JPH10217068A - Thermal displacement correcting device of work finishing machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable highly accurate machining by correcting a thermal displacement due to variation in ambient temperature by a simple operation in a groove cutting operation for such as quartz bar. SOLUTION: A moving table 18 comprises a ball screw 22 as moving means and driving means such as servo motor 26 to drive the ball screw 22. Also a sensor 38 to detect the start point 36a and end point 36b of a scale for correction reference which is provided independently from a work finishing machine 14 is installed on the moving table, start point and end point detecting signals from the sensor are input into B NC controlled calculation means 34 so as to calculate the nominal value length of the scale for correction reference, a moved distance of the moving table corresponding to the scale length or the length of a ball screw section corresponding to the moved distance, and an error between the scale length of the scale for correction reference and the moved distance or the length of the ball screw section, and parameters to control the drive means are adjusted automatically.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a work, for example, a wafer carrier boat or a quartz rod provided for a wafer carrier boat, which is mounted and fixed on a movable movable table, and moves the movable table. In a work processing machine for processing a work, for example, a grooving process, a moving table is precisely moved to perform high-precision processing, for example, a thermal displacement correction device in a work processing machine capable of performing a grooving process. And a method for grooving a wafer carrier boat or quartz rod using the apparatus.

[0002]

2. Description of the Related Art Generally, grooving for forming a large number of grooves in a wafer carrier boat used for heat treatment of a semiconductor or a quartz rod provided for a wafer carrier boat is performed by an NC control grooving machine. It is done in. The grooving machine includes a movable moving table for mounting and fixing a workpiece (a workpiece, that is, a wafer carrier boat or a quartz rod), a ball screw for moving the moving table in a predetermined direction, and driving the ball screw. Driving means for
For example, it is composed of a servomotor and an NC control unit that controls the driving means (for example, instructs the servomotor on the number of rotations).

Further, since this grooving machine is used under a normal environment without temperature control, a ball screw and a moving table are thermally displaced in accordance with a change in external temperature, and the air temperature is reduced. When it is high, it expands and contracts when the temperature drops. In other words, ball screws and the like shrink in the morning and evening due to the low temperature in the day, expand in the daytime due to the high temperature, and expand in the summer season and shrink in the winter season. .

[0004] For this reason, when performing the above-mentioned grooving on a wafer carrier boat, a quartz rod, or the like,
Before the grooving of the product, it was necessary to perform a trial cutting, actually measure the formed groove, check whether it was cut up as indicated, and then perform the grooving of the product for the first time. .

[0005] In addition, since the work for correcting the thermal displacement requires time and labor, it is not possible to perform the work frequently because the work efficiency is reduced, and it is impossible to perform the correction work at most once a day at most. It was the limit to do. Therefore,
It is a fact that the grooving machine could not be corrected at all for the temperature change during the day. In addition, the correction work itself is performed by the operation of the program by the operator's hand,
It was very cumbersome and required accuracy.

That is, the grooving machine is affected by environmental changes (machine temperature, cutting fluid temperature, etc.)
The numerical value of the NC control unit is adjusted so as to achieve the desired processing size. However, the numerical control of the NC control unit is frequently required, and the operation for the numerical adjustment is complicated. Therefore, real-time adjustment according to environmental changes was impossible. In other words, since the temperature of the grooving machine itself changes, there is a problem that required accuracy cannot be obtained.

[0007] A method of correcting thermal displacement in a general processing machine is described in, for example, JP-A-62-187204, JP-A-63-27245, JP-A-64-23340, and JP-A-Hei.
-295742, JP-A-1-295743, JP-A-2-
Various proposals such as 243248 have been made, but none of them have been sufficient for high precision processing of quartz glass products.

[0008]

The inventors of the present invention have conducted intensive studies in order to solve the above-mentioned problems of the prior art, and as a result, a desired processing accuracy can be easily obtained in any environment. We have invented a thermal displacement correction device for a work machine that enables high precision processing of glass products. As a result, even if the temperature of the processing machine changes frequently, it is possible to automatically perform correction each time processing such as grooving is performed. It was maintained at a remarkably high precision, and it was possible to achieve sufficiently satisfactory results.

According to the present invention, it is possible to perform correction for thermal displacement caused by a change in external temperature by a simple operation, and to perform high-precision processing, for example, groove cutting for a wafer carrier boat or a quartz rod. It is an object of the present invention to provide a thermal displacement compensating device for a work processing machine as described above and a method for grooving a wafer carrier boat or quartz rod using the device.

[0010]

Means for Solving the Problems In order to solve the above-mentioned problems, a thermal displacement compensating device in a work machine according to the present invention comprises:
A movable table on which a workpiece can be placed and fixed, and a movable table, a ball screw for moving the movable table in a predetermined direction, and a driving unit for driving the ball screw;
An NC control operation means for controlling the drive means and performing a predetermined operation based on the input processing information, wherein the correction reference scale having a predetermined nominal scale length is connected to the work processing machine. And a sensor capable of detecting the starting point and the ending point of the correction reference scale attached independently to the moving table, moving the moving table and moving the moving table to the starting point of the correction reference scale. An end point is detected, and a start point detection signal and an end point detection signal from the sensor are input to the NC control calculating means, and the movement corresponding to the nominal value length of the correction reference scale and the scale length of the correction reference scale is performed. The moving distance of the table or the length of the ball screw portion corresponding to this moving distance and the scale length of the correction reference scale and the moving distance or An error with the length of the ball screw portion is calculated, and the NC control calculating means automatically adjusts a parameter for controlling the driving means based on the calculated error, thereby correcting the error. Features.

As the work, a wafer carrier boat or a quartz rod provided for a wafer carrier boat can be used, and the processing is performed by forming a plurality of grooves having a predetermined width and a predetermined interval with respect to the quartz rod. Cutting can be performed.

As the correction reference scale, any scale can be used as long as it is not affected by a change in temperature. Quartz glass has the lowest coefficient of thermal expansion and is most suitable.

As the sensor, any of a contact type and a non-contact type can be applied, and examples thereof include a touch sensor and an optical sensor.

The method for grooving a wafer carrier boat or a quartz rod according to the present invention uses the above-described apparatus, and (1) moves a wafer carrier boat or a quartz rod to be grooved to a moving table of a grooving machine. (2) moving the moving table so that the sensor detects the start point and the end point of the correction reference scale, and controls the start point detection signal and the end point detection signal from the sensor by the NC control. The error is calculated by inputting to the calculating means and calculating the difference between the nominal value length of the correction reference scale and the moving distance of the moving table corresponding to the scale length of the correcting reference scale or the length of the ball screw portion corresponding to the moving distance. (3) determining whether the error is equal to or greater than a predetermined value; and (4) performing the drive in the NC control calculating means based on the calculated error. Automatically adjusting a parameter for controlling the means, correcting the error, and matching a nominal value length of the correction reference scale with a moving distance of the moving table or a ball screw portion corresponding to the moving distance. And (5) performing a grooving process on the wafer carrier boat or the quartz bar under predetermined grooving conditions, and when the error is equal to or more than a predetermined value, the above (4) (5) If the error is less than a predetermined value, the step (4) is omitted and the step (5) is performed.

[0015]

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a perspective explanatory view showing one embodiment of a thermal displacement correction device for a work processing machine according to the present invention.

In the figure, reference numeral 12 denotes a thermal displacement correcting device for a work processing machine according to the present invention, which includes a work processing machine 14. The work processing machine 14 has a movable table 18 on which a work, for example, a wafer carrier boat or a quartz rod, for example, a quartz round bar 16 provided for the wafer carrier boat can be mounted and movable. In the illustrated example, the work 16 is shown as four quartz round bars fixed on a carbon work table 20 via wax or the like.

The moving table 18 is moved along the ball screw 22 by rotating a ball screw 22 attached to the lower surface side. 24, 24 are bearings for rotatably supporting the shaft portion 22a of the ball screw 22. When grooving the quartz round bar 16 or the like, the moving table 18 is intermittently moved at a predetermined grooving interval, and a cutting means (not shown) such as a diamond cutter blade is used. To perform groove cutting.

Reference numeral 26 denotes a servo motor,
Acts as a driving means for rotationally driving the. The drive shaft 28 of the servo motor 26 is connected to one shaft portion 2 of the ball screw 22.
The pulley 30 is connected to a pulley 30 provided via a pulley belt 32. The rotation of the drive shaft 28 causes the ball screw 22 to rotate via the pulley 30.

Reference numeral 34 denotes an NC control operation means,
That is, it controls the servo motor 26 and performs a predetermined calculation based on the input processing information.

Reference numeral 36 denotes a correction reference scale having a predetermined nominal scale length.
And is provided independently. That is, the correction reference scale 36 is connected to the moving table 18 of the workpiece processing machine 14.
Are provided independently so as not to be affected by the thermal displacement. As a material of the correction reference scale 36, any material can be used as long as it is not affected by a change in temperature. However, quartz glass has the lowest coefficient of thermal expansion and is most preferably used.

The sensor 38 is provided at an appropriate position of the moving table 18, in the illustrated example, at a side end of the moving table 18.
Is attached. The sensor 38 operates to detect a start point 36a and an end point 36b of the correction reference scale 36.

The sensor 38 is connected to the correction reference scale 3.
It is only necessary to have a function capable of detecting the start point 36a and the end point 36b of No. 6, and there is no particular limitation, and any of a contact type and a non-contact type can be used. For example, a touch sensor or an optical sensor is used. be able to. In the illustrated example, a case where a touch sensor is provided as the sensor 38 is shown.

The case where the work 16 such as a wafer carrier boat or a quartz round bar is grooved by the above configuration will be further described with reference to FIG. In this example, a case where a touch sensor is used as the sensor 38 will be described.

First, as shown in FIG. 1, a work 16 (four in the illustrated example) such as a quartz round bar for cutting a groove is bonded and fixed on a carbon work table 20 by a bonding means such as wax. 101).

The work table 2 on which the work 16 is fixed on the upper surface
0 is placed and fixed on the moving table 18 of the work processing machine 14 (102).

A diamond cutter blade is selected according to the groove size formed in the work 16 (103).

By moving the moving table 18, the quartz glass correction reference scale 36 (for example, with a nominal value of 80)
The touch sensor 38 is brought into contact with the start point 36a and the end point 36b (0.00 mm) (104).

The start point contact signal and the end point contact signal from the touch sensor 38 are input to the NC control operation means 34, and the nominal value length of the correction reference scale 36 (for example, 80
An error between the movement distance of the movement table 18 corresponding to the scale length of the correction reference scale 36 and the length of the ball screw 22 corresponding to the movement distance is calculated (105).

The NC control calculating means 34 determines whether the calculated error is equal to or greater than a predetermined value (106).

If the error is equal to or greater than a predetermined value, the NC control calculating means 34 automatically adjusts a parameter for controlling the driving means 26 based on the error, corrects the error, and corrects the correction reference. The nominal length of the application scale 36 and the moving distance of the moving table 18 or the length of the ball screw 22 corresponding to this moving distance are matched (1).
07).

If the error is equal to or greater than a predetermined value, after correcting the above-described error, the grooving is performed on the work 16 under predetermined grooving conditions (108). If the error does not reach the predetermined value, it is not necessary to correct the above-described error, and therefore, the groove cutting (108) may be performed directly without performing the error correction.

A work 16 such as a rounded quartz bar or the like that has been subjected to groove processing.
Is removed from the carbon work table 20. The carbon work table 20 is used after cleaning the wax and the like adhering thereto.

A work 16 such as a round bar made of quarted quartz.
After drying, the groove width and the groove cumulative pitch are actually measured by a three-dimensional coordinate measuring machine, and if they are finished as indicated, they will flow to the next step.

In the conventional method, it is necessary to measure the groove width and the groove cumulative pitch by the above-described three-dimensional coordinate measuring machine at a frequency of one line / batch, and the measured value may be out of the indicated value. The work was complicated, and the material yield was poor.

According to the method of the present invention, as for the frequency of the above-mentioned measurement, one sample / day is sufficient for confirmation, and the measured value never deviates from the specified value. This not only eliminates the complexity of the operation but also improves the material yield.

[0036]

As described above, according to the present invention, it is possible to perform correction for thermal displacement caused by a change in external temperature by a simple operation, and to perform high-precision processing, for example, a wafer carrier boat or a wafer carrier. Groove processing can be performed on a quartz rod provided to a boat, and therefore a high-precision wafer carrier boat can be directly produced, or a high-precision wafer carrier boat can be produced using the grooved quartz rod. The great effect that can be achieved is achieved.

[Brief description of the drawings]

FIG. 1 is an explanatory perspective view showing one embodiment of a thermal displacement correcting device for a work processing machine according to the present invention.

FIG. 2 is a flowchart showing an example of a process order of the method for grooving a quartz round bar according to the present invention.

[Explanation of symbols]

 Reference Signs List 12 Thermal displacement correction device 14 Work processing machine 16 Work, quartz round bar 18 Moving table 20 Carbon work table 22 Ball screw 22a Shaft portion 24 Bearing 26 Servo motor 28 Drive shaft 30 Pulley 32 Pulley belt 34 NC control calculation means 36 Correction reference Scale 36a Start point 36b End point 38 Sensor, touch sensor

Claims (4)

[Claims] 1. A movable table on which a work can be placed and fixed, the movable table being movable, a ball screw for moving the movable table in a predetermined direction, a driving means for driving the ball screw, and controlling the driving means. And an NC control operation means for performing a predetermined operation based on the input processing information, the correction reference scale having a predetermined nominal scale length is provided independently of the work processing machine. A sensor that is installed and capable of detecting the start point and end point of the correction reference scale is attached to the moving table, the moving table is moved, and the sensor detects the start point and the end point of the correction reference scale, A start point detection signal and an end point detection signal from the sensor are input to the NC control calculation means, and the nominal value length of the correction reference scale and the correction The moving distance of the moving table corresponding to the scale length of the reference scale or the length of the ball screw portion corresponding to the moving distance and the error between the scale length of the correction reference scale and the moving distance or the length of the ball screw portion In the workpiece processing machine, wherein the NC control calculation means automatically adjusts a parameter for controlling the driving means based on the calculated error, and corrects the error. Thermal displacement correction device. 2. A grooving process in which the workpiece is a wafer carrier boat or a quartz rod provided for a wafer carrier boat, and a plurality of grooves having a predetermined width and a predetermined interval are formed on the wafer carrier boat or the quartz rod. 2. The thermal displacement compensating device in a work machine according to claim 1, wherein 3. The thermal displacement compensator according to claim 2, wherein the compensation reference scale is made of quartz glass. 4. A step of: (1) mounting and fixing a wafer carrier boat or a quartz rod to be subjected to grooving on a moving table of a grooving machine using the apparatus according to claim 3. (2) The moving table is moved, and the start point and the end point of the correction reference scale are detected by the sensor,
The start point detection signal and the end point detection signal from the sensor are
The error between the nominal value length of the correction reference scale and the movement distance of the moving table corresponding to the scale length of the correction reference scale or the length of the ball screw portion corresponding to the movement distance, which is input to the C control calculating means. And calculating
(3) determining whether the error is equal to or greater than a predetermined value;
(4) The NC control calculating means automatically adjusts parameters for controlling the driving means based on the calculated error, corrects the error, corrects the nominal value length of the correction reference scale and the movement table. And (5) performing a grooving process on the wafer carrier boat or the quartz bar under predetermined grooving conditions. If the error is equal to or greater than the predetermined value, the steps (4) and (5) are performed. If the error is less than the predetermined value, the step (4) is omitted and the step (5) is omitted. A method of grooving a wafer carrier boat or quartz rod, wherein the method is performed.