JPH10189837A - Heat-dissipating device for electronic component and its manufacture, and mold for manufacturing heat-dissipating device for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a high-performance heat-dissipating device in which smaller-diameter pins are arranged at high density in such a way that the generation of defectives is reduced by a method, wherein the heat dissipating device is molded by using a mold in which hole parts sufficiently deeper than the height of the pins are formed and the pins are cut at a prescribed height. SOLUTION: In pin holes 212, only entrance parts through which a material is guided have diameters which are equal to diameters of pins, and diameters at the inside of the pin holes 212 are made thicker than those of the entrance parts. By this structure, the material which is passed through the entrance parts of the pin holes 212 does not come into contact with the pin holes 212 any longer. In addition, the respective pin holes 212 are not subjected to any limit in the direction of their depth, until they reach a die counter punch 22. Then, pin parts at a press finished product are in serted into a die for cutting the pin legs are cut by an edge, and heights of the pins are made uniform at a prescribed height.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device which is used by adhering to the surface of an electronic component such as an integrated circuit device (hereinafter referred to as an IC chip) in order to efficiently release heat generated by the component. The present invention relates to a component radiator, a method of manufacturing the same, and a mold used in the manufacture thereof.

[0002]

2. Description of the Related Art With the advance of electronic component technology, the degree of integration of IC chips is increasing year by year, and the power consumption of IC chips is also increasing. Some high performance microprocessors provided in recent years consume several to several tens of watts. When such an IC chip is used, the heat generated from the IC chip is appropriately released and
The C chip needs to be cooled. Therefore, for example, I
A so-called radiating fin is mounted on the upper surface of the C chip, and a cooling airflow is forcibly generated by a fan or the like. Many of the heat dissipating fins so far are provided such that fins on a plurality of flat plates are perpendicular to the base and are parallel to each other. However, in order to more efficiently dissipate heat, various shapes of heat dissipating fins have been proposed, such as a shape having a large surface area and a shape considering a passage of a cooling airflow. As one of the radiators capable of efficiently dissipating heat by increasing such a surface area, there is a radiator in which a large number of pin-shaped radiating elements are provided on a base.

[0003] Such a radiator is often manufactured by casting, that is, a method in which a material is melted, poured into a mold, cooled, and then taken out. However, this method requires equipment such as a heat source, and it is difficult to manufacture uniform good products due to the possibility of nests on the product. There was a problem that it was difficult. For this reason, for example, in a radiator provided with a large number of the pin-shaped radiating elements described above, a method has been proposed in which a die having a large number of holes is used to perform cold shock extrusion.

A method of manufacturing such a radiator described in Japanese Patent Application Laid-Open No. 49-12370 will be described with reference to FIG. FIG. 9 is a diagram showing the shape of a mold when a radiator is manufactured by the conventional cold impact extrusion.
In this method, as shown in FIG. 9, a material is placed between a die 90 having a through hole 912 corresponding to a pin of a radiator and a punch (not shown). The surplus material is guided to the through-hole 912 by cold impact extrusion by the action to form a pin-shaped heat radiating portion. In the die 90, a knockout portion 93 in which pin-like knockouts 92 are arranged in the same arrangement as the through hole 912 of the die is inserted into the through hole 912 from the side opposite to the punch. The height of the pin-shaped heat radiating portion to be molded is defined by the position of the portion. After the molding, the knockout 92 is moved toward the molded radiator, so that the molded product can be released from the die 90.

[0005]

However, when a radiator having such a pin-shaped radiator is manufactured by the cold forging as described above, various problems occur, and a high-quality radiator is inexpensive. There is a problem that cannot be manufactured. Therefore, a radiator having such a pin-shaped radiator has not been widely used, despite its high heat radiation effect. Specifically, first, there is a problem that the mold is easily damaged. In particular, as the diameter of the pin-shaped heat radiating portion is reduced and the number thereof is increased in order to enhance the heat radiating effect, the rate of breakage of the mold increases. For this reason, the achievable heat radiation effect has been limited from this point. It is said that a pin-shaped heat radiator having a diameter of 1.6 [mm] or less cannot be molded by the conventional manufacturing method.

In addition, there is another problem that, during extrusion, a material enters the gap between the through hole 912 and the knockout 92 to generate burrs, and the molded product cannot be used.
Also, if the diameter of the pin-shaped heat radiating part becomes small and the number increases,
In the above-described method, there is also a problem that it is difficult to separate the molded product from the mold.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a high-performance radiator having a high radiating effect in which a larger number of pins having smaller diameters are arranged at a high density, while reducing the rate of occurrence of defective products. Another object of the present invention is to provide a manufacturing method that can improve the quality of individual products and can be manufactured more easily. Another object of the present invention is to provide a heat radiation effect that is hardly damaged even when used for manufacturing a heat sink for such an electronic component, whereby a larger number of pins having smaller diameters are arranged at a high density. A mold for the manufacture of heatsinks for electronic components, which makes it possible to improve the quality of individual products and to make it easier to manufacture high-performance heatsinks with extremely low rejection rates. Is to provide. Further, another object of the present invention is to produce by such a production method,
It is an object of the present invention to provide a high-performance heat radiator for electronic parts having a high heat radiation effect in which a larger number of pins having smaller diameters are arranged at a high density.

[0008]

In order to solve the above-mentioned problems, a mold composed of three independent parts is used, so that the strength is substantially increased, and even if it is damaged, it can be quickly dealt with. I made it. Also, the shape of the inlet of the hole through which the material was guided was changed so that the friction between the material and the mold due to the material guidance was reduced during cold forging. In addition, a release agent containing a component that facilitates release is used.

Therefore, in the method of manufacturing a radiator for an electronic component according to the present invention for manufacturing a radiator for an electronic component in which a large number of fine pins are arranged on a substrate, the radiator substantially corresponds to the shape of the radiator. Cold forging the material using a mold having a hole that is sufficiently deeper than its height so that the material extruded is not restricted in the height direction of the pin. Then, the pin of the molded product is cut to a desired height to obtain the electronic component radiator. Preferably, the mold supports a first mold having a large number of through holes for molding its pins and a guide hole for guiding an extruding member when removing the molded product, and supports the first mold. A second mold having a groove for allowing discharge from the through hole of the first mold and a guide hole connected to the guide hole of the first mold for guiding the pushing member; and the first and second molds. And a third die into which the pushing member is inserted into the guiding hole.

[0010] Preferably, the through hole of the first type has a diameter substantially equal to the diameter of the columnar heat radiating portion only in the inlet portion into which the material is introduced, and the inner portion other than the inlet portion. Is formed so as to have a diameter larger than the diameter of the cylindrical heat radiating portion. In other words, the diameter of the inlet portion into which the material of the through hole is introduced is formed so that the end of the inlet portion protrudes in the radial direction so as to be smaller than the inner diameter of the through hole. I have. Specifically, the cold forging is performed using an oil containing calcium sulfonate as a lubricant.
More specifically, the lubricant includes a releasing agent having synthetic fatty acid ester, GSE + phosphorus additive, chlorine additive, Ca sulfonate as components, zinc stearate, 35% sulfur contaminant, sulfur An oil agent obtained by mixing a lubricant containing chlorine-containing cutting oil as a component at a weight ratio of 1: 1.

Further, the mold for manufacturing a radiator for electronic parts according to the present invention comprises a radiator for electronic parts in which a large number of fine pins are arranged on a base mounted on the electronic part for heat radiation. A first mold having a plurality of through-holes for molding its pins and a guide hole for guiding an extruding member when removing a molded product; A second die having a groove for supporting the die of the first type and allowing discharge from the through-hole of the first die and a guide hole connected to the guide hole of the first die for guiding an extruding member; A third hole having a guide hole for guiding the pushing member in connection with the guide holes of the first and second molds, and a third die into which the pushing member is inserted into the guide hole; By stacking the molds of No. 3 and 3 in the height direction of the pins corresponding to the shape of the radiator Deep enough hole so as not to restrict the material to be extruded Te is of the type substantially as formed. Preferably, the through hole of the first mold has a diameter substantially equal to the diameter of the cylindrical heat radiating portion only at an inlet portion into which the material is introduced, and the inside other than the inlet portion has the cylindrical shape. It is formed so as to have a diameter larger than the diameter of the heat radiating portion.

Further, the heat radiator for an electronic component according to the present invention is a heat radiator for an electronic component, wherein a large number of small cylindrical heat radiating portions are arranged on a base mounted on the electronic component for heat radiation, A mold substantially formed in accordance with the shape of the radiator, and in the height direction of the cylindrical radiator, the material extruded in the direction is not substantially limited. Using a mold in which a hole sufficiently deeper than the height is substantially formed, the material is cold-forged and molded, and the cylindrical heat-radiating portion of the molded product is cut to a desired height. This is a manufactured electronic component radiator.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIGS.

First, an example of a radiator for electronic parts manufactured by the manufacturing method of the present invention will be described with reference to FIG. FIG.
Is a diagram for explaining the electronic component radiator,
(A) is a figure which shows the structure, (B) is a figure which shows the usage form. As shown in FIG. 1A, the radiator 14 has a structure in which a large number of pin-shaped radiating portions 16 (hereinafter, simply referred to as pins) are vertically provided on a base 15. In the radiator 14 of the present embodiment, the upper and lower surfaces are 50 [m
m], a pin having a height of 7 [mm] and a diameter of 1.5 [mm] is placed on the base 15 in the vertical and horizontal directions of the base 15 by 3 [m].
[m] pitch. That is, 16 × 16 pins are provided on the entire substrate 15 in principle. The thickness of the base 15 is 3.5 [mm] in the radiator 14 of the present embodiment. The material of the base 15 and the pins 16 is aluminum.

As shown in FIG. 1B, this radiator 14 has a surface on which the pins 16 of the base 15 are not provided,
It is used by being bonded to the back surface of the semiconductor chip 81. That is, the heat generated from the semiconductor chip 81 is
And the heat is radiated from the base 15 and the pins 16 so that the heat of the semiconductor chip is efficiently radiated. Further, in order to cool the semiconductor chip more efficiently, a fan for generating a cooling airflow is provided on the radiator 14, on a substrate on which the semiconductor chip is mounted, or on a housing in which the semiconductor chip is accommodated. Usually provided. The airflow generated by the fan passes between the pins 16 of the radiator 14 so that the radiator 14
The heat generated from the semiconductor chip is more efficiently dissipated through the above.

Further, the radiator 14 of the present embodiment is arranged such that a fan can be directly mounted on the radiator 14 as shown in FIG.
As shown in (A), four pedestals 17 for mounting a fan are provided. The positions of the four pedestals 17 are near each intermediate portion on an imaginary line connecting the center of the base 15 and the four corners. Each of the four pedestals 17 is a cylinder having a diameter of 5 [mm], which is one size larger than the pin 16, and has an opening having a diameter of 2 [mm] and a bottom having a diameter of 1 [mm]. Is provided. By using such a pedestal 17, a fan 82 is mounted on the radiator 14 as shown in FIG. 1B so that the semiconductor chip 81 can be cooled more efficiently.

Next, a method of manufacturing the radiator 14 will be described with reference to FIGS. First, an outline of a manufacturing process of the radiator 14 will be described with reference to FIGS. FIG. 2 is a flowchart showing a manufacturing process of the radiator 14.
3 and 4 are schematic diagrams for specifically explaining the process. As shown in FIG. 2, the radiator 14 as described above includes cutting (step S1), oil applying step (step S2), reflection pressing (step S3), and the like as main steps.
It is manufactured through the steps of a cutting process (step S4) and an outline punching process (step S5).

Specifically, first, as shown in FIG. 3A, the shape and shape of the radiator 14 for manufacturing an aluminum plate 10 supplied in a flat plate shape of, for example, 1200 [mm] × 400 [mm]. By cutting according to the size, an aluminum material 11 as shown in FIG. 3B is obtained (step S1). Next, the cut aluminum material 11 is placed between the front mold 20 and the back mold 24 as shown in FIG. 3C, and an oil (lubricant) is attached (step S2). The components and purpose of the oil agent will be described later. Next, the aluminum material 11 placed between the front mold 20 and the back mold 24 and coated with the oil agent is pressed with a pressure of about 150 [t] by a reflection press machine, as shown in FIG. ) Is processed into a press-finished product having the shape shown in FIG.

Next, as shown in FIG. 4 (E), the pin portion of the finished press product 12 is inserted into a cutting die 31 and the pin portion penetrated by a blade 32 is cut.
The height of 6 is adjusted to a desired height (step S4). And finally, by separating the pressed finished product 12 into a central effective portion 14 and a peripheral dust portion 13 by press working, a radiator 14 as a product can be obtained (step S5).

Next, among such manufacturing steps, the pressing step S3 according to the present invention will be described in detail. First, the front mold 20 used in the pressing step S3 will be described with reference to FIG. The table 20 is a die 2
1, a die receiving die 22, and a knockout die 23.

The die 21 is a die for actually pressing the aluminum material 11 into contact with the aluminum material 11 and deforming the aluminum material 11 into a desired shape by pressing. A pin hole 212 corresponding to 16;
And, a shape corresponding to the pedestal 17 not shown is formed. A knockout hole 211 for releasing the press-formed product from the mold is formed outside the pin hole 212. These pin holes 212, holes corresponding to the pedestals 17, and knockout holes 211 penetrate in the die 21.

FIG. 6 shows the detailed structure of the pin hole 212. FIG. 6 is a diagram showing the shape of the entrance of the pin hole 212. FIG. 6A shows the shape of the pin hole 2 of the die 21 of the present embodiment.
FIG. 12B is a view showing a conventional type pin hole 912 described with reference to FIG. 9 shown for comparison. As shown in FIG. 6, conventionally, the pin hole 912 is an ordinary cylindrical pin hole in which the diameter is equal to the diameter l of the pin everywhere.

However, the pin hole 212 of the die 21 of the present embodiment has a raised portion 216 near the entrance thereof, and the diameter of the opening formed by the raised portion 216 is smaller than the diameter of the pin 16. l. In other words, in the pin hole 212 shown in FIG. 6 (A), only the entrance where the material is guided has a diameter equal to the diameter of the pin 16, and when entering the inside of the pin hole 212, the diameter becomes the entrance. It is thicker than the part. With such a structure, the material that has passed through the entrance portion of the pin hole 212 can no longer contact the pin hole 212, and the friction when the material enters the pin hole 212 can be reduced. it can.

The die receiving die 22 is a type provided so as to be in contact with the die 21 and has an area in contact with the pin hole 212 penetrating through the die 21 when pressed.
A groove 224 is provided for allowing air, lubricating oil, aluminum chips, and the like discharged from the air to escape. The die 21
Similarly, a knockout hole 221 is provided so as to be connected to the knockout hole 211.

The knockout type 23 is a type provided so as to be in contact with the die receiving die 22.
Similarly, a knockout hole 231 is provided so as to be connected to the knockout hole 211 of the first die 22 and the knockout hole 221 of the die receiving die 22. In order to release the press-finished product 12 from the upper die 20, for example, when a pin-shaped knockout as shown in FIG. 9 is inserted into the knockout hole 231, the knockout die 23 is knocked out. An opening 235 is also provided as a guide for properly inserting the part.

Next, lubricating oil used in such cold forging will be described. Usually, when pressing aluminum, there is a problem that aluminum powder adheres to the mold and the press becomes impossible. Further, in cold forging, it is necessary to improve the lubricating effect in order to secure the quality by preventing the deformation and friction of the mold and the prevention of molding marks of the product, and the use of a lubricant is indispensable. In particular, in the processing of the radiator 14 of the present embodiment, since a large number of fine pins are provided, it is determined whether or not release can be performed smoothly in order to ensure product quality. It is necessary to efficiently manufacture the radiator 14. For this purpose, in the present embodiment, a lubricant having a synthetic fatty acid ester as a main component and calcium sulfonate close to a metal type are blended and used as a releasing agent.

More specifically, a release agent having the composition shown in Table 3 and a lubricant shown in Table 4 are mixed at a weight ratio of 1: 1 and used as a lubricant. In Table 3, the chlorine-based additive is, for example, chlorinated paraffin or chlorinated fatty oil.

[0028]

[Table 3]

[0029]

[Table 4]

The cold forging in step S3 is performed by using the surface mold 20 and the lubricant. That is, FIG.
The cut aluminum material 11 as shown in FIG. 2B is coated with the above-described lubricant, placed on the back mold 24, and pressed between the front mold 20 and the back mold 24. . At this time, the aluminum material 11 which is deformed and guided to the pin holes 212 of the die 21 is guided into the pin holes 212 through the narrowed-down entrance portion as shown in FIG. Go. Therefore, the aluminum material sequentially formed into the pin shape does not contact the wall around the pin hole 212 inside the pin hole 212 and does not generate friction.

The hole 212 for each pin is provided in the die receiving mold 2.
Until the number reaches 2, there is no restriction in the depth direction. Therefore, the aluminum material does not apply pressure to the die 21 in the hole 212 for each pin, so that the die 21 is not damaged. At this time, in the holes 212 for the respective pins, pins having different heights are formed in accordance with the aluminum material to be guided. Since the heights are aligned in S4, there is no problem.

At the time of this press working, air, lubricating oil, aluminum chips and the like are discharged from the holes 212 for the pins through the openings of the holes 212 for the pins on the die receiving die 22 side. It is discharged to the outside along the groove 224 of the receiving mold 22. When the press working is completed, pin-shaped knockouts are inserted through the knockout holes 211, 221 and 231 of the table die 20, and the pressed finished product 12 is put into the table die 20.
It is released more. Since the lubricant having the above-described composition has penetrated between the finished press product 12 and the die 21,
This release is easily performed. As a result of such press working, a press finished product 12 as shown in FIG. 3 (D) having an elaborate product portion in which small-diameter pins as shown in FIG. 1 (A) are clustered is obtained.

As described above, in the method of manufacturing the radiator 14 according to the present embodiment, when molding the pins, the pins and the molds formed in the depth direction and the radial direction with respect to the pin holes of the mold are used. Since the contact is prevented from occurring, the pressure applied to the hole 212 for the pin of the mold can be remarkably reduced in the depth direction and the radial direction by performing the press working.
In other words, it is possible to prevent the mold from being damaged, which has been the most problematic when manufacturing a radiator provided with a large number of such small-diameter pins by cold forging, and arrange a larger number of pins at a high density. As a result, a high-performance radiator 14 having a high heat radiation effect can be manufactured.

In addition, since a new lubricant is used to reduce the friction between the individual pins and the mold and to facilitate the release, the press-finished product can be easily released from the mold. I can do it. As a result, it is possible to prevent the product from being scratched or damaged at the time of release from the mold, and to efficiently manufacture the radiator. Also, the mold itself uses a mold that can be disassembled into three parts, and the pin holes are provided only in the die mold 21, and the other molds 22 and 23 have knockout holes 221 and 231. Is merely provided. Therefore, the strength of each mold is higher than that of the conventional integrated mold described with reference to FIG. 9, and the mold is less likely to be damaged by impact or friction during forging.

Further, since the mold is divided into three parts as described above, the mold can be manufactured using different heights and materials for each part. That is, since a mold can be manufactured by selecting an appropriate material in accordance with the type of force applied to each mold, a more appropriate mold can be made as a whole. Also, by allowing one mold to be disassembled into these three parts, the structure of each mold can be simplified, the mold can be easily manufactured, the number of manufacturing days can be reduced, and the manufacturing cost can be reduced. Can be lower. Further, even if one of the molds is damaged, a substitute can be manufactured in a short time, and the radiator can be manufactured stably.

In the method of manufacturing a radiator according to the present embodiment, the height of the pins is not specified at the time of forging, and the pressed finished product 12 having appropriately formed pins is released from the mold. Radiator 1 as a product by cutting pins at the height of
I am trying to get 4. Therefore, it is possible to completely eliminate a defect in which burrs are formed at the tip of the pin as in the related art. Further, in order to adjust the height of the pin to a desired height, conventionally, it was necessary to change the setting at the time of forging, such as changing the arrangement of a knockout pin that closes the pin hole. However, in the method of manufacturing the radiator according to the present embodiment, the pin 16 having an arbitrary height can be obtained only by changing the cutting position, and the adjustment of the height of the pin can be easily performed. It can be carried out.

The present invention is not limited to the embodiment, and various modifications are possible. For example, the configuration of the mold of the radiator 14 according to the present invention is not limited to the present embodiment, and various modifications are possible. For example, the mold 20 according to the present embodiment is composed of the three parts of the die 21, the die receiving mold 22 and the knockout mold 23, but is divided into two parts of the die 21 and other parts. , Or may be further divided into four or more parts.

Further, the configuration of details of the mold 20 may be arbitrary. For example, press finished product 12 can be more easily
If it is desired to forcibly release the mold, a knockout hole may be further provided. In this case, a knockout hole may be newly provided. For example, as shown in FIG. 7, some of the pin holes 212 of the die 21 The mold 22 and the knockout mold 23 may be provided with knockout holes 222 and 232, and a pin-shaped knockout may be inserted into these holes to release the mold.

Further, the manufacturing method of the present invention and the radiator manufactured using the mold of the present invention are not limited to those described with reference to FIG. For example, the concave portion formed on the upper surface of the fan mounting base 17 shown in FIG. 1 may have a structure in which a screw for mounting the fan is cut, or may be simply flat without such a concave portion. It may be an appropriate upper surface. Further, the shape and configuration of the pedestal itself may be arbitrarily and suitably changed. Instead of having a configuration having four as in this embodiment, only one may be used, and the shape of each pedestal may be a larger cylinder or a smaller cylinder,
Alternatively, a pedestal having a shape other than a column may be used. The pedestal may have any suitable shape and configuration according to the shape of the fan to be installed. Of course, when the fan is not mounted on the radiator 14, the radiator 14 has no pedestal and the base 15
A configuration in which the pins 16 are provided on the entire upper surface may be used.

The shape of the pin 16 may be arbitrarily modified. For example, the diameter and pitch of the pins may be arbitrarily changed. In the present invention, for example, a pin of about 1.0 [mm] to about 1.5 [mm], which is said to be unable to be manufactured by ordinary cold forging, of 1.6 [mm] or less is used for about 3 [mm]. A main object of the present invention is to provide a manufacturing method and a mold that can be arranged at a narrow pitch. However, even in a radiator in which pins of about 1.6 [mm] as in the related art are arranged at a normal pitch, by applying the manufacturing method and the mold according to the present invention, it is simpler and less expensive. It is clear that high quality products can be manufactured stably. Accordingly, the present invention may be applied to the manufacture of such conventional radiators. That is, the present invention is not limited at all by the diameter and pitch of the pins of the radiator to be manufactured.

The height of the pins does not need to be the same for all pins in one radiator, but may be a radiator having pins of different heights. FIG. 8 shows such an example. FIG. 8 is a diagram for explaining a radiator having pins with different heights, and FIG. 8A is a diagram showing a cutter for forming pins with different heights by a single punch on a pressed product. And (B) shows such a radiator 14b having relatively high pins 16a and lower pins 16b on the substrate 15. FIG.

The cutting device 33 includes a die 34, a pin cutting blade 3
5. It has a bevel 36. The die 34 is a die for determining the size of the pin, and the pin cutting blade mold 35 is a cutting portion for actually cutting the pin to its height. The bevel 36 is a driving unit for moving the pin cutting blade mold 35 in the direction of the arrow so that the pin is cut. In the cutter 33, a die 34 suitable for a desired pin height is prepared, and the finished press product 12 obtained by press working is set on the die 34. When the bevel 36 is moved in the direction of the arrow (downward in the figure), the pin cutting blade mold 35 is also moved in the direction of the arrow (rightward in the figure). As a result, the press is completed on the lower surface of the die 34. Each pin of the article 12 is cut. As a result, a radiator 14b having pins of a desired height as shown in FIG. 8B is manufactured.
Note that the pin cutting blade mold 35 needs only a small movement of about 2 mm in diameter of the pin.

In today's miniaturized devices, in order to effectively use the limited space in the housing, the boards must be densely mounted or locally mounted on the boards. The method is often done. In such a case, the radiator 14 mounted on the microprocessor is also required to have a shape adapted to the spatial gap, and therefore, a radiator having a partially different pin height is also required. When a conventional radiator manufacturing method shown in FIG. 9 is used to manufacture a radiator 14b as shown in FIG. 8B, the setting during forging, such as changing the arrangement of knockout pins that close the pin holes, is performed. Although it is necessary to change, in the method of manufacturing the radiator according to the present embodiment, if there is a certain difference in the height of the pins, it is only necessary to change the positions of the pins to be cut in the cutting step S4. Therefore, such a radiator can be easily manufactured.

The size of the radiator itself may be arbitrarily changed according to the size of the semiconductor chip to be applied, and the manufacturing method and the mold of the present invention are not limited to the size. The radiator having a side of 50 [mm] shown in the present embodiment is for a relatively large semiconductor chip such as a microprocessor.
The size may be arbitrarily determined, for example, a size applied to a semiconductor chip of about [mm] or a size applied to a larger semiconductor chip having a side of, for example, about 80 [mm]. Further, the shape of the radiator is not limited at all. In particular, the shape of the portion corresponding to the base of the radiator may be arbitrarily and suitably changed according to the shape of the electronic component to be mounted. However, as long as the heat radiator is shaped so as to have a small pin-shaped heat radiating portion having a high heat radiating effect as shown in this embodiment even in a part of its configuration, the effects of the manufacturing method and the mold of the present invention can be obtained. Can be further exhibited, which is preferable.

The radiator manufactured by the manufacturing method and the mold according to the present invention is not limited to a radiator for radiating heat of a semiconductor chip. The present invention may be applied to manufacture a heat radiator for cooling various electronic components such as a power transistor and a thyristor, or a motor and a transformer.

[0046]

As described above, according to the method for manufacturing a radiator for electronic parts of the present invention, a larger number of small-diameter pins are used.
High-performance heatsinks with high heat-dissipation effects, such as high-density arrangements, can improve the quality of individual products while reducing the rate of defective products, and can be manufactured more easily. . Further, deformation such as shape can be easily dealt with in a short time. In addition, if the mold for manufacturing a radiator for electronic parts of the present invention is used, a higher-performance radiator having a higher radiating effect such that a larger number of small-diameter pins are arranged at a high density,
The quality of individual products can be improved while the rate of occurrence of defective products can be greatly reduced, and the product can be manufactured more easily. Further, according to the electronic component radiator of the present invention,
Heat can be efficiently radiated by the small-diameter pins arranged at high density.

[Brief description of the drawings]

FIG. 1 is a view for explaining a radiator for electronic components according to the present invention, wherein (A) is a view showing the structure thereof;
(B) is a figure which shows the usage form.

FIG. 2 is a flowchart showing a manufacturing process of a radiator according to an embodiment of the present invention.

3A and 3B are views for specifically explaining each step shown in FIG. 2, wherein FIG. 3A is a view showing an aluminum plate, FIG. 3B is a view showing a cut aluminum material, (C) is a figure for demonstrating the reflection press process shown in FIG. 2, (D) is a figure which shows a press finished product.

FIGS. 4A and 4B are diagrams for specifically explaining each step shown in FIG. 2; FIG. 4E is a diagram for explaining a trimming step; and FIG. FIG.

FIG. 5 is a view showing a structure of a mold used in the reflection press step shown in FIG. 2 for manufacturing a radiator for an electronic component according to the present invention.

6A and 6B are diagrams for explaining a structure of an inlet portion of a hole for a pin of the type shown in FIG. 5, wherein FIG. 6A is a diagram showing the structure, and FIG. It is a figure which shows the structure of the inlet part of the hole for pins in this type | mold.

FIG. 7 is a view showing a modification of the mold shown in FIG. 5;

FIG. 8 is a view showing a modified example of the cutting step shown in FIG. 2, and FIG. 8 (A) is a view showing a cutter for forming pins having different heights by a single punch on a finished press product. ,
(B) is a figure which shows the radiator which has the pin from which a height differs on a base | substrate.

FIG. 9 is a view showing a mold used in conventional cold forging.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Aluminum plate, 11 ... Aluminum material, 12 ... Press finished product, 13 ... Heat sink, 15 ... Base, 16 ... Pin, 17 ... Pedestal, 20 ... Mold, 21 ... Die mold, 211 ... Knockout hole, 212 ... Pin holes, 213 ... Die type, 21
6 ... raised portion, 22 ... die receiving type, 221 ... hole for knockout, 224 ... groove, 23 ... knockout type, 231
… Knockout hole, 235… opening, 24… back mold, 3
1 ... die, 32 ... blade, 33 ... cutting device, 34 ... die,
35: pin cutting blade type, 36: bevel, 81: semiconductor chip, 82: fan, 90: die, 912: through hole, 9
2 ... Knockout, 93 ... Knockout part

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI C10M 135/10 C10M 135/10 // C10N 40:14

Claims (8)

[Claims] 1. A method of manufacturing a radiator for electronic components, wherein a large number of small cylindrical radiators are disposed on a base mounted on the electronic component for heat radiation, the method corresponding to the shape of the radiator. A hole substantially deeper than the height of the columnar heat radiating portion so as not to substantially limit the material extruded in the height direction of the columnar heat radiating portion. Using a substantially formed mold, a step of cold forging the material and molding the material, and a step of cutting the columnar heat radiating portion of the molded product to a desired height, The manufacturing method of the heat sink for electronic components which has. 2. The mold according to claim 1, wherein said mold has a through-hole provided corresponding to said cylindrical heat radiating portion for molding said cylindrical heat radiating portion, and a molded product pushing member for taking out said molded product. A first die having a guide hole for guiding the first die, a groove for supporting the first die, and allowing discharge from the through-hole of the first die, and a groove of the first die. A second die having a guide hole connected to a guide hole for guiding the molded product extruding member; a guide hole connected to the guide holes of the first and second molds for guiding the molded product extruding member; A third die into which the molded product extruding member is inserted into the guide hole; and the cold forging is performed using the die. Production method. 3. The through hole of the first type, wherein only the entrance where the material is introduced has a diameter substantially equal to the diameter of the columnar heat radiating portion, and the inside other than the entrance is provided inside. The method for manufacturing a radiator for an electronic component according to claim 2, wherein the radiator is formed so as to have a diameter larger than a diameter of the cylindrical radiator, and the cold forging is performed using the mold. 4. The method according to claim 3, wherein said cold forging is performed by using an oil containing calcium sulfonate in said mold as a lubricant. 5. The cold forging comprises an oil agent obtained by mixing a releasing agent having the components shown in Table 1 and a lubricating agent having the components shown in Table 2 at a weight ratio of 1: 1. 5. The method for manufacturing a radiator for electronic parts according to claim 4, wherein the radiator is used as a lubricant. [Table 1] [Table 2] 6. A mold used for molding and manufacturing a radiator for electronic parts having a large number of fine columnar heat radiating parts disposed on a substrate mounted on an electronic part for heat radiation by cold forging. There is a through hole provided corresponding to the cylindrical heat dissipating portion for molding the cylindrical heat dissipating portion of the radiator, and a guide hole for guiding a molded product extruding member when removing the molded product. A first die having: a groove for supporting the first die and allowing discharge from the through-hole of the first die to escape, and being connected to the guide hole of the first die. A second die having a guide hole for guiding the molded product extruding member, and a guide hole for guiding the molded product extruding member by being connected to the guide holes of the first and second molds; A third mold into which the molded product extruding member is inserted into the hole; By stacking the third mold, the cylindrical heat radiator corresponds to the shape of the heat radiator, and does not substantially limit the material extruded in the height direction of the cylindrical heat radiator in the direction. A mold for manufacturing a radiator for an electronic component in which a hole portion sufficiently deeper than the height of the radiator is formed. 7. The through hole of the first type, wherein only the entrance where the material is introduced has a diameter substantially equal to the diameter of the cylindrical heat radiating portion, and the inside other than the entrance is provided inside. The mold for manufacturing a radiator for an electronic component according to claim 6, wherein the mold is formed so as to have a diameter larger than a diameter of the cylindrical heat radiating portion. 8. A radiator for an electronic component, wherein a large number of small cylindrical radiators are arranged on a base mounted on the electronic component for heat radiation, wherein the heat radiator substantially corresponds to the shape of the radiator. In the height direction of the cylindrical heat dissipating portion, a hole sufficiently deeper than the height of the columnar heat dissipating portion is provided so as not to substantially limit the material extruded in the direction. A radiator for electronic components manufactured by cold forging a material using a formed mold and molding the material, and cutting the cylindrical heat radiation portion of the molded product to a desired height.