JPH10238092A - Wooden soundproof floor material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow a buffer sheet to exert the primary sound isolation performance and improve the performance of a soundproof floor material by sticking the buffer sheet laminated with spun bond nonwoven fabrics on both the surface and back face to the back face of a wooden plate. SOLUTION: A buffer sheet 14 laminated with spun bond nonwoven fabrics 12, 13 on both the surface and back face is stuck to the back face of a wooden plate 11 to form a wooden soundproof floor material 10. Any wooden plate-like material, e.g. plywood, LVL, LVB, particle board, MDF, hard board, OSB, LSL, or solid plate, can be used for the wooden plate 11. A material having a cushioning property, e.g. foam synthetic resin or foam rubber, is used for the buffer sheet 14. The spun bond nonwoven fabrics 12, 13 prevent the infiltration of an adhesive into the buffer sheet 14, and the buffer sheet 14 exerts the primary sound isolation performance. The performance of the soundproof floor material 10 can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wood-based sound-insulating floor material installed in a house, and more particularly to a wood-based sound-insulating floor material that can sufficiently exhibit the sound insulation performance inherent in a buffer sheet. .

[0002]

2. Description of the Related Art There have been proposed various flooring materials in which a cushioning sheet is laminated on the back surface in order to impart soundproofing to a wooden flooring material. As the buffer sheet, for example, foamed polyethene or urethane foam, foamed rubber, a thick nonwoven fabric and the like,
These are used alone or in some cases in combination. These wood-based soundproof flooring materials are installed on the flooring material via an adhesive.

[0003]

However, there is a problem that the applied adhesive penetrates into the inside of the buffer sheet, and the cured adhesive hardens after curing, and the buffer sheet cannot exhibit sufficient sound insulation performance. Was. Also, when manufacturing this wood-based soundproof flooring material, an adhesive was applied to the back surface of the wooden board and the buffer sheet was stuck, but the adhesive still permeated into the buffer sheet, There is a problem that the original sound insulation performance of the buffer sheet cannot be exhibited. The present invention has been made in view of such circumstances, and an object of the present invention is to provide a wood-based acoustic flooring material in which an adhesive is prevented from penetrating into a buffer sheet so that the buffer sheet has an original performance.

[0004]

According to the present invention, there is provided a semiconductor device comprising:
The described wood-based sound-insulating flooring material has a buffer sheet in which a spunbonded nonwoven fabric is laminated on both sides on the back surface of a wooden board.

According to the first aspect of the present invention, since the spunbonded nonwoven fabric is laminated on both sides of the buffer sheet, penetration of the adhered adhesive into the buffer sheet is suppressed. In addition, about the manufacturing method of a spunbonded nonwoven fabric, for example, JP-A-7-300753, JP-A-8-109565, JP-A-4-22
No. 2267, Japanese Unexamined Patent Publication No. 7-197367 and the like can be employed.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention. Here, FIG. 1 is a cross-sectional view of a wood-based soundproof flooring according to one embodiment of the present invention. As shown in FIG. 1, a wooden soundproof flooring material 10 according to one embodiment of the present invention.
Are spunbonded nonwoven fabrics 12 on the front and back,
And a buffer sheet 14 attached to the back surface of the wooden board 11. Hereinafter, these will be described in detail.

The wood board 11 is made of plywood, LVL (laminate veneer), LVB (laminate veneer board),
Particle board, MDF (medium fiber board), hard board, OSB (oriented strand board), L
All other woody and plate-like materials such as SL (Laminated Strand Lumber), solid board and the like can be adopted. The thickness is about 3 to 15 mm, and the surface is subjected to a makeup treatment by sticking a veneer, a decorative paper, a resin sheet, or the like as necessary, or applying a coating. Also, on the back of the wooden board 11,
A slit may be formed to impart flexibility to improve adhesion to a floor substrate having irregularities, or grooves may be provided at appropriate intervals to improve sound insulation performance.

The cushioning sheet 14 has a thickness of 1 to 5 for example.
What has a buffering property, such as foam synthetic resin and foam rubber of about mm, is used. As shown in FIG. 1, the buffer sheet 14 may be formed by laminating materials 14a and 14b having different foaming rates. In the case of this example, urethane foam of 50 times expansion is used for the material 14a, and urethane of 40 times expansion is used for the material 14b. In order to prevent the adhesive from penetrating into the inside of the buffer sheet 14, the thickness on both sides is 0.1 to
The spunbonded nonwoven fabrics 12 and 13 having a thickness of 0.5 mm are adhered.
Is bonded by a small amount of adhesive and / or heat fusion. This is because if a large amount of adhesive is used, the cushioning sheet 14
This is because the adhesive penetrates into the inside and there is no point in attaching the spun bond nonwoven fabrics 12 and 13. It is preferable to use an adhesive having a slightly higher viscosity to prevent penetration into the buffer sheet 14.

As described in the above publications, spunbonded nonwoven fabrics 12 and 13 are one of methods for obtaining a nonwoven fabric and are manufactured by a method called a spunbond method, and are obtained by melt-spinning a thermoplastic resin. This is a method of forming a continuous long fiber group, narrowing and stretching the continuous long fiber group using a high-speed airflow traction device to spread the continuous long fiber group, and then depositing the group on a net conveyor to form a nonwoven web. Therefore, when using the wood-based sound-insulating flooring material 10, an epoxy-based adhesive is applied on the floor substrate to perform the construction. Thereby, the spunbonded nonwoven fabric 13 prevents the buffer sheet 14 of the adhesive from entering, and prevents the buffer sheet 14 from being hardened due to the entry of the adhesive.

[0010]

According to the first aspect of the present invention, in the case of applying the adhesive to the back surface of the wooden board and attaching the buffer sheet thereto, the spunbonded nonwoven fabric disposed in the middle is used for the buffer sheet. In the case where the adhesive is prevented from penetrating, and the adhesive is applied onto the floor substrate, the spunbonded nonwoven fabric stuck on the back surface prevents the adhesive from penetrating into the buffer sheet. As described above, since the spunbonded nonwoven fabric prevents the penetration of the adhesive, the cushioning sheet can exhibit the original sound insulation performance, and as a result, the performance of the soundproof flooring material is improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a wood-based soundproof flooring material according to an embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Wood-based sound-insulating floor material 11 Wood material 12 Spunbonded nonwoven fabric 13 Spunbonded nonwoven fabric 14 Buffer sheet 14a Material 14b Material

Claims (1)

[Claims] 1. A wood-based sound-insulating flooring material, characterized in that a buffer sheet having a spun-bonded nonwoven fabric laminated on both sides is attached to the back surface of a wooden board.