JPH10209042A - Aligner for semiconductor wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the local distortion of a wafer, by controlling a power source device which electrically heats a heater wire buried in a wafer chuck, and a shutter for controlling a light emitting body and exposure quantity. SOLUTION: A shutter 32 which controls the pass quantity of light emitted from a light emitting body 31 and controls exposure quantity reaching the upper face of a wafer 40 grasped by a wafer chuck 33 is installed below the light emitting body 31. The wafer chuck 33 which safely grasps the wafer 40 being an exposure object body is installed below the shutter 32. A power source device 36 is connected to a heater wire (heater) 35 buried in the wafer chuck 33 and it electrically heats the wire 35. A temperature sensing sensor 37 for sensing the temperature of the wafer 40 is connected to the power source device 36. An exposure controller 38 is connected to the light emitting body 31, the shutter 32 and a power source device 26, and it controls the light emitting quantity of the light emitting body 31, and the operations of the shutter 32 and the light source device 36.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus for a semiconductor wafer, and more particularly, to a semiconductor wafer exposure apparatus.
The present invention relates to a semiconductor wafer exposure apparatus capable of correcting n).

[0002]

2. Description of the Related Art In a conventional semiconductor wafer exposure apparatus, as shown in FIG.
A shutter 12 for adjusting the exposure amount; a wafer chuck 13 for securely holding the semiconductor wafer 20; a position adjuster 14 for adjusting the position by moving the wafer chuck 13; A flow pipe 15 which is a circulation passage of the adjusting refrigerant; a heat exchanger 16 which adjusts the temperature of the refrigerant;
A valve 17 interposed in the valve to adjust the amount of refrigerant circulated; a flow controller 18 to control the opening / closing operation of the valve 17; and the luminous body 11, the shutter 12, the position adjuster 14 and the flow adjuster 18, respectively. And an exposure controller 19 for controlling. In the figure, an unexplained reference numeral 25 indicates a mask.

[0003] The operation of the conventional semiconductor wafer exposure apparatus thus configured will be described. When the light emitted from the light emitter 11 by the control signal of the exposure controller 19 passes through the mask 25 and reaches the wafer 20, the coolant flows into the wafer chuck 13 via the flow pipe 15 and is generated in the exposure process. Wafer chuck 13 and wafer 2
The heat of 0 is absorbed by the coolant, and local distortion of the wafer 20 due to heat generated during exposure is prevented.

In this case, the exposure controller 19 informs the flow controller 18 of the start and end of the exposure step, and the flow controller 18 controls the opening and closing operation of the flow control valve 17 to control the opening and closing of the flow pipe 15. Adjust the circulation flow rate. In addition, the temperature of the refrigerant is adjusted by the heat exchanger 16.

[0005]

However, in such a conventional semiconductor wafer exposure apparatus, the magnification of the wafer corresponding to the mask pattern cannot be adjusted.
There is an inconvenience that a desired magnification pattern cannot be formed on the wafer. Accordingly, the present invention has been made in view of such a conventional problem, and a semiconductor wafer exposure apparatus capable of adjusting a magnification of a wafer corresponding to a mask pattern during an exposure process and preventing local distortion of the wafer. The purpose is to provide.

[0006]

In order to achieve such an object, a semiconductor wafer exposure apparatus according to the present invention comprises a light emitter for performing exposure, a shutter for adjusting an exposure amount, and a semiconductor wafer exposure apparatus. A wafer chuck to be gripped, a position adjuster for adjusting the position by moving the wafer chuck, a hot wire embedded inside the wafer chuck, and a power supply device for electrically generating the hot wire,
And an exposure controller for controlling the light emitter, the shutter, and the power supply device, respectively.

Here, a temperature sensor for sensing the temperature of the wafer and transmitting the sensed temperature data to the exposure controller may be additionally provided. In this case, the exposure controller includes Based on wafer temperature data,
It is preferable that a temperature adjustment control signal is applied to the power supply device, and the power supply device controls the temperature of the heating wire according to a temperature adjustment control signal applied from the exposure controller.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG.
This will be described with reference to FIG. In the semiconductor wafer exposure apparatus according to the present invention, the light emitter 31 serving as an exposure source and the light emitter 3
1, a shutter that adjusts the amount of light emitted from the light emitter 31 and adjusts the amount of light (exposure) reaching the upper surface of the wafer 40 held by the wafer chuck 33 described below. 32, a wafer chuck 33 that is installed below the shutter 32 and safely grips the wafer 40 that is the object to be exposed, and is installed beside the wafer chuck 33 to move the wafer chuck 33 to move the wafer chuck 33 to a position. A position adjuster 34 for adjustment, and a heating wire (heater) 35 embedded inside the wafer chuck 33
And a power supply device 36 connected to the heating wire 35 for electrically heating the heating wire 35, and a temperature sensor 37 connected to the power supply device 36 and sensing the temperature of the wafer 40.
And the light emitter 31, shutter 32 and power supply 36
And the light emission amount of the light emitter 31 and the shutter 32
And an exposure controller 3 for controlling the operation of the power supply device 36, respectively.
8 is provided. In the figure, reference numeral 45 denotes a mask.

The operation of the semiconductor wafer exposure apparatus thus configured will be described below. First, the wafer 40 is gripped on the upper surface of the wafer chuck 33, and the patterned mask 45 is installed so as to be positioned above the wafer 40. Next, the light emitted from the light emitting body 31 according to the control signal of the exposure controller 38 passes through the shutter 32 and the mask 45 sequentially, and reaches the upper surface of the wafer 40.

At this time, the exposure controller 38 controls the operation of the shutter 32 to adjust the amount of exposure passing through the shutter 32, and controls the power supply 36 to supply a current to the heating wire 35. Then, the heating wire 35 is heated. Thereafter, heat is supplied to the wafer chuck 33 by the heat generated by the heating wire 35, and the supplied heat is transmitted to the wafer 40.

Next, the temperature sensor 37 senses the temperature of the wafer 40, and the sensed temperature data is transmitted to the exposure controller 38 via the power supply 36, and the exposure controller 38 Applies a temperature adjustment control signal to the power supply device 36 based on the input temperature data, and causes the power supply device 36 to adjust the amount of heat generated by the heating wire 35.

That is, the temperature of the wafer 40 is raised or lowered according to the amount of heat generated by the heating wire 35,
0 is finely expanded or reduced to adjust the magnification of the wafer. In addition, local distortion of the wafer 40 can be corrected by the heat transmitted to the wafer 40.

[0013]

As described above, according to the semiconductor wafer exposure apparatus of the present invention, local distortion of the wafer due to heat generated during exposure is prevented, and the magnification of the wafer corresponding to the mask pattern can be accurately determined. It has the effect of being adjustable. In addition, by controlling while sensing the temperature of the wafer, more accurate adjustment can be performed.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing a semiconductor wafer exposure apparatus according to the present invention.

FIG. 2 is a schematic configuration diagram showing a conventional semiconductor wafer exposure apparatus.

[Explanation of symbols]

 31: Light Emitting Element 32: Shutter 33: Wafer Chuck 34: Position Adjuster 35: Hot Wire 36: Power Supply 37: Temperature Sensing Sensor 38: Exposure Controller 40: Wafer 45: Mask

Claims (4)

[Claims] 1. A light emitting body (31) for performing exposure, a shutter (32) for adjusting an exposure amount, a wafer chuck (33) for securely holding a semiconductor wafer (40), and the wafer chuck (33). A position adjuster (34) for adjusting the position by moving the heating wire; a heating wire (35) embedded inside the wafer chuck (34); and a power supply device (36) for electrically heating the heating wire (35).
And an exposure controller (38) for controlling the light emitter (31), shutter (32), and power supply (36), respectively. 2. A temperature sensor for sensing the temperature of the wafer and transmitting the sensed temperature data to the exposure controller. An exposure apparatus for a semiconductor wafer according to claim 1. 3. The power supply device (3) based on temperature data of the wafer (40).
3. The apparatus for exposing a semiconductor wafer according to claim 2, wherein a temperature adjustment control signal is applied to (6). 4. The power supply device according to claim 3, wherein the power supply device controls the temperature of the heating wire according to a temperature adjustment control signal applied from the exposure controller. Exposure equipment for semiconductor wafers.