JPH10189075A - Connecting method of high frequency printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce unevenness of transmission loss among signal patterns at connecting sections by attaining a highly precise and uniform contact pressure by uninforming contact pressures at connecting sections of respective signal patterns by adding a connecting board without soldering so as to mechanically depress it to each high frequency signal pattern connecting section of a printed wiring board by using a pressing mechanism part. SOLUTION: A connecting board 3 to connect a signal pattern 6 of a printed wiring board 1 and a signal pattern 7 of a printed wiring board 2 is pressed across the printed wiring board 1 and the printed wiring board 2 by using a pressing mechanism part 4. As a through pattern 8 of the connecting board 3 increases a contact area between it and the signal patterns 6, 7 of the printed wiring boards 1, 2 by pressing by a press screw part 5 of the pressing mechanism part 4, an electric signal that carries the signal pattern 6 of the printed wiring board 1 transmits on the through pattern 8 of the connecting board 3, and further, transmits the signal pattern 7 of the printed wiring board 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting a high-frequency printed circuit board, and more particularly to a method for connecting a high-frequency printed circuit board that uses mechanical pressing without using solder.

[0002]

2. Description of the Related Art In general, as a connection method of a printed wiring board, a connection by a "flexible board connector" as described in "Flexible board connector" of Japanese Patent Application Laid-Open No. 5-135831 shown in FIG. There is a method. In this method, the flexible substrate 2 sandwiched between the base member 21 and the cover member 22 using the lever member 23 is used.
6 and 27 are pressed in their entirety, a certain degree of uniformity in the range of the pressing force can be obtained. However, since there is no means such as a correction function for improving the accuracy of the variation in the pressing force of each pattern, a high frequency It could not be used as a printed wiring board due to the large variation in transmission loss. In other words, what determines the electrical performance of the high-frequency circuit is
The key is how to reduce the energy variation between each pattern. The main cause of the variation is the pattern connection portion of the printed circuit board. Conventionally, this portion has been connected by soldering using a copper foil ribbon described below.

That is, as shown in FIG. 3, in the conventional high-frequency printed wiring board connection system, printed wiring boards 9 and 1 having respective high-frequency signal patterns 13 and 14 are provided.
The respective substrates are fixed to the chassis 10 so as to be brought into the same plane by abutting the connection end portions with 0. Then, the copper foil gold-plated ribbon 15 in a state of being bridged between the connection ends of the respective high-frequency signal patterns and the connection ends is soldered 16 to the respective signal patterns 13 and 14.

[0004]

However, in such a conventional printed wiring board connection system, each high-frequency signal pattern is connected by soldering a copper foil gold-plated ribbon 15, so that the operator is required to connect the high-frequency signal patterns. The amount of solder 16 changed depending on the skill, and the transmission loss fluctuated such that the loss was small when the amount of solder was small and large when the amount was small. The width of the patterns 13 and 14 is small (about 0.5
mm), the amount of solder in the solder connection portion affects transmission loss. To reduce this effect, the soldering operation was performed while controlling the amount of solder 16. However, the variation in the amount of solder in connection of each signal pattern still affects the transmission loss in each signal pattern.

[0005] Further, since heating during soldering also causes pattern peeling, the copper foil gold-plated ribbon 1
5, the number of repetitions of connection or disconnection was also limited.

Accordingly, an object of the present invention is to add a connection board without soldering and mechanically press the connection board to each high-frequency signal pattern connection portion of the printed wiring board by a pressing mechanism. By making the pressing force adjustable, the contact pressure at each signal pattern connection point is made uniform, thereby obtaining a highly accurate and uniform contact pressure and reducing the transmission loss between the signal patterns at the connection portion. The aim is to reduce variation.

[0007]

According to the present invention, there is provided a high-frequency printed circuit board connection system, wherein the first printed wiring board and the second printed wiring board are arranged on the same plane, and a wiring pattern of the same signal is provided. Between the wiring pattern of the first printed wiring board and the wiring pattern of the second printed wiring board when the printed wiring is laid across the first printed wiring board and the second printed wiring board. The connection is made by a through pattern printed on a connection board different from the first and second printed wiring boards, and the through pattern is abutted across the two wiring patterns of the first and second printed wiring boards. And contact by mechanical pressing.

In the high frequency printed circuit board connection method according to the present invention, when the plurality of wiring patterns are printed on the first and second printed wiring boards, the through pattern is formed on one connection substrate. A plurality of wiring patterns are provided corresponding to the plurality of wiring patterns.

In the high-frequency printed circuit board connection method according to the present invention, when the wiring pattern is a high-frequency signal pattern, the connection between the wiring pattern of the first printed wiring board and the wiring pattern of the second printed wiring board is performed. The pattern width of the through pattern of the substrate for use is all the same as the printed wiring width, and the through pattern is provided so as to face each of the wiring patterns.

In the method for connecting a high-frequency printed wiring board according to the present invention, the connection board is connected to the first and second printed wiring boards while the respective wiring patterns and the through patterns are in contact with each other. Fixing is performed by screwing from a pressing mechanism having a structure in which the connection substrate is interposed and covers the entire surface of the connection substrate, and attachment and detachment in assembly and disassembly are performed only by the screw operation. Easy to do.

In the method for connecting a printed circuit board for high frequency wave according to the present invention, a pressing force for pressing the through-pattern portion of the connection board from the opposite surface of the through-pattern to the pressing mechanism, that is, each of the wiring patterns and A pressing screw portion capable of adjusting the contact force between the through patterns is provided on the pressing mechanism main body for supporting the pressing force of the screw corresponding to the plurality of the through patterns, and each of the wiring patterns is operated by the screw operation of the pressing screw portion. And the through pattern are pressed to make contact connection.

In the method of connecting a high-frequency printed wiring board according to the present invention, a resin such as Teflon is used as a material of the connection board.

In the method for connecting a printed circuit board for high frequency according to the present invention, the pressing force for pressing the through pattern portion of the connection substrate is defined by defining a screw tightening torque of the pressing screw portion of the pressing mechanism portion. By making them constant, variations in the transmission loss of the high-frequency signal at the time of contact between the plurality of wiring patterns of each of the first and second printed wiring boards and each of the plurality of through patterns are minimized. Hold down.

[0014]

Embodiments of the present invention will now be described with reference to the drawings.

Referring to the overall configuration of FIG. 1 (2) showing an embodiment of the present invention, the high-frequency printed circuit board connection method employs an end face of a printed circuit board 1 having a high-frequency signal pattern (for example, 6) to be connected. And the end face of the printed wiring board 2 having another high-frequency signal pattern (for example, 7) to be connected is brought into contact with each other, and the high-frequency signal pattern of the printed wiring board 1 and the printed wiring are connected to connect each signal pattern. The printed circuit board 1 has the same pattern width as the high-frequency signal pattern of the substrate 2 and has a through pattern (for example, 8) surface etched on a connection substrate (for example, a thin plate of Teflon) 3 provided correspondingly.
And 2 are set so as to be in contact with the high-frequency signal patterns (for example, 6 and 7), the pressing mechanism 4 is fixed to the printed wiring boards 1 and 2, and the pressing screw 5 of each signal pattern is set to a constant torque. And press the connection board 3
Is pressed with a uniform pressure.

Next, the operation of the present invention will be described. FIG.
FIG. 1A is a cross-sectional view illustrating a connection state according to the present invention. The electric signal that has propagated on the signal pattern 6 of the printed wiring board 1 propagates on the through pattern 8 of the connection substrate 3 via the contact surface. Next, the printed circuit board 2
The electric signal propagates on the signal pattern 7 of the printed circuit board 2 via the contact surface with the signal pattern 7 of the printed circuit board 2.

[0017]

As described above, according to the present invention, a through-pattern substrate is added without using solder, and the through-pattern substrate is mechanically pressed uniformly to the pattern connection portion of the printed wiring board. Since the uniform contact area and contact pressure of each pattern and their increase and stabilization can be obtained, and by controlling the torque using a torque driver, the pressing force due to the screw pressing becomes constant, Loss variation can be reduced, and energy with less variation can be transmitted.

Furthermore, since the pressing mechanism employs a fastening method using screws, thermal stress is not applied to the pattern unlike soldering, so that repeated connection and disconnection can be performed, and torque management is performed with torque. Since the screws are fastened using a screwdriver, there is no need for operator skills such as soldering, and workability can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view (2) showing a high-frequency printed wiring board connection method according to one embodiment of the present invention, and a cross-sectional view (1) showing a connection state of the same part.

FIG. 2 is a plan view (1) of a connector for a flexible substrate according to the prior art of the present invention, and a schematic perspective view (2) of the same part in section.

FIG. 3 is a perspective view (2) showing a conventional printed wiring board connection method, and a sectional view (1) showing a connection state of the same part.

[Explanation of symbols]

 1, 2 printed wiring board 3 connection board 4 pressing mechanism section 5 pressing screw section 6, 7 signal pattern 8 through pattern 16 solder

Claims (7)

[Claims] A first printed wiring board and the second printed circuit board;
The first printed wiring board is arranged over the first printed wiring board and the second printed wiring board, and the first wiring pattern is printed over the first printed wiring board and the second printed wiring board. The connection between the wiring pattern of the printed wiring board and the wiring pattern of the second printed wiring board is performed by a through pattern printed and printed on a connection board different from the first and second printed wiring boards. A high-frequency printed circuit board connection method, wherein the first and second printed circuit boards are brought into contact by straddling the two wiring patterns and making contact by mechanical pressing. 2. The method according to claim 1, wherein the wiring pattern is formed of the first and second wiring patterns.
If more than one printed wiring is printed on the printed wiring board,
2. The high-frequency printed wiring board connection method according to claim 1, wherein a plurality of the through patterns are provided on one connection substrate in correspondence with the plurality of wiring patterns. 3. The pattern width of a wiring pattern of the first printed wiring board, a wiring pattern of the second printed wiring board, and a through pattern of the connection board when the wiring pattern is a high-frequency signal pattern. 3. The high-frequency printed wiring board connection method according to claim 1, wherein all the wiring patterns have the same printed wiring width, and the through pattern is provided so as to face each of the wiring patterns. 4. The fixing of the connection board in a state where the respective wiring patterns and the through patterns are in contact with the first and second printed wiring boards, between the connection boards. And a screw mechanism from a pressing mechanism having a structure that covers the entire surface of the connection substrate, and that the assembly and disassembly can be easily performed only by the screw operation. 4. The high-frequency printed circuit board connection method according to claim 1, 2, or 3. 5. A pressing force for pressing the through-pattern portion of the connection substrate from the opposite surface of the through-pattern to the pressing mechanism, that is, a contact force between each of the wiring patterns and the through-pattern can be adjusted. A pressing screw portion is provided on the pressing mechanism body for supporting the pressing force of the screw corresponding to the plurality of through patterns, and each of the wiring patterns and the through pattern are pressed and contacted by the screw operation of the pressing screw portion. 5. The high-frequency printed circuit board connection method according to claim 1, wherein the connection is performed. 6. The high-frequency printed circuit board connection system according to claim 1, wherein a resin such as Teflon is used as a material of the connection substrate. 7. A method according to claim 1, wherein the pressing force for pressing the through pattern portion of the connection board is fixed by defining a screw tightening torque of the pressing screw portion of the pressing mechanism. 2. The method according to claim 1, wherein a variation in transmission loss of the high-frequency signal at the time of contact between the plurality of wiring patterns of each of the second printed wiring boards and each of the plurality of through patterns is minimized. 7. The high-frequency printed circuit board connection method according to 2, 3, 4, 5, or 6.