JPH10236845A - Low melting point leadless glass composition - Google Patents

Low melting point leadless glass composition

Info

Publication number
JPH10236845A
JPH10236845A JP4265897A JP4265897A JPH10236845A JP H10236845 A JPH10236845 A JP H10236845A JP 4265897 A JP4265897 A JP 4265897A JP 4265897 A JP4265897 A JP 4265897A JP H10236845 A JPH10236845 A JP H10236845A
Authority
JP
Japan
Prior art keywords
glass composition
glass
sealing
composition
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4265897A
Other languages
Japanese (ja)
Inventor
Toshiki Nishiyuki
敏紀 西雪
Takashi Morita
高史 森田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iwaki Glass Co Ltd
Original Assignee
Iwaki Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iwaki Glass Co Ltd filed Critical Iwaki Glass Co Ltd
Priority to JP4265897A priority Critical patent/JPH10236845A/en
Publication of JPH10236845A publication Critical patent/JPH10236845A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a glass with low sealing temp. which enables tight sealing and shows improved adhesion strength by mixing SiO2 , B2 O3 , Al2 O3 , BaO, MgO+ CaO+ZnO and Li2 O+Na2 O+KO and fusing and vitrifying the mixture. SOLUTION: This leadless glass compsn. having a low melting point for sealing or coating a ceramic material is produced by mixing 5 to 15wt.% SiO2 , 25 to 45wt.% B2 O3 , 1 to 8wt.% Al2 O3 , 25 to 50wt.% BaO, 0 to 20wt.% MgO+ CaO+ZnO, 0 to 10wt.% LiO2 +Na2 O+K2 O in total >=85wt.%, 0 to 1wt.% clarifying agent such as As2 O3 and Sb2 O3 , 0 to 2wt.% coloring agent such as CoO and Fe2 O3 , and if necessary, <=30wt.% ceramic powder such as cordierite, zircon and β-eucryptite, and then fusing by heating to vitrify, slowly cooling and pulverizing. The obtd. compsn. has 50×10<-7> to 80×10<-7> / deg.C average coefft. of thermal expansion at 50 to 700 deg.C after calcined.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明はセラミックス材料例
えばアルミナ(Al23 )を主成分とするセラミック
ス材料を900℃以下の温度で封着またはコーティング
できる低融点無鉛ガラス組成物に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a low melting point lead-free glass composition capable of sealing or coating a ceramic material, for example, a ceramic material containing alumina (Al 2 O 3 ) as a main component at a temperature of 900 ° C. or less.

【0002】[0002]

【従来の技術】近年アルミナを主成分とするセラミック
ス材料は多くの分野で使用されているが、これらのセラ
ミックス材料は各種の金属材料と複合された形で使用さ
れることが多い。このような材料を封着またはコーティ
ングする場合、付属する金属材料を損傷しないよう、な
るべく低い温度で作業できることが望ましく、特に90
0℃以下で作業できると、使用できる金属材料が多く好
適である。
2. Description of the Related Art In recent years, ceramic materials containing alumina as a main component have been used in many fields, but these ceramic materials are often used in a form of composite with various metal materials. When sealing or coating such materials, it is desirable to be able to work at as low a temperature as possible so as not to damage the associated metallic material, in particular 90
If the operation can be performed at 0 ° C. or lower, many usable metal materials are suitable.

【0003】[0003]

【発明が解決しようとする課題】アルミナを主成分とす
るセラミックス材料を900℃以下で封着またはコーテ
ィングする材料として、ハンダガラス(ガラスフリッ
ト)と呼ばれる低融点のガラスが多数市販されている
が、いずれも有害物のPbOを多量に含有し、作業上の
環境管理、廃棄物の処理などにコストがかさむ欠点があ
った。PbOを含まない材料では一般に作業温度が高く
900℃以下の低温では作業できない欠点があった。
As a material for sealing or coating a ceramic material containing alumina as a main component at a temperature of 900 ° C. or less, many low melting point glasses called solder glass (glass frit) are commercially available. All of them have a drawback that they contain a large amount of harmful substance PbO and increase costs for environmental management in work, waste disposal, and the like. A material containing no PbO generally has a disadvantage that the working temperature is high and the working cannot be performed at a low temperature of 900 ° C. or less.

【0004】[0004]

【課題を解決するための手段】本発明は、前述の課題を
解決すべくなされたものであり、本質的にPbOを含有
せず、軟化点が750℃以下のバリウムホウ酸塩ガラス
組成物であって、焼成後の50〜300℃の平均熱膨張
係数が50×10-7〜80×10-7/℃の範囲にあるこ
とを特徴とする、セラミックス材料の封着またはコーテ
ィング用の低融点無鉛ガラス組成物を提供する。
DISCLOSURE OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and is a barium borate glass composition containing essentially no PbO and having a softening point of 750 ° C. or less. And a low melting point lead-free material for sealing or coating a ceramic material, wherein the average coefficient of thermal expansion at 50 to 300 ° C. after firing is in the range of 50 × 10 −7 to 80 × 10 −7 / ° C. A glass composition is provided.

【0005】また、好ましい態様として前記バリウムホ
ウ酸塩ガラス組成物が重量表示で、 SiO2 5〜15%、 B23 25〜45%、 Al23 1〜 8%、 BaO 25〜50%、 MgO+CaO+ZnO 0〜20%、 Li2 O+Na2 O+K2 O 0〜10%、 の成分を含み、前記成分の合量が前記バリウムホウ酸塩
ガラス組成物の85%以上を占める上記低融点無鉛ガラ
ス組成物を提供する。
In a preferred embodiment, the barium borate glass composition is expressed in terms of weight: 5 to 15% of SiO 2 , 25 to 45% of B 2 O 3 , 1 to 8% of Al 2 O 3 , 25 to 50% of BaO , MgO + CaO + 0~20% ZnO , Li 2 O + Na 2 O + K 2 O 0~10%, by weight of component, the low melting point lead-free glass composition total amount accounts for more than 85% of the Bariumuhou glasses composition of the components I will provide a.

【0006】すなわち、本発明の低融点無鉛ガラス組成
物は、本質的にPbOを含有しないバリウムホウ酸塩ガ
ラス組成物であって、750℃以下の軟化点を有し、5
0〜300℃の平均熱膨張係数が50×10-7〜80×
10-7/℃の範囲であることにより、900℃以下の温
度で封着可能で、かつアルミナセラミックスと強固に接
合することにより、気密な封着または付着強度の高い被
膜が得られる、封着用またはコーティング用組成物であ
る。
That is, the low-melting-point lead-free glass composition of the present invention is a barium borate glass composition essentially containing no PbO, and has a softening point of 750 ° C. or less.
The average coefficient of thermal expansion at 0 to 300 ° C. is 50 × 10 −7 to 80 ×
When the temperature is within the range of 10 -7 / ° C, sealing can be performed at a temperature of 900 ° C or less, and a hermetic seal or a film having high adhesive strength can be obtained by firmly bonding with alumina ceramics. Or a coating composition.

【0007】[0007]

【発明の実施の形態】本発明のガラス組成物として好ま
しいガラスの組成を以下に説明する。以下、単に%と記
載した場合は、重量%を意味するものとする。SiO2
が15%超ではガラスの粘性が上昇し900℃以下の焼
成が困難になる。好ましくは13%以下である。5%未
満ではガラスが不安定となり、ガラスを作製する際の溶
解、冷却中に結晶析出が起こり封着またはコーティング
性能が劣化するおそれがある。好ましくは8%以上であ
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred glass compositions for the glass composition of the present invention are described below. Hereinafter, when simply described as%, it means weight%. SiO 2
If it exceeds 15%, the viscosity of the glass increases, and firing at 900 ° C. or lower becomes difficult. Preferably it is 13% or less. If it is less than 5%, the glass becomes unstable, and crystal precipitation occurs during melting and cooling during the production of the glass, and sealing or coating performance may be deteriorated. It is preferably at least 8%.

【0008】B23 が45%超ではガラスを作製する
際の溶解、冷却中に結晶析出が起こり封着またはコーテ
ィング性能が劣化するおそれがある。好ましくは40%
以下である。25%未満ではガラスの粘性があがり、9
00℃以下での焼成が困難になる。好ましくは30%以
上である。
If B 2 O 3 exceeds 45%, crystal precipitation occurs during melting and cooling during glass production, and there is a possibility that sealing or coating performance may be deteriorated. Preferably 40%
It is as follows. If it is less than 25%, the viscosity of the glass increases, and 9
Baking at a temperature of 00 ° C. or less becomes difficult. It is preferably at least 30%.

【0009】Al23 が8%超ではガラス粘性が上昇
して900℃以下での焼成が困難になる。好ましくは6
%以下である。1%未満ではガラスが不安定となり、強
固なセラミックスとの接合性が得られない。好ましくは
3%以上である。
If the content of Al 2 O 3 exceeds 8%, the viscosity of the glass increases, so that firing at 900 ° C. or less becomes difficult. Preferably 6
% Or less. If the content is less than 1%, the glass becomes unstable, and the bonding property with strong ceramics cannot be obtained. It is preferably at least 3%.

【0010】BaOが50%超ではガラスが不安定とな
り、ガラスを作製する際の溶解、冷却中に結晶析出が起
こり封着またはコーティング性能が劣化するおそれがあ
る。好ましくは40%以下である。25%未満ではガラ
スの粘性があがり900℃以下での焼成が困難になる。
好ましくは30%以上である。
If the content of BaO exceeds 50%, the glass becomes unstable, and crystal deposition occurs during melting and cooling during the production of the glass, so that sealing or coating performance may be deteriorated. Preferably it is 40% or less. If it is less than 25%, the viscosity of the glass increases, and firing at 900 ° C. or less becomes difficult.
It is preferably at least 30%.

【0011】MgO、CaOおよびZnOについては、
必須ではないが熱膨張係数の調整のため、いずれか1種
以上を含有させうる。しかし、合量で20%超では50
〜300℃の平均熱膨張係数を50×10-7〜80×1
-7/℃の範囲に入れるのが困難である。好ましくは合
量で15%以下である。
For MgO, CaO and ZnO,
Although not essential, any one or more of them may be contained for adjusting the coefficient of thermal expansion. However, if the total amount exceeds 20%, 50
The average coefficient of thermal expansion at up to 300 ° C. is 50 × 10 −7 to 80 × 1
It is difficult to enter the range of 0 -7 / ° C. Preferably, the total amount is 15% or less.

【0012】Li2 O、Na2 OおよびK2 Oについて
は、必須ではないが溶解性の向上のため、いずれか1種
以上を含有させうる。しかし、合量で10%超では50
〜300℃の平均熱膨張係数を50×10-7〜80×1
-7/℃の範囲に入れるのが困難である。好ましくは合
量で5%以下である。
As for Li 2 O, Na 2 O and K 2 O, any one or more of them may be contained for improving the solubility, though not essential. However, if the total amount exceeds 10%, 50
The average coefficient of thermal expansion at up to 300 ° C. is 50 × 10 −7 to 80 × 1
It is difficult to enter the range of 0 -7 / ° C. Preferably, the total amount is 5% or less.

【0013】本発明の好ましい形態では、前記成分の合
量がガラス組成物の85%以上を占めるようにする。効
果をより確実にするためにはガラス組成物の90%以上
を占めるようにすることが好ましい。
In a preferred embodiment of the present invention, the total amount of the above components accounts for 85% or more of the glass composition. In order to ensure the effect more, it is preferable to account for 90% or more of the glass composition.

【0014】本発明のガラス組成物には本発明の効果を
損しない限り、公知の清澄剤(As23 、Sb23
など)を合量でガラス組成物の1%以下、着色剤(Co
O、Fe23 など)を合量でガラス組成物の2%以下
含有させうる。
The glass composition of the present invention contains known fining agents (As 2 O 3 , Sb 2 O 3) as long as the effects of the present invention are not impaired.
Etc.) in a total amount of 1% or less of the glass composition and a coloring agent (Co
O, Fe 2 O 3, etc.) in a total amount of 2% or less of the glass composition.

【0015】本発明のガラス組成物を封着用、コーティ
ング用に用いる場合、上記の組成を有するガラス粉末
に、必須ではないが、コーディエライト、ジルコン、β
−ユークリプタイト、ホルステライト等のセラミックス
粉末をガラス粉末とセラミックス粉末との合量に対して
30%以下の範囲で混合し、熱膨張係数のコントロール
を行うこともできる。
When the glass composition of the present invention is used for sealing or coating, cordierite, zircon, β
-It is also possible to control the thermal expansion coefficient by mixing a ceramic powder such as eucryptite or forsterite in a range of 30% or less based on the total amount of the glass powder and the ceramic powder.

【0016】本発明のガラス組成物は焼成後の50〜3
00℃の平均熱膨張係数が50×10-7〜80×10-7
/℃の範囲にある。この範囲外では、アルミナセラミッ
クスと焼成後のガラスとの熱膨張係数の差が大きいた
め、充分な接合強度が得られない。より好ましくは、5
0〜300℃の平均熱膨張係数が60×10-7〜75×
10-7/℃である。また、本発明のガラス組成物は軟化
点が750℃以下である。このため、900℃以下での
封着が可能になる。
The glass composition of the present invention has a viscosity of 50 to 3 after firing.
The average thermal expansion coefficient at 00 ° C. is 50 × 10 −7 to 80 × 10 −7.
/ ° C. Outside of this range, sufficient bonding strength cannot be obtained because the difference in thermal expansion coefficient between the alumina ceramic and the fired glass is large. More preferably, 5
The average coefficient of thermal expansion at 0 to 300 ° C. is 60 × 10 −7 to 75 ×
10 −7 / ° C. Further, the glass composition of the present invention has a softening point of 750 ° C. or less. Therefore, sealing at 900 ° C. or less is possible.

【0017】本発明の組成物は、通常この組成物の粉末
を水または有機溶剤と混合しペースト状としアルミナ主
成分のセラミックスの被接合物または被コーティング物
に塗布し、焼成することにより接合体またはコーティン
グ物を得るが、他に粉体を加圧成形したもの、さらに加
圧成形したものをガラスの軟化点付近で焼成した焼結
体、または粉体を溶剤と混合しスラリー状とした後シー
ト状に成形したものを利用し、接合体を得ることもでき
る。
The composition of the present invention is usually prepared by mixing a powder of this composition with water or an organic solvent to form a paste, applying the mixture to a ceramic-based material to be bonded or a material to be coated, and baking it. Alternatively, a coated material is obtained, but a powder compact is formed by pressing, a sintered compact obtained by further calcining the pressed compact near the softening point of glass, or a powder mixed with a solvent to form a slurry. A joined body can also be obtained by using a sheet-shaped product.

【0018】さらに本発明の組成物は、粉砕を行わず融
解溶液を所定の形状に鋳込み成形したもの、およびその
後さらに所定の寸法に加工したものを封着用組成物とし
接合体を得ることもできる。
Further, the composition of the present invention can be obtained by casting a molten solution into a predetermined shape without pulverization, and then further processing the solution to a predetermined size to obtain a bonded composition as a sealing composition. .

【0019】[0019]

【実施例】表1に本発明の実施例(例1〜5)および比
較例(例6〜7)を示す。表1に示した組成(wt%)
に従い、最終組成物として1kgとなるよう各原料を秤
取しミキサーで混合した。混合後、白金ルツボを用い電
気炉中で1300℃で1時間保持して溶解した。その後
炉内より取り出し鉄板上に成形したブロックを550℃
の温度の電気炉に移し、徐冷した。
EXAMPLES Table 1 shows Examples (Examples 1 to 5) and Comparative Examples (Examples 6 to 7) of the present invention. Composition shown in Table 1 (wt%)
According to the above, each raw material was weighed so as to become 1 kg as a final composition, and mixed with a mixer. After mixing, the mixture was melted in a platinum crucible at 1300 ° C. for 1 hour in an electric furnace. After that, the block was taken out of the furnace and molded on an iron plate.
Was transferred to an electric furnace having a temperature of, and gradually cooled.

【0020】例1〜3および例6〜7については、得ら
れたブロックをアルミナ製乳鉢で粗砕の後ボールミルで
微粉砕し、150メッシュのふるいを通し粉末を得た。
例4〜5については、得られたブロックを下記テストに
見合う形状に切断・研削し、所定のテストピースとした
(コーティング性のテストはすべて粉末により実施し
た)。
For Examples 1 to 3 and 6 to 7, the obtained blocks were crushed in an alumina mortar and then finely pulverized in a ball mill, and passed through a 150-mesh sieve to obtain powder.
In Examples 4 and 5, the obtained block was cut and ground into a shape suitable for the following test to obtain a predetermined test piece (all of the coating properties were tested with powder).

【0021】まず、得られたガラスの示差熱分析(DT
A)を行い軟化点を求め、表1に記載した。熱膨張係数
については、各サンプルを軟化点より150℃高い温度
で20分保持して焼成した後、室温まで冷却後TMA分
析装置(示差熱膨張計)により50〜300℃の平均熱
膨張係数を測定した。
First, a differential thermal analysis (DT) of the obtained glass was performed.
A) was performed to determine the softening point, and the results are shown in Table 1. Regarding the coefficient of thermal expansion, each sample was held at a temperature 150 ° C. higher than the softening point for 20 minutes, fired, cooled to room temperature, and then subjected to an average thermal expansion coefficient of 50 to 300 ° C. by a TMA analyzer (differential thermal dilatometer). It was measured.

【0022】接合強度については、α−アルミナ質で5
mm×10mm×2mm厚の板2枚を表1の組成物を介
在させてはり合せ、軟化点より150℃高い温度で20
分保持して焼成して接合した。その後強度試験機(オー
トグラフ)によりせん断強度を測定した。せん断強度は
300kg/cm2 以上が望ましい。
Regarding the bonding strength, α-alumina
Two plates having a thickness of 10 mm × 10 mm × 2 mm were bonded together with the composition shown in Table 1 at a temperature 150 ° C. higher than the softening point.
After holding for a minute, it was baked and joined. Thereafter, the shear strength was measured by a strength tester (autograph). The shear strength is desirably 300 kg / cm 2 or more.

【0023】気密性については、α−アルミナのチュー
ブ(外径30mm、内径26mm、長さ40mm)とβ
−アルミナの板(縦50mm、横50mm、厚さ2m
m)を表1の組成物によりチューブの片端を板で塞ぐよ
うにはり合せ、軟化点より150℃高い温度で20分保
持して焼成して接合した。チューブの開放端をHeリー
クテスターに接続し、α−アルミナとβ−アルミナの接
合部にHeガスを吹き付けることにより、Heリークテ
ストを行った。ヘリウムリーク量が10-6atm・cc
/sec以上のものは不良、未満のものを良とした。
With respect to the airtightness, α-alumina tube (outer diameter 30 mm, inner diameter 26 mm, length 40 mm) and β
-Alumina plate (50 mm long, 50 mm wide, 2 m thick)
m) was glued together with the composition shown in Table 1 so that one end of the tube was covered with a plate, held at a temperature 150 ° C. higher than the softening point for 20 minutes, and fired and joined. The He leak test was performed by connecting the open end of the tube to a He leak tester and blowing He gas on the joint between α-alumina and β-alumina. Helium leak rate is 10 -6 atm · cc
/ Sec or more was evaluated as poor, and less than / sec was evaluated as good.

【0024】コーティング性については、アルミナ主成
分の磁器(熱膨張係数70×10-7/℃)に、表1の組
成物を水中に分散させスリップ状にしたものを焼成後の
ガラス厚みが30〜100μmとなるように塗布し、乾
燥後、900℃、20分で焼成した。焼成後ガラス表面
に光沢がありクラックのないものを良とした。
Regarding the coating property, the composition shown in Table 1 was dispersed in water in a porcelain containing alumina as a main component (coefficient of thermal expansion: 70 × 10 −7 / ° C.) to form a slip. It was applied to a thickness of about 100 μm, dried, and baked at 900 ° C. for 20 minutes. After firing, those having a glossy glass surface and no cracks were evaluated as good.

【0025】[0025]

【表1】 [Table 1]

【0026】表1よりわかるように、本発明の組成物は
いずれも900℃以下での封着作業またはコーティング
作業が可能で、50〜300℃の平均熱膨張係数が50
×10-7〜80×10-7/℃の範囲にあり、Al23
主成分のセラミックスと強固な接合体または被膜付着強
度の高いコーティング物が得られる。
As can be seen from Table 1, all of the compositions of the present invention can be sealed or coated at 900 ° C. or lower, and have an average thermal expansion coefficient of 50 to 300 ° C. of 50.
× is in the range of 10 -7 ~80 × 10 -7 / ℃ , Al 2 O 3
A strong bonded body with a ceramic as a main component or a coating material having high film adhesion strength can be obtained.

【0027】[0027]

【発明の効果】以上のように、本発明の組成物は、90
0℃以下の温度で封着作業またはコーティング作業がで
き、アルミナ主成分のセラミックスについて、気密な封
着ができまたは付着強度の高い被膜が得られる。封着温
度が低いため、被接合物のアルミナ主成分のセラミック
スに多くの金属材料が適用できる。たとえば電極材料を
見ると、900℃以下の封着であればNi、Cu等比較
的安価な材料が使用できるが、900℃以上ではMo、
Wなどの高価な材料が必要となる。
As described above, the composition of the present invention comprises 90
A sealing operation or a coating operation can be performed at a temperature of 0 ° C. or less, and a ceramic having alumina as a main component can be hermetically sealed or a film having a high adhesive strength can be obtained. Since the sealing temperature is low, many metal materials can be applied to the ceramic mainly composed of alumina of the article to be joined. For example, when looking at electrode materials, relatively inexpensive materials such as Ni and Cu can be used for sealing at 900 ° C. or lower, but Mo,
An expensive material such as W is required.

【0028】50〜300℃の平均熱膨張係数が50×
10-7〜80×10-7/℃の範囲にあるので、強い接合
強度が得られ、したがって、気密な封着ができまたは付
着強度の高い被膜が得られる。PbOを不含有とするこ
とにより、有害性がなく、安全な作業が実施できかつ廃
棄物の処理も容易である。
The average thermal expansion coefficient at 50 to 300 ° C. is 50 ×
Since it is in the range of 10 -7 to 80 × 10 -7 / ° C., a strong bonding strength can be obtained, and thus a hermetic seal can be obtained or a coating film having a high adhesion strength can be obtained. By not containing PbO, there is no harm, safe operation can be performed, and waste disposal is easy.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】本質的にPbOを含有せず、軟化点が75
0℃以下のバリウムホウ酸塩ガラス組成物であって、焼
成後の50〜300℃の平均熱膨張係数が50×10-7
〜80×10-7/℃の範囲にあることを特徴とする、セ
ラミックス材料の封着またはコーティング用の低融点無
鉛ガラス組成物。
(1) It contains essentially no PbO and has a softening point of 75
A barium borate glass composition having a temperature of 0 ° C. or less, which has an average coefficient of thermal expansion at 50 to 300 ° C. after firing of 50 × 10 −7.
A low melting point lead-free glass composition for sealing or coating a ceramic material, wherein the composition is in a range of from about 80 × 10 −7 / ° C.
【請求項2】前記バリウムホウ酸塩ガラス組成物が重量
表示で、 SiO2 5〜15%、 B23 25〜45%、 Al23 1〜 8%、 BaO 25〜50%、 MgO+CaO+ZnO 0〜20%、 Li2 O+Na2 O+K2 O 0〜10%、 の成分を含み、前記成分の合量が前記バリウムホウ酸塩
ガラス組成物の85%以上を占める請求項1記載の低融
点無鉛ガラス組成物。
2. The barium borate glass composition is expressed by weight: 5 to 15% of SiO 2 , 25 to 45% of B 2 O 3 , 1 to 8% of Al 2 O 3 , 25 to 50% of BaO, MgO + CaO + ZnO 0 2. The low melting point lead-free glass composition according to claim 1, wherein the composition contains Li 2 O + Na 2 O + K 2 O 0-10%, and the total amount of the components accounts for 85% or more of the barium borate glass composition. Stuff.
JP4265897A 1997-02-26 1997-02-26 Low melting point leadless glass composition Pending JPH10236845A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4265897A JPH10236845A (en) 1997-02-26 1997-02-26 Low melting point leadless glass composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4265897A JPH10236845A (en) 1997-02-26 1997-02-26 Low melting point leadless glass composition

Publications (1)

Publication Number Publication Date
JPH10236845A true JPH10236845A (en) 1998-09-08

Family

ID=12642120

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4265897A Pending JPH10236845A (en) 1997-02-26 1997-02-26 Low melting point leadless glass composition

Country Status (1)

Country Link
JP (1) JPH10236845A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001058849A (en) * 1999-06-09 2001-03-06 Asahi Glass Co Ltd Barium borosilicate glass and glass ceramic composition
US6566792B2 (en) 2000-06-30 2003-05-20 Ngk Spark Plug Co., Ltd. Spark plug
US6590318B2 (en) 2000-02-29 2003-07-08 Ngk Spark Plug Co., Ltd. Spark plug having a reduced lead glaze layer on the insulator thereof
US6744188B2 (en) 2000-09-29 2004-06-01 Ngk Spark Plug Co., Ltd Spark plug
JP2004172142A (en) * 2004-02-24 2004-06-17 Ngk Spark Plug Co Ltd Manufacturing method of spark plug
US6752677B2 (en) * 2001-05-02 2004-06-22 Ngk Spark Plug Co., Ltd. Method for producing spark plug
US6765340B2 (en) 2001-06-26 2004-07-20 Ngk Spark Plug Co., Ltd. Spark plug
US6771009B2 (en) 2000-09-29 2004-08-03 Ngk Spark Plug Co., Ltd. Spark plug
US6822378B2 (en) 2001-06-26 2004-11-23 Ngk Spark Plug., Ltd. Glaze layer for a spark plug
US6831396B2 (en) 2000-06-28 2004-12-14 Ngk Spark Plug Co., Ltd. Spark plug with glaze and marking
US6831395B2 (en) 2000-05-31 2004-12-14 Ngk Spark Plug Co., Ltd. Spark plug
US7081274B2 (en) 2001-06-26 2006-07-25 Ngk Spark Plug Co., Ltd. Method for producing spark plug
JP2018154532A (en) * 2017-03-17 2018-10-04 東洋アルミニウム株式会社 Paste composition for solar cells
CN115043590A (en) * 2022-06-17 2022-09-13 贵州航天电器股份有限公司 Application of glass powder in packaging electronic components or motors

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001058849A (en) * 1999-06-09 2001-03-06 Asahi Glass Co Ltd Barium borosilicate glass and glass ceramic composition
US6590318B2 (en) 2000-02-29 2003-07-08 Ngk Spark Plug Co., Ltd. Spark plug having a reduced lead glaze layer on the insulator thereof
US6831395B2 (en) 2000-05-31 2004-12-14 Ngk Spark Plug Co., Ltd. Spark plug
US6831396B2 (en) 2000-06-28 2004-12-14 Ngk Spark Plug Co., Ltd. Spark plug with glaze and marking
US6566792B2 (en) 2000-06-30 2003-05-20 Ngk Spark Plug Co., Ltd. Spark plug
US6744188B2 (en) 2000-09-29 2004-06-01 Ngk Spark Plug Co., Ltd Spark plug
US6771009B2 (en) 2000-09-29 2004-08-03 Ngk Spark Plug Co., Ltd. Spark plug
US6752677B2 (en) * 2001-05-02 2004-06-22 Ngk Spark Plug Co., Ltd. Method for producing spark plug
US6765340B2 (en) 2001-06-26 2004-07-20 Ngk Spark Plug Co., Ltd. Spark plug
US6822378B2 (en) 2001-06-26 2004-11-23 Ngk Spark Plug., Ltd. Glaze layer for a spark plug
US7081274B2 (en) 2001-06-26 2006-07-25 Ngk Spark Plug Co., Ltd. Method for producing spark plug
JP2004172142A (en) * 2004-02-24 2004-06-17 Ngk Spark Plug Co Ltd Manufacturing method of spark plug
JP2018154532A (en) * 2017-03-17 2018-10-04 東洋アルミニウム株式会社 Paste composition for solar cells
CN115043590A (en) * 2022-06-17 2022-09-13 贵州航天电器股份有限公司 Application of glass powder in packaging electronic components or motors
CN115043590B (en) * 2022-06-17 2023-12-05 贵州航天电器股份有限公司 Application of glass powder in packaging electronic components or motors

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