnetic pole P1. ID of magnetic pole P3 and magnetic pole P1
One magnetic pole of the head is formed, and the other magnetic pole is formed by the magnetic pole P4 and the magnetic pole P2 via a magnetic gap G made of alumina. The magnetic pole P4 is a CoZrTa film having a saturation magnetization of 15 kG, a specific resistance of 100 μΩ · cm, and a film thickness of 0.5 μm, and the magnetic pole P2 is a NrFe film having a film thickness of 3 μm. At this time, the width of each of the magnetic poles P2, P3 and P4 is 1.1 μm,
The thickness of the magnetic pole P3 is 0.5 μm, and the thickness of the magnetic gap G is 0.25 μm. The magnetic pole P3 and the magnetic poles P2, P4
A Cu coil insulated by a photoresist material is formed at a depth of 2 μm from the ABS surface of the above, and a current is caused to flow through this coil to generate a recording magnetic field between the magnetic gaps G.

Next, a method of manufacturing the composite head according to the present embodiment will be described with reference to FIG.

On the NiFe magnetic layer P1 'serving as the magnetic pole P1, an alumina nonmagnetic layer G' serving as the magnetic gap G and a CoZrTa magnetic layer P4 'serving as the magnetic pole P4 are formed by sputtering. NiFe magnetic layer P2 '
Are formed by a frame plating method to form photoresist frames 5 and 6 (FIG. 2A). Here, although not shown in FIG. 2A, before the frames 5 and 6 are formed, they are located between the magnetic poles P3 and P4.
A Cu coil insulated by a photoresist material is formed at a depth of about 2 μm from the ABS. Subsequently, after a magnetic layer P2 of NiFe to be the magnetic pole P2 is formed by frame plating, the alumina protective film 19 is subsequently coated with 0.5 μm.
A μm sputter film is formed (FIG. 2B). Subsequently, the magnetic pole portion was covered with a photoresist, the other portions of the alumina film and the plated NiFe film were removed, and then the photoresist frames 5 and 6 were removed (FIG. 2C). The etching of the alumina film at this time used ion milling. The angle of incidence of the ion beam was 45 degrees at which the etching rate of the alumina film was maximized. The etching rate at this time was about 250 A / min at an acceleration voltage of 500 V and an ion current density of 1.0 mA / cm ² . Subsequently, using the magnetic pole P2 as a mask, the magnetic layer P4′P
The 1 ′ and the nonmagnetic layer G ′ are etched by ion milling (FIG. 2D).

At this time, the ion milling is performed by the magnetic pole P3 having the same side surface as the side surface defining the width in the track width direction.
At this time, and at this time, it is necessary to suppress the re-sputtered layer due to ion milling on the side surface of the magnetic pole P3. For this purpose, first, the side face of the magnetic gap G and the magnetic pole P3 was formed by setting the incident angle of the ion beam to 30 degrees, and then the resputtered layer on the side face of the magnetic pole P3 was removed by setting the incident angle of the ion beam to 70 degrees. When the alumina film thickness of the magnetic gap G is 0.25 μm, the side wall thickness of the magnetic pole P3 is 0.5 μm, and the CoZrTa film thickness of the magnetic pole P4 is 0.5 μm, the alumina film formed on the magnetic pole P2 by this ion milling is all The NiFe film of the magnetic pole P2 disappears about 1.
It decreased by 0 μm. Therefore, the initial film thickness for obtaining the film thickness of the magnetic pole P2 of 3.5 μm is 4.5 μm. This magnetic pole P
The thickness of the frames 5 and 6 necessary to obtain the thickness of 2 is set to the thickness of the magnetic pole P2 + 1.5 μm in consideration of the variation in plating thickness.
It is. Further, the alumina protective film 19 is laminated on the magnetic pole P2. Since the alumina film is formed by the sputtering method, the variation in the film thickness is small, and the increase in the film thickness of the frames 5 and 6 due to the lamination of the alumina film is as follows. There is no need to consider this because the increase in film thickness taking into account the above-mentioned variation in plating film thickness can be sufficiently covered. That is, the film thickness of the frames 5 and 6 required in the present invention is about 6.0 μm. The thickness of the frames 5 and 6 is 6.0 μm
1.1μm spacing between frames 5 and 6
Can be formed. FIG. 2E is a completed view of the above process.

Next, for comparison, a conventional method of manufacturing a composite head will be described with reference to FIG.

On the NiFe magnetic layer P1 'serving as the magnetic pole P1, a nonmagnetic alumina layer G' serving as the magnetic gap G and a CoZrTa magnetic layer P4 'serving as the magnetic pole P4 are formed by sputtering. Subsequently, the magnetic layer P of NiFe to be the magnetic pole P2
In order to form 2 'by frame plating, frames 5 and 6 made of photoresist are formed [FIG.
(A)]. Here, although not shown in FIG.
Before forming the frames 5 and 6, a Cu coil insulated by a photoresist material is formed between the magnetic poles P2 and P4 and about 2 μm deep from the ABS surface. Subsequently, a magnetic layer P2 'is formed by frame plating. Subsequently, after covering the magnetic pole portion with a photoresist and removing the plated NiFe film in other portions, the frame 5,
FIG. 6C in which the photoresist of No. 6 is removed. Subsequently, using the magnetic pole P2 as a mask, the nonmagnetic layer G 'and the magnetic layer P
1 ', P4 etched by ion milling Fig. 6
(D).

In the ion milling at this time, it is necessary to form the magnetic pole P3 having the same side surface as the side surface defining the width in the track width direction, and at this time, it is necessary to suppress the resputtering layer due to the ion milling on the side surface of the magnetic pole P3. is there. For this purpose, first, the side face of the magnetic gap G and the magnetic pole P3 was formed by setting the incident angle of the ion beam to 30 degrees, and then the resputtered layer on the side face of the magnetic pole P3 was removed by setting the incident angle of the ion beam to 70 degrees. The thickness of the nonmagnetic layer G ′ is 0.25 μm.
m, the thickness of the magnetic layer P4 ′ was 0.5 μm, and the thickness of the side wall of the magnetic layer P3 ′ was 0.5 μm. This ion milling reduced the thickness of the magnetic layer P2 ′ by about 4.0 μm. Therefore, the film thickness of the first magnetic layer P2 ′ for obtaining the film thickness of the magnetic pole P2 of 3.5 μm is 7.5 μm. This magnetic layer P2 '
The thickness of the frames 5 and 6 for obtaining the thickness of the magnetic layer P2 ′ is +1.5 μm in consideration of the variation in plating thickness. That is, the necessary film thickness of the frames 5 and 6 is about 9.0 μm.
m, and it is very difficult to obtain a pattern in which the interval between the frames 5 and 6 is 2.0 μm or less. FIG. 6E is a completed view of the above process.

[0034]

In a composite head having a structure in which an MR head and an ID head are stacked, side fringing is suppressed and a narrow track recording up to about 1 μm is realized.
A composite head having a D head was realized. In the ID head magnetic pole of the composite head, the magnetic pole shared with the magnetic shield of the MR head is magnetic pole P1, and the other magnetic pole via the magnetic gap is magnetic pole P2. At this time, in the step of forming a magnetic pole P3 having a side surface that coincides with the side surface that defines the width of the magnetic pole P2 and being magnetically continuous with the magnetic pole P1, protection with a smaller etching rate by ion milling than the magnetic pole on the magnetic pole P2. By stacking the films in advance, the magnetic gap and the magnetic pole P1 can be patterned by ion milling using the magnetic pole P2 as a mask.
Since the decrease in the film thickness of the magnetic pole P2 can be largely suppressed, and therefore, it is not necessary to increase the film thickness of the initial magnetic pole P2, the resist pattern film thickness when performing the frame plating can be reduced, and the width of the magnetic pole P2 becomes smaller A pattern of about 1 μm can be formed. As a result, a high-density composite head was realized.

In the embodiment of the present invention, the high Bs film formed near the recording gap is not only a CoZrTa film but also a FeN-based film and a FeML-based film (M is Ta, Zr, N
A high Bs film mainly containing at least one element selected from b, Hf, Mo, and Ti, and L being at least one element selected from nitrogen, carbon, boron, and oxygen) may be used.

[Brief description of the drawings]

FIG. 1 is a front view illustrating a first embodiment of a method of manufacturing a composite head according to the present invention, as viewed from an ABS. FIG.
The steps proceed in the order of (a) to FIG. 1 (e).

FIG. 2 is a front view, viewed from the ABS, showing a second embodiment of the method for manufacturing a composite head according to the present invention. FIG.
The process proceeds in the order of (a) to FIG. 2 (e).

FIG. 3 is a front view showing a first example of a composite head according to the related art and the present invention as viewed from the ABS.

FIG. 4 is a front view showing a second example of a composite head according to the related art and the present invention as viewed from the ABS.

FIG. 5 shows a first example of a conventional method for manufacturing a composite head.
It is the front view seen from the ABS side. 5 (a) to 5
The process proceeds in the order of (e).

FIG. 6 shows a second example of a conventional method for manufacturing a composite head.
It is the front view seen from the ABS side. 6 (a) to 6
The process proceeds in the order of (e).

[Explanation of symbols]

 P1 First magnetic pole P2 Second magnetic pole P3 Third magnetic pole P4 Fourth magnetic pole G Magnetic gap S1 Magnetic shield film S2 Magnetic shield film 5,6 Frame

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Nobuyuki Asbestos 5-7-1 Shiba, Minato-ku, Tokyo Inside NEC Corporation

Claims (12)

[Claims] A read head having a magnetoresistive element sandwiched between first and second magnetic shield films via a magnetic separation film; and a second magnetic shield film serving as a first magnetic pole. A third magnetic pole that is magnetically continuous with the first magnetic pole is formed on the first magnetic pole, and a second magnetic pole is stacked on the third magnetic pole via a magnetic gap. Wherein the length in the stacking plane direction as viewed from the ABS is shorter in the second magnetic pole than in the first magnetic pole and equal to the third magnetic pole and the magnetic gap. In the resistance-effect composite head, before forming the third magnetic pole by etching the nonmagnetic layer serving as the magnetic gap and the magnetic layer serving as the first magnetic pole by ion milling using the second magnetic pole as a mask In addition, Protective film allowed to advance laminated on the second on poles, the method for manufacturing a magneto-resistance effect type composite head, characterized in that for suppressing the film thickness of the second magnetic pole is reduced by the ion milling. 2. The magnetoresistive composite according to claim 1, wherein the ion milling rate of the protective film when performing the ion milling is smaller than the ion milling rate when performing the ion milling of the second magnetic pole. Head manufacturing method. 3. An alumina film is used as the protective film.
A method for manufacturing a magnetoresistive head according to claim 1. 4. The method according to claim 1, wherein the length of the second magnetic pole in the direction of the laminated surface viewed from the ABS is 2 μm or less. 5. A read head in which a magnetoresistive element is sandwiched between first and second magnetic shield films via a magnetic separation film; and said second magnetic shield film as a first magnetic pole. A third magnetic pole magnetically continuous with the first magnetic pole is formed on the first magnetic pole, and a fourth magnetic pole is laminated on the third magnetic pole via a magnetic gap. A second magnetic pole that is magnetically continuous with the second magnetic pole is stacked on the fourth magnetic pole, and the fourth magnetic pole has a larger saturation magnetization than the second magnetic pole,
A recording head for generating a magnetic field from the magnetic gap, wherein the length in the stacking plane direction viewed from the ABS is such that the second magnetic pole is shorter than the first magnetic pole and the third and fourth magnetic poles And a non-magnetic layer serving as the magnetic gap and a magnetic layer serving as the first and fourth magnetic poles are etched by ion milling using the second magnetic pole as a mask. Thus, before forming the third magnetic pole, a protective film for suppressing the thickness of the second magnetic pole from being reduced by the ion milling is previously laminated on the second magnetic pole. A method for manufacturing a magnetoresistive composite head. 6. The magnetoresistive composite according to claim 5, wherein the ion milling rate of the protective film when performing the ion milling is lower than the ion milling rate when performing the ion milling of the second magnetic pole. Head manufacturing method. 7. An alumina film is used as the protective film.
A method for manufacturing a magnetoresistive head according to claim 5. 8. The method according to claim 5, wherein the length of the second magnetic pole in the direction of the laminated surface as viewed from the ABS is 2 μm or less. 9. A read head in which a magnetoresistive element is sandwiched between first and second magnetic shield films via a magnetic separation film; and said second magnetic shield film as a first magnetic pole. A third magnetic pole magnetically continuous with the first magnetic pole is laminated on the first magnetic pole, and a fourth magnetic pole is laminated on the third magnetic pole via a magnetic gap. A second magnetic pole magnetically continuous with the fourth magnetic pole is laminated, the third magnetic pole has a larger saturation magnetization than the first magnetic pole,
A recording head for generating a magnetic field from the magnetic gap, wherein the fourth magnetic pole has a larger saturation magnetization than the second magnetic pole, and has a length in the stacking plane direction as viewed from the ABS plane; Wherein the magnetic pole is shorter than the first magnetic pole and equal to the third and fourth magnetic poles and the magnetic gap. In the magneto-resistance effect type composite head, the second magnetic pole is used as a mask to become the magnetic gap. Before forming the third magnetic pole by etching the layer and the magnetic layer that will be the first, third and fourth magnetic poles by ion milling, the thickness of the second magnetic pole is reduced by the ion milling. A method for manufacturing a magneto-resistance effect type composite head, comprising: laminating a protective film on the second magnetic pole in advance to prevent the magnetic head from being damaged. 10. The magnetoresistive composite according to claim 9, wherein the ion milling rate of the protective film when performing the ion milling is smaller than the ion milling rate when performing the ion milling of the second magnetic pole. Head manufacturing method. 11. The method according to claim 9, wherein an alumina film is used as the protective film. 12. The method according to claim 9, wherein the length of the second magnetic pole in the direction of the laminated surface viewed from the ABS is 2 μm or less.