JPH10185989A - Semiconductor part-mounting board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the efficiency of burn-in test per constant temperature tank in a unit of time by providing a child substrate capable of mounting a semiconductor part and connecting via a vertical connector containing a protection resistor to the child substrate. SOLUTION: A semiconductor part-mounting board is provided with a plug part and each wiring circuit. At the connecting position on each wiring circuit and a child substrate 2, through holes are formed and each conduction terminal 3a and 3b of a vertical connector 3 and the vertical connector 5 for electric power supply are contacted to conduct. The child substrate 2 is provided with a socket 2a for mounting semiconductor part on the middle surface, and a through hole is formed similarly by wiring the socket and each conduction terminal 3a and 3b of vertical connectors 3 and 5 are contacted to conduct. The vertical connector 3 contains protection resistors in parallel and by extending protection resistor terminals, conduction terminal 3a and 3b of vertical connector 3 are formed. By this, it becomes possible to increase the number of parts mounted on a board and the improve the efficiency of burn-in test.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermostatic chamber apparatus for performing a temperature environment test and a function test of a semiconductor component, and relates to an improvement of a semiconductor component mounting board used by being inserted into the thermostatic chamber.

[0002]

2. Description of the Related Art As an environmental test of semiconductor components such as a CPU and a memory, burn-in using a thermostat device or the like is performed. That is, a semiconductor component mounting board on which semiconductor components are mounted is loaded via a socket or the like into a constant temperature chamber in which air heated by a heater is supplied by a fan and maintained at a predetermined temperature, and is repeatedly heated in the chamber. For the temperature / temperature lowering operation, a temperature environment test and a function test are performed to check how the semiconductor component supplied with power shows a change in state with respect to the stimulus signal.

At this time, a connector consisting of a socket for test equipment provided on the constant temperature chamber side and a board side plug of a semiconductor component mounting board to be loaded in the constant temperature chamber is connected, whereby the semiconductor component is connected. The above test is performed by connecting a semiconductor component mounted on a mounting board to the test equipment built in the apparatus side.

[0004]

In order to increase the yield of the test apparatus, it is preferable that the number of semiconductor components that can be put into the constant temperature chamber in one test is as large as possible. However, in recent years, semiconductor components such as CPUs have been reduced in size but have increased the number of pins (some BGAs have more than 600 pins). Due to the increase in the number of pins, semiconductor components are connected to each pin for the purpose of protecting the semiconductor components. The proportion of the installation area of the protection resistor occupying on the semiconductor component mounting board increases, and the number of semiconductor components that can be loaded in the constant temperature chamber cannot be increased so much.

In a CSP (Chip Scale Package), the pin pitch is reduced to 0.8 mm or less. In order to manufacture a semiconductor component mounting board on which such miniaturized semiconductor components are mounted, it is inevitable to use a multilayer printed circuit board. There is a need to. However, semiconductor component mounting boards
As described above, the thickness of the board must be limited to about 1.6 mm in order to use the connector for connection. However, in the current printed circuit board production technology, considering the reliability by adding a heat cycle, However, the above-mentioned plate thickness is limited to about 10 layers, so that even if an attempt is made to increase the number of mountings, there is considerable restriction. In addition, since the displacement of the hole position such as a through hole, etc., required when forming a multilayer, becomes more remarkable for a board of a larger size after the above thermal cycle, the number of semiconductor components mounted due to the expansion of the size of the semiconductor component mounting board is increased. There is a limit to increasing.

The present invention has been made in view of the above problems of the prior art, and provides a semiconductor component mounting board capable of greatly increasing the number of semiconductor components mounted on the board. It is intended to improve the efficiency of burn-in inspection per unit time.

[0007]

Therefore, a semiconductor component mounting board according to the present invention has a child substrate on which a semiconductor component can be mounted, and can be connected to the child substrate via a vertical connector having a built-in protection resistor. The basic feature is that

[0008]

In the above-mentioned structure, the space occupied by the resistor is reduced because of the use of a vertical connector having a built-in protection resistor, so that more semiconductor components can be mounted. Also, since the semiconductor components are mounted on the sub-board, if the size of the sub-board is reduced, there is no need to worry about misalignment such as through holes due to the effects of thermal cycling, and a semiconductor that can be mounted on a single semiconductor component mounting board The number of parts can also be increased.

[0009]

Embodiments of the present invention will be described below. 1 to 4 show an embodiment of the configuration of the present invention. In the figure, 1 is a semiconductor component mounting board, 2 is a child board,
Reference numeral 3 denotes a vertical connector having a built-in protection resistor 4, and reference numeral 5 denotes a power supply vertical connector.

The semiconductor component mounting board 1 has a plug 1a which is connected to a socket for test equipment provided in a constant temperature chamber, supplies power to each of the daughter boards 2 described later, and outputs a stimulus signal. A wiring circuit for sending or receiving an output signal from a semiconductor component is constituted by a printed wiring board formed on the surface thereof. The conductive terminals 3 of the connectors 3 and 5, which will be described later, are respectively provided at positions corresponding to the connection between the wiring circuit and these wiring circuits on the daughter board 2.
Through holes (not shown) are formed so that a, 3b and 5a, 5b can contact and be electrically connected.

As shown in FIGS. 2 and 3, the daughter board 2 has a socket 2a for mounting a semiconductor component on the center upper surface thereof, and a socket corresponding to each through hole of the semiconductor component mounting board 1 around the socket 2a. And through holes for power supply, stimulus signal transmission, and semiconductor component output signal reception so that the conductive terminals 3a, 3b and 5a, 5b of the connectors 3 and 5 are also in contact with each other and can be electrically connected. 2b and 2c are provided. Each terminal of the socket 2a and the corresponding through hole 2
b and 2c are electrically connected to each other by a wiring circuit.

As shown in FIG. 4, the connector 3 has a plurality of protective resistors 4 built therein in parallel.
Further, the terminals of the resistor 4 extend to form conductive terminals 3a and 3b of the connector. In this configuration, the power supply vertical connector 5 also has a vertical configuration with both terminals extending respectively.

When the child board 2 is mounted on the semiconductor component mounting board 1, as shown in FIG. 3, the terminals of the connectors 3 and 5 are connected to the respective terminals of the semiconductor component mounting board 1 and the child board 2. This is done by fitting it into a through hole. By mounting in this way, the use of the vertical connector 3 having the built-in protection resistor 4 makes the resistor 4
The space occupied by the device has been reduced, and more semiconductor components can be mounted. FIG. 1 shows a semiconductor component mounting board 1
The mounting state of the child board 2 on the top is shown. In this example, 20 sub-boards 2 can be mounted on one semiconductor component mounting board 1 (accordingly, a total of 20 semiconductor components can be mounted). On the other hand, in a semiconductor component mounting board having a conventional structure, only 15 semiconductor components can be mounted in the same size.

FIGS. 5 to 7 show the structure of a semiconductor component mounting board 1 on which CSP type semiconductor components are mounted.
Since the basic configuration is the same as the above configuration, the same configuration is denoted by the same reference numeral. As shown in FIG. 6, a child board 2 is mounted on a semiconductor component mounting board 1 via a spacer 6, and further connected to the semiconductor component mounting board 1 via a vertical connector 3 having a built-in protection resistor. The substrate 2 is electrically connected. In this example, 196-pin CS
Although the pitch is P, since the lead pitch is 0.8 mm, a gap of only 150 μm can be obtained even when the pattern width is 100 μm when the semiconductor component mounting board 1 is manufactured. Therefore, with the current printed circuit board manufacturing technology, only small-sized products can be manufactured. However, as shown in this example, the child board 2 mounted type and the built-in resistor type vertical connector 3
As shown in FIG. 7, with the use of, 54 can be mounted.

[0015]

According to the structure of the present invention described in detail above, the space occupied by the resistor is reduced and the number of semiconductor components mounted is increased due to the use of a vertical connector having a built-in protection resistor. You can do it. Also, since the semiconductor components are mounted on the sub-board, if the size of the sub-board is reduced, there is no need to worry about misalignment such as through holes due to the effects of thermal cycling, and a semiconductor that can be mounted on a single semiconductor component mounting board The number of parts can also be increased.
Therefore, the efficiency of burn-in inspection per unit time per thermostat apparatus can be greatly improved.

[Brief description of the drawings]

FIG. 1 is a plan view showing a semiconductor component mounting board according to an embodiment of the present invention.

FIG. 2 is a plan view showing a configuration of a daughter board used in the above configuration.

FIG. 3 is a side view showing a state where a connector is connected to the daughter board.

FIG. 4 is an explanatory diagram showing a configuration of a vertical connector with a built-in protection resistor.

FIG. 5 is a plan view showing a configuration of a child board according to another embodiment of the configuration of the present invention.

FIG. 6 is a sectional view showing a section taken along line AA.

FIG. 7 is a plan view showing a semiconductor component mounting board in the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor component mounting board 2 Substrate 2a Socket 2a, 2b Through hole 3 Vertical connector 3a, 3b, 5a, 5b Terminal 4 Protection resistor 5 Power supply vertical connector 6 Spacer

Claims (1)

[Claims] A semiconductor component mounting board that mounts and inserts semiconductor components into a thermostatic chamber of a thermostat device for performing a temperature environment test and a function test of a semiconductor component and electrically couples the test component with a test device via a connector. A semiconductor component mounting board having a child substrate on which a semiconductor component can be mounted, and being connectable to the child substrate via a vertical connector having a built-in protection resistor.