JPH10223601A - Substrate holder mechanism and substrate spin drier - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate the need for replacing a comb-tooth guide for supporting the orientation flat of a semiconductor wafer in a substrate holder mechanism of a substrate spin drier. SOLUTION: An orientation flat holder mechanism for a wafer W comprises a pair of flat guides 10a, 10b combined with an orientation flat comb-tooth guide 20 disposed between them so that the bottom B of the valley V of the guide 20 may not touch the edge EF of the orientation flat. The flat guides 10a, 10b are dedicated to transmit the rotary acceleration/deceleration to the orientation flat F and to receive the impact force from the flat F, while the guide 20 functions only for blocking the wafer W from turning down. Because the edge EF of the flat F never touches the bottom B of the valley V of the guide 20, the guide is never scratched to eliminate the need for replacing the guide 10 at a high cost and much labor.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mechanism for arranging and holding semiconductor substrates having an orientation flat (orientation flat), and more particularly to a technology improvement suitable for holding a substrate in a batch type substrate rotary drying apparatus.

[0002]

2. Description of the Related Art In a semiconductor substrate processing process, a substrate rotary drying device (spin dryer) for rotating a substrate around its center and drying the substrate is widely used as one of typical drying processes after cleaning the substrate. It is used.

Although there is a single wafer type of such a spin dryer, in order to improve the throughput,
The boards in the upright posture are horizontally stacked and arranged in lot units,
It is effective to use a batch method in which they are collectively rotated and dried.

FIG. 11 schematically shows a conventional example of a substrate holding mechanism 100 used in such a batch-type spin dryer. The holding mechanism 100 has six rod-shaped guides 110 to 140 as its basic elements. Out of these six guides, the lower two guides 110 and 120 are for holding the side of the wafer W on the orientation flat F, and the other four guides 130 and 140 are circular arc portions of the wafer W. C is to be held.

Two guides 11 supporting the orientation flat F side
One of the guides 110, 0 and 120, corresponds to FIG.
Upper surface 11 forming a flat ridge line as shown in FIG.
The edge EF of the orientation flat F of each wafer W is held in contact with the upper surface 111. Hereinafter, such a guide is referred to as a “flat guide” (since the ridge portion is substantially flat).

[0006] The other guide 120 has a comb-like structure 121 in which a plurality of valleys V are alternately and periodically arranged with peaks P, as shown in FIG. Each valley V
Can accommodate the portion of the orientation flat F of the wafer W.

Hereinafter, a comb-shaped guide such as the guide 120 is referred to as a "comb guide", and the comb guide provided for the orientation flat is particularly referred to as a "comb guide for orientation flat". In the conventional comb tooth guide 120 for orientation flat, the edge EF of the orientation flat F is in contact with the bottom B of the valley V.

[0008] Further, 4 holding the arc portion C of the wafer W
The book guides 130 and 140 (FIG. 11) are also shown in FIG.
Has a comb-like structure similar to that of the comb guide 120 for orientation flat. However, these guides 130 and 140 are arranged so that the bottoms of the valleys thereof are slightly lifted so as not to come into contact with the edge of the arc portion C of the wafer W.

Hereinafter, the comb-shaped guides which hold the arc portion C of the wafer W like these guides 130 and 140 will be referred to as "comb guides for arc portions". A pair of upper half guides 13 of the comb guides 130 and 140 for the arc portion are used.
0 can be opened and closed as indicated by an arrow A (FIG. 11) when loading / unloading the wafer W into / from the holding mechanism 100.

The group of wafers W thus held by the holding mechanism 100 of FIG. 11 is rotated at high speed in a predetermined rotation direction θ together with the holding mechanism 100 around a horizontal axis R passing through the center point of each wafer W. Thereby, the wafer W is dehydrated and dried.

Here, each of the above guides 110-1
Of the guides 40, the guides 110 and 120 for contacting and supporting the orientation flat F function to prevent the wafer W from falling and to transmit acceleration / deceleration force from the holding mechanism 100 to the wafer W during rotation acceleration / deceleration. Having. On the other hand, the comb structure of the comb guides 120, 130, and 140 not only restricts the wafer W from jumping out during rotation, but also prevents the wafer W from protruding outside as shown in FIG.
1 each wafer W in the X direction or the opposite direction
, That is, the function of regulating the inclination of the wafer W.

[0012]

In such a conventional holding structure 100, as described above, the flat guide 1 is used.
Although each of the guide 10 and the comb tooth guide 120 is in contact with the orientation flat F, there is a circumstance that the contact portion of the guides 110 and 120 with the orientation flat F is easily damaged. There are two main causes.

First, the acceleration / deceleration force of the rotation of the wafer W is applied to the wafer W through contact between the orientation flat guides 110 and 120 and the wafer W. As a result, the contact portion between the orientation flat guides 110 and 120 and the orientation flat edge EF frequently undergoes a pressing force, and if this is repeated frequently, the contact portion may be damaged.

The second is related to the comb guide 130 for the arc portion which can be opened and closed.
The second cause is larger and more serious as the impact force applied to the 10, 120. The contents of the second cause refer to FIG. 14 shown as a schematic diagram. However,
In FIG. 14, each part is exaggerated.

Before and after the rotation of the substrate, the wafer W is held at the position shown by the solid line in FIG. 14, but when the wafer W is rotated at high speed together with the holding mechanism 100, the rotation center of the wafer W is Since R does not completely match the mechanical center of gravity, the wafer W
Centrifugal force acts in the direction away from

Even when such a centrifugal force acts, the position of the wafer W is regulated by the guides 110 to 140, so that the center of gravity of the wafer W does not significantly deviate from the rotation center R. However, the rigidity of the comb guide 130 for the arc portion is higher than that of the other guides 110, 120, and 140 because the degree of freedom in opening and closing in the direction A must be given to carry in and carry out the wafer W. Is low. Therefore, the comb guide 130 for the arc portion escapes due to the centrifugal force, so that the wafer W rotates around the guide 110 or 120 for the orientation flat (120 in the example of FIG. 14) as a fulcrum, as shown by a virtual line in FIG. Eccentric in the direction toward the comb guide 130 for the arc portion. When the rotation of the arc-shaped comb tooth guide 130 returns with the stop of rotation, the orientation flat F returns in a state inclined in the reverse direction as shown by the broken line in FIG. Therefore, in such a process, a considerable force is applied from the orientation flat F to the orientation flat guides 110 and 120.

The upper portions of the guides 110 to 140 are relatively soft because they are made of resin or the like so as not to damage the wafer W.
When such a pressing force repeatedly acts, the guide 110,
13 (a),
A flaw S is formed as shown in FIG. This flaw S
If the groove S becomes deeper, it may cause generation and accumulation of particles.
120 will need to be replaced.

Of these, the linear guide 110 has a simple structure and can be replaced with a new one at a small cost. Further, since the upper surface 111 is flat, there is almost no need for the positioning accuracy in the X direction in FIG. 11 when a new linear guide is mounted.

On the other hand, the comb guide 120 for orientation flat
Has a complicated structure and a high manufacturing cost (and hence replacement cost). Also, the comb guide 130 for the arc portion,
It is also necessary to perform high-precision alignment of the valleys 140 with the respective valleys in the X direction.

For this reason, the comb guide 120 for orientation flat is a member whose replacement is to be avoided as much as possible. However, frequent replacement is necessary due to the above-mentioned circumstances, and high replacement cost and highly accurate positioning work are inevitable. There is a problem.

In particular, since the diameter of the semiconductor substrate has been increasing in recent years, the force generated between the wafer and the guide tends to increase, and it is particularly important to solve the above problem.

[0022]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a substrate holding mechanism capable of avoiding replacement of a comb guide for an orientation flat due to formation of a flaw. Aim.

A second object of the present invention is to provide a substrate rotating and drying apparatus incorporating such an improved substrate holding mechanism.

[0024]

In order to achieve the above object, in the substrate holding mechanism of the present invention, the functions of contact support and surface fall prevention in the orientation flat are separated, and the former is replaced by a plurality of flat guides, and the latter is replaced by the flat guide. It is configured to be in charge of each by a comb tooth guide for orientation flat.

That is, according to the present invention, there is provided a substrate holding mechanism used for holding and rotating an arrangement of a plurality of semiconductor substrates having an orientation flat, wherein (a) a valley into which the orientation flat portion of each semiconductor substrate can be inserted. Orifice comb tooth guides whose portions are periodically arranged and formed, (b) a plurality of flat guides having substantially flat ridges, and the ridges abutting the edges of the oriental flat portions of each semiconductor substrate, c) A substantially parallel array of arc-shaped comb tooth guides in which valleys into which the arc-shaped edge portions of each semiconductor substrate can be inserted are periodically arranged.

The bottom of each valley portion of the comb guide for the orientation flat is not in contact with the edge of the orientation flat portion.

Preferably, the plurality of flat guides are arranged separately on both sides of the comb guide for orientation flat.

Further, the orifice comb tooth guide is arranged near the center of the orifice flat, and two flat guides symmetrically arranged on both sides of the orifice comb tooth guide as the plurality of flat guides. It is preferably used.

The present invention also provides a substrate rotating / drying apparatus for arranging and holding a plurality of semiconductor substrates by these substrate holding mechanisms, and rotating and drying the plurality of semiconductor substrates together with the substrate holding mechanism to dehydrate and dry the semiconductor substrates. I will provide a.

[0030]

BEST MODE FOR CARRYING OUT THE INVENTION

[0031]

FIG. 1 is an external perspective view of a main part of a spin dryer SD as a substrate rotary dryer incorporating a substrate holding mechanism of the present invention. The spin dryer SD is inlined in the Y direction with a substrate cleaning device (not shown) or the like, and a wafer transfer robot RB traveling in the Y direction is provided on the front side (X side).

The spin dryer SD comprises a rotary drying main body 1
And the control unit 4. In the main unit 1,
An outer drum-shaped substrate holding mechanism 5 is housed in the tank 2,
One lot (for example, 50) semiconductor substrates (in this example, silicon wafers) W are stacked and arranged at predetermined intervals in a standing posture and held and held. After the transfer robot RB loads the wafer W into the substrate holding mechanism 5, the upper opening of the tank 2 is automatically closed by a lid (not shown).

The substrate holding mechanism 5 rotates at high speed around the rotation center R by the motor M in a state where the wafer W is housed and held. The wafer W to which the pure water has adhered is centrifugally dehydrated and dried by the high-speed rotation in the cleaning apparatus corresponding to the previous step of the spin dryer SD. The dried wafer W is unloaded from the tank 2 by the transfer robot RB and transferred to the next step or an unloader.

[0034]

FIG. 2 is a schematic view showing the main part of the inside of a substrate holding mechanism (clamp mechanism) 5 according to an embodiment of the present invention, which is drawn in comparison with FIG. 11 for a conventional example. . In FIG. 2, the alignment state of each wafer W is the same as the conventional one, and the arrangement of these wafers W in the substrate holding mechanism 5 is changed by seven parallel guides 10a,
Hold at 10b, 20, 30, 40. Of these, the four arc-shaped comb guides 30 and 40 for holding the arc portion C of the wafer W are body-side guides 130 and 140 of the conventional example.
It is provided in the same shape and installation position as (FIG. 11).

On the other hand, the orientation flat holding portion 6 for holding the edge of the orientation flat F has the following configuration according to the features of the present invention.

First, the orientation flat holding unit 6 includes three guides 10a, 10b, and 20 arranged substantially in parallel. Of these, the center guide 20 is a comb guide for orientation flat, and Are arranged at substantially the center positions of. Also, two guides 10a and 10 which are divided and arranged symmetrically on both sides of the comb tooth guide 20 for orientation flat.
b is a flat guide.

Although the detailed shape of each of these guides will be described later, the flat guides 10a and 10b are configured so that the flat ridges on the upper surfaces thereof come into contact with the orientation flat F.
On the other hand, the arc-shaped portion comb tooth guide 20 has a comb tooth structure for preventing the wafer W from falling down, and the bottom B of the valley (see FIG. No contact is made with the edge EF. In addition, the arc-shaped portion comb tooth guides 30 and 40 also have a comb-shaped structure for preventing the wafer W from falling down, but the bottoms of their troughs do not contact the arc-shaped portion C of the wafer W.

FIG. 3 is a schematic diagram showing a state where the wafer W is held by the substrate holding section 6. Guide 1
Reference numerals 0a, 10b, and 20 to 40 denote hollow rotors 7 having a substantially drum shape.
The comb guides 30 for the arc portions are openable and closable in the direction A in FIG. That is, when one lot of wafers W is loaded in the loading direction IN as shown in FIG. 3 by the hand HD of the transfer robot RB in FIG. From the wafer W. When the hand HD retreats upward, the pair of arc-shaped comb guides 30 is relatively closed to chuck or clamp the wafer W, and is locked in that state. When the wafer W is carried out after the rotational drying, the operation is reversed.

In the holding state in which the pair of arc-shaped comb guides 30 is closed, the wafer W
Are supported from below by a pair of flat guides 10a and 10b, and the surface inclination of the wafer W is regulated by five comb tooth guides 20, 30, and 40. Also, the wafer W
The misalignment in the outward direction is caused by the comb guide 30 for the arc portion,
40.

As described above, the substrate holding structure 5 of this embodiment
In this embodiment, the edge of the orientation flat F is supported in contact with the orientation flat holding section 6 only by the plurality of flat guides 10a and 10b, and the comb tooth guide 20 for orientation flat is exclusively used for restricting the wafer W from falling down. By adopting such a holding structure, when the wafer W rotates at a high speed around the rotation center R, a pressing force as a reaction of the acceleration deceleration is generated from the wafer W to the orientation flat holding unit 6. Even if the wafer W collides strongly with the orientation flat holding portion 6 when the rotation is stopped due to the cause described above, only the upper surfaces of the flat guides 10a and 10b receive such force, and the valleys of the comb guide 20 for the orientation flat. Do not touch the bottom of the part. For this reason, the comb guide 20 for orientation flats is prevented from being damaged, and replacement due to generation of a flaw is unnecessary.

Further, in the structure of this embodiment, the flat guides 10a and 10b are arranged symmetrically left and right with respect to the center of the orientation flat F, and the flat guides 10a and 10b guard both sides of the comb guide 20 for the orientation flat. Therefore, it is possible to more reliably prevent a part of the orientation flat F from contacting the bottom of the valley of the comb flat guide 20. Further, stability in holding the wafer W is high. The reason why a plurality of flat guides are required is that two-dimensional position control of the orientation flat F cannot be performed with only one flat guide.

A more detailed specific example of the structure of the substrate holding mechanism 5 based on such a principle will be described below.

[0043]

[Details and Advantages of Substrate Holding Mechanism 5] FIG. 4 is a front view showing the substrate holding mechanism 5 through the hollow rotor 7, and FIG. 5 is a plan view thereof. In each of the drawings, only a main part of the holding mechanism is shown, and ancillary parts are omitted.

First, in FIG. 5, both end portions 7a and 7b of the hollow rotor 7 are cut-out disk-shaped plates.
The curved rotor side members 7c and 7d are stretched between them. The rotation axis RO in FIG. 5 is aligned with the rotation center R (FIG. 4) of the wafer W, and each guide and the wafer W accommodated and held together with the hollow rotor 7 by the rotation force from the motor M in FIG. And are rotated at high speed integrally.
This rotation speed is, for example, about 1500 rpm.

Referring to both FIG. 4 and FIG. 5, each of a pair of open / close comb tooth guides 30 for an arc portion is attached to a guide support 33, and the guide support 33 is turned. It is rotatable around a driving shaft 34. As a result, the pair of arcuate comb tooth guides 30 is formed.
Constitutes a structure (a retainer) that embraces the wafer W and holds it open and closed in the hollow rotor 7. The rotation by these structures corresponds to opening and closing of arrow A. Further, a pin 35 is formed so as to protrude to regulate the end point of the opening and closing, and an arc hole 36 corresponding to the pin 35 is formed in the plate 8 of FIG. 4 (the arc hole 36 is not shown in FIG. 5). ). This opening / closing operation is automatically performed by a mechanical operating force from the outside of the hollow rotor 7 while the rotation is stopped. Further, after the door is closed, a lock is applied so as to maintain the closed state until the door is released from the outside.

Each of the pair of arc-shaped comb tooth guides 40 is supported by a guide support 43, and both ends of the guide support 43 are fixed in the hollow rotor 7.

In the orientation flat holding section 6, flat guides 10a and 10b are symmetrically arranged on both sides of the comb guide 20 for orientation flat. For this portion, refer to an enlarged view of FIG. In FIG. 6, in the orientation flat holding unit 6, the upper part of the guide connecting body 60 is a comb tooth guide supporting body 61. Further, flat guide supports 63 a and 63 b are screwed with bolts 67 on both sides of the guide coupling body 60.

The comb guide 20 for orientation flat is screwed to the comb guide support 61 and the flat guide 10
a and 10b are flat guide supports 63a and 63b, respectively.
It is supported by being screwed to 3b. This comb tooth guide 20 for orientation flat is made of resin,
As shown in the side view of FIG. 7A, the peaks P and the valleys V are alternately and periodically arranged, and the four ends of the peaks P are chamfered and tapered. The edge of the wafer W is accommodated in the valley V.

FIG. 7B is an enlarged view of the vicinity Q of the valley V, and FIG. 8A is a sectional view taken along the line of the wafer W in FIG. Is shown in FIG.
As can be seen from (a), both shoulders of the valley V are chamfered and tapered, but the bottom B located at the center of the valley V is substantially planarized. When the orientation flat F of the wafer W is accommodated in the valley V, the edge EF of the orientation flat F is not in contact with the bottom B. In order to realize such a non-contact state, as can be seen from FIG. 6, the comb teeth for the orientation flat are located farther (in a direction away from the rotation center) than the lines connecting the ridges (tops) 11 of the flat guides 10a and 10b. Each of the guides 10a, 10b, 20 is connected to the guide connector 60 so that the bottom B of the valley V of the guide 20 is positioned.
It should just be attached to.

Preferably, gap G between edge EF and bottom B (FIG. 7B) is, for example, 0.5 mm. The existence of the gap G not only prevents the edge EF of the wafer W in the orientation flat F from being damaged by colliding with the bottom B, but also has an effect of increasing drainage near the edge EF. Further, since the bottoms B of the peaks P and the valleys V are chamfered, water hardly accumulates in these portions, and drainage is further enhanced.

In the example of FIG. 8A, the guide support 6
Although the comb tooth guide for orientation flat 20 is screwed from one side of the guide support 1, it may be configured to straddle the guide support 61 as shown in FIG. 8B.

The structure shown in FIG. 7 is also applied to the tips of the comb guides 30 and 40 for the arc portions. However, in these cases, the valley V accommodates the circular arc portion C of the wafer W, and the edge of the arc portion C does not contact the bottom B.

FIG. 9 is an enlarged view of the flat guide 10a (10b is also symmetrical thereto), and FIG. 10A is a sectional view thereof. This flat guide 10a is also made of resin,
The upper surface 11 forms a substantially flat band-shaped ridgeline, and the edge EF of the orientation flat portion F of the wafer W is held in contact with the ridgeline. Both shoulders of the upper surface 11 are chamfered and tapered, thereby increasing drainage performance.

The flat guides 10a and 10b have screws 17
The screw 17 is screwed to the guide support 67, and if a flaw S is formed as shown in FIG. 13A due to long-term use, the screw 17 can be loosened and replaced. The cross-sectional structure of the flat guide 10a may be as shown in FIG.

FIG. 6 is referred to again for the relative positional relationship of the orientation flat guide having such a configuration. The edges EF of the orientation flat F are flat guides 10a and 10b.
And is separated from the bottom B of the valley of the comb guide 20 for the orientation flat. For this reason, even if a reaction from the wafer W due to the rotation acceleration / deceleration is applied, or the orientation flat F collides downward in FIG. 6 when the rotation is stopped, the flat guides 10a and 10b are not moved from the edge EF.
Only by applying a force to the comb tooth guide 20 for the orientation flat.
Does not touch the bottom B of As a result, scratches are generated in the orientation flat holding portion 6 because of the flat guides 10a and 10b.
Only.

In such an improvement, the number of flat guides required in the substrate holding mechanism is increased as compared with the conventional case, but the flat guides are inexpensive compared with frequent replacement of the comb guide for the orientation flat. Even if the number of replacements increases, the cost burden is relatively small. In addition, the flat guides 10a and 10b need only be arranged substantially in parallel, and the accuracy of determining the arrangement direction of the wafers W in the arrangement direction (the X direction in FIG. 2) is not so much a problem.

Therefore, the problems of the prior art can be solved by the configuration of the above embodiment.

If the wafer W is eccentric in the direction toward the orientation flat holding mechanism 6 (FIG. 4) during rotation, there is a problem of whether or not damage is caused on the side of the comb guides 30 and 40 for arc portions when rotation is stopped. . In this regard, it is noted that the orientation flat holding mechanism 6 does not need to have mobility for opening and closing. For this reason, the orientation flat holding mechanism 6 can be firmly fixed by using a member having high rigidity. Therefore, even if the rotating centrifugal force acts on the wafer W and attempts to be eccentric toward the orientation flat holding mechanism 6, the orientation flat holding mechanism 6 does not substantially bend.

As a result, the wafer W does not strongly collide with the comb guides 30 and 40 for the arc portion due to the returning force of the deflection of the orientation flat holding mechanism 6 when the rotation is stopped. For this reason, measures to prevent collision with the comb guide are provided by the comb guide 2 for the orientation flat.
It suffices to perform only 0, and it is not necessary to take measures for the comb guides 30 and 40 for the arc portions.

[0060]

[Modifications] While the embodiment of the present invention has been described above, the following modifications are possible in the present invention.

A plurality of flat guides are required in the orientation flat holder, but the number of flat guides may be three or more. However, if the minimum number is two, the mounting structure is also simplified.

The size of the gap (or clearance) G between the edge EF of the orientation flat F and the bottom B of the comb guide 20 for orientation flat is not limited as long as the edge EF does not substantially contact. Preferably, a fraction of a mm
The range is several mm.

In the above embodiment, the four arc-shaped comb tooth guides 30 and 40 support the arc-shaped edge C of the wafer W, but the number of the arc-shaped comb tooth guides is not limited. Any number may be used as long as the rotating wafer W does not come off the holding mechanism. Although only one comb tooth guide 20 for orientation flat is sufficient, it is not prohibited to provide a plurality of guides.

The substrate supporting structure of the present invention is most typically applied to a substrate rotating and drying apparatus, but can also be applied to other substrate rotating type processing apparatuses.

[0065]

As described above, according to the present invention, the reaction from the orientation flat during the acceleration and deceleration of the rotation and the collision force with the orientation flat when the rotation is stopped can be achieved only by a relatively inexpensive flat guide which can be easily replaced. Because of the burden, the flaw groove is not generated in the comb tooth guide for the orientation flat by a mechanical action with the orientation flat. For this reason, it is not necessary to replace the comb guide for orientation flat due to the flaw.

If the flat guides are arranged separately on both sides of the comb guide for the orientation flat as in the second aspect of the invention, the contact of the orientation flat with the comb guide for the orientation flat can be more reliably prevented.

Further, if two flat guides are symmetrically arranged on both sides of the comb guide for the orientation flat as in the third aspect of the invention, the replacement of the comb guide for the orientation flat is prevented, and the balance of the substrate support is particularly good. become.

In the invention of claim 4, since such an improvement of the substrate holding mechanism is applied, the maintenance of the apparatus in the rotary drying of the substrate becomes low cost and easy.

[Brief description of the drawings]

FIG. 1 is an external perspective view of a substrate rotating device (spin dry ear) incorporating a substrate holding mechanism according to an embodiment of the present invention.

FIG. 2 is an arrangement principle diagram of a substrate (wafer) support guide in the substrate holding mechanism according to the embodiment of the present invention.

FIG. 3 is a conceptual diagram showing a substrate support principle and a substrate carry-in / out principle in a substrate holding mechanism according to an embodiment of the present invention.

FIG. 4 shows a hollow rotor 7 according to the substrate holding mechanism of the embodiment.
FIG. 2 is a front view of a main part, which is expressed by transmitting light.

FIG. 5 is a plan view of a main part of the substrate holding mechanism of the embodiment.

FIG. 6 is a layout diagram of the orientation flat holding unit 60 in the embodiment.

FIG. 7 is a partially enlarged view of a comb tooth guide for orientation flat 20 in the embodiment.

FIG. 8 is an enlarged sectional view of a comb tooth guide 20 for an orientation flat in the embodiment.

FIG. 9 shows flat guides 10a and 10 according to the embodiment.
It is the elements on larger scale of b.

FIG. 10 shows flat guides 10a and 1 according to the embodiment.
It is an expanded sectional view of Ob.

FIG. 11 is a conceptual diagram of a conventional substrate holding mechanism.

FIG. 12 is an explanatory diagram of a support state in a conventional substrate holding mechanism.

FIG. 13 is an explanatory diagram of generation of a guide flaw groove S in a flat guide and a comb tooth guide for an orientation flat.

FIG. 14 is an explanatory diagram of eccentricity in rotation of a substrate.

[Explanation of symbols]

10a, 10b Flat guide 11 Upper surface of flat guide (flat ridge) 20 Comb guide for orientation flat 30, 40 Comb guide for circular arc portion SD Spin dryer (substrate rotating and drying device) W Semiconductor wafer (semiconductor substrate) RB Transport robot HD Hand of the transfer robot F Orientation flat EF Edge of orientation flat F C Arc portion of wafer W CF Edge of arc portion C A Opening / closing direction of the comb tooth guide 30 for the arc portion R Rotation center P Peak portion of the comb tooth guide V Comb tooth guide Valley B Bottom of valley of comb guide G Gap between bottom of valley of comb guide and edge of orientation flat

Claims (4)

[Claims] 1. A substrate holding mechanism used when holding and rotating an arrangement of a plurality of semiconductor substrates having an orientation flat, wherein (a) a valley portion into which an orientation flat portion of each semiconductor substrate can be inserted is periodically arranged. (B) a plurality of flat guides having substantially flat ridges, the ridges abutting against the edges of the oriental flat portions of each semiconductor substrate, and (c) each semiconductor And a comb guide for an arc portion, in which valley portions into which arc-shaped edge portions of the substrate can be inserted are periodically arranged, and a substantially parallel arrangement of the comb tooth guides for the orientation flat. A substrate holding mechanism, wherein a bottom is not in contact with an edge of the orientation flat portion. 2. The substrate holding mechanism according to claim 1, wherein the plurality of flat guides are arranged on both sides of the comb guide for orientation flat. 3. The substrate holding mechanism according to claim 2, wherein the comb guide for the orientation flat is disposed near a center position of the orientation flat, and as the plurality of flat guides,
A substrate holding mechanism, wherein two flat guides symmetrically arranged on both sides of the orifice comb tooth guide are used. 4. A plurality of semiconductor substrates are arranged and held by the substrate holding mechanism according to claim 1, and the semiconductor substrates are dehydrated by rotating the plurality of semiconductor substrates together with the substrate holding mechanism. A substrate rotary drying device for drying.