JPH1022200A - Semiconductor substrate exposure device - Google Patents

Semiconductor substrate exposure device

Info

Publication number
JPH1022200A
JPH1022200A JP17488296A JP17488296A JPH1022200A JP H1022200 A JPH1022200 A JP H1022200A JP 17488296 A JP17488296 A JP 17488296A JP 17488296 A JP17488296 A JP 17488296A JP H1022200 A JPH1022200 A JP H1022200A
Authority
JP
Japan
Prior art keywords
semiconductor substrate
semiconductor
exposure apparatus
support
fixing portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17488296A
Other languages
Japanese (ja)
Inventor
Hiroyuki Nakano
浩之 中野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP17488296A priority Critical patent/JPH1022200A/en
Publication of JPH1022200A publication Critical patent/JPH1022200A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor substrate exposure device that hardly causes defocusing caused by displacement, etc., due to existence of dirt, etc., between the device and a semiconductor substrate supporting part. SOLUTION: A semiconductor substrate exposure device has a semiconductor substrate supporting part 40 and semiconductor substrate fixing parts 50a and 50b which have a form according with an outer peripheral form of a semiconductor substrate 30 and which are allowed to move on the semiconductor supporting part 40. It employs a structure in which contact parts of the semiconductor substrate fixing parts 50a and 50b for the semiconductor substrate 30 have recessed parts 70a and 70b, respectively, which separate the semiconductor substrate 30 from the semiconductor substrate supporting part 40. By employing the semiconductor substrate exposure device, the semiconductor substrate 30 is, when it is fixed, picked up with the recessed parts 70a and 70b which are formed on the semiconductor substrate fixing parts 50a and 50b, respectively, to be fixed while being separated from the semiconductor substrate supporting part 40. Therefore, defocusing due to interposition of dirt, etc., is hardly caused.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、半導体基板露光装
置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor substrate exposure apparatus.

【０００２】[0002]

【従来の技術】一般に、半導体基板露光装置は、図６に
示すように露光のための光源部２１０、光源部２１０へ
電力を供給する電源コード２２０、半導体基板２３０を
支持する基板支持部２４０、バキュームノズル２５０及
び基板支持部２４０を任意の水平方向へ移動させるＸＹ
テーブル２６０から構成される。なお、マスク（図示せ
ず）は光源部２１０と基板２３０との間の所定の位置に
設置される。2. Description of the Related Art Generally, as shown in FIG. 6, a semiconductor substrate exposure apparatus includes a light source 210 for exposure, a power cord 220 for supplying power to the light source 210, a substrate support 240 for supporting a semiconductor substrate 230, XY for moving vacuum nozzle 250 and substrate support 240 in any horizontal direction
It comprises a table 260. Note that a mask (not shown) is installed at a predetermined position between the light source unit 210 and the substrate 230.

【０００３】このような半導体基板露光装置における基
板支持部２４０では、従来、図７及び図８に示すように
所定の位置に複数個のバキューム孔２７０を設けた構造
をしていた。当該バキューム孔２７０は、バキュームノ
ズル２５０（図６参照）を介し吸引することにより、基
板支持部２４０上に置かれた半導体基板２３０を真空吸
着し固定する。Conventionally, the substrate support portion 240 in such a semiconductor substrate exposure apparatus has a structure in which a plurality of vacuum holes 270 are provided at predetermined positions as shown in FIGS. The vacuum holes 270 suck and fix the semiconductor substrate 230 placed on the substrate support 240 by vacuum suction through the vacuum nozzle 250 (see FIG. 6).

【０００４】なお、溝２８０は、半導体基板２３０と基
板支持部２４０との接触を軽減するために設けられたも
のである。また、他の従来の技術として、図１０乃至図
１３に示す構造の基板支持部２４０を有する半導体基板
露光装置がある。この半導体基板露光装置は、バキュー
ム孔２７０がなく、代わりに、基板支持部２４０上に基
板固定部２９０及びガイド溝３００を有することを除け
ば、図６に示した装置と同様に構成されている。この従
来の装置によれば、半導体基板支持部２４０は、半導体
基板固定部２９０と当該半導体基板固定部２９０を移動
させるためのガイド溝３００とを有する。そして、図１
０及び図１１に示すように基板固定部２９０を基板支持
部２４０の側端方向へバキュームノズルからの空気圧を
動力源として移動させ、その状態で基板支持部２４０の
上に半導体基板２３０を置き、その後、図１２及び図１
３に示すように、基板固定部２９０を基板支持部２４０
の中心方向へ移動させ半導体基板２３０を挟み込み固定
する。The groove 280 is provided to reduce the contact between the semiconductor substrate 230 and the substrate support 240. As another conventional technique, there is a semiconductor substrate exposure apparatus having a substrate support 240 having a structure shown in FIGS. This semiconductor substrate exposure apparatus has the same configuration as that of the apparatus shown in FIG. 6 except that it has no vacuum hole 270 and, instead, has a substrate fixing portion 290 and a guide groove 300 on a substrate support portion 240. . According to this conventional apparatus, the semiconductor substrate supporting portion 240 has the semiconductor substrate fixing portion 290 and the guide groove 300 for moving the semiconductor substrate fixing portion 290. And FIG.
As shown in FIG. 0 and FIG. 11, the substrate fixing part 290 is moved toward the side end of the substrate supporting part 240 using the air pressure from the vacuum nozzle as a power source, and in that state, the semiconductor substrate 230 is placed on the substrate supporting part 240, Then, FIG. 12 and FIG.
As shown in FIG. 3, the substrate fixing portion 290 is
And the semiconductor substrate 230 is sandwiched and fixed.

【０００５】[0005]

【発明が解決しようとする課題】以上のような半導体基
板露光装置においては、前述のように真空吸着または側
面からの挟み込みにより、半導体基板２３０を基板支持
部２４０に固定している。しかしながら、このように固
定した際、当該半導体基板２３０と当該基板支持部２４
０との間に基板かけ片などゴミ３１０が介在することが
ある。このゴミ３１０により、真空吸着の場合は図９に
示すように半導体基板２３０のゴミが存在する部分が盛
り上がり、挟み込みによる場合は図１４に示すように半
導体基板２３０が傾き、マスクパターンを焼き付ける場
合にフォーカスズレが生じる。このフォーカスズレが生
じると半導体素子の不良品率が非常に上昇してしまうと
いう問題があった。In the semiconductor substrate exposing apparatus as described above, the semiconductor substrate 230 is fixed to the substrate support 240 by vacuum suction or sandwiching from the side as described above. However, when fixed in this way, the semiconductor substrate 230 and the substrate support 24
There is a case where dust 310 such as a substrate hanging piece intervenes between the zero and the zero. Due to the dust 310, the portion where the dust is present on the semiconductor substrate 230 rises as shown in FIG. 9 in the case of vacuum suction, and the semiconductor substrate 230 tilts as shown in FIG. Focus shift occurs. When the focus shift occurs, there is a problem that the defective product rate of the semiconductor element is significantly increased.

【０００６】また、ゴミ３１０の介在の可能性をできる
だけ低下させるために、溝２８０を設け（図７及び図８
参照）、半導体基板２３０と基板支持部２４０との接触
を軽減する改良を施すことも、一般になされているが、
この場合であっても半導体基板２３０と基板支持部２４
０とが接触する部分にゴミ３１０が存在した場合、やは
り、前述の問題が発生していた。In order to reduce the possibility of the interposition of dust 310 as much as possible, a groove 280 is provided (FIGS. 7 and 8).
See, for example, an improvement that reduces contact between the semiconductor substrate 230 and the substrate support 240 is also generally performed.
Even in this case, the semiconductor substrate 230 and the substrate support 24
If the dust 310 is present at the portion where the dust comes in contact with the zero, the above-described problem still occurs.

【０００７】そこで、本発明は、半導体基板２３０と半
導体基板支持部２４０との間におけるゴミの介在による
フォーカスズレをほとんど起こさない半導体基板露光装
置を提供することを目的としている。Accordingly, an object of the present invention is to provide a semiconductor substrate exposure apparatus which hardly causes a focus shift due to the presence of dust between the semiconductor substrate 230 and the semiconductor substrate support 240.

【０００８】[0008]

【課題を解決するための手段】このような目的を達成す
るため本発明の半導体基板露光装置は、半導体基板支持
部と、半導体基板の外周形状と合致した形状を有し前記
半導体支持部上を移動可能な複数の半導体基板固定部
と、を有する半導体露光装置であって、前記半導体基板
固定部の前記半導体基板との接触部分の一部または全部
に、前記半導体基板を前記半導体基板支持部から離間さ
せる突起部を、または、前記半導体基板固定部の前記半
導体基板との接触部分に、当該半導体基板の平面視外方
向に向けて少なくとも半導体基板支持部に最も近い側面
がテーパー状である凹部を有するという構造を採用して
いる。In order to achieve the above object, a semiconductor substrate exposure apparatus according to the present invention comprises a semiconductor substrate supporting portion and a semiconductor substrate supporting portion having a shape matching the outer peripheral shape of the semiconductor substrate. A plurality of movable semiconductor substrate fixing portions, and a semiconductor exposure device comprising: a part of or all of a contact portion of the semiconductor substrate fixing portion with the semiconductor substrate; The protrusion to be separated, or the contact portion of the semiconductor substrate fixing portion with the semiconductor substrate, a concave portion whose at least the side surface closest to the semiconductor substrate support portion is tapered toward the direction outside the planar view of the semiconductor substrate. The structure of having is adopted.

【０００９】この半導体基板露光装置を採用することに
より、半導体基板を固定する際に、半導体基板固定部の
移動に伴い、半導体基板固定部に形成された突起部また
は凹部により半導体基板がすくい上げられ半導体基板支
持部から離間して固定される。そのため、半導体基板と
半導体基板支持部との間におけるゴミの介在に半導体基
板の位置ズレ等が防止されることにより、フォーカスズ
レをほとんど起こすことなく半導体基板の露光ができ
る。By employing this semiconductor substrate exposure apparatus, when the semiconductor substrate is fixed, the semiconductor substrate is scooped up by the projections or recesses formed in the semiconductor substrate fixing portion as the semiconductor substrate fixing portion moves. It is fixed away from the substrate support. Therefore, the semiconductor substrate can be exposed with almost no focus deviation by preventing the semiconductor substrate from being displaced due to the interposition of dust between the semiconductor substrate and the semiconductor substrate supporting portion.

【００１０】[0010]

【発明の実施の形態】以下、本発明の実施の形態を図面
を参考にして詳細に説明する。まず、本発明の実施の形
態を示す半導体基板露光装置の概略の構造は、図１に示
すように、露光のための光源部１０、光源部１０へ電力
を供給する電源コード２０、半導体基板３０を支持する
半導体基板支持部４０及び半導体基板３０を固定する半
導体基板固定部５０ａ、５０ｂ、半導体基板支持部４０
を任意の水平方向へ移動させるＸＹテーブル６０から構
成される。なお、マスク（図示せず）は光源部１０と半
導体基板３０との間の所定の位置に設置される。Embodiments of the present invention will be described below in detail with reference to the drawings. First, a schematic structure of a semiconductor substrate exposure apparatus according to an embodiment of the present invention includes a light source unit 10 for exposure, a power cord 20 for supplying power to the light source unit 10, a semiconductor substrate 30 as shown in FIG. Substrate supporting portion 40 for supporting semiconductor substrate, semiconductor substrate fixing portions 50a and 50b for fixing semiconductor substrate 30, semiconductor substrate supporting portion 40
Is moved to an arbitrary horizontal direction. Note that a mask (not shown) is provided at a predetermined position between the light source unit 10 and the semiconductor substrate 30.

【００１１】次に、図２乃至図５に基づき、前記半導体
基板露光装置の半導体基板支持部４０及び半導体基板固
定部５０ａ、５０ｂの構造の詳細及び動作について説明
する。まず、半導体基板支持部４０は、平面視形状がほ
ぼ正方形である直方体形状となっており、ＸＹテーブル
５５上に設置され、前後左右方向へ移動可能となってい
る。Next, the structure and operation of the semiconductor substrate support 40 and the semiconductor substrate fixing portions 50a and 50b of the semiconductor substrate exposure apparatus will be described with reference to FIGS. First, the semiconductor substrate support portion 40 has a rectangular parallelepiped shape having a substantially square shape in plan view, is set on an XY table 55, and is movable in the front-rear and left-right directions.

【００１２】図２に示すように、前記半導体基板支持部
４０上には、２つの相対する半導体基板固定部５０ａ、
５０ｂと当該２つの半導体基板固定部５０ａ、５０ｂを
近接または離間する方向に移動可能とするガイド溝６０
が各々３本（半導体基板固定部５０ａ、５０ｂの中央付
近に１本、両端付近に２本）設けられている。前記ガイ
ド溝６０は断面形状が逆Ｔ字形状をしている。一方、前
記半導体基板固定部５０ａ、５０ｂには前記ガイド溝６
０に対応した形状を有する突起部（図示せず）を各々３
個ずつ設けられている。そして、コンプレッサによる空
気圧またはモータ等（図示せず）を動力源として、前記
突起部が前記ガイド溝６０に沿って移動することによ
り、前記半導体基板固定部５０ａ、５０ｂが、前述の通
り、近接または離間する方向に移動する。As shown in FIG. 2, on the semiconductor substrate supporting portion 40, two opposing semiconductor substrate fixing portions 50a,
A guide groove 60 that enables the two semiconductor substrate fixing portions 50a and 50b to move toward or away from each other.
Are provided (one near the center of the semiconductor substrate fixing portions 50a and 50b and two near both ends). The guide groove 60 has an inverted T-shaped cross section. On the other hand, the guide grooves 6 are provided in the semiconductor substrate fixing portions 50a and 50b.
Each of the protrusions (not shown) having a shape corresponding to 0
Each is provided. Then, the protrusion moves along the guide groove 60 using the air pressure of a compressor or a motor or the like (not shown) as a power source, so that the semiconductor substrate fixing portions 50a and 50b move close to or close to each other as described above. Move away.

【００１３】前記半導体基板固定部５０ａ、５０ｂは、
各々、半導体基板３０との接触側（内側）を半導体基板
３０の外周形状に合致した半円弧状にしており、更に、
当該接触側の側面には、凹部７０ａ、７０ｂが形成され
ており、前記凹部７０ａ、７０ｂの形状は、接触側の上
端及び下端から中央部に向けてテーパー状に形成されて
いる。The semiconductor substrate fixing portions 50a and 50b are
Each of them has a semi-circular shape on the contact side (inside) with the semiconductor substrate 30 so as to conform to the outer peripheral shape of the semiconductor substrate 30.
Recesses 70a, 70b are formed on the side surface on the contact side, and the shapes of the recesses 70a, 70b are tapered from the upper end and the lower end on the contact side toward the center.

【００１４】次に動作について説明すると、図２に示す
ように前記半導体基板固定部５０ａ、５０ｂを離間する
方向に移動させ、半導体基板３０を前記半導体基板固定
部５０ａ、５０ｂ間である半導体基板支持部４０上の所
定の位置に置き、図４に示すように、前記半導体基板固
定部５０ａ、５０ｂの各々がガイド溝６０に沿って近接
する方向へ移動する際に、前記凹部７０ａ、７０ｂが前
述のようにテーパー状に形成されているため前記半導体
基板固定部５０ａ、５０ｂが前記半導体基板３０に接触
すると、前記半導体基板３０を徐々にすくい上げ、図５
に示すように半導体基板３０が前記凹部７０ａ、７０ｂ
の中央部まで持ち上げられ、前記半導体基板支持部４０
から離間した状態で固定することができる。Next, the operation will be described. As shown in FIG. 2, the semiconductor substrate fixing portions 50a and 50b are moved in a direction to separate from each other, and the semiconductor substrate 30 is moved between the semiconductor substrate fixing portions 50a and 50b. As shown in FIG. 4, when the semiconductor substrate fixing portions 50a and 50b move in the direction of approaching along the guide grooves 60, the concave portions 70a and 70b When the semiconductor substrate fixing portions 50a and 50b come into contact with the semiconductor substrate 30, the semiconductor substrate 30 is gradually scooped up, as shown in FIG.
As shown in FIG.
Of the semiconductor substrate supporting portion 40
It can be fixed in a state separated from.

【００１５】そして、このような構造の半導体基板露光
装置にすることにより、半導体基板支持部４０の所定の
位置に半導体基板３０を置き、単に半導体基板固定部５
０ａ、５０ｂにて囲い込むように半導体基板３０を固定
することにより、半導体基板固定部５０ａ、５０ｂに設
けられた凹部７０ａ、７０ｂに沿って半導体基板３０を
すくい上げ半導体基板支持部４０から離間させることが
できる。これにより、半導体基板３０の固定時に半導体
基板３０と半導体基板支持部４０との間にゴミが介在す
ることによる半導体基板の盛り上がりや傾きが防止でき
る。By using the semiconductor substrate exposure apparatus having the above structure, the semiconductor substrate 30 is placed at a predetermined position of the semiconductor substrate supporting portion 40, and the semiconductor substrate fixing portion 5 is simply placed.
By fixing the semiconductor substrate 30 so as to be surrounded by the semiconductor substrate fixing portions 50a and 50b, the semiconductor substrate 30 is scooped up along the concave portions 70a and 70b provided in the semiconductor substrate fixing portions 50a and 50b and separated from the semiconductor substrate supporting portion 40. Can be. This prevents the semiconductor substrate 30 from rising or tilting due to dust between the semiconductor substrate 30 and the semiconductor substrate supporting portion 40 when the semiconductor substrate 30 is fixed.

【００１６】なお、半導体基板固定部５０ａ、５０ｂに
設けられる凹部７０ａ、７０ｂは、必ずしも半導体基板
支持部４０に接する位置から設けられる必要はない。例
えば、半導体基板支持部４０の半導体基板３０の置かれ
る部分を凸状にする等して前記半導体基板３０を高く保
持すれば、、半導体基板固定部５０ａ、５０ｂの半導体
基板支持部４０表面から前記半導体基板３０の保持され
ている高さ位置までの範囲には凹部７０ａ、７０ｂを及
ぼす必要がない。更に、凹部７０ａ、７０ｂの形状は、
前述したようなテーパー状に限定されず、導体基板３０
をすくい上げて固定できる形状であればどのような形状
でも良く、例えば、凹部でなく突起部でもよい。The recesses 70a and 70b provided in the semiconductor substrate fixing portions 50a and 50b do not necessarily need to be provided from positions in contact with the semiconductor substrate support 40. For example, if the semiconductor substrate 30 is held high by making the portion of the semiconductor substrate supporting portion 40 where the semiconductor substrate 30 is placed convex or the like, the semiconductor substrate fixing portions 50a and 50b can be removed from the surface of the semiconductor substrate supporting portion 40. The recesses 70a and 70b do not need to be exerted in the range up to the held height position of the semiconductor substrate 30. Further, the shapes of the concave portions 70a and 70b are as follows.
The conductor substrate 30 is not limited to the tapered shape described above.
Any shape may be used as long as it can be picked up and fixed. For example, a protrusion may be used instead of a recess.

【００１７】また、本実施の形態では、２つの半導体基
板固定部５０ａ、５０ｂにて半導体基板３０を固定して
いるが、３つ以上であってもかまわない。更に、半導体
基板固定部５０ａ、５０ｂは必ずしも半導体基板外周全
体を覆う形状である必要はなく、半導体基板が固定でき
ればどのような形状でも良い。In the present embodiment, the semiconductor substrate 30 is fixed by the two semiconductor substrate fixing portions 50a and 50b, but may be three or more. Furthermore, the semiconductor substrate fixing portions 50a and 50b do not necessarily have to have a shape that covers the entire outer periphery of the semiconductor substrate, and may have any shape as long as the semiconductor substrate can be fixed.

【００１８】[0018]

【発明の効果】以上のように本発明によれば、半導体基
板を半導体基板支持部から離間させることにより、半導
体基板と半導体基板支持部との間に介在するゴミによる
半導体基板の盛り上がりや傾きが防止されることから、
前記盛り上がりや傾きによる露光時のフォーカスズレが
格段に解消される。As described above, according to the present invention, the semiconductor substrate is separated from the semiconductor substrate supporting portion, so that the swelling or inclination of the semiconductor substrate due to dust interposed between the semiconductor substrate and the semiconductor substrate supporting portion is reduced. From being prevented,
The focus shift at the time of exposure due to the swelling or inclination is remarkably eliminated.

【００１９】そして、フォーカスズレが解消されること
により半導体素子の不良品率を格段に低下することがで
き、半導体素子製造コストを格段に低減することができ
る。By eliminating the focus shift, the defective rate of the semiconductor element can be remarkably reduced, and the manufacturing cost of the semiconductor element can be remarkably reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の半導体基板露光装置の概観を示す図で
ある。FIG. 1 is a view showing an overview of a semiconductor substrate exposure apparatus of the present invention.

【図２】本発明の半導体基板露光装置に設けられた半導
体基板支持部の平面図（半導体基板固定前）である。FIG. 2 is a plan view (before fixing the semiconductor substrate) of a semiconductor substrate support provided in the semiconductor substrate exposure apparatus of the present invention.

【図３】図２に示す半導体支持部のＡ−Ａ視断面図であ
る。FIG. 3 is a cross-sectional view of the semiconductor support shown in FIG.

【図４】本発明の半導体基板露光装置に設けられた半導
体基板支持部の平面図（半導体基板固定後）である。FIG. 4 is a plan view (after fixing the semiconductor substrate) of a semiconductor substrate support provided in the semiconductor substrate exposure apparatus of the present invention.

【図５】図４に示す半導体支持部のＢ−Ｂ視断面図であ
る。FIG. 5 is a cross-sectional view of the semiconductor support shown in FIG.

【図６】従来の半導体基板露光装置の概観を示す図であ
る。FIG. 6 is a view showing an overview of a conventional semiconductor substrate exposure apparatus.

【図７】従来の半導体基板露光装置に設けられた半導体
基板支持部の平面図である。FIG. 7 is a plan view of a semiconductor substrate support provided in a conventional semiconductor substrate exposure apparatus.

【図８】図７に示す半導体支持部のＣ−Ｃ視断面図であ
る。8 is a cross-sectional view of the semiconductor support section shown in FIG.

【図９】半導体基板と半導体基板支持部との間にゴミが
介在した態様を示す半導体支持基板（従来の技術）の断
面図である。FIG. 9 is a cross-sectional view of a semiconductor supporting substrate (prior art) showing an aspect in which dust is interposed between a semiconductor substrate and a semiconductor substrate supporting portion.

【図１０】他の従来の半導体基板露光装置に設けられた
半導体基板支持部の平面図（半導体基板固定前）であ
る。FIG. 10 is a plan view (before fixing a semiconductor substrate) of a semiconductor substrate support provided in another conventional semiconductor substrate exposure apparatus.

【図１１】図１０に示す半導体支持部のＤ−Ｄ視断面図
である。11 is a sectional view of the semiconductor support section shown in FIG.

【図１２】他の従来の半導体基板露光装置に設けられた
半導体基板支持部の平面図（半導体基板固定後）であ
る。FIG. 12 is a plan view (after fixing a semiconductor substrate) of a semiconductor substrate support provided in another conventional semiconductor substrate exposure apparatus.

【図１３】図１２に示す半導体支持部のＥ−Ｅ視断面図
である。13 is a cross-sectional view of the semiconductor support portion shown in FIG.

【図１４】半導体基板と半導体基板支持部との間にゴミ
が介在した態様を示す半導体支持基盤（他の従来の技
術）の断面図である。FIG. 14 is a cross-sectional view of a semiconductor support base (another conventional technique) showing an aspect in which dust is interposed between a semiconductor substrate and a semiconductor substrate support.

【符号の説明】[Explanation of symbols]

３０ 半導体基板 ４０ 半導体基板支持部 ５０ 半導体基板固定部 ６０ ガイド溝 ７０ 凹部 Reference Signs List 30 semiconductor substrate 40 semiconductor substrate supporting part 50 semiconductor substrate fixing part 60 guide groove 70 concave part

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】半導体基板支持部と、半導体基板の外周形
状と合致した形状を有し前記半導体支持部上を移動可能
な複数の半導体基板固定部と、を有する半導体基板露光
装置であって、前記半導体基板固定部の前記半導体基板
との接触部分の一部または全部に、前記半導体基板を前
記半導体基板支持部から離間させる突起部を有すること
を特徴とする半導体基板露光装置An apparatus for exposing a semiconductor substrate, comprising: a semiconductor substrate supporting portion; and a plurality of semiconductor substrate fixing portions having a shape that matches the outer peripheral shape of the semiconductor substrate and movable on the semiconductor supporting portion. A semiconductor substrate exposure apparatus, comprising: a projection portion for separating the semiconductor substrate from the semiconductor substrate support portion, at a part or the whole of a contact portion of the semiconductor substrate fixing portion with the semiconductor substrate. 【請求項２】半導体基板支持部と、半導体基板の外周形
状と合致した形状を有し前記半導体支持部上を移動可能
な複数の半導体基板固定部と、を有する半導体基板露光
装置であって、前記半導体基板固定部の前記半導体基板
との接触部分に、当該半導体基板の平面視外方向に向け
て少なくとも半導体基板支持部に最も近い側面がテーパ
ー状である凹部を有することを特徴とする半導体基板露
光装置2. A semiconductor substrate exposure apparatus, comprising: a semiconductor substrate support portion; and a plurality of semiconductor substrate fixing portions having a shape matching the outer peripheral shape of the semiconductor substrate and movable on the semiconductor support portion. A semiconductor substrate having a semiconductor substrate fixing portion in a contact portion with the semiconductor substrate, a concave portion in which at least a side surface closest to the semiconductor substrate support portion in a direction outside the planar view of the semiconductor substrate is tapered. Exposure equipment
JP17488296A 1996-07-04 1996-07-04 Semiconductor substrate exposure device Pending JPH1022200A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17488296A JPH1022200A (en) 1996-07-04 1996-07-04 Semiconductor substrate exposure device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17488296A JPH1022200A (en) 1996-07-04 1996-07-04 Semiconductor substrate exposure device

Publications (1)

Publication Number Publication Date
JPH1022200A true JPH1022200A (en) 1998-01-23

Family

ID=15986320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17488296A Pending JPH1022200A (en) 1996-07-04 1996-07-04 Semiconductor substrate exposure device

Country Status (1)

Country Link
JP (1) JPH1022200A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101937174A (en) * 2009-06-30 2011-01-05 Asml荷兰有限公司 The method and the device making method of substrate table, lithographic equipment, use substrate table

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101937174A (en) * 2009-06-30 2011-01-05 Asml荷兰有限公司 The method and the device making method of substrate table, lithographic equipment, use substrate table
KR101160215B1 (en) 2009-06-30 2012-06-26 에이에스엠엘 네델란즈 비.브이. Substrate table for a lithographic apparatus, lithographic apparatus, method of using a substrate table and device manufacturing method

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