JPH10218278A - Transfer container for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transfer container for semiconductor devices which does not require a reel for winding up the transfer container and keeps and transfers the transfer containers in a state folded zigzag, by providing hinges which can be folded so as to form peaks and bottoms in the transfer way of the containers. SOLUTION: A hinge 4 is provided on the transfer way of at least one or more consecutive transfer containers 1 and respective joint parts 3 are connected at the hinge to make it possible to keep or transfer the transfer containers zigzag. The hinge 4 has folding lines 5 constituted of one or more recessed parts and hence, it is movable 360 degrees. Or a butterfly shape or an elastic material can be used for the hinge to eliminate folding lines 5 and make it movable within 360 degrees. By this constitution, the transfer containers can be kept and transferred zigzag and folded and contained as they are and hence, conventional winding-up reels are not required.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in which a transport container can be stored and transported in a zigzag state by means of a fold that is provided in the middle of a plurality of continuous transport containers and that can be folded in a mountain fold and a valley. The present invention relates to an apparatus transport container.

[0002]

2. Description of the Related Art A conventional semiconductor device transport container will be described with reference to the drawings. FIG. 4 is a perspective view of a conventional semiconductor device transport container.

In FIG. 4, reference numeral 1 denotes a transfer container for transferring the semiconductor device, 2 denotes a reel for winding the transfer container 1, and 3 denotes a connecting portion for connecting the transfer container 1 continuously. In the conventional transport container, the connecting portion 3 can be wound along the circumferential shape of the reel 2 by bending.

[0004]

However, the connecting portion of the conventional semiconductor device transport container has a problem that the movable angle is limited and cannot be used unless the center of the reel 2 has a core. there were.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems. By providing a foldable portion in the middle of a transfer container that can be folded in a mountain fold and a valley, a reel for winding the transfer container is not required. An object of the present invention is to provide a semiconductor device transport container that can store and transport a transport container in a zigzag state.

[0006]

In order to achieve this object, a semiconductor device transport container according to the present invention has the following configuration. That is, in a semiconductor device transfer container in which a plurality of transfer containers provided with a recess for accommodating a semiconductor device to be transferred are connected by a plurality of connecting portions, at least halfway between the transfer container and the transfer container. A valley portion that can be folded in a valley is provided, and the connecting portions are connected by the ridge portion. Further, the tongue portion has a sheet shape and is formed of an injection-type synthetic resin. In addition, the fork has a sheet shape, and has a hinge shape. Further, the tongue portion is sheet-shaped, and has depressions on the front and back surfaces.

[0007] According to the above configuration, there is a margin in the movable angle of the knee portion, and the semiconductor device transport container can be stored and transported in a zigzag state without requiring a take-up reel.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a semiconductor device transport container according to the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of a semiconductor device transport container according to the present embodiment. FIG. 2 is an enlarged perspective view of the vicinity of a fork of the semiconductor device transport container of FIG. 1, showing a movable state.

As shown in the figure, the semiconductor device transport container according to the present embodiment is a semiconductor device transport container in which a plurality of transport containers provided with concave portions for accommodating semiconductor devices to be transported are connected by respective connecting portions. In the container, at least in the middle of the transport container, a fold that can be folded in a mountain fold and a valley is provided, and the connecting portions are connected by the fold.

[0011] Specifically, at least one or more continuous transport containers 1 are provided with a hinge 4 in the middle thereof, and the connecting portions 3 are connected to each other at the hinges, whereby the transport container 1 is folded in a zigzag manner. Can be stored and transported in a state. Since the fore part 4 has the folding line 5 composed of at least one concave portion, it becomes movable by 360 °. Alternatively, the hinge part 4 can be made movable by 360 ° even if the folding line 5 is eliminated by using a hinge shape or using an elastic material. FIG. 2A shows a state before the bending, and FIG. 2B shows a state where the bending is performed along the folding line 5.

FIG. 3 is a sectional view showing the shape of the tongue. FIG. 3 (a) shows a case where a recess 6 is provided as a movable part in the tongue 4, and the recess 6 has a circular shape. It is a concave part having a shape and a hinge shape. FIG. 3B shows a case in which a recess 7 is provided on the front and back surfaces as a movable portion of the forehead 4. FIG. 3 (c) shows a tongue formed of an injection-type synthetic resin.
It is movable by 60 °.

The transfer container for a semiconductor device according to the present embodiment has a structure in which a hinge portion is provided between the transfer containers and the connecting portions are connected to each other by the twist portion. Can be stored and transported in a zigzag state, and can be folded and stored as it is, eliminating the need for a conventional take-up reel.

[0014]

As described above, the transfer container for a semiconductor device according to the present invention has a structure in which the connecting portion is connected between the transferring container and the connecting portion by the connecting portion. By doing so, the transport container can be stored and transported in a zigzag state, and can be folded and stored as it is, eliminating the need for a conventional take-up reel.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a transfer container for a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a partially enlarged perspective view of a transfer container for a semiconductor device according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a tongue portion of a semiconductor device transport container according to an embodiment of the present invention.

FIG. 4 is a perspective view showing a conventional semiconductor device transport container.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Transport container 2 Reel 3 Connecting part 4 Knee part 5 Fold line 6 Concave part 7 Depression

Claims (4)

[Claims] 1. A semiconductor device transport container in which a plurality of transport containers each having a recess for accommodating a semiconductor device to be transported are connected by a plurality of connecting portions, at least in the middle of the transport container and the transport container. And a joint part which can be folded in a mountain valley and a valley part, and the connecting parts are connected by the joint part. 2. A method according to claim 1, wherein the fork has a sheet shape and is formed of an injection-type synthetic resin.
A transfer container for a semiconductor device as described in the above. 3. The transfer container for a semiconductor device according to claim 1, wherein the hinge portion has a sheet shape and has a hinge shape. 4. The transport container for a semiconductor device according to claim 1, wherein the spine portion is sheet-shaped, and has a depression on the front and back surfaces.