JPH10190267A - Structure of casing of electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a structure of a casing of an electronic device which can efficiently perform thermal conduction from the inside of the casing to the casing. SOLUTION: In an electronic device casing having no vent hole for radiating heat in the device, the casing 10 is partitioned by a wiring board 13 into upper and lower spaces 14 and 15 and there is provided a fan 17 for circulating the air in the casing. The fan 17 is constructed to form convection so that the air is blown from the bottom toward the ceiling of the casing and is flowed in the upper and lower spaces 14 and 15. Further, besides the fan installing part, at least one gap for ventilation is provided between the casing and the wiring board in the casing, thereby obtaining the ventilation for the whole casing. Thus, the efficiency of the heat conductivity from the internal of the casing to the casing is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing structure of an electronic device relating to heat radiation inside the device.

[0002]

2. Description of the Related Art In a housing of an electronic device, heat generated from the inside is radiated to the outside air via the housing surface, so that heat is efficiently conducted from the inside of the housing to the housing. Is desirable.

[0003] Referring to FIG. 3, a housing structure of a conventional electronic device will be described.

[0004] A display window 2 is formed on the upper surface of the housing 1, and the ceiling of the housing 1 is L-shaped so as to cover the display window 2 from the inside.
CD (Liquid Crystal Display)
y) 3 is provided. A wiring board 4 is disposed inside the housing 1 so as to be parallel to the bottom surface of the housing 1 so as to partition the inside of the housing 1 into an upper space 5 and a lower space 6. It is in contact with one side wall 1a of the body 1. A space is formed between the other side wall 1b facing the side wall 1a and the wiring board 4, and a fan 7 for circulating air inside the device is provided in the space from the side wall 1b to the side wall 1a. It is provided to blow air toward.

The heat generated from the wiring board 4 is generated by the fan 7
The heat is removed by the air blown from the housing 1, further conducted to the housing 1 via the internal air, and radiated to the outside via the surface of the housing 1.

[0006]

The air blown out from the side wall 1b toward the side wall 1a by the fan 7 is in a state in which both the upper space 5 and the lower space 6 are closed on the downstream side. It circulates around the fan 7 having a small ventilation resistance like the flow 8.

Therefore, as described above, in the housing structure of the conventional electronic device, air circulation around the fan can be obtained, but ventilation through the entire housing cannot be obtained. There was a problem that conduction was not performed efficiently.

The present invention has been made in view of the above circumstances, and provides a housing structure of an electronic device that can efficiently conduct heat from the inside of the housing to the housing by obtaining ventilation throughout the housing. The purpose is to improve the heat radiation ability of the body.

[0009]

SUMMARY OF THE INVENTION The present invention relates to a housing of an electronic device which does not have a ventilation hole for heat radiation inside the device, wherein the inside of the housing is partitioned into a vertical space by a wiring board, and A housing structure of an electronic device including a fan for circulating air therein, the fan blowing out from the bottom surface of the housing toward the ceiling of the housing to form a convection flowing through the upper and lower spaces. In addition, the present invention relates to a housing structure of an electronic device in which at least one gap for ventilation is provided between the housing and a wiring board inside the housing in addition to the fan mounting portion.

By providing a fan for circulating air and a gap for circulation inside the housing, forced convection is generated inside the housing, and the efficiency of heat conduction from the inside of the housing to the housing is improved.

[0011]

Embodiments of the present invention will be described below with reference to the drawings.

In FIG. 1, a display window 1 is provided on an upper surface of a housing 10.
An LCD 12 is provided on the ceiling of the housing 10 so as to cover the display window 11 from inside. Inside the housing 10, a wiring board 13 partitions the interior of the housing 10 into an upper space 14 and a lower space 15.
A gap 16 is provided parallel to the bottom surface, and is provided between one end of the wiring board 13 and one side wall 10 a of the housing 10. A position facing the gap 16, that is, the other end of the wiring board 13 and the other side wall 10b of the housing 10.
And a fan 1 for circulating the air inside the equipment.
7 is provided to blow air from the bottom surface of the housing 10 toward the ceiling of the housing 10.

The air blown from the fan 17 is blown upward like an air flow 18 and then the wiring board 1
3 from the side wall 10b to the side wall 10
Move toward a. Further, the air that has reached the side wall 10a descends through the gap 16 having a small ventilation resistance, moves in the lower space 15 below the wiring board 13 toward the side wall 10b, and is further sucked into the fan 17.

By providing the fan 17 and the gap 16, convection (counterclockwise in FIG. 1) surrounding the wiring board 13 is forcibly generated inside the housing 10. Heat can be efficiently transferred from the inside of the housing 10 to the housing 10. The heat transmitted to the housing 10 is radiated to the outside via the surface of the housing 10.

Next, another embodiment of the present invention will be described with reference to FIG. In FIG. 2, the same components as those in FIG. 1 are denoted by the same reference numerals.

A display window 11 is formed on the upper surface of the housing 10,
An LCD 12 is provided on the ceiling of the housing 10 so as to cover the display window 11 from inside. A wiring board 13 is disposed inside the housing 10 in parallel to the bottom surface of the housing 10 so as to partition the inside of the housing 10 into an upper space 14 and a lower space 15. A gap 16 and a gap 19 are respectively provided between the side walls 10a and 10b of the body 10, and a fan 17 for circulating air inside the device is provided at the center of the wiring board 13 from the bottom of the housing 10. It is provided to blow air toward the housing ceiling.

The air blown upward from the fan 17 is diffused horizontally along the LCD 12. On the side wall 10a side, the diffused air moves in the upper space 14 above the wiring board 13 toward the side wall 10a like an air flow 18. The air that has reached the side wall 10a descends through the gap 16 having a small ventilation resistance, and
The lower space 15 moves further toward the side wall 10 b and is sucked into the fan 17.

Similarly, on the side wall 10b side, the LCD 1
The air diffused along 2 moves in the upper space 14 above the wiring board 13 toward the side wall 10b like the air flow 20. The air having reached the side wall 10b passes through the gap 19 having a small ventilation resistance, moves in the lower space 15 below the wiring board 13 toward the side wall 10a, and is sucked into the fan 17.

By installing the fan 17 at the center of the wiring board 13 and providing the gaps 16 and 19, two sets of convection surrounding the wiring board 13 inside the housing 10, ie, the side wall Since the counterclockwise air flow 18 on the side 10a and the clockwise air flow 20 on the side wall 10b are forcibly generated, the air flow 18 from the inside of the housing 10 is formed through both the air flows 18 and 20. Heat transfer to the housing 10 can be performed more efficiently.

[0020]

As described above, according to the present invention, since a smooth forced convection is formed inside the housing, the efficiency of heat conduction to the housing is improved, and the heat dissipation capability of the housing is improved. It has the effect.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing an embodiment of the present invention.

FIG. 2 is a schematic sectional view showing another embodiment of the present invention.

FIG. 3 is a schematic sectional view showing a conventional example.

[Explanation of symbols]

 Reference Signs List 10 housing 13 wiring board 14 upper space 15 lower space 16 gap 17 fan 19 gap

Claims (2)

[Claims] In a case of an electronic device which does not have a ventilation hole for heat radiation inside the device, the inside of the case is divided into a vertical space by a wiring board, and air is circulated inside the case. A housing structure for an electronic device, comprising a fan, wherein the fan blows out from a bottom surface of the housing toward a ceiling portion of the housing to form a convection flowing through the vertical space. 2. The housing structure of an electronic device according to claim 1, wherein at least one ventilation gap other than the fan mounting portion is provided between the housing and a wiring board inside the housing.