JPH10200281A - Forcible air cooling radiator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To miniaturize a forcible air cooling radiator by enhancing a cooling of a heater laminated at a downstream side of an air flow of the radiator. SOLUTION: A radiator body 1 is formed in a square cylindrical state. And, power transistors TR1, TR2 are mounted in close contact with its outer surface. A fan 2 is mounted in one opening of the body 1, and the other opening is connected to an opening of a back surface panel. A hole 3 is provided between the transistors TR1 and TR2 of the body 1. A cutout 4 is provided at a lower side of the transistor TR2. Cold air sucked from the hole 3 and the cutout cools the transistor TR2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a forced air cooling radiator for cooling a heating element such as a power transistor, and in particular, by averaging the cooling performance of heating elements arranged in the direction in which air flows. The present invention relates to a forced air cooling radiator that can be reduced in size.

[0002]

2. Description of the Related Art FIG. 6 shows an example of a conventional forced air cooling radiator. The radiator body 1 shown in the figure is formed in a rectangular cylindrical shape, and power transistors TR1 to TR4 are adhered to the outer surface thereof in close contact. The fan 2 is attached to one opening of the radiator body 1 and the other opening communicates with the opening of the back panel, so that air flows as shown by the arrow in the drawing and does not stay inside the housing. Is exhausted to the outside of the housing. The power transistors TR1 to TR4 are arranged side by side in the direction of air flow.

In the conventional forced air-cooled radiator shown in FIG. 7, power transistors TR1 and TR2 are arranged side by side in the direction of air flow of a fan 2 attached to one open portion of a radiator body 1, and the power transistor TR1 And a printed circuit board 7 to which TR2 is attached is in close contact with the lower surface of the radiator body 1.

[0004]

In the above-mentioned conventional forced air-cooled radiator, the air flowing inside the radiator body 1 is heated by the power transistors TR1 to TR4 or the power transistors TR1 and TR2, and the temperature increases as going downstream. Therefore, the cooling effect is weakened, so that the temperature becomes higher as the power transistor becomes more downstream. Therefore, in order to keep the temperature rise of the power transistor TR4 or the power transistor TR2 on the most downstream side within the specified range, it is necessary to reduce the size of the radiator in spite of having room for other transistors. could not.

[0005] The present invention has been made in view of the above points, and an object of the present invention is to reduce the size of a forced air cooling radiator by increasing the cooling efficiency of a heating element attached to a downstream side. Is to do.

[0006]

A forced air-cooled radiator according to the present invention is a forced air-cooled radiator for flowing air into a cylindrical radiator, which is adhered side by side in a direction in which the air of the cylindrical radiator flows. An air intake is provided in the middle part of the heating element.

[0007] A forced air-cooled radiator according to the present invention is a forced air-cooled radiator for flowing air into a cylindrical radiator.
The flow path is narrowed in the direction in which the air of the cylindrical radiator flows.

Further, the forced air-cooled radiator according to the present invention is a forced air-cooled radiator for flowing air into a cylindrical radiator, wherein the inside and outside of the flow path are located upstream of the cylindrical radiator in the air flow direction. Is provided with a partition plate for partitioning.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A forced air cooling radiator according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a forced air cooling radiator according to a first embodiment of the present invention.
The radiator body 1 shown in the figure is formed in a rectangular cylindrical shape, and power transistors TR1 and TR2 are closely adhered to the outer surface thereof. The fan 2 is attached to one opening of the radiator body 1 and the other opening communicates with the opening of the back panel.

A power transistor T is provided below the radiator body 1.
A printed circuit board 7 to which R1 and TR2 are attached is arranged. Power transistor TR1 of radiator body 1
A hole 3 is provided between the power transistor TR2 and the power transistor TR2, and a notch 4 is provided below the power transistor TR2.

The air flows as shown by the arrows in the figure and is exhausted to the outside of the housing so as not to stay inside the housing. The cool air sucked from the hole 3 by the airflow of the fan 2 cools the power transistor TR2. The cool air sucked from the notch 4 cools the feet of the power transistor TR2 and the printed circuit board 7, and the power transistor TR2
Of the radiator body 1 can be reduced in size.

FIG. 2 shows a forced air-cooled radiator according to a second embodiment of the present invention. In this embodiment, the left side surface of the radiator body 1 is inclined, and power transistors TR1 to TR4 are attached to the right side surface. The width A of the outlet of the flow path of the airflow sent by the fan 2 is smaller than the width of the inlet. Therefore, the flow velocity of the downstream airflow increases, so that the heat transfer coefficient between the air and the radiator body 1 increases, and the cooling efficiency of the downstream power transistor increases. Therefore, the radiator body 1 can be reduced in size.

FIG. 3A shows a forced air-cooled radiator according to a third embodiment of the present invention. In this embodiment, the radiator body 1
Left and right sides are inclined, and power transistors TR1 to TR4 and power transistor TR
5 to TR8 are stuck. The flow path of the airflow sent by the fan 2 becomes narrower on the downstream side, and the flow velocity of the airflow on the downstream side increases. Therefore, the heat transfer coefficient between the air and the radiator body 1 on the downstream side increases, and the cooling efficiency of the power transistor on the downstream side increases. And the radiator body 1 can be reduced in size.

FIG. 3B shows a forced air cooling radiator according to a fourth embodiment of the present invention. In this embodiment, the radiator body 1
Left and right sides are parallel, and power transistors TR1 to TR4 and power transistor TR
5 to TR8 are stuck. A wedge-shaped member 5 that is thicker toward the downstream side is arranged in the flow path of the air flow sent by the fan 2, and the flow path becomes narrower on the downstream side, and the flow velocity of the air flow on the downstream side increases. Therefore, the heat transfer coefficient between the air and the radiator body 1 on the downstream side increases, and the cooling efficiency of the power transistor on the downstream side increases. And the radiator body 1 can be reduced in size.

FIG. 4 shows a forced air cooling radiator according to a fifth embodiment of the present invention. In this embodiment, power transistors TR5 to TR8 and power transistor T
Partition plates 6, 6 are arranged on the upstream side of the radiator body 1 to which R1 to TR4 are attached, and the air sent by the fan 2 flows as shown by arrows in the drawing. That is, the airflow sent by the fan 2 is divided into a central portion and an outer portion on the upstream side. The air flowing in the central portion joins the outside air at the downstream portion without being heated, and cools the downstream air. Therefore, the cooling efficiency of the power transistor on the downstream side is increased, and the radiator body 1 can be downsized.

FIG. 5 shows a forced air cooling radiator according to a sixth embodiment of the present invention. In this embodiment, power transistors TR5 to TR8 and power transistor T
The partition plates 6 and 6 are arranged on the upstream side of the radiator body 1 to which R1 to TR4 are attached, and the wedge-shaped member 5 that becomes thicker toward the downstream side is arranged on the downstream side of the partition plate 6.

The air sent by the fan 2 flows as shown by arrows in the figure. That is, the airflow sent by the fan 2 is divided into a central portion and an outer portion on the upstream side. The air flowing in the central portion joins the outside air at the downstream portion without being heated, and cools the downstream air. Further, the flow rate of the air on the downstream side is increased due to the presence of the wedge-shaped member 5, and the heat transfer coefficient between the air and the radiator body 1 is increased. Therefore, the cooling efficiency of the power transistor on the downstream side is increased, and the radiator body 1 can be downsized. The wedge-shaped member 5 has a function of directing the flow of the cool air flowing through the central portion toward the side surface of the radiator body 1 to further increase the cooling efficiency of the downstream heating element.

In the embodiment shown in FIG. 5, the partition plate 6 is arranged so as to expand on the downstream side. However, it may be arranged in parallel as in the embodiment shown in FIG.

[0019]

According to the forced air-cooling radiator of the present invention, the cooling efficiency of the heating element attached on the downstream side is increased, so that the size of the forced air-cooling radiator can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a forced air cooling radiator according to a first embodiment of the present invention.

FIG. 2A is a perspective view showing a forced air cooling radiator according to a second embodiment of the present invention, and FIG. 2B is a sectional view showing the forced air cooling radiator.

FIG. 3A is a sectional view showing a forced air-cooled radiator according to a third embodiment of the present invention, and FIG. 3B is a sectional view showing a forced air-cooled radiator according to a fourth embodiment of the present invention. FIG.

FIG. 4A is a perspective view showing a forced air cooling radiator according to a fifth embodiment of the present invention, and FIG. 4B is a sectional view showing the forced air cooling radiator.

FIG. 5 is a sectional view showing a forced air cooling radiator according to a sixth embodiment of the present invention.

FIG. 6A is a perspective view showing an example of a conventional forced air cooling radiator, and FIG. 6B is a sectional view showing the same forced air cooling radiator.

FIG. 7 is a perspective view showing another example of the conventional forced air cooling radiator.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Radiator main body 2 Fan 3 Hole 4 Notch 5 Wedge-shaped member 6 Partition plate 7 Printed circuit board TR1-TR8 Power transistor

Claims (3)

[Claims] 1. A forced air-cooled radiator for flowing air into a cylindrical radiator, wherein an air intake port is provided in an intermediate portion of a heating element attached in a direction in which the air of the cylindrical radiator flows. A forced air-cooled radiator characterized by the following. 2. A forced air-cooled radiator for flowing air into a cylindrical radiator, wherein a flow path is narrowed in a direction in which the air of the cylindrical radiator flows. 3. A forced air-cooled radiator for flowing air into a cylindrical radiator, wherein a partition plate for partitioning the inside and the outside of the flow path is provided at an upstream portion of the cylindrical radiator in the air flow direction. Features a forced air-cooled radiator.