JPH1021727A - Device having light source group for illumination - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device having a light source group for illumination capable of illuminating various types of electronic components so as to surely picking up images with an area sensor. SOLUTION: A device 10A has illumination light source groups 6, 7, 8 for irradiating light to a read objective material 3 in order to pickup the image of the read objective material 3 with an area sensor. The illumination light source groups 6, 7, 8 are arranged at a plurality of stages in the surroundings of a reflecting light axis lines A1 extending from the read objective material 3, and irradiation elevation angles α deg., β deg., γ deg. of the illumination light source groups 6, 7, 8 at each stage are gradually increased with going away from the read objective material 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup apparatus used for detecting the position of an electronic component or confirming a defect in an electronic component mounting apparatus.

[0002]

2. Description of the Related Art As a conventional image pickup apparatus, Japanese Patent Laid-Open No.
There is an apparatus disclosed in Japanese Patent No. 37099. This imaging device has a pair of illumination light sources that are spaced apart from each other. An electronic component sucked by a suction nozzle is arranged above the illumination light sources, and the illumination light source emits light at a constant angle from below. It was illuminated at an elevation angle, and the reflected light from the electronic components was received by a camera.

[0003]

However, in the above-described image pickup apparatus, since light is always incident on the electronic component at a constant irradiation elevation angle, a portion to be imaged depends on the type of lead of the electronic component. In some cases, the reflected light from the camera cannot be sufficiently obtained, and the electronic component cannot be reliably imaged.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has as its object to provide an image pickup apparatus capable of reliably picking up images of various electronic components by an area sensor.

[0005]

According to the present invention, there is provided an imaging apparatus comprising: an illumination light source group for irradiating light to an object to be read; and an area sensor for imaging an image of the object to be read by light from the illumination light source group. In the imaging apparatus provided, the illumination light source group is arranged in a plurality of stages around the reflection optical axis extending from the reading object, and the irradiation elevation angle of the illumination light source group in each stage is sequentially increased as the distance from the reading object increases. It is characterized in that the lighting is selectively switched between the illumination light source groups in each stage.

According to this image pickup apparatus, from among the plurality of illumination light source groups, the illumination light source group having the optimum irradiation elevation angle with respect to the object to be read is selected, and the reading light source group is read from the illumination light source group. When the object is irradiated with light, the light is reflected by the object to be read. At this time, the amount of light reflected along the reflected light axis increases, and this light is received by the area sensor, and an image of the object to be read is captured. Then, for a different object to be read, the illumination light source group is switched to a stage having another optimal irradiation elevation angle, and an image of the object to be read is similarly captured by the illumination light source group.

Further, it is preferable to arrange the illumination light source groups in three stages. According to this imaging device, the object to be read is illuminated at three different irradiation elevation angles corresponding to the three-stage illumination light source groups.

In addition, the irradiation elevation angles of the illumination light source groups at each stage are respectively approximately X ゜ to (X ゜ + 10 °) from the object to be read.
Assuming a reading target having a plurality of hemispherical leads having a height T of about 45 ° ± 15 ° and about 75 ° ± 15 ° and a pitch P, a formula A ゜ = tan ⁻¹ (( cosX @ .T
−sin (90 ° − ((90 ° −X ゜) / 2)) · T)
/ (P- (cos (90 °-((90 ° -X ゜)) /
2) With respect to the optimum elevation angle A ゜ defined by () + T + sinX ゜ · T)), it is preferable that X ゜ satisfy X ゜ ≧ A 、 and have a value closest to the optimum elevation angle A ゜.

According to this imaging apparatus, the object to be read is illuminated by the second-stage illumination light source group at an irradiation elevation angle of 45 ° ± 15 °, and is read by the third-stage illumination light source group at 75 ° ± 15 °. 1
Illuminated at an illumination elevation of 5 °. In particular, by illuminating the reading target having hemispherical leads with the optimal elevation angle A 仰 by the first-stage illumination light source group, a desired image for the reading target can be obtained.

Further, the light is provided outside the first-stage illumination light source group closest to the object to be read, reflects light from the first-stage illumination light source group, and reads the reflected light. It is preferable to provide a reflecting means for irradiating the object. According to this imaging device, the light emitted from the first-stage illumination light source is reflected by the reflection means, and the reflected light is emitted toward the reading target. As a result, the optical path can be made longer than in the case of direct illumination, and the object to be read is not irradiated with an excessive light intensity.

Further, it is preferable to provide a dust-proof glass immediately before the illumination light source group located farthest from the object to be read. According to this imaging device, even if the illumination light source group farthest from the object to be read is turned on, light from the illumination light source group is reflected by the dust-proof glass immediately before the illumination light source group. The image of the illumination light source group does not enter the optical path. As a result, the image of the illumination light source group farthest from the object to be read is not captured.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of an imaging apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIG. 1, the image pickup apparatus 10 has an opening 1. When the electronic component 3 sucked by the suction nozzle 2 passes over the opening 1 at a high speed, the electronic component 3
Is instantaneously imaged from below. In addition, the imaging device 10
The electronic component 3 can be illuminated from above by the transmitted illumination light source 4 provided above the suction nozzle 2, and the silhouette thereof can be imaged. In addition, the imaging device 10 includes a light source support 5 having a rectangular tube shape in which the opening 1 is formed. In this light source support portion 5, a reflected optical axis A extending from the electronic component 3 is provided.
Along the periphery of 1, there are provided three stages of illumination light source groups 6, 7, 8 for irradiating the electronic component 3 with light. That is, a first-stage illumination light source group 6 is provided in the uppermost portion of the light source support portion 5, and a second-stage illumination light source group 6 is provided below the first-stage illumination light source group 6. The light source group 7 for the third stage is provided below the light source group 7 for the second stage.

As described above, the first, second, and third-stage illumination light source groups 6, 7, and 8 are arranged substantially parallel to the reflected optical axis A1, so that the electronic component 3 The irradiation elevation angle of the light irradiated to the electronic components 3 gradually increases as the distance from the electronic component 3 increases. Here, the irradiation elevation angle refers to an angle between a plane orthogonal to the reflected light axis A1 and the light rays from the illumination light source groups 6, 7, and 8. Further, the first, second, or third-stage illumination light source groups 6, 7, 8 can switch the lighting between them.

On the reflected light axis A1, a half mirror 9 and a reflecting mirror 1 are positioned below the third stage illumination light source group 8.
1 is provided. A reflected optical axis A2 extends from the half mirror 9 in the direction of light reflected by the half mirror 9, and the high-magnification imaging lens 1 is placed on the reflected optical axis A2.
2 and an area sensor 13 are provided. On the other hand, a reflection optical axis A3 extends from the reflection mirror 11 in the direction of light reflected by the reflection mirror 11, and a low-magnification imaging lens 14 and an area sensor 15 are provided on the reflection optical axis A3. ing.

As shown in FIGS. 2 to 4, the first-stage illumination light source group 6 includes four reflection illumination sections 16 arranged at four sides with respect to the reflection optical axis A1 for uniform illumination. Has,
Each reflection illumination unit 16 is provided with four inner wall surfaces 18 of the light source support 5.
Are arranged correspondingly. Each reflection lighting section 16
Has a reflective illumination light source group 20 on a flat support plate 19 fixed to each inner wall surface 18, and the reflective illumination light source group 20 includes a reflective illumination light source 21 (for example, a light emitting diode).
Are arranged along each inner wall 18 so that a total of 40 light sources 21 are provided. Light source 2 for each reflective illumination
1 directs the output optical axis C1 in the direction of the inner wall surface 18. Further, between the light source group 20 for reflected illumination and each inner wall surface 18, a flat and long reflecting mirror 22 is fixed.
The reflecting mirror 22 irradiates the light emitted from the reflected illumination light source group 20 to the electronic component 3 along the axis C2, and illuminates the electronic component 3 with light at an irradiation elevation angle α ゜. By employing the indirect illumination method in this manner, the optical path length from the reflective illumination light source group 20 to the electronic component 3 can be increased, and the electronic component 3 is not illuminated with excessive light intensity.

As shown in FIG. 4, the first-stage illumination light source group 6 has auxiliary illumination portions 24 at the four uppermost corner portions 23 of the light source support portion 5, respectively. The auxiliary illumination unit 24 is for illuminating the electronic component 3 with light supplementarily to a part that cannot be sufficiently imaged by the illumination of the reflection illumination unit 16. Each auxiliary lighting unit 24
Has an auxiliary illumination light source group 25 on a standing plate 26, and the auxiliary illumination light source group 25 is configured by arranging five auxiliary illumination light sources 27 (for example, light emitting diodes) at each corner 23. , 20 light sources 27 in total. Each auxiliary illumination light source 27 has its emission optical axis D1 directed directly to the electronic component 3 and irradiates the electronic component 3 with light at the same illumination elevation angle as the illumination elevation angle α ゜ of the reflection illumination unit 16 described above. As described above, since the electronic component 31 is also illuminated from the diagonal direction, the uniformity of illumination on the electronic component 3 is further improved.

Here, the elevation angle α ゜ of light irradiation by the first stage illumination light source group 6 will be described. The first-stage illumination light source group 6 mainly includes a hemispherical lead 41 shown in FIG.
It is provided in order to recognize only the lead 41, especially for the electronic component 3 having. Therefore, the irradiation elevation angle α ゜ is also set assuming this kind of electronic component 3. In the electronic component 3, a plurality of hemispherical leads 41 having a height T from the specific surface 3a are arranged at a constant pitch P on the lead support surface 3a. About such an electronic component 3,
The irradiation elevation angle α ゜ is set as follows.

That is, when the irradiation elevation angle to be set is X ゜, for each lead 41, the optimum elevation angle A ゜ at which most of the lead 41 can be imaged is: A ゜ = tan ^-1 (cosX ゜ T −sin (90 ° −
(90 ゜ −X ゜) / 2) · T) / (P− (cos (90
゜ − (90 ° −X ゜) / 2) · T + sinX ゜ · T)), and X ゜ ≧ A ゜ with respect to the optimal elevation angle A ゜, and is closest to the optimal elevation angle A ゜. Determine X ゜ with value. Then, for this X ゜, X ゜ to X ゜ +10
The irradiation elevation angle α ゜ is set in the range of ゜.

For example, when X ゜ = 8 ゜ for the electronic component 3 with T = 0.6 and P = 1.5, the optimal elevation angle A ゜ is A ゜ = 7.87 °, but X ゜= 7 ゜, A ゜ = 8.08 ゜, and X ゜ <A 、, so
X ゜ = 7 ゜ is inappropriate. When X ゜ is an integer, X ゜ = 8 ゜ for the electronic component 3. At this time,
Since the irradiation elevation angle α ゜ is set in the range of X ゜ to X ゜ + 10 °, the irradiation elevation angle α ゜ is set in the range of 8 ° to 18 °.
Set to ゜. When imaging the electronic component 3 at this irradiation elevation angle, only the leads 41 are emphasized and imaged. X ゜ is most preferably X ゜ = A ゜. In this case, it is possible to image the entire lead 41. The irradiation elevation angle α ゜ determined as described above is also applied to an electronic component in which a plurality of disk-shaped leads are arranged in addition to the electronic component 3 having the hemispherical lead 41 described above. Can be done.

As shown in FIGS. 2 and 3, the second-stage illumination light source group 7 is provided with a reflected light axis A for uniform illumination.
The four light source groups 7 for illumination are arranged in four directions with respect to 1.
It is arranged on four swash plates 28 extending obliquely downward from the four inner wall surfaces 18 of the light source support 5. Light source group 7 for each lighting
Is composed of a total of 80 light sources 29 by arranging 20 illumination light sources 29 (for example, light-emitting diodes) in three rows from each inner wall surface 18 side along each inner wall surface 18. Each illumination light source 29 has its emission optical axis E1 directed directly toward the electronic component 3 and is arranged at a specific irradiation elevation angle β 角 with respect to the electronic component 3. Here, the irradiation elevation angle β ゜ is
The irradiation elevation angle α ゜ by the first-stage illumination light source group 6 described above is set larger than, for example, 45 °. However, the irradiation elevation angle β ゜ can be arbitrarily set in the range of 30 ゜ to 60 ゜.

The second-stage illumination light source group 7 is effective mainly in recognizing the leads 41 of the electronic component 3 in which the reflectance of the lead support surface 3a is high and the reflectance of the leads 41 is high. For example, when the electronic component 3 in which the lead support surface 3a is formed of gold is used, when the second-stage illumination light source group 7 is turned on, the light from the second-stage illumination light source group 7 becomes:
The amount of reflected light that is specularly reflected on the lead support surface 3a of the electronic component 3 and reflected along the reflected light axis A1 decreases. On the other hand, light is scattered and reflected from the lead 41, and the amount of reflected light reflected from the lead 41 along the reflected light axis A1 increases. As a result, the electronic component image in which the lead 41 is emphasized is captured.

A position between each of the light source groups 7 for illumination in the second stage and the electronic component 3 facing each swash plate 28 is a second position.
Diffusion plates 30 are provided to diffuse the light emitted from the respective illumination light source groups 7 in the tier. Therefore, the second
When the illumination light source group 7 in the second stage is turned on, the light emitted from each illumination light source group 7 in the second stage is diffused, and the electronic component 3 is almost uniformly illuminated.

As shown in FIGS. 2 and 3, the third-stage illumination light source group 8 includes a reflected light axis A for uniform illumination.
The four light source groups 8 for illumination are arranged in four directions with respect to 1.
The light source support 5 is disposed on a protruding plate 31 extending from each inner wall surface 18 in the vertical direction. The third-stage illumination light source group 8 includes an illumination light source 32 along each inner wall surface 18.
(For example, light emitting diodes) from the inner wall surface 18 side in three rows 3
By arranging 0 pieces at a time, a total of 120 pieces are formed.

Each illumination light source 32 has an output optical axis F1.
Are directed toward the electronic component 3, and are arranged at a specific irradiation elevation angle γ ゜ with respect to the electronic component 3. Here, the irradiation elevation angle γ ゜ is set to be larger than the irradiation elevation angle β ゜ by the second-stage illumination light source group 7 described above, and is set to, for example, 75 °. However, the irradiation elevation angle γ ゜ can be arbitrarily set in the range of 60 ° to 90 ° depending on the type of the electronic component 3 to be used.

The third stage illumination light source group 8 is effective mainly in recognizing the leads 41 of the electronic component 3 in which the reflectance of the lead support surface 3a is low and the reflectance of the lead 41 is high. In this case, when the third-stage illumination light source group 8 is turned on, the light is emitted from the illumination light source group 8 along the emission optical axis F1. At this time, the amount of light reflected from the lead 41 increases, and the lead supporting surface 3 of the electronic component 3 having a low reflectivity.
The amount of reflected light from a decreases. As a result, the lead 41
Are picked up.

As shown in FIGS. 2 and 3, immediately before the third-stage illumination light source group 8 disposed farthest from the electronic component 3, dust in the image pickup device 10 is removed. A dust-proof glass 33 for preventing intrusion is provided.
Is made of, for example, transparent glass. Even if the dust-proof glass 33 reflects the light emitted from the third-stage illumination light source group 8, the dust-proof glass 33 guides the reflected light into the optical path B1 indicated by the two-dot chain line and the optical path B2 indicated by the solid line. There is no. Therefore, the image of the third stage illumination light source group 8 is not captured by the area sensors 13 and 15. Also,
Since it is not necessary to provide the anti-reflection coating on the dust-proof glass 33, the cost can be reduced, and sufficient emitted light can be obtained without reducing the light passing through the dust-proof glass 33.

The first to third illuminating light source groups 6, 7 and 8 are arranged outside the optical paths B1 and B2. , 8 are in optical path B
No image is captured by the area sensors 13 and 15 after passing through the areas 1 and B2.

As shown in FIG. 6, the first to third stages of the light source groups 6, 7, and 8 of the first to third stages can be switched between lighting by the switching control circuit 34. Have been. In the switching control circuit 34, the first, second, and third-stage illumination light source groups 6,
Illumination circuit units 35, 36, and 37 for 7, 8 are connected in parallel, and changeover switches 38, 39, and 40 are connected in series for each of the illumination circuit units 35, 36, and 37, respectively. The light source groups 6, 7, 8 for lighting are turned on / off independently by turning on / off the switches 38, 39, 40. Each lighting circuit 35,
36 and 38 are configured by connecting the same number of illumination light sources (light emitting diodes) connected in series in parallel.

As shown in FIG. 7, the changeover switch 38 includes a plurality of (eg, two) terminals 42 and 43 in which resistors R and r (R> r) are connected in parallel; 4
3 and a switch lever 44 connected to the switch lever 3. When connecting the switch lever 44 to the terminal 42,
Since a large resistance is connected to the terminal 42, the current flowing through the illumination light source is reduced. On the other hand, when the switch lever 44 is connected to the terminal 43, the terminal 43 is connected to a small resistor, so that the current flowing through the light source for illumination increases. Accordingly, the amount of light emitted from the illumination light source can be adjusted in two steps. Also, changeover switches 39 and 4
0 has the same configuration as the changeover switch 38 described above. The reason why the amount of emitted light can be adjusted in this way is that when imaging the electronic component 3, light is strongly reflected from both the lead 41 and the lead support surface 3 a of the electronic component 3 due to an excessive amount of emitted light. This is to prevent the leads 41 and the lead support surface 3a from being difficult to distinguish.

Next, based on the above-described configuration, the imaging device 1
The operation of 0 will be briefly described.

First, the first-stage illumination light source group 6 is turned on to irradiate the electronic component 3 with light. At this time, the first-stage illumination light source group 6 is arranged around the reflected optical axis A1, so that the electronic component 3 is almost uniformly illuminated from the periphery by the first-stage illumination light source group 6. Is done. The light reflected along the reflected optical axis A1 on the lower surface of the electronic component 3 is reflected by the half mirror 9 while forming the optical path B1, and the reflected light is imaged at a high magnification along the reflected optical axis A2. The light enters the lens 12 and is imaged on the area sensor 13 by the imaging lens 12. At this time, the area sensor 13
Then, a local image of the electronic component 3 is captured.

On the other hand, light reflected along the reflection optical axis A1 on the lead supporting surface 3a of the electronic component 3 passes through the half mirror 9 while forming the optical path B2, is reflected by the reflection mirror 11, and is reflected by the reflection mirror 11. Light enters the low-magnification imaging lens 14 along the reflection optical axis A3, and is imaged on the area sensor 15 by the imaging lens 14. At this time, the area sensor 1
At 5, the entire image of the electronic component 3 is captured. When switching the first-stage illumination light source group 6 to the second-stage illumination light source group 7, the electronic component 3 is illuminated at a larger irradiation elevation angle by the second-stage illumination light source group. . It should be noted that which stage of the illumination light source group is turned on depends on the shape or properties of the target electronic component 3.

The present invention is not limited to the above embodiment. For example, the illumination light source groups 6, 7, and 8 are arranged in three stages, but the illumination light source groups may be two or more stages. Also in this case, desired electronic component images can be captured for the electronic components 3 having various shapes and properties.

Further, the illumination light source groups 6, 7, 8 are arranged in four directions with respect to the reflected light axis A1, but the illumination light source groups 6, 7, 8 may be arranged in an annular shape. . Even in this case, the electronic component 3 can be uniformly illuminated.

[0036]

As described above, the imaging apparatus according to the present invention has the following effects because it is configured as described above. That is, in the imaging apparatus according to the present invention, the illumination light source group is arranged in a plurality of stages around the reflected optical axis extending from the reading object, and the irradiation elevation angle of the illumination light source group at each stage is set from the reading object. As the distance between the light sources increases, the lighting between the illumination light source groups in each stage is selectively switched, so that an image of various electronic components can be reliably captured by the area sensor.

[Brief description of the drawings]

FIG. 1 is an end view showing a first embodiment of an imaging device according to the present invention.

FIG. 2 is a cross-sectional view illustrating a main part of the imaging device of FIG. 1;

FIG. 3 is a partially cutaway perspective view showing a main part of the imaging device of FIG. 1;

FIG. 4 is a plan view showing a first-stage illumination light source group from the reading object side.

FIG. 5 is a side view of an electronic component having hemispherical leads.

FIG. 6 is a circuit diagram illustrating a switching control circuit.

FIG. 7 is a circuit diagram showing an internal configuration of a changeover switch.

[Explanation of symbols]

Reference numeral 3 denotes an electronic component (object to be read), 6, 7, 8 ... a light source group for illumination, 13, 15 ... an area sensor, 22 ... a reflection mirror (reflection means), 33 ... dustproof glass, 41 ... a lead, α ゜, β゜,
γ ゜: irradiation elevation angle, A ゜: optimum elevation angle.

────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] January 7, 1997

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Full text

[Correction method] Change

[Correction contents]

[Document Name] Statement

[Title of the Invention] An apparatus provided with a light source group for illumination

[Claims]

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus provided with an illumination light source group used in an image pickup apparatus for detecting the position of an electronic component or confirming a defect in an electronic component mounting apparatus.

[0002]

2. Description of the Related Art Japanese Patent Application Laid-Open No. 4-3709 discloses an apparatus provided with a conventional illumination light source group (hereinafter referred to as an illumination apparatus).
There is one disclosed in Japanese Patent Application Laid-Open Publication No. 9-No. This illumination device has a pair of illumination light sources spaced apart from each other, electronic components sucked by a suction nozzle are arranged above the illumination light sources, and the illumination light source emits light at a constant angle from below. Illumination was performed at an elevation angle, and reflected light from electronic components was received by a camera or the like.

[0003]

However, in the above-described lighting device, light is always incident on the electronic component at a constant irradiation elevation angle. In some cases, illumination cannot be performed so that reflected light from the camera can be sufficiently received by a camera or the like, and an electronic component cannot be reliably imaged by a camera or the like.

The present invention has been made in view of the above-mentioned problems, and has as its object to provide an illumination device that can illuminate various electronic components so that an area sensor can reliably image them.

[0005]

According to the present invention, there is provided an illumination device for irradiating light to an object to be read in order to pick up an image of the object to be read by an area sensor. Are arranged in a plurality of stages around the reflected light axis extending from the object, and the illumination elevation angle of the illumination light source group in each stage is gradually increased as the distance from the object to be read increases.

In this illuminating device, since the illumination light source group is arranged in a plurality of stages, the object to be read can be illuminated at a plurality of different irradiation elevation angles, and the object to be read is illuminated at the optimum irradiation elevation angle. can do. For example, when an electronic component having a hemispherical lead is to be read and only the lead is recognized, it is effective to turn on a group of illumination light sources near the read target. In this case, the electronic component is illuminated at a smaller irradiation elevation angle, and the reflected light from the lead can be imaged by the area sensor along the reflected optical axis. In addition, it is effective to use, for example, an electronic component having a high reflectance of the lead support surface and a high reflectance of the lead as an object to be read, and illuminating a group of illumination light sources located farther from the electronic component. In this case, the electronic components are illuminated at a large illumination elevation,
The amount of reflected light from the lead along the reflected light axis increases, and an image of the electronic component in which the lead is emphasized can be captured. In addition, for example, it is effective to set an electronic component having a low reflectance of the lead support surface and a high reflectance of the lead as a reading target object, and to turn on an illumination light source group at a farther stage. In this case, the electronic component is illuminated with a larger irradiation elevation angle, the amount of reflected light from the lead along the reflected light axis increases, and an image of the electronic component with the lead enhanced can be taken.

The elevation angles of the illumination light sources at each stage are approximately X ゜ to (X ゜ + 10 °) from the object to be read, respectively.
Assuming a reading target having a plurality of hemispherical leads having a height T of about 45 ° ± 15 ° and about 75 ° ± 15 ° and a pitch P, a formula A ゜ = tan ⁻¹ (( cosX @ .T
−sin (90 ° − ((90 ° −X ゜) / 2)) · T)
/ (P- (cos (90 °-((90 ° -X ゜)) /
2) With respect to the optimum elevation angle A ゜ defined by () + T + sinX ゜ · T)), it is preferable that X ゜ satisfy X ゜ ≧ A 、 and have a value closest to the optimum elevation angle A ゜.

According to this illuminating device, the object to be read is illuminated by the second-stage illuminating light source group at an irradiation elevation angle of 45 ° ± 15 °, and is read by the third-stage illuminating light source group at 75 ° ±±. 1
It is also illuminated at an illumination elevation of 5 °. In particular, by illuminating the reading target having hemispherical leads with the optimal elevation angle A ゜ by the first-stage illumination light source group, a desired image of the reading target can be captured by the area sensor. .

Further, the light is provided outside the first-stage illumination light source group closest to the object to be read, reflects light from the first-stage illumination light source group, and reads the reflected light. It is preferable to provide a reflecting means for irradiating the object. According to this illumination device, the light is emitted from the first-stage illumination light source,
The object to be read is illuminated by the reflected light reflected by the reflecting means. At this time, the optical path can be made longer than in the case of direct illumination, and the reading object is not illuminated with excessive light intensity.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a lighting device according to the present invention will be described below in detail with reference to the accompanying drawings.

As shown in FIG. 1, the illumination device 10A forms a part of the imaging device 10. The lighting device 10A
An opening 1 is provided, and a suction nozzle 2 is provided above the opening 1.
When the electronic component 3 adsorbed on the electronic component 3 passes at high speed, the electronic component 3 is illuminated instantaneously from below. Lighting device 10A
Has a rectangular tube-shaped light source support portion 5 having an opening 1 formed therein. The light source support portion 5 is provided in the light source support portion 5 along the periphery of a reflection optical axis A1 extending from the electronic component 3 toward the electronic component 3. Illumination light source groups 6, 7, 8 for irradiating light are provided in three stages. That is, a first-stage illumination light source group 6 is provided in the uppermost portion of the light source support portion 5, and a second-stage illumination light source group 6 is provided below the first-stage illumination light source group 6. Light source group 7
The third-stage illumination light source group 8 is provided below the second-stage illumination light source group 7.

In this lighting device 10A, the first stage, the second stage
Since the illumination light source groups 6, 7, 8 of the third and third stages are arranged substantially parallel to the reflected optical axis A1, the electronic component 3
The irradiation elevation angle of the light irradiating the light gradually increases as the distance from the electronic component 3 increases. Here, the irradiation elevation angle refers to a plane orthogonal to the reflected light axis A1 and the illumination light source groups 6, 7,.
8 means the angle formed by the light rays. Also, the first
Light source groups 6, 7, 8 for the stage, the second stage or the third stage
Can switch between lighting.

In the imaging device 10, a half mirror 9 and a reflecting mirror 11 are provided below the third-stage illumination light source group 8 on the reflected optical axis A1. From the half mirror 9, a reflected optical axis A2 extends in the direction of light reflected by the half mirror 9, and on the reflected optical axis A2,
A high magnification imaging lens 12 and an area sensor 13 are provided. On the other hand, a reflection optical axis A3 extends from the reflection mirror 11 in the direction of light reflected by the reflection mirror 11, and a low-magnification imaging lens 14 and an area sensor 15 are provided on the reflection optical axis A3. ing. The electronic component 3 is illuminated by a transmission illumination light source 4 provided above the suction nozzle 2.
Can be performed from above.

As shown in FIGS. 2 to 4, the first-stage illumination light source group 6 includes four reflection illumination sections 16 arranged at four sides with respect to the reflection optical axis A1 for uniform illumination. Has,
Each reflection illumination unit 16 is provided with four inner wall surfaces 18 of the light source support 5.
Are arranged correspondingly. Each reflection lighting section 16
Has a reflective illumination light source group 20 on a flat support plate 19 fixed to each inner wall surface 18, and the reflective illumination light source group 20 includes a reflective illumination light source 21 (for example, a light emitting diode).
Are arranged along each inner wall 18 so that a total of 40 light sources 21 are provided. Light source 2 for each reflective illumination
1 directs the output optical axis C1 in the direction of the inner wall surface 18. Further, between the light source group 20 for reflected illumination and each inner wall surface 18, a flat and long reflecting mirror 22 is fixed.
The reflecting mirror 22 irradiates the light emitted from the reflected illumination light source group 20 to the electronic component 3 along the axis C2, and illuminates the electronic component 3 with light at an irradiation elevation angle α ゜. By employing the indirect illumination method in this manner, the optical path length from the reflective illumination light source group 20 to the electronic component 3 can be increased, and the electronic component 3 is not illuminated with excessive light intensity.

As shown in FIG. 4, the first stage illumination light source group 6 has auxiliary illumination portions 24 at the four uppermost corner portions 23 of the light source support portion 5, respectively. The auxiliary illumination unit 24 is for illuminating the electronic component 3 with light supplementarily to a part that cannot be sufficiently imaged by the illumination of the reflection illumination unit 16. Each auxiliary lighting unit 24
Has an auxiliary illumination light source group 25 on an upright plate 26, and the auxiliary illumination light source group 25 includes an auxiliary illumination light source 27.
By arranging five light emitting diodes (for example, light emitting diodes) at each corner 23, a total of 20 light sources 27 are provided. Each auxiliary illumination light source 27 has its emission optical axis D1 directed directly to the electronic component 3 and irradiates the electronic component 3 with light at the same illumination elevation angle as the illumination elevation angle α ゜ of the reflection illumination unit 16 described above. As described above, since the electronic component 31 is also illuminated from the diagonal direction, the uniformity of illumination on the electronic component 3 is further improved.

The elevation angle α 仰 of light irradiation by the first-stage illumination light source group 6 will now be described. The first-stage illumination light source group 6 mainly includes a hemispherical lead 41 shown in FIG.
It is provided in order to recognize only the lead 41, especially for the electronic component 3 having. Therefore, the irradiation elevation angle α ゜ is also set assuming this kind of electronic component 3. In the electronic component 3, a plurality of hemispherical leads 41 having a height T from the specific surface 3a are arranged at a constant pitch P on the lead support surface 3a. About such an electronic component 3,
The irradiation elevation angle α ゜ is set as follows.

That is, when the irradiation elevation angle to be set is X ゜, for each lead 41, the optimum elevation angle A ゜ that can image most of the lead 41 is A ゜ = tan ⁻¹ (cosX ゜ · T −sin (90 ° −
(90 ゜ −X ゜) / 2) · T) / (P− (cos (90
゜ − (90 ° −X ゜) / 2) · T + sinX ゜ · T)), and X ゜ ≧ A ゜ with respect to the optimal elevation angle A ゜, and is closest to the optimal elevation angle A ゜. Determine X ゜ with value. Then, for this X ゜, X ゜ to X ゜ +10
The irradiation elevation angle α ゜ is set in the range of ゜.

For example, for an electronic component 3 with T = 0.6 and P = 1.5, when X ゜ = 8 °, the optimal elevation angle A ゜ is A ゜ = 7.87 °, but X ゜= 7 ゜, A ゜ = 8.08 ゜, and X ゜ <A 、, so
X ゜ = 7 ゜ is inappropriate. When X ゜ is an integer, X ゜ = 8 ゜ for the electronic component 3. At this time,
Since the irradiation elevation angle α ゜ is set in the range of X ゜ to X ゜ + 10 °, the irradiation elevation angle α ゜ is set in the range of 8 ° to 18 °.
Set to ゜. When the electronic component 3 is illuminated at this irradiation elevation angle, only the leads 41 are emphasized and imaged. X ゜ is most preferably X ゜ = A ゜. In this case, it is possible to image the entire lead 41. The irradiation elevation angle α ゜ determined as described above is also applied to an electronic component in which a plurality of disk-shaped leads are arranged in addition to the electronic component 3 having the hemispherical lead 41 described above. Can be done.

As shown in FIGS. 2 and 3, four illumination light source groups 7 at the second stage are arranged in four directions with respect to the reflected light axis A1, and each illumination light source group 7 It is arranged on four swash plates 28 extending obliquely downward from the four inner wall surfaces 18 of the support portion 5. Each of the illumination light source groups 7 has a total of 8 by arranging 20 illumination light sources 29 (for example, light emitting diodes) in three rows from each of the inner wall surfaces 18 along each of the inner wall surfaces 18.
It consists of zero light sources 29. In addition, each lighting light source 2
Reference numeral 9 directs the emission optical axis E1 toward the electronic component 3 and is disposed at a specific irradiation elevation angle β 角 with respect to the electronic component 3. Here, the irradiation elevation angle β ゜ is set to be larger than the irradiation elevation angle α ゜ by the first-stage illumination light source group 6 described above, and is set to, for example, 45 °. However, the irradiation elevation angle β ゜ can be arbitrarily set in the range of 30 ゜ to 60 ゜.

The second stage illumination light source group 7 mainly has a high reflectance of the lead support surface 3a and a high
1 is effective for recognizing the lead 41 of the electronic component 3 having a high reflectance. For example, when the electronic component 3 in which the lead support surface 3a is formed of gold is used, when the second-stage illumination light source group 7 is turned on, the light from the second-stage illumination light source group 7 becomes: Specularly reflected on the lead support surface 3a of the electronic component 3,
The amount of reflected light reflected along the reflected light axis A1 decreases. On the other hand, light is scattered and reflected from the lead 41, and the amount of reflected light reflected from the lead 41 along the reflected light axis A1 increases. As a result, the electronic component image in which the lead 41 is emphasized is captured.

A position facing each swash plate 28 between each illumination light source group 7 of the second stage and the electronic component 3 is a second position.
Diffusion plates 30 are provided to diffuse the light emitted from the respective illumination light source groups 7 in the tier. Therefore, the second
When the illumination light source group 7 in the second stage is turned on, the light emitted from each illumination light source group 7 in the second stage is diffused, and the electronic component 3 is almost uniformly illuminated.

As shown in FIGS. 2 and 3, four illumination light source groups 8 in the third stage are arranged in four directions with respect to the reflected light axis A1, and each illumination light source group 8 It is arranged on a protruding plate 31 extending vertically from each inner wall surface 18 of the support portion 5. The third-stage illumination light source group 8 has a total of 120 illumination light sources 32 (for example, light-emitting diodes) arranged in three rows from the inner wall surface 18 side along each inner wall surface 18. Has become.

Each illumination light source 32 has an emission optical axis F1.
Are directed toward the electronic component 3, and are arranged at a specific irradiation elevation angle γ ゜ with respect to the electronic component 3. Here, the irradiation elevation angle γ ゜ is set to be larger than the irradiation elevation angle β ゜ by the second-stage illumination light source group 7 described above, and is set to, for example, 75 °. However, the irradiation elevation angle γ ゜ can be arbitrarily set in the range of 60 ° to 90 ° depending on the type of the electronic component 3 to be used.

The third stage illumination light source group 8 mainly has a low reflectance of the lead support surface 3a and the
1 is effective for recognizing the lead 41 of the electronic component 3 having a high reflectance. In this case, when the third-stage illumination light source group 8 is turned on, the emission light axis group F1
Are emitted along. At this time, the amount of reflected light from the lead 41 increases, and the amount of reflected light from the lead supporting surface 3a of the electronic component 3 having a low reflectance decreases. As a result, the electronic component image in which the lead 41 is emphasized is captured.

As shown in FIGS. 2 and 3, immediately before the third-stage illumination light source group 8 disposed farthest from the electronic component 3, dust entering the image pickup device 10 is removed. A dust-proof glass 33 for preventing intrusion is provided.
Is made of, for example, transparent glass. Even if the dust-proof glass 33 reflects the light emitted from the third-stage illumination light source group 8, the dust-proof glass 33 guides the reflected light into the optical path B1 indicated by the two-dot chain line and the optical path B2 indicated by the solid line. There is no. Therefore, the image of the third stage illumination light source group 8 is not captured by the area sensors 13 and 15. Also,
Since it is not necessary to apply the anti-reflection coating to the dust-proof glass 33, the cost can be reduced, and sufficient emitted light can be obtained without reducing the light passing through the dust-proof glass 33.

The first to third illuminating light source groups 6, 7 and 8 described above are arranged outside the optical paths B1 and B2. , 8 are in optical path B
No image is captured by the area sensors 13 and 15 after passing through the areas 1 and B2.

As shown in FIG. 6, the first to third stages of the light source groups 6, 7, 8 for the first to third stages can be switched between lighting by the switching control circuit 34. Has become. In the switching control circuit 34, the first, second, and third-stage illumination light source groups 6,
Illumination circuit units 35, 36, and 37 for 7, 8 are connected in parallel, and changeover switches 38, 39, and 40 are connected in series for each of the illumination circuit units 35, 36, and 37, respectively. The light source groups 6, 7, 8 for lighting are turned on / off independently by turning on / off the switches 38, 39, 40. Each lighting circuit 35,
36 and 38 are configured by connecting the same number of illumination light sources (light emitting diodes) connected in series in parallel.

As shown in FIG. 7, the changeover switch 38 includes a plurality of (for example, two) terminals 42 and 43 in which resistors R and r (R> r) are connected in parallel; 4
3 and a switch lever 44 connected to the switch lever 3. When connecting the switch lever 44 to the terminal 42,
Since a large resistance is connected to the terminal 42, the current flowing through the illumination light source is reduced. On the other hand, when the switch lever 44 is connected to the terminal 43, the terminal 43 is connected to a small resistor, so that the current flowing through the light source for illumination increases. Accordingly, the amount of light emitted from the illumination light source can be adjusted in two steps. Also, changeover switches 39 and 4
0 has the same configuration as the changeover switch 38 described above. The reason why the amount of emitted light can be adjusted in this way is that when imaging the electronic component 3, light is strongly reflected from both the lead 41 and the lead support surface 3 a of the electronic component 3 due to an excessive amount of emitted light. This is to prevent the leads 41 and the lead support surface 3a from being difficult to distinguish.

Next, based on the above-described configuration, the lighting device 1
The operation of the imaging device 10 to which 0A is applied will be briefly described.

First, the first-stage illumination light source group 6 of the illumination device 10A is turned on to irradiate the electronic component 3 with light.
At this time, the first-stage illumination light source group 6 includes the reflected light axis A
1, the electronic component 3 is almost uniformly illuminated from the periphery by the first-stage illumination light source group 6. The light reflected along the reflected optical axis A1 on the lower surface of the electronic component 3 is reflected by the half mirror 9 while forming the optical path B1, and the reflected light is imaged at a high magnification along the reflected optical axis A2. Incident on the lens 12,
Thus, an image is formed on the area sensor 13. At this time, the area sensor 13 captures a local image of the electronic component 3.

On the other hand, light reflected along the reflection optical axis A1 on the lead support surface 3a of the electronic component 3 passes through the half mirror 9 while forming the optical path B2, is reflected by the reflection mirror 11, and is reflected by the reflection mirror 11. Light enters the low-magnification imaging lens 14 along the reflection optical axis A3, and is imaged on the area sensor 15 by the imaging lens 14. At this time, the area sensor 1
At 5, the entire image of the electronic component 3 is captured. The electronic component 3 includes a first-stage illumination light source group 6 of the illumination device 10A.
Is switched to the second-stage illumination light source group 7, the light is radiated by the second-stage illumination light source group at a larger irradiation elevation angle. Which stage of the illumination light source group is turned on depends on the shape or properties of the target electronic component 3.

The present invention is not limited to the above embodiment. For example, the illumination light source groups 6, 7, 8 are arranged in three stages, but the illumination light source groups 6, 7, 8 need only be two or more stages. Also in this case, desired electronic component images can be captured for the electronic components 3 having various shapes and properties.

Although the illumination light source groups 6, 7, 8 are arranged on four sides with respect to the reflected light axis A1, the illumination light source groups 6, 7, 8 may be arranged in a ring shape. Even in this case, the electronic component 3 can be uniformly illuminated.

[0034]

As described above, in the illumination device according to the present invention, the illumination light source group is arranged in a plurality of stages around the reflection optical axis extending from the object to be read, and the illumination light source group of each stage is arranged. Since the irradiation elevation angle is gradually increased as the distance from the object to be read increases, it is possible to illuminate various area electronic components so that they can be reliably imaged by the area sensor.

[Brief description of the drawings]

FIG. 1 is an end view showing a preferred embodiment of an imaging device to which a lighting device according to the present invention is applied.

FIG. 2 is a sectional view showing the lighting device of FIG. 1;

FIG. 3 is a partially cutaway perspective view showing the lighting device of FIG. 1;

FIG. 4 is a plan view showing a first-stage illumination light source group from the reading object side.

FIG. 5 is a side view of an electronic component having hemispherical leads.

FIG. 6 is a circuit diagram illustrating a switching control circuit.

FIG. 7 is a circuit diagram showing an internal configuration of a changeover switch.

[Description of Signs] 3 ... Electronic components (reading target), 6, 7, 8 ... Light source group for illumination, 13, 15 ... Area sensor, 22 ... Reflection mirror (reflection means), 33 ... Dustproof glass, 41 ... Lead , Α ゜, β ゜,
γ ゜: irradiation elevation angle, A ゜: optimum elevation angle.

[Procedure amendment 2]

[Document name to be amended] Drawing

[Correction target item name] Fig. 1

[Correction method] Change

[Correction contents]

FIG.

[Procedure amendment 3]

[Document name to be amended] Drawing

[Correction target item name] Figure 2

[Correction method] Change

[Correction contents]

FIG. 2

[Procedure amendment 4]

[Document name to be amended] Drawing

[Correction target item name] Figure 3

[Correction method] Change

[Correction contents]

FIG. 3

[Procedure amendment 5]

[Document name to be amended] Drawing

[Correction target item name] Fig. 4

[Correction method] Change

[Correction contents]

FIG. 4

[Procedure amendment 6]

[Document name to be amended] Drawing

[Correction target item name] Fig. 6

[Correction method] Change

[Correction contents]

FIG. 6

Claims (5)

[Claims] 1. An imaging apparatus comprising: an illumination light source group that irradiates light to an object to be read; and an area sensor that captures an image of the object to be read using light from the illumination light source group. A plurality of light sources are arranged around the reflected light axis extending from the object to be read around the light source group, and the illumination elevation angle of the illumination light source group at each stage is gradually increased as the distance from the object to be read increases. An image pickup apparatus characterized in that the lighting between the illumination light source groups in a row is selectively switched. 2. The imaging apparatus according to claim 1, wherein the illumination light source group is arranged in three stages. 3. The irradiation elevation angles of the illumination light source groups of the respective stages are respectively approximately X ゜ to (X ゜ +1) from the reading object side.
0 °), approximately 45 ° ± 15 °, approximately 75 ° ± 15 °, and assuming the reading object in which a plurality of hemispherical leads having a height T are arranged at a pitch P, the expression A 式 = tan ^-1 ((cosX ゜ · T-sin (90 ゜-
((90 ° −X ゜) / 2)) · T) / (P− (cos)
(90 °-((90 ° -X ゜) / 2)) · T + sinX
゜ · T)) With respect to the optimal elevation angle A ゜ defined by
3. The imaging apparatus according to claim 2, wherein A ゜ is satisfied and has a value closest to the optimum elevation angle A ゜. 4. A light source provided outside the first-stage illumination light source group closest to the object to be read, and reflects light from the first-stage illumination light source group. The imaging device according to claim 1, further comprising a reflection unit configured to irradiate light onto the object to be read. 5. The imaging apparatus according to claim 1, wherein a dust-proof glass is provided immediately before the illumination light source group at the farthest stage from the object to be read.