JPH1021404A - Circuit pattern read and input device for printed wiring board - Google Patents

Circuit pattern read and input device for printed wiring board

Info

Publication number
JPH1021404A
JPH1021404A JP8210389A JP21038996A JPH1021404A JP H1021404 A JPH1021404 A JP H1021404A JP 8210389 A JP8210389 A JP 8210389A JP 21038996 A JP21038996 A JP 21038996A JP H1021404 A JPH1021404 A JP H1021404A
Authority
JP
Japan
Prior art keywords
circuit pattern
wiring board
printed wiring
light
light source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8210389A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Yamaumi
嘉之 山海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KIYOUSHIYA KK
Original Assignee
KIYOUSHIYA KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KIYOUSHIYA KK filed Critical KIYOUSHIYA KK
Priority to JP8210389A priority Critical patent/JPH1021404A/en
Publication of JPH1021404A publication Critical patent/JPH1021404A/en
Pending legal-status Critical Current

Links

Landscapes

  • Image Analysis (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Image Processing (AREA)

Abstract

PROBLEM TO BE SOLVED: To precisely read the line width of a circuit pattern on a printed wiring board by receiving transmission light passing through the printed wiring board from a light source and outputting a circuit pattern picture data in an image sensor and detecting the transmission light and controlling the light emission of the light source in an optical sensor. SOLUTION: The image sensor 2 receives transmission light passing through the printed wiring board P from the light source 1 and reads the form of the circuit pattern Y. The optical sensor 5 senses the light quantity and the optical spectrum of transmission light passing through the printed wiring board P from the light source 1 and sends a control signal to an inventor control circuit 4. Namely, the optical sensor 5 detects the difference of transmission light from the printed wiring board P by the difference of the material of a board Pa as the difference of light quantity and the optical spectrum, feeds back it to the inventor control circuit 4, controls the inventor 3 and adjusts the light source 1 so that a prescribed condition is obtained for the image sensor 2 even if the material of the substrate Pa changes.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、プリント配線板
の基板上に形成された回路の配線欠陥を配線の外観検査
で見つけ出すために、プリント配線板上の回路パターン
を光学的に読み取って回路パターン画像データ(画像電
気信号)を得る装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit pattern formed by optically reading a circuit pattern on a printed wiring board in order to find a wiring defect of a circuit formed on the substrate of the printed wiring board by inspecting the appearance of the wiring. The present invention relates to an apparatus for obtaining image data (image electric signal).

【0002】[0002]

【従来の技術】一般にプリント配線板の回路パターンの
欠陥の主なものとして、断線欠陥、短絡欠陥、細り欠
陥、太り欠陥がある。すなわち図2に示すように、プリ
ント配線板Pの基板上に形成された回路パターンYの一
部に、断線欠陥Q1や、短絡欠陥Q2や、細り欠陥Q3
や、太り欠陥Q4が生ずる場合がある。細り欠陥Q3
は、正常な設計上の線幅Wに対して許される細り許容仕
様を超えて線幅が異常に細くなった状態であり、太り欠
陥Q4は、正常な設計上の線幅Wに対して許される太り
許容仕様を超えて線幅が異常に太くなった状態である。
細り欠陥Q3や太り欠陥Q4は、未だ断線欠陥や短絡欠
陥に至っていないが、断線状態や短絡状態に至る可能性
の高い重大な欠陥である。
2. Description of the Related Art In general, the main defects in a circuit pattern of a printed wiring board include a disconnection defect, a short-circuit defect, a thin defect, and a fat defect. That is, as shown in FIG. 2, a part of the circuit pattern Y formed on the substrate of the printed wiring board P includes a disconnection defect Q1, a short-circuit defect Q2, and a thin defect Q3.
Or, a fat defect Q4 may occur. Thin defect Q3
Is a state where the line width is abnormally thinner than the allowable thinning specification allowed for the normal design line width W, and the fat defect Q4 is the allowable line width W for the normal design line width W. In this state, the line width has become abnormally thicker than the allowable thickening specification.
The thin defect Q3 and the fat defect Q4 are serious defects that have not yet resulted in a disconnection defect or a short-circuit defect, but are likely to be in a disconnection state or a short-circuit condition.

【0003】このような回路パターンの欠陥を見つけ出
すために、回路パターンの外観検査が欠かせないものと
なっており、この外観検査として、コンピュータを用い
た画像認識による回路パターン検査が多用されている。
すなわちプリント配線板P上の回路パターンYをCCD
(電荷結合素子)カメラで読み取り、これを回路パター
ン画像データとしてCPU(コンピュータの中央処理装
置)に入力し、予め記憶された正常な回路パターンの画
像データと比較照合して、プリント配線板P上の回路パ
ターンYにおける欠陥の有無を検査している。そしてプ
リント配線板Pの背面から光を照射しプリント配線板P
を透過した透過光をCCDカメラで受け、その透過光の
光量や光スペクトルが回路パターンYの存する部分と存
しない部分で異なることから、CCDカメラで回路パタ
ーンYを読み取ってCPUに回路パターン画像データを
入力する装置が用いられている。また一方、プリント配
線板Pの基板には、フェノール樹脂基板、エポキシ樹脂
基板、ポリイミド樹脂基板など、用途によって種々の材
質の基板が用いられる。
In order to find such a defect in a circuit pattern, an appearance inspection of the circuit pattern is indispensable. As the appearance inspection, a circuit pattern inspection by image recognition using a computer is frequently used. .
That is, the circuit pattern Y on the printed wiring board P is
(Charge Coupled Device) Read by a camera, input this as circuit pattern image data to a CPU (Central Processing Unit of a computer), compare it with image data of a normal circuit pattern stored in advance, The presence or absence of a defect in the circuit pattern Y is inspected. Then, light is emitted from the back of the printed wiring board P to
The CCD camera receives the transmitted light transmitted through the CCD camera, and since the amount of light and the light spectrum of the transmitted light are different between the portion where the circuit pattern Y exists and the portion where the circuit pattern Y does not exist, the circuit pattern Y is read by the CCD camera and the CPU outputs the circuit pattern image data. Is used. On the other hand, as the substrate of the printed wiring board P, substrates of various materials such as a phenol resin substrate, an epoxy resin substrate, and a polyimide resin substrate are used depending on the application.

【0004】[0004]

【発明が解決しようとする課題】このような従来のプリ
ント配線板の回路パターン読み取り入力装置では、プリ
ント配線板の基板の材質によって光の透過率が異なるこ
とから、プリント配線板の背面から光を照射する光源の
発光が同じであっても、プリント配線板を透過した光の
光量や光スペクトルが基板の材質によって変化し、その
結果、CCDの作動電圧のスレシホールド(しきい値)
の関係で、プリント配線板上の回路パターンの実際の線
幅が同じであっても、CCDで読み取った回路パターン
の線幅が基板の材質によって異なり、CCDで読み取ら
れる回路パターン画像の線幅が、正しい線幅よりも細く
あるいは太く認識される恐れがある。この発明は、プリ
ント配線板の基板の材質が変わってもプリント配線板上
の回路パターンの線幅がCCDによって正しく読み取ら
れるようにするものである。
In such a conventional circuit pattern reading and input device for a printed wiring board, since the light transmittance varies depending on the material of the substrate of the printed wiring board, light is transmitted from the back surface of the printed wiring board. Even if the light emitted from the light source emits the same light, the amount of light and the light spectrum transmitted through the printed wiring board change depending on the material of the substrate. As a result, the threshold of the operating voltage of the CCD (threshold) is obtained.
Therefore, even if the actual line width of the circuit pattern on the printed wiring board is the same, the line width of the circuit pattern read by the CCD differs depending on the material of the substrate, and the line width of the circuit pattern image read by the CCD May be recognized as being thinner or thicker than the correct line width. An object of the present invention is to allow a line width of a circuit pattern on a printed wiring board to be correctly read by a CCD even if the material of the substrate of the printed wiring board is changed.

【0005】[0005]

【課題を解決するための手段】上記の課題を解決するた
めに、この発明のプリント配線板の回路パターン読み取
り入力装置は、回路パターンが形成されたプリント配線
板を背面から照射する光源と、この光源からプリント配
線板を透過した透過光を受光してプリント配線板上の回
路パターンを読み取り回路パターン画像データを出力す
るイメージセンサーと、この透過光を検知しする光セン
サーを設け、プリント配線板の基板の材質の違いによる
プリント配線板からの透過光の差を、その透過光量や透
過光スペクトルの差としてこの光センサーで検知し、こ
の検知信号に基づき、基板の材料が違ってもイメージセ
ンサーの受光が一定となるよう光源の発光を制御する。
In order to solve the above-mentioned problems, a circuit pattern reading and input device for a printed wiring board according to the present invention comprises: a light source for irradiating a printed wiring board on which a circuit pattern is formed from a back surface; An image sensor that receives the transmitted light transmitted through the printed wiring board from the light source and reads the circuit pattern on the printed wiring board and outputs circuit pattern image data, and an optical sensor that detects this transmitted light are provided. This optical sensor detects the difference in transmitted light from the printed wiring board due to the difference in the material of the board as the difference in the amount of transmitted light and the spectrum of the transmitted light.Based on this detection signal, even if the material of the board is different, the image sensor The light emission of the light source is controlled so that the light reception becomes constant.

【0006】[0006]

【発明の実施の形態】この発明のプリント配線板の回路
パターン読み取り入力装置の実施の形態として、回路パ
ターンが形成されたプリント配線板の背面を照射する光
源と、この光源からプリント配線板を透過した透過光を
受光してプリント配線板の回路パターンを読み取り回路
パターン画像データを出力するイメージセンサーと、こ
の透過光を検知して上記光源の発光を制御する光センサ
ーを設けるものであるが、以下図1を参考にして、この
発明のプリント配線板の回路パターン読み取り入力装置
の一つの具体的な実施の形態について説明する。Pはプ
リント配線板で、その基板Paの表面に、回路パターン
Yが形成されている。1は光源で、平行光線が得られる
よう横長蛍光灯からなる面光源である。そして光源1は
プリント配線板Pの裏面を照射する。2はCCDで構成
したイメージセンサーで、光源1からプリント配線板P
を透過した透過光を受光して回路パターンYの形状を読
み取るものである。3はインバーター、4はインバータ
ー制御回路で、PWM方式(パルス幅変調方式)によっ
て光源1のパルス点灯のタイミングを変えて光源1から
発す。る光の調光を行う。5は光センサーで、光源1か
らプリント配線板Pを透過した透過光の光量や光スペク
トルを感知して、インバーター制御回路4に制御信号を
送るものである。そしてこのプリント配線板の回路パタ
ーン読み取り入力装置では、基板Paの材質の違いによ
るプリント配線板Pからの透過光の差を、その光量や光
スペクトルの差として光センサー5で検知し、これをイ
ンバーター制御回路4にフィードバックしてインバータ
ー3を制御し、基板Paの材質が変わってもイメージセ
ンサー(CCD)2に対し一定の条件の受光が得られる
よう光源1の調光を行うものである。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As a preferred embodiment of a circuit pattern reading and input device for a printed wiring board according to the present invention, a light source for irradiating the back surface of a printed wiring board on which a circuit pattern is formed, and a light source for transmitting the printed wiring board from the light source. An image sensor that receives the transmitted light, reads the circuit pattern of the printed wiring board and outputs circuit pattern image data, and an optical sensor that detects the transmitted light and controls the light emission of the light source. With reference to FIG. 1, one specific embodiment of a circuit pattern reading and input device for a printed wiring board according to the present invention will be described. P is a printed wiring board, and a circuit pattern Y is formed on the surface of the substrate Pa. Reference numeral 1 denotes a light source, which is a surface light source composed of a horizontally long fluorescent lamp so as to obtain a parallel light beam. Then, the light source 1 irradiates the back surface of the printed wiring board P. Reference numeral 2 denotes an image sensor composed of a CCD.
In this case, the shape of the circuit pattern Y is read by receiving the transmitted light transmitted therethrough. Reference numeral 3 denotes an inverter, and 4 denotes an inverter control circuit, which emits light from the light source 1 by changing the pulse lighting timing of the light source 1 by a PWM method (pulse width modulation method). Dimming the light. Reference numeral 5 denotes an optical sensor which senses the amount of light and the optical spectrum of light transmitted from the light source 1 through the printed wiring board P and sends a control signal to the inverter control circuit 4. In the circuit pattern reading and input device for a printed wiring board, a difference in transmitted light from the printed wiring board P due to a difference in the material of the substrate Pa is detected by the optical sensor 5 as a difference in light amount or light spectrum, and this is detected by an inverter. The inverter 3 is controlled by feeding back to the control circuit 4, and the light source 1 is adjusted so that the image sensor (CCD) 2 can receive light under certain conditions even when the material of the substrate Pa changes.

【0007】なお、光源からの光をプリント配線板Pの
表面(回路パターンが形成されいる面)に照射してその
反射光をイメージセンサー2が受光して回路パターンY
の形状を読み取る方式では、回路パターンYの角部で乱
反射生じ、画像の精度が低下したり現物とは寸法的に異
なる画像として捕らえられるなど、回路パターンYを正
しく読み取れないことがある。従って回路パターンYを
正確に読み取るために、プリント配線板Pの裏面から光
を照射しその透過光をイメージセンサー2が受光して回
路パターンYを読み取る方式が採られている。
The surface of the printed wiring board P (the surface on which the circuit pattern is formed) is irradiated with light from a light source, and the reflected light is received by the image sensor 2 so that the circuit pattern Y
In the method of reading the circuit pattern Y, irregular reflection occurs at the corners of the circuit pattern Y, and the circuit pattern Y may not be correctly read, for example, the accuracy of the image is reduced or the image is captured as an image having dimensions different from the actual product. Therefore, in order to accurately read the circuit pattern Y, a method is employed in which light is emitted from the back surface of the printed wiring board P, and the transmitted light is received by the image sensor 2 to read the circuit pattern Y.

【0008】[0008]

【発明の効果】一般にプリント配線板Pの基板Paに
は、紙基材フェノール樹脂基板、ガラス布基材エポキシ
樹脂基板、ガラス布基材ポリイミド樹脂基板など、用途
によって種々の材質の基板が用いられる。そして基板P
aの材質によって光の透過率が異なりために、光源1か
らの発光が同じであっても、プリント配線板Pを透過し
た光の光量や光スペクトルが基板Paの材質によって変
化することになる。この結果、イメージセンサー(CC
D)2の作動電圧のスレシホールド(しきい値)の関係
で、回路パターンYの線幅Wが同じでも、この線幅Wに
対応して生ずるイメジセンサー2の出力パルス6のパル
ス幅Wpが、基板Paの材質によって変化し、イメージ
ンサー2で読み取られる回路パターン画像の線幅が実際
の正しい線幅よりも細くあるいは太く認識される恐れが
あるが、上記の実施の形態に示すこの発明のプリント配
線板の回路パターン読み取り入力装置では、基板Paの
材質の違いによるプリント配線板Pからの透過光の差
を、その光量や光スペクトルの差として光センサー5で
検知し、この検知信号をインバーター制御回路4にフィ
ードバックしてインバーター3を制御し、基板Paの材
質が変わってもイメージセンサー2に対し一定条件の受
光が得られるよう光源1の調光を行うので、基板Paの
材質が種々変わっても、回路パターンYの形状・寸法を
イメージセンサー2によって正しく認識することができ
る。
As the substrate Pa of the printed wiring board P, substrates of various materials such as a paper-based phenol resin substrate, a glass-fabric-based epoxy resin substrate, and a glass-fabric-based polyimide resin substrate are generally used. . And the substrate P
Since the light transmittance differs depending on the material of the substrate a, even if the light emission from the light source 1 is the same, the light amount and the light spectrum of the light transmitted through the printed wiring board P vary depending on the material of the substrate Pa. As a result, the image sensor (CC
D) Due to the threshold of the operating voltage of 2, even if the line width W of the circuit pattern Y is the same, the pulse width Wp of the output pulse 6 of the image sensor 2 generated corresponding to this line width W May vary depending on the material of the substrate Pa, and the line width of the circuit pattern image read by the imager 2 may be recognized as being thinner or thicker than the actual correct line width. In the device for reading and inputting a circuit pattern of a printed circuit board, the difference in transmitted light from the printed circuit board P due to the difference in the material of the substrate Pa is detected by the optical sensor 5 as the difference in the amount of light or the light spectrum. The inverter 3 is controlled by feeding it back to the inverter control circuit 4 so that the image sensor 2 can receive light under a certain condition even if the material of the substrate Pa changes. Since the first dimming, even if the material of the substrate Pa various changes can correctly recognize the shape and dimensions of the circuit pattern Y by the image sensor 2.

【図面の簡単な説明】[Brief description of the drawings]

【図1】この発明一つの実施の形態を示すプリント配線
板の回路パターン読み取り入力装置の構成図。
FIG. 1 is a configuration diagram of an apparatus for reading and inputting a circuit pattern of a printed wiring board according to an embodiment of the present invention.

【図2】プリント配線板の部分拡大平面図。FIG. 2 is a partially enlarged plan view of a printed wiring board.

【符号の説明】[Explanation of symbols]

1 光源 2 イメージセンサー(CCD) 3 インバーター 4 インバーター制御回路 5 光センサー 6 出力パルス Wp 出力パルス幅 P プリント配線板 Pa 基板 Y 回路パターン Q1 断線欠陥 Q2 短絡欠陥 Q3 細り欠陥 Q4 太り欠陥 Reference Signs List 1 light source 2 image sensor (CCD) 3 inverter 4 inverter control circuit 5 optical sensor 6 output pulse Wp output pulse width P printed wiring board Pa board Y circuit pattern Q1 disconnection defect Q2 short circuit defect Q3 thin defect Q4 fat defect

Claims (4)

【特許請求の範囲】[Claims] 【請求項 1】 回路パターンが形成されたプリント配
線板の背面を照射する光源と、この光源から前記プリン
ト配線板を透過した透過光を受光して前記回路パターン
を読み取り回路パターン画像データを出力するイメージ
センサーと、この透過光を検知して前記光源の発光を制
御する光センサーを備えたことを特徴とするプリント配
線板の回路パターン読み取り入力装置。
1. A light source for irradiating a back surface of a printed wiring board on which a circuit pattern is formed, and a light transmitted through the printed wiring board from the light source is received to read the circuit pattern and output circuit pattern image data. A circuit pattern reading and input device for a printed wiring board, comprising: an image sensor; and an optical sensor that detects the transmitted light and controls light emission of the light source.
【請求項 2】 表面に回路パターンが形成されたプリ
ント配線板の裏面を照射する光源と、この光源から前記
プリント配線板を透過した透過光を受光して前記回路パ
ターンを読み取り回路パターン画像データを出力するイ
メージセンサーと、この透過光を検知する光センサー
と、前記光源への電力を制御するインバータと、前記光
センサーの検知信号に基づいて前記インバータの作動を
制御するインバータ制御回路を備えたことを特徴とする
プリント配線板の回路パターン読み取り入力装置。
2. A light source for irradiating a back surface of a printed wiring board having a circuit pattern formed on a front surface, a light transmitted through the printed wiring board from the light source, the circuit pattern being read, and circuit pattern image data being read. An image sensor for outputting, an optical sensor for detecting the transmitted light, an inverter for controlling electric power to the light source, and an inverter control circuit for controlling the operation of the inverter based on a detection signal of the optical sensor. A circuit pattern reading and input device for a printed wiring board.
【請求項 3】 透過光の光量を検知する光センサーを
備えた、請求項1または2記載のプリント配線板の回路
パターン読み取り入力装置。
3. The printed circuit board circuit pattern input device according to claim 1, further comprising an optical sensor for detecting the amount of transmitted light.
【請求項 4】 透過光の光スペクトルを検知する光セ
ンサーを備えた、請求項1または2記載のプリント配線
板の回路パターン読み取り入力装置。
4. The apparatus according to claim 1, further comprising an optical sensor for detecting an optical spectrum of transmitted light.
JP8210389A 1996-07-04 1996-07-04 Circuit pattern read and input device for printed wiring board Pending JPH1021404A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8210389A JPH1021404A (en) 1996-07-04 1996-07-04 Circuit pattern read and input device for printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8210389A JPH1021404A (en) 1996-07-04 1996-07-04 Circuit pattern read and input device for printed wiring board

Publications (1)

Publication Number Publication Date
JPH1021404A true JPH1021404A (en) 1998-01-23

Family

ID=16588532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8210389A Pending JPH1021404A (en) 1996-07-04 1996-07-04 Circuit pattern read and input device for printed wiring board

Country Status (1)

Country Link
JP (1) JPH1021404A (en)

Similar Documents

Publication Publication Date Title
US4772125A (en) Apparatus and method for inspecting soldered portions
US7471424B2 (en) Original size detecting apparatus, original size detecting method, and program for original size detection
JP2008147816A (en) Image reader
US7369644B2 (en) Printed circuit board inspection system combining X-ray inspection and visual inspection
US20160169803A1 (en) Biological detection calibration system and operating method thereof
TW200819770A (en) Adjustable illumination apparatus and AOI system using the same
JP2009150835A (en) Optical inspection method and optical inspection device
KR20060066041A (en) Apparatus for inspecting back light unit
JP2005140663A (en) Inspection device for wiring pattern, and wiring pattern inspecting method
JPH1021404A (en) Circuit pattern read and input device for printed wiring board
JP2776692B2 (en) Solder arrangement status identification method and identification device
JP2008227301A (en) Inspecting method and device for electronic circuit component mounting
JP2007192598A (en) Device for inspecting object to be inspected
JPS59192902A (en) Position checking device for parts attached to substrate
KR100609603B1 (en) Integrated x-ray and visual inspection system
JP2006098104A (en) Printing inspection system and laser marking device
TW577973B (en) Inspection apparatus for lead wire
JP2003240730A (en) Semiconductor chip examining apparatus
KR0137950Y1 (en) Apparatus for checking the mounting state of the part that is mounted on printed board
JPH0526821A (en) Visual inspecting device
JPH03233692A (en) Bar code reader
JPH11266343A (en) Image reader, original retaining sheet and original detection method
KR20110094558A (en) Solder paste inspection apparatus and method for inspecting the same
JP3214275B2 (en) Automatic visual inspection system sensitivity correction method
JP2004264529A (en) Image reading apparatus

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees