JPH10199845A - Substrate-cleaning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To measure a pressing force applied on a substrate at the time of substrate cleaning with no mounting and dismounting a rotary stage of a substrate holding means from a rotary shaft. SOLUTION: A substrate cleaning device is so constituted that a base member 31, where a load measuring instrument 30 measuring a pressing load of a cleaning brush 13, is mounted on a rotary stage 3, a load cell 33 mounted on the base member 31, a horizontal shaft 38 mounted on the base member 31 rotatably around an axis in the horizontal direction, a cleaning equipment 13 made up in a seesaw constitution on the horizontal shaft 38, a cradle member 40 and a balancer 41 and a load-transmitting member 43, where one end side is connected to the cradle member 40 and the other end part is provided with an abutting member 43a, which turns into from a lower position than the top height position for abutting on a pressure-sensing part 34 of the top of the load cell 33 are provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for holding a substrate such as a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display, and a substrate for an optical disk while rotating the substrate around a vertical axis. The present invention relates to a substrate cleaning apparatus for cleaning a substrate by applying a cleaning tool such as a brush to the upper surface (cleaning surface) of the substrate with a predetermined pressing force, and more particularly, to the same level as the height position of the cleaning surface of the held substrate. The present invention relates to a substrate cleaning apparatus provided with a pressing load measuring means for measuring a pressing load from a cleaning tool in the above.

[0002]

2. Description of the Related Art As a conventional substrate cleaning apparatus of this type, for example, there is one disclosed in Japanese Patent Application Laid-Open No. 8-141533.
This conventional example is provided with a load measuring means including a support member detachably attached to a rotating shaft constituting a substrate holding means, and a load meter provided on the support member.

According to this conventional example, the rotary table for holding the substrate is removed from the rotary shaft, a support member is attached to the rotary shaft instead, and a load meter is provided on the support member, whereby the substrate is actually cleaned. The pressing force applied to the substrate can be measured at the same level as the height position of the upper surface of the substrate. Then, operating conditions such as the height of the cleaning tool and the pressure applied to the cleaning tool in a state where the pressing force during the measurement becomes a desired magnitude are obtained, and the operating conditions obtained by replacing the support member and the turntable are obtained. The substrate can be cleaned by applying a desired pressing force from the cleaning tool to the substrate by cleaning the substrate by driving the substrate.

[0004]

However, in the configuration of the prior art described above, when the pressing force applied to the substrate is measured by using the load measuring means, the rotating table attached to the rotating shaft is mounted on the supporting member. When the operating conditions are required and the actual substrate cleaning process is performed, the support member attached to the rotating shaft must be replaced with a rotating table. As described above, in the configuration of the related art, there is a problem that the work of replacing the turntable and the support member is required, and the working efficiency is poor. In addition, a mistake occurs in the replacement work, for example, if the turntable is not properly attached to the rotating shaft, accurate substrate cleaning cannot be performed, and if the support member is not properly attached to the rotating shaft, Accurate pressing force cannot be measured, and accurate operating conditions cannot be obtained.

Further, the substrate holding means is of a so-called mechanical type in which three or more substrate holding members hold the outer periphery of the substrate at three or more places and hold the substrate slightly lifted from the turntable. In such a case, the size of the turntable itself is also increased, and therefore, when replacing the turntable with the support member, members near the rotation axis may be damaged.

For example, if the pressing force applied to a substrate can be measured by directly placing a load cell on a rotating table of a mechanical substrate holding means, all of the above disadvantages can be solved. In this case, the substrate is cleaned. In this case, the pressing force cannot be measured at the same level as the height position of the upper surface of the substrate. That is, in general, the mechanical type substrate holding means generally reduces the gap between the lower surface of the substrate and the upper surface of the rotary table as much as possible in order to suppress turbulence in air flow during cleaning of the substrate and contamination of the lower surface of the substrate. There is no load cell that is designed to hold the substrate in such a manner as to have such a narrow gap. Therefore, when the load cell is directly mounted on the rotating table of the mechanical substrate holding means, the height position of the upper surface of the load cell provided with the pressure-sensitive portion of the load cell is determined when the substrate is washed. Therefore, the pressing force cannot be measured at the same level as the height position of the upper surface of the substrate at the time of cleaning the substrate.

The present invention has been made in view of such circumstances, and in a substrate cleaning apparatus provided with a mechanical type substrate holding means, the substrate can be removed without an operation of attaching and detaching a turntable from a rotary shaft. An object of the present invention is to provide a substrate cleaning apparatus that includes a load measuring unit that can measure a pressing force applied to a substrate at the time of cleaning and that can accurately apply a desired pressing force to the substrate and clean the substrate with high accuracy.

[0008]

The present invention has the following configuration in order to achieve the above object. That is, the invention according to claim 1 is a substrate holding means for holding a substrate rotatably around an axis of a vertical method, a cleaning tool for cleaning an upper surface of the substrate held by the substrate holding means, Load measuring means for measuring a pressing load from the cleaning tool at the same level as the height position of the upper surface of the substrate held by the holding means, and the substrate holding means is provided around a vertical axis. In a substrate cleaning apparatus comprising: a rotatable rotary table; and three or more substrate holding members provided on the rotary table and holding an outer peripheral portion of the substrate at three or more locations, the load measuring means A base member placed on the turntable, a load meter provided on the base member, a horizontal axis provided on the base member rotatably around a horizontal axis, and the horizontal Swing with the axis as the swing fulcrum A receiving member connected to the horizontal shaft, the receiving member receiving the cleaning tool, a balancer disposed opposite to the receiving member across the horizontal shaft, and connected to the horizontal shaft, and a receiving member at one end side; And a load transmitting member provided at the other end with a contact portion that wraps around from a position lower than the height position of the upper surface of the load meter and contacts the pressure-sensitive portion on the upper surface of the load meter. It is characterized by being constituted.

According to a second aspect of the present invention, in the substrate cleaning apparatus according to the first aspect, the base member has a leg portion for lifting a bottom surface of the base member from an upper surface of the turntable. Things.

According to a third aspect of the present invention, in the substrate cleaning apparatus according to the first or second aspect, the distance between the balancer and the horizontal axis can be arbitrarily changed. It is characterized by the following.

[0011]

According to the structure of the rotary substrate cleaning apparatus of the present invention, the load measuring means is placed on the rotary table of the mechanical type substrate holding means, and the cleaning is actually performed by the load measuring means. The pressing force applied to the substrate is measured at the same level as the height position of the upper surface of the substrate.

That is, the base member of the load measuring means is mounted on the rotary table of the mechanical substrate holding means. A load meter is provided on the base member. The base member is provided with a horizontal shaft rotatably around a horizontal axis. A receiving member for receiving the cleaning tool is connected to the horizontal shaft so as to be able to swing around the horizontal shaft as a swing fulcrum. Have been. The receiving member is cantilevered on the horizontal axis at a predetermined height position by balance with the balancer. One end of the load transmitting member is connected to the receiving member, and the abutment portion provided at the other end of the load transmitting member moves from a position lower than the height position of the upper surface of the load meter, and the pressure-sensitive member on the upper surface of the load meter. Is in contact with the department.

When the cleaning member is received by the receiving member of the load measuring means, the contact portion of the load transmitting member presses the pressure-sensitive portion of the load meter with the same pressing load as the pressing load.
The pressing force of the cleaning tool can be measured with a load meter.

By measuring the pressing load of the cleaning tool received by the receiving member with the load meter via the load transmitting member, the height position of the receiving member is lower than the height position of the upper surface of the load meter. The position can be set at the same level as the height position of the upper surface of the substrate at the time of substrate cleaning. Since the receiving member has a seesaw structure and is balanced with the balancer, the receiving member can be supported in a suspended fishing state. Therefore, it is possible to measure the pressing force applied to the substrate at the same level as the height position of the upper surface of the substrate at the time of cleaning the substrate.

[0015] In this manner, the operation processing conditions such as the height of the cleaning tool and the pressure applied to the cleaning tool in a state where the pressing force measured by the load measuring means has a desired magnitude are obtained.
When the operation processing conditions are determined, the load measuring means is removed from the turntable. Since the load measuring means is simply placed on the rotating table of the mechanical type substrate holding means, the loading / unloading operation is easy, and the rotating table is not attached to or detached from the rotating shaft at all. The work efficiency is good and there is no inconvenience due to mistakes in attachment and detachment.

By operating under the determined processing conditions, the substrate can be cleaned by applying a desired pressing force from the cleaning tool to the substrate accurately.

According to the second aspect of the present invention, the base member of the load measuring means is mounted on the rotary table of the mechanical substrate holding means via the leg, and the bottom surface of the base member is formed of the rotary table. Floating from the top. Therefore, compared with the case where the entire bottom surface of the base member is directly placed on the turntable, the contact area between the upper surface of the turntable and the base member is reduced, and the contamination of the upper surface of the turntable can be reduced, and the substrate cleaning can be performed. Substrate contamination at the time can be reduced.

According to the third aspect of the present invention, since the distance between the balancer and the horizontal axis can be arbitrarily changed, the height position of the receiving member which is balanced with the balancer is set to the upper surface of the substrate. Height can be precisely adjusted to the same level.

[0019]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a longitudinal sectional view showing a structure near a substrate holding mechanism of a substrate cleaning apparatus according to one embodiment of the present invention, FIG. 2 is a plan view of the embodiment apparatus, and FIG. It is a side view with a part omitted showing composition of.

As shown in FIGS. 1 and 2, the mechanical type substrate holding mechanism 1 includes a rotating table 3 provided at an upper end of a rotating shaft 2 and three or more rotating tables 3 provided on the rotating table 3 (see FIG. 1 and FIG. 2). Then 6
) Substrate holding member 4. Each substrate holding member 4 includes a substrate supporting member 4a that supports an outer peripheral portion of the substrate W, and a horizontal regulating member that is provided on an upper surface of the substrate supporting member 4a and regulates a horizontal position of the substrate W supported by the substrate supporting member 4a. 4b, the outer periphery of the substrate W is held at three or more places while the substrate W is slightly lifted from the upper surface of the turntable 3. The substrate support member 4
a and the horizontal regulating member 4b may be separated and provided on the turntable 3, and the substrate supporting member 4a and the horizontal regulating member 4b may be provided separately.
Are collectively referred to as a substrate holding member.

The rotating shaft 2 is connected to an electric motor 5, and the rotating table 3 and the held substrate W are configured to be rotatable together with the rotating shaft 2 around a vertical axis. The rotating shaft 2 is formed in a cylindrical shape, and a cleaning liquid supply pipe is erected in the hollow portion thereof coaxially with the rotating shaft 2 to supply the cleaning liquid to the lower surface (usually the back surface) of the held substrate W to supply the cleaning liquid. The lower surface of the held substrate W and the turntable are configured so that the lower surface of the substrate W is also cleaned, and the space between the cleaning liquid supply pipe and the inner peripheral surface of the cylindrical rotary shaft 2 is used as a gas supply path. In some cases, a gas such as an inert gas or dry air is supplied to a space in a gap between the substrate and the upper surface of the substrate 3 to clean the substrate.

The periphery of the substrate holding mechanism 1 and the substrate W held by it are covered with a cup 6 that can be raised and lowered by a lifting drive mechanism (not shown). One or a plurality of nozzles 7 are provided on the lateral outer side of the cup 6 for jetting and supplying a cleaning liquid such as pure water toward the rotation center of the substrate W.

As shown in FIG. 3, a rotation support shaft 9 on the base end side of the angle-shaped support arm 8 is provided on the support 11 provided on the base 10 on the lateral outer side of the cup 6. It is provided rotatably around a first shaft center P1 in the vertical direction and vertically, and is provided only rotatably on a rotary cylinder 12 provided only rotatable on the base 11. A cleaning brush for cleaning the upper surface (usually, the surface) of the substrate W held by the substrate holding mechanism 1 so as to be rotatable around a second axis P2 in the vertical direction below the distal end arm portion 8a of the support arm 8. 1
4 are provided.

An air cylinder 1 for lifting and lowering is provided at the lower end of the rotating shaft 9.
4 are provided. An electric motor 16 is linked to the rotating cylinder 12 via a belt 15. Reference numeral 17 in FIG. 3 indicates that the cleaning brush 13 is at the rotation center position of the substrate W,
A position detecting mechanism for detecting whether the position is the position corresponding to the outer peripheral edge of the substrate W or the standby position at the time of non-cleaning, which is deviated from above the substrate W, is shown.

A balance arm 18 is provided on the support 11 so as to be swingable about a horizontal axis.
First and second contact rollers 19 and 20 are provided at both ends of the roller 8.

A receiving plate 21 is provided at an intermediate position of the rotary support shaft 9.
Is provided. On the other hand, the support 2 protruding from the base 10
2, a weight base 23 is provided so as to be able to move up and down.
A weight 24 is placed on a weight base 23 in a state of being fitted to the column 22. The first contact roller 19 is in contact with the lower surface of the receiving plate 21, while the second contact roller 20 is in contact with the lower surface of the weight base 23. The weight of the weight 24 is set to be slightly smaller than the weight of the rotating shaft 9, the support arm 8, the cleaning brush 13, and the like.

A deceleration cylinder 26 is provided on a support member 25 erected on the base 10, and the tip of a cylinder rod 26 a of the deceleration cylinder 26 is in contact with the upper surface of the weight table 23. Further, a stopper 27 is provided on the support member 25, and the tip of the stopper abuts on the upper surface of the weight table 23, so that the cleaning brush 13 is cleaned from the rotation center position of the substrate W to a position corresponding to the outer peripheral edge of the substrate W. Is set so as to set the lowest position when it is located at the position.
The stopper 27 is provided with a micrometer 28 so that the lowest position to be set can be arbitrarily adjusted.

Next, the configuration of the load measuring device according to the present embodiment will be described with reference to FIGS. FIG. 4 is a plan view showing the entire configuration of the load measuring device, and FIG.
6 is a sectional view taken along the line AA, FIG. 6 is a sectional view taken along the line BB of FIG.
FIG. 7 is a cross-sectional view showing the configuration near the horizontal axis.

A plurality of (four in the figure) legs 32 are provided on the bottom surface of the base member 31 of the load measuring device 30, and the load measuring device 30 (base member 31) is provided through these legs 32.
Is mounted on the upper surface of the turntable 3, the contact area between the upper surface of the turntable 3 and the base member 31 is reduced, and contamination of the upper surface of the turntable 3 is reduced.

A load cell 33 is mounted on the base member 31. Although not shown, the load cell 33 is provided with a load cell for measuring a load therein, and displays a pressure-sensitive portion 34 for measuring a pressing load from the cleaning brush 13 by the load cell as described later, and displays the measured load. A display unit 35 is provided.

The base member 31 is provided with a housing 36 adjacent to the load cell 33. A horizontal shaft 38 is accommodated in the housing 36 so as to be rotatable around a horizontal axis by a bearing 37a.
At both ends of the horizontal shaft 38, an intermediate portion of a bracket 39 is fixed via a collar 37b for preventing blurring, and the bracket 39 can swing about the horizontal shaft 38 as a swing fulcrum.
8.

A receiving member 40 is connected to one end of the bracket 39, and a balancer 41 is screwed to the other end. The balancer 41 is provided with an opening 42 whose longitudinal direction is a direction perpendicular to the rotation axis of the horizontal shaft 38, and the balancer 41 with respect to the bracket 39.
Can be shifted in a direction perpendicular to the rotation axis of the horizontal shaft 38. Thus, the distance between the balancer 41 and the horizontal axis 38 can be arbitrarily changed and adjusted.

The upper surface of the receiving member 40 is a receiving surface 40a for receiving the cleaning brush 13. By appropriately adjusting the screwing position of the balancer 41,
Balance the receiving member 40 and the balancer 41,
In a state where the receiving member 40 is supported by hanging fishing, the height position of the receiving surface 40a of the receiving member 40 is the same as the height position Wh of the upper surface of the substrate W held by the substrate holding mechanism 1. Each member is designed. The receiving member 40 portion of the base member 31 is open, and the receiving member 40 is configured to be supported in a suspended state at a position below the base member 31 through the opening 31a.

One end of an L-shaped load transmitting member 43 is integrally connected to the receiving member 40 when viewed from the direction of the arrows BB in FIG. The load transmitting member 43 is moved from a position lower than the height position of the upper surface of the load meter 33 to the load meter 3.
The contact member 43 wraps slightly above the upper surface of the load cell 3 and contacts the pressure-sensitive portion 34 on the upper surface of the load cell 33 at the other end.
a are connected.

The receiving surface 40a of the receiving member 40 is positioned at the height position Wh of the upper surface of the substrate W held by the substrate holding mechanism 1.
When the receiving member 40 and the balancer 41 are balanced so that they are at the same level as each other, and the receiving member 40 is supported in a suspended state at its height position, the contact member 43
It is configured such that the pressing load of “a” pressing the pressure-sensitive portion 34 of the load meter 33 is “0”. When the cleaning brush 13 is received on the receiving surface 40a of the receiving member 40, the receiving member 40 is pressed downward in accordance with a pressing load that presses the upper surface of the substrate W held by the cleaning brush 13 by the cleaning brush 13, The pressing force is applied to the load transmitting member 43.
Is transmitted to the pressing of the pressure-sensitive portion 34 by the abutting member 43a, and the pressing load that presses the cleaning brush 13 against the upper surface of the substrate W held by the substrate holding mechanism 1 can be measured by the load meter 33. ing. The measured load is displayed on the display unit 35 of the load cell 33.

Using the load measuring device 30 having such a configuration, prior to the substrate cleaning processing, the operation processing conditions relating to the pressing force of the cleaning brush 13 of the substrate cleaning apparatus on the substrate W are adjusted as follows.

Prior to the substrate cleaning process, the load measuring tool 30 is placed on the turntable 3 in a state where the substrate W is not held by the substrate holding mechanism 1. Then, the screwing position of the balancer 41 is adjusted so that the receiving surface 40a of the receiving member 40 of the load measuring unit 30 is at the same level as the height position Wh of the upper surface of the substrate W held by the substrate holding mechanism 1. .
When the adjustment of the load measuring tool 33 is completed, the electric motor 16 is driven to move the cleaning brush 13 to above the receiving surface 40a of the receiving member 40 of the load measuring tool 30, and the cylinder rod of the air cylinder 14 is contracted. Lower the cleaning brush 13 to the lowermost position, and
The cleaning brush 13 is received on the 0 receiving surface 40a, and the pressing load from the cleaning brush 13 is measured. Then, the lowermost position is adjusted by the micrometer 28 while visually observing the measured load displayed on the display unit 35 of the load meter 33, and the adjustment by the micrometer 28 is stopped when a desired pressing force is obtained. Thus, the adjustment for setting the pressing force of the cleaning brush 13 on the substrate W to a desired pressing force in the substrate cleaning process ends. When the adjustment is completed, the cleaning brush 13 is moved to the standby position, and the load measuring tool 30 is taken out of the turntable 3. Thereafter, the substrate pressing process is performed by applying the adjusted pressing force to the substrate W.

In the substrate cleaning process, the cleaning liquid is ejected from the nozzle 7 onto the substrate surface while the substrate W held by the substrate holding mechanism 1 is rotated about the axis in the vertical direction, and the cleaning brush 13 is lowered to the lowest position. In this state, the support arm 7 is rotated around the first axis P1 to move along the upper surface of the substrate W in a state where the support arm 7 is lowered to the position. At this time, depending on the type of the cleaning brush 13 and the content of the substrate cleaning process, the substrate cleaning process is performed while rotating the cleaning brush 13 around the second axis P2, and the substrate is not rotated around the second axis P2. May perform the substrate cleaning process.

According to this embodiment, the load measuring device 30
The pressing force of the cleaning tool 13 against the substrate W can be measured simply by placing the cleaning tool 13 on the turntable 3, so that the operation of adjusting the pressing force of the cleaning tool 13 against the substrate W can be easily performed. Since it is not necessary to attach and detach the rotating shaft 2 to and from the rotating shaft 2, it is possible to eliminate inconveniences caused by damage to members near the rotating shaft 2 and mistakes in attaching and detaching.

For example, when the height position of the upper surface of the substrate W held by the substrate holding mechanism 1 differs depending on the type of the substrate holding mechanism 1 and the size of the substrate W (6 inches, 8 inches, 300 mm). In FIG. 8, individual load measuring tools 30 corresponding to the respective height positions may be prepared. For example, as shown in FIG. 8, the spacer 41b is placed on the upper surface of the receiving member 40 to form the receiving surface 40a. The height position may be adjusted arbitrarily. In the case of FIG. 8, the screwing position of the balancer 41 is adjusted and balanced so as to negate the own weight of the spacer 40b, and the height position of the upper surface (receiving surface 40a) of the spacer 40b in this balanced state is determined by the substrate holding mechanism. The thickness of the spacer 40b is determined so as to be at the same level as a desired height position on the upper surface of the substrate W held at 1.

Next, a modified example having a different pressing force setting structure will be described with reference to FIG. In the configuration of FIG. 9, a hollow cylindrical rotating body 51 is provided rotatably around the second axis P <b> 2 via a bearing 50 in the distal end side arm portion 8 a, and a longitudinal direction of the rotating body 51 is provided. A pulley 52 is attached in the middle so as to be rotatable integrally. The pulley 52 and an electric motor 53 provided on the rotation center side of the support arm 8 are linked to each other via a timing belt 54.

The cleaning brush 13 is integrally attached to the cleaning tool support 55, and the cleaning tool support 55 is
And the upper side of the rotating body 51 slightly above the middle of the cleaning tool support 55 and the lower side of the rotating body 51 slightly below the middle of the cleaning tool support 55. The first bellows 56 made of stainless steel is integrally rotatably connected.

At a position facing the upper end of the cleaning tool support 55, a stopper member 58 is provided in the distal arm portion 8a via a second stainless steel bellows 57 which can be extended and retracted.
The upper end side of the cleaning tool support 55 is rotatably fitted and held in the stopper member 58. A sealed space S is formed by the distal arm portion 8a, the second bellows 57, and the stopper member 58, and a supply / drain hole 5 connected to the sealed space S is formed above the distal arm portion 8a.
9 are provided.

A supply source (not shown) of pressurized air is connected to the supply / discharge hole 59 via an air pipe 60, and a pressure gauge 61 and a regulator capable of changing a set pressure are provided at an intermediate point of the air pipe 60. 62 and an open / close valve 63 are interposed, and are configured to automatically maintain the pressure in the air pipe 60 within a set range.

A magnetic fluid seal 64 and a labyrinth mechanism 65 are provided between the distal end arm portion 8a and the lower side of the rotating body 51.
Is provided so that dust generated due to abrasion caused by rotation in the upper bearing 50 can be prevented from dropping on the substrate W and the cleaning liquid can be prevented from entering.

With the above arrangement, when the cleaning liquid is supplied to the upper surface of the substrate W and the cleaning brush 13 is pressed against the upper surface of the substrate W for cleaning, if the substrate W is warped and deformed, the rotation of the substrate W is performed. And the movement of the cleaning brush 13,
The pressing force of the cleaning brush 13 against the substrate W changes. At a place where the substrate W is warped, a pressure higher than a set range is sensed by the pressure gauge 61.
Therefore, the regulator 62 acts to reduce the pressure in the air pipe 60 so that the pressure in the air pipe 60 falls within a set range, and contracts the second bellows 57. As a result, the cleaning brush 13 supported by the cleaning tool support 55 is raised, and the pressing force of the cleaning brush 13 against the substrate W can be maintained within a set range. On the other hand, in a concave portion of the substrate W, a pressure lower than the set range is sensed by the pressure gauge 61. Therefore, the regulator 62 increases the pressure in the air pipe 60 and extends the second bellows 57 so that the pressure in the air pipe 60 falls within a set range. As a result, the cleaning brush 13 supported by the cleaning tool support 55 is lowered, and the pressing force of the cleaning brush 13 against the substrate W can be maintained within a set range.

In the case of the substrate cleaning apparatus having such a pressing force setting structure, the load measuring tool 30 is placed on the turntable 3 prior to the substrate cleaning processing, and the cleaning brush 13 is placed on the receiving surface 40a of the receiving member 40. Then, the pressing load from the cleaning brush 13 is measured, and the set pressure of the regulator 62 is changed until the measured load reaches a desired value. Then, when the measured load reaches a desired value, the pressure at that time is set as the pressure of the regulator 62. Thereafter, the load measuring tool 30 is taken out from the turntable 3, and the substrate W is held, and a normal substrate cleaning process is performed.

Thus, the cleaning support 55 and the rotating body 51
A predetermined pressing force can be applied to the substrate W from the cleaning brush 13 irrespective of the pressure loss due to resistance or the like.

According to the present invention, the cleaning brush 13
It can be applied not only when using soft materials such as nylon brushes, mohair brushes, or cleaning tools made of sponge or felt, but also when using plastic materials. It is called generically.

In the above-described embodiment, the support arm 8 is moved by the electric motor 16 so as to displace the cleaning brush 13 in the horizontal direction along the upper surface of the substrate W.
Although it is configured to rotate around one, it may be configured to move the support arm 8 in a linear direction by an air cylinder or the like.

The present invention can be applied not only to the circular substrate as in the above-described embodiment but also to a substrate cleaning apparatus for a square substrate.

[0052]

As is apparent from the above description, according to the first aspect of the present invention, in the substrate cleaning apparatus provided with the mechanical type substrate holding means, the height of the upper surface of the substrate to be actually cleaned is set. Since a load measuring means for measuring the pressing force applied to the substrate at the same level as the position is provided, the substrate can be cleaned by accurately applying a desired pressing force to the substrate from the cleaning tool, and the cleaning accuracy can be improved. Can be improved. Moreover, the load measuring means has a seesaw structure in which the receiving member for receiving the cleaning tool is balanced with the balancer,
Since the pressing load of the cleaning tool received by the receiving member is measured by the load meter via the load transmitting member, the load measuring means (base member) is simply placed on the rotary table of the mechanical substrate holding means. Further, the pressing force applied to the substrate can be measured at the same level as the height position of the upper surface of the substrate to be actually cleaned without being restricted by the thickness of the load cell.
Therefore, according to the device according to the present invention, there is no need to attach / detach the turntable to / from the rotary shaft, so that the working efficiency is high,
It is also possible to prevent a reduction in cleaning accuracy due to the rotating table not being properly attached to the rotating shaft and a breakage of objects around the rotating shaft.

According to the second aspect of the present invention, the base member of the load measuring means is mounted on the rotary table of the mechanical substrate holding means via the leg, and the bottom surface of the base member is located on the upper surface of the rotary table. The contact surface between the top surface of the turntable and the base member is smaller than when the entire bottom surface of the base member is placed directly on the turntable, reducing contamination on the top surface of the turntable. Thus, contamination of the substrate during substrate cleaning can be reduced.

According to the third aspect of the present invention, since the distance between the balancer and the horizontal axis can be arbitrarily changed, the height position of the receiving member balanced with the balancer is adjusted to the upper surface of the substrate. Height can be precisely adjusted to the same level.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a configuration near a substrate holding mechanism of a substrate cleaning apparatus according to one embodiment of the present invention.

FIG. 2 is a plan view of the apparatus according to the embodiment.

FIG. 3 is a partially omitted side view showing a configuration near a rotation support shaft of the embodiment apparatus.

FIG. 4 is a plan view showing the overall configuration of the load measuring device.

FIG. 5 is a sectional view taken along the line AA of FIG. 4;

FIG. 6 is a sectional view taken along the line BB of FIG. 4;

FIG. 7 is a cross-sectional view showing a configuration near a horizontal axis.

FIG. 8 is a diagram showing a configuration of a main part of a modified example of the load measuring tool.

FIG. 9 is an enlarged vertical sectional view of a main part showing a modification of the pressing force setting structure.

[Explanation of symbols]

 1: substrate holding mechanism 3: rotating table 4: substrate holding member 13: cleaning tool 30: load measuring tool 31: base member 32: leg 33: load meter 38: horizontal axis 40: receiving member 41: balancer 42: balancer Opening for screwing position adjustment 43: Load transmitting member W: Substrate Wh: Height position of upper surface of retained substrate

Claims (3)

[Claims] 1. A substrate holding means for rotatably holding a substrate around an axis of a vertical method, a cleaning tool for cleaning an upper surface of a substrate held by the substrate holding means, and a cleaning tool held by the substrate holding means. Load measuring means for measuring a pressing load from the cleaning tool at the same level as the height position of the upper surface of the substrate, and, the substrate holding means, a turntable rotatable around a vertical axis. And three or more substrate holding members provided on the turntable and holding an outer peripheral portion of the substrate at three or more locations, wherein the load measuring means is provided on the turntable. A base member mounted on the base member, a load meter provided on the base member, a horizontal axis provided on the base member so as to be rotatable around a horizontal axis, and the horizontal axis as a swing fulcrum. Swingable horizontal A receiving member that receives the cleaning tool, which is connected to a shaft, a balancer that is disposed on the opposite side of the receiving member across the horizontal shaft, and is connected to the horizontal shaft, and one end side is connected to the receiving member, And a load transmitting member provided at the other end with a contact portion that wraps around from a position lower than the height position of the upper surface of the load meter and contacts the pressure-sensitive portion on the upper surface of the load meter. A substrate cleaning apparatus, comprising: 2. The substrate cleaning apparatus according to claim 1, wherein the base member has a leg for lifting a bottom surface of the base member from an upper surface of the turntable. 3. The substrate cleaning apparatus according to claim 1, wherein a distance between the balancer and the horizontal axis can be arbitrarily changed.