JP3048075U - Socket for semiconductor component mounting board - Google Patents

Abstract

(57) [Summary] [PROBLEMS] Even if the protrusion pitch of a semiconductor component becomes smaller than before, the mounting board used so far can be used, and even when semiconductor components having different protrusion pitches are mixed. An object of the present invention is to provide a socket for a mounting board that requires only one type of mounting board. SOLUTION: The pin pitch on the mounting board 3 mounting side is made larger than the pin receiving pitch on the semiconductor component 2 mounting side in the socket 1 so that the corresponding pin receivers and pins are electrically connected.

Description

[Detailed description of the invention]

[0001]

[Industrial applications]

 The present invention relates to a socket for a semiconductor component mounting board which is inserted into a thermostatic chamber of a thermostat apparatus and is used between a semiconductor component and a mounting board used for a temperature environment test and a function test of a semiconductor component. Regarding improvement.

[0002]

[Prior art]

 As an environmental test of semiconductor components such as a CPU and a memory, burn-in using a thermostatic oven has been performed. That is, a semiconductor component mounting board on which semiconductor components are mounted is loaded via a socket or the like into a constant temperature chamber in which air heated by a heater is supplied by a fan and maintained at a predetermined temperature, and is repeatedly heated in the chamber. For temperature and temperature reduction operations, a temperature environment test and a function test are performed to check how the semiconductor component supplied with power changes in response to the stimulus signal.

At this time, a connector consisting of a socket for test equipment provided on the constant temperature chamber side and a board side plug of a semiconductor component mounting board loaded in the constant temperature chamber is connected, whereby the semiconductor component is connected. The above-described test is performed by connecting the semiconductor component mounted on the mounting board to the test equipment built in the apparatus.

[0004]

[Problems to be solved by the invention]

 In recent years, semiconductor components such as CPUs have become more and more multi-projected (BGAs have more than 600 pins) while their size has been reduced. Due to this multi-projection, the pitch of the projections is reduced to 0 in BGA (Ball Grid Array). 0.8 mm, and about 0.5 mm for FBGA (Fine Pitch Ball Grid Array) and CSP (Chip Scale Package). If it is necessary to prepare a mounting board formed with a projection receiver corresponding to the pitch in accordance with the increase in the number of projections, the board used so far cannot be used. Further, when testing semiconductor components having different protrusion pitches, it is necessary to change the board to be used for each semiconductor component, which is complicated. Further, there is a problem that the above test cannot be performed in a state where semiconductor components having different protrusion pitches are mixed. Even in these cases, it is desirable in terms of labor and cost if only one type of mounting board is used.

[0005] On the other hand, the projection receiver on the mounting board is usually formed for a BGA, but a projection for a 0.5 mm pitch BGA cannot be manufactured at present. The same applies to sockets interposed between semiconductor components and mounting boards.

[0006] The present invention has been made in view of the above-described problems of the prior art. Even if the pitch of protrusions of a semiconductor component becomes smaller than before, it is possible to use a mounting board which has been used so far. The present invention does not provide a socket for a mounting board capable of using only one type of mounting board even when semiconductor components having different projection pitches are mixed.

[0007]

[Means for Solving the Problems]

 For this reason, the configuration according to the present invention provides a semiconductor component mounting board socket that is used interposed between the mounting board and the semiconductor component so that the semiconductor component can be electrically connected to the mounting board. The basic feature is that the pitch of the projections on the mounting board mounting side is made larger than the pitch of the projection receptions on the side, and the corresponding projection receivers and projections are conducted. More specifically, as the configuration of the socket, a configuration in which the protrusion receiving portion on the semiconductor component mounting side is for receiving the FBGA or CSP protrusion, and the protruding portion on the mounting board mounting side is a BGA protrusion is considered. Can be

[0008]

[Action]

 According to the above configuration, the socket absorbs the difference in the projection pitch, so that the mounting board to be used can be the same or a single type.

[0009]

[Embodiment of the invention]

 Hereinafter, embodiments of the present invention will be described. 1 to 4 show an embodiment of the configuration of the present invention. In the figure, 1 is a socket, 2 is a semiconductor component, and 3 is a mounting board.

In the socket 1, as shown in FIG. 1, a pin receiver 1 a for receiving a pin on the semiconductor component 2 mounting side is for receiving an FBGA pin, and a pin 1 b on the mounting board 3 mounting side is a BGA Pin configuration. Therefore, the pitch of the pin receiver 1a on the semiconductor component mounting side is 0.5 mm, whereas the pitch of the pins 1b on the mounting board 3 mounting side is 1.0 mm. The corresponding pin receiver 1a and pin 1b on both sides are in a conductive state.

The semiconductor component 2 is an LSI having an FBGA package configuration, and is, for example, a CPU or the like.

As shown in FIG. 2, the mounting board 3 has a plug portion 3 a coupled to a socket portion for test equipment provided in a constant temperature chamber, and supplies power to the socket 1. A wiring circuit for transmitting a stimulus signal and receiving an output signal from the semiconductor component 2 is constituted by a printed wiring board formed on the surface thereof. A pin receiver (not shown) for receiving the pin 1b, which is a ball grid, is provided on the wiring circuit at a position corresponding to the pin 1b of the socket 1.

When the semiconductor component 2 is mounted on the socket 1, as shown in FIG. 3, a conductive rubber 4 a having a conductive portion formed at a position corresponding to the pin of the semiconductor component 2 and the pin receiver 1 a of the socket 1. The semiconductor component 2 is mounted on the socket 1 with the intermediary of. On the other hand, when the socket 1 is mounted on the mounting board 3, as shown in FIG. 4, a conductive rubber 4 b having a conductive portion formed at a position corresponding to the pin 1 b of the socket 1 and the pin receiver of the mounting board 3. The socket 1 is mounted on the mounting board 3 with the intermediary of. A predetermined number of them (the number that can be mounted on the mounting board 3 is predetermined) is mounted.

By using the above-described configuration, even when the pin pitch of the semiconductor component 2 is 0.5 mm, which is smaller than the conventional 1.0 mm, the socket 1 can absorb the difference in the pin pitch. The mounting board that has been used for 1.0mm can be used. In addition, even in a state where both the semiconductor components 2 having the pin pitches of 0.5 mm and 1.0 mm are mixed, only one type of mounting board is required.

The above-described socket 1 is formed as a configuration in which a plurality of layers are stacked in the height direction, and the position of the corresponding pin or pin receiver is slightly shifted every time each layer is stacked. It is good to use the built-up method of connecting to a state where it can be conducted to Of course, the present invention is not limited to such a forming method, and any method may be used as long as the above basic structure of the present structure can be applied.

[0016]

[Effect of the invention]

 According to the configuration of the present invention described in detail above, even when the projection pitch of the semiconductor component becomes smaller than before, the socket absorbs the difference in the projection pitch. This eliminates the need to prepare a separate mounting board with a smaller size, and allows the mounting board that has been used so far to be used. In addition, even when semiconductor components having different projection pitches are mixed, it is possible to cope with a single type of mounting board.

[Brief description of the drawings]

FIG. 1 is a plan view illustrating a configuration of a socket according to an embodiment of the present invention;

FIG. 2 is a plan view showing a configuration of a mounting board in the embodiment of the configuration of the present invention;

FIG. 3 is an explanatory view showing a state where a semiconductor component is mounted on a socket.

FIG. 4 is an explanatory diagram showing a state in which a socket is mounted on a mounting board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Socket 1a Pin receiver 1b pin 2 Semiconductor component 3 Mounting board 3a Plug part 4a, 4b Conductive rubber

Claims (3)

[Utility model registration claims] 1. A semiconductor component mounting board socket which is used for mounting a semiconductor component in an electrically conductive state with respect to the mounting board and which is interposed between the semiconductor component mounting board and the semiconductor component mounting side. From the pitch,
A socket for a semiconductor component mounting board, characterized in that the pitch of the projections on the mounting board mounting side is increased, and the corresponding projection receiver and the projection are electrically connected. 2. The semiconductor component mounting board according to claim 1, wherein the projection receiver on the semiconductor component mounting side is for receiving a projection of FBGA or CSP. Socket. 3. The semiconductor component mounting board socket according to claim 1, wherein the projection on the mounting board mounting side is a BGA projection. socket.