JPH10183361A - Three-dimensionally molded circuit parts and their production - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain three-dimensionally molded circuit parts which obviate the occurrence of abnormal growth of copper, etc., to insulating parts by forming secondary moldings at a primary molding having roughened surfaces exclusive of the parts to be formed as circuits and forming conductor circuits by plating on this primary molding. SOLUTION: The primary molding resin 1 is formed by injection molding using polyethersulfone, etc., contg. a palladium salt as a plating catalyst. The primary molding 1 is subjected to a roughening treatment by using a chromic acid/sulfuric acid soln. mixture. The secondary molding resin 2a, 2b are formed by injection molding in such a manner that the circuit parts are exposed around the primary molding 1. Polyphenylene sulfide, etc., are used for the secondary moldings 2a, 2b. The moldings are then immersed into an electroless copper plating liquid to deposit the metallic films 3 of the copper on the primary molding 1. As a result, even the inside surfaces of through-holes 4 are uniformly plated without the unequal throwing of the plating on the surfaces of the primary molding 1 and without the abnormal deposition of copper between the insulating patterns and insulating parts.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a three-dimensional molded circuit component having a conductor circuit on the surface of a three-dimensional resin molded product, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, as a method of producing a three-dimensional molded circuit component having a conductor circuit on the surface of a three-dimensional resin molded product, a plastic primary molded product is formed, and the entire surface thereof is roughened. For example, palladium,
Applying a plating catalyst using gold, silver, platinum, or the like, forming a secondary molded product by coating the primary molded body provided with the plating catalyst with a plastic material while exposing a predetermined portion, and forming the primary molded product. For forming a metal film (conductor circuit) by performing plating treatment on the exposed part of
997).

As another method of forming a three-dimensional molded circuit component, a first insulating shape is formed using an amorphous thermoplastic resin compound containing a catalyst for plating, and a second insulating shape is formed around the first insulating shape. Forming an integrated article with the first shape exposed on the surface, roughening only the surface area of the integrated article, depositing metal on the surface portion of the integrated article having the first shape to form a conductor circuit Forming method (JP-A-63
No. -50482) is known.

[0004]

By the way, in an environment in which a plating operation is performed, various kinds of acids such as hydrochloric acid, sulfuric acid, and chromic acid, and alkali solutions such as sodium hydroxide, potassium hydroxide, and potassium permanganate solution are used. You are using chemicals. When working in such an environment, the chemical liquid may adhere to the molded body due to scattering of the chemical liquid or the like. The first conventional method (Japanese Unexamined Patent Publication No.
No. 46997), a catalyst is applied after the primary molded article is roughened, and such a chemical solution may adhere during the catalyst application operation. The adhering chemical solution becomes a catalyst poison for plating, which may cause unevenness such as no deposition of metal after plating.

A second conventional method (Japanese Patent Laid-Open No. 63-5 / 1988)
No. 0482), the resin or plating catalyst roughened or eluted during the roughening treatment remains as a residue on the insulating portion of the molded body after the roughening treatment. In some cases, nuclei grew and copper was deposited on insulating portions, which was called abnormal deposition. Furthermore, in the second conventional method, the primary molded article resin is subjected to a roughening treatment after the secondary molded article is formed. Therefore, for the resin used for the secondary molded article, a resin which is not affected by the roughening treatment is selected. And the choice of resins that can be used is limited.

An object of the present invention is to eliminate the disadvantages of a three-dimensional molded circuit component having a conductor circuit on the surface of a three-dimensional resin molded product as described above and a method of manufacturing the same. An object of the present invention is to provide a three-dimensional molded circuit component that does not cause uneven plating and does not cause abnormal growth of copper or the like on an insulating portion and a method for manufacturing the same. Another object of the present invention is to provide a three-dimensional molded circuit component capable of increasing the choice of resins that can be used for the secondary molded body, and a method for manufacturing the same.

[0007]

According to the present invention, as a means for solving the above-mentioned problems, a primary molded body having a roughened surface and a part of the primary molded body other than a portion which becomes a circuit are formed. A three-dimensional molded circuit component having a formed secondary molded body, and a conductor circuit formed by plating on the primary molded body that is not covered with the second molded body, The three-dimensional molded circuit component is characterized in that the body contains a plating catalyst, and the second molded body is formed by coating after the roughening treatment of the primary molded body.

[0008] As a method of manufacturing such a three-dimensionally formed circuit component, a primary molded body containing a plating catalyst is formed, and the primary molded body is subjected to a roughening treatment. Forming a secondary molded body other than the part to be a circuit of the applied primary molded body, and forming a conductor circuit by plating on the primary molded body not covered with the second molded body The present invention provides a method for manufacturing a three-dimensional molded circuit component characterized by the following.

[0009] In the present invention, substances that can be used for the primary molded article and the secondary molded article include insulating thermosetting resins and thermoplastic resins, and inorganic fibers such as glass fibers and potassium titanate fibers. , Calcium carbonate, calcium silicate, etc., and insulating thermosetting resins and thermoplastic resins.

As the thermoplastic resin, acetal resin,
Acrylic resins such as methyl acrylate, ethyl cellulose, acetyl cellulose, propionyl cellulose, acetyl butyl cellulose, cellulose resins such as nitrocellulose, and the like, polyethers,
For example, polyphenylene ether, nylon, polystyrene, acrylonitrile styrene and copolymers, styrene blends such as acrylonitrile-butadiene-styrene copolymer, polycarbonates, polychlorotrifluoroethylene, and vinyl acetate, vinyl alcohol, vinyl butyral, chloride There are vinyl polymers and copolymers such as vinyl, vinyl chloride-vinyl acetate copolymer, vinylidene chloride and vinyl formal. Also, polyetherimide, polysulfone, polyarylate,
Polyethylene terephthalate, polyether sulfone,
Polyphenylene sulfide, polyphenylene oxide, polyether ether ketone, liquid crystal polymer, and the like can also be used.

As the thermosetting resin, allyl phthalate,
Furan, melamine-formaldehyde, phenol formaldehyde and phenolfurfural copolymer, alone or in combination with butadiene acrylonitrile copolymer or acrylonitrile-butadiene-styrene copolymer, polyacrylate, silicones, urea formaldehyde, epoxy resin, There are allyl resin, glycerin phthalate, polyesters, polyimide resin and polyamide resin. As a substance that can be used for the primary molded body, a substance such as polyether sulfone or a liquid crystal polymer is preferable, and as a substance that can be used for the secondary molded body,
Polyphenylene sulfide and liquid crystal polymers are preferred. Both may be the same. The resins listed here are only examples, and the present invention is not limited thereto.

At the time of molding the primary molded body, a plating catalyst is attached to a filler to be contained in the material to be contained in the resin, and a molding treatment is performed by a method such as extrusion molding, injection molding or the like. As the plating catalyst, a usual electroless copper plating catalyst such as a barium-tin colloid or a metal copper colloid can be used. Next, a roughening treatment is performed on the surface of the formed primary molded body. The roughening treatment may be the same as the conventional method for treating the resin used for the primary molded body resin. For example, when polyether sulfone is used for the primary molded body resin, N, N′-dimethyl An organic solvent such as formaldehyde, a mixed solution of chromic acid and sulfuric acid, or the like is used. When a liquid crystal polymer is used, an alkaline solution is used.

[0013] For the primary molded body subjected to surface roughening,
A second molded body is formed around the first molded body resin so that a wiring pattern is formed on the surface of the molded article. A conductor circuit is formed on the thus-formed integral molded product on the primary molded body that is not covered with the second molded body by plating. At this time, if necessary, a degreasing treatment may be performed before the plating treatment. As the plating treatment, a conventional electroless plating treatment can be used.

According to the present invention, since the plating catalyst is contained in the material resin of the primary molded body, it is necessary to apply the plating catalyst after the molding of the primary molded body as in the prior art. do not do. Therefore, as in the conventional method,
The occurrence of uneven plating due to the chemical solution attached to the surface of the primary molded body can be avoided, and a uniform plating layer, that is, a conductive circuit can be obtained.

[0015] Further, since a resin containing a plating catalyst is used as the primary molded body resin and the second molded body is coated on the primary molded body after the roughening treatment, the resin is formed before the plating treatment. The nucleus of the residue is not eluted, and the occurrence of abnormal precipitation as in the prior art is avoided. Further, since the secondary molded body is formed on the primary molded body resin after the roughening treatment, no particular limitation is required on the choice of the resin used for the secondary molded body. The three-dimensional molded circuit component manufactured by the present invention can be effectively used as a circuit component of a small portable terminal device, a printer head portion, or the like, for example.

[0016]

Embodiments of the present invention will be described below in detail. However, the present invention is not limited to this. Embodiment 1 As shown in FIG. 1, secondary molded bodies 2a and 2b are coated on portions other than a part of the primary molded body 1 which becomes a circuit,
A three-dimensional molded circuit component having a metal film 3 as a conductor circuit on a portion to be the circuit was prepared by the procedure shown in FIG.
4 is a through hole.

The primary molded body resin was prepared by injection molding using polyether sulfone containing a palladium salt as a plating catalyst as the primary molded body resin.
a). At this time, the injection molding temperature was 360 ° C, and the mold temperature was 150 ° C. Next, the primary compact 1 was subjected to a roughening treatment with a mixed solution of chromic acid / sulfuric acid (FIG. 2B). Thereafter, secondary molded bodies 2a and 2b were formed around the primary molded body 1 by injection molding so that the circuit portion was exposed (FIG. 2c). At this time, polyphenylene sulfide was used for the secondary molded resin, and the injection molding temperature was 300.
° C and the mold temperature were 150 ° C. Then, it was immersed in an electroless copper plating solution having the following composition for 6 hours to deposit about 30 μm of a copper film (metal film 3) (FIG. 2d).

Copper sulfate pentahydrate 10 g / l Ethylenediaminetetraacetic acid 30 g / l Polyethylene glycol (Mw600) 0.8 g / l 2,2′-dipyridyl 30 ml / l 37% formaldehyde 3 ml / l pH (water 12.5 Liquid temperature 70 ° C. Observation of the appearance of this three-dimensional molded circuit component produced at a temperature of 70 ° C. or more revealed that there was no plating unevenness on the surface of the primary molded body, and there was no wiring pattern or insulation problem. No abnormal precipitation of copper was observed in the portion. The inner surface of the through hole 4 also formed a uniform plating layer.

Example 2 In Example 1, the resin of the primary molded body was replaced with an inorganic filler 50 containing a palladium salt.
A "plating grade" liquid crystal polymer (Vectra C.820, manufactured by Polyplastics) containing weight% was used. Also,
At this time, the injection molding temperature of the primary molded body was 320 ° C., and the mold temperature was 100 ° C. This primary molded body is heated at 50 ° C.
For 30 minutes in an aqueous sodium hydroxide solution (150 g / l) to perform a roughening treatment. Next, a secondary molded body was formed in the same manner as in Example 1, and a wiring pattern (metal film 3) was formed.

Observation of the appearance of the three-dimensionally formed circuit component produced as described above revealed that there was no uneven plating on the surface of the primary molded body, and that abnormal deposition of copper was observed between the wiring patterns and between the insulating portions. Did not. In addition, through hole 4
Also formed a uniform plating layer.

Example 3 In Example 2, an epoxy resin (EP-20 manufactured by Toshiba Chemical Co., Ltd.) was used as the resin of the secondary molded body.
05) was used. The injection molding temperature at this time is 80 ° C,
The mold temperature was 170 ° C. Example 2 except for the above
Same as. Observation of the appearance of the three-dimensionally formed circuit component produced as described above revealed that there was no uneven plating on the surface of the primary molded body, and no abnormal precipitation of copper was observed between the wiring patterns or on the insulating portion. The inner surface of the through hole 4 also formed a uniform plating layer.

Comparative Example 1 A "plating grade" liquid crystal polymer (Vectra C.820 manufactured by Polyplastics) containing 50% by weight of an inorganic filler was used as a molding material for the first molded body. At this time, the injection molding temperature was 330 ° C., and the mold temperature was 100 ° C.

Next, the first compact was roughened in the same manner as in Example 2 and a plating catalyst (HS-101B; manufactured by Hitachi Chemical Co., Ltd.) was applied. A secondary molded body was formed around the primary molded body by injection molding so as to be exposed, thereby producing a molded body of an integrated article. At this time, polyphenylene sulfide was used as a material of the secondary molded body. At this time, the injection molding temperature was 280 ° C., and the mold temperature was 120 ° C.

This compact was treated with the same roughening solution as in Example 1 and immersed in the same electroless copper plating solution as in Example 1 for 6 hours. Observation of the appearance of the three-dimensionally formed circuit component produced as described above revealed that a portion where plated copper was not deposited (uneven plating) on the surface of the primary molded body.

Comparative Example 2 A catalyst (palladium salt) was mixed into a "plating grade" liquid crystal polymer (Vectra C.820 manufactured by Polyplastics) containing 50% by weight of an inorganic filler in the molding material of the first molded body. Was used. At this time, the injection molding temperature was 330 ° C., and the mold temperature was 100 ° C. Next, a secondary molded body was formed around the primary molded body by injection molding so that the circuit portion of the first molded body was exposed, thereby producing a molded body of an integrated article. At this time, polyphenylene sulfide was used as a material of the secondary molded body. At this time, the injection molding temperature was 280 ° C., and the mold temperature was 120 ° C.

This compact was treated with the same roughening solution as in Example 2 and immersed in the same electroless copper plating solution as in Example 2 for 6 hours. Observation of the appearance of the three-dimensionally formed circuit component produced as described above revealed that abnormal deposition of copper was found between wiring patterns and in the insulating portion. Its size is about 1 μm to 40 μm, and there are some places where the wiring patterns are short-circuited depending on the places.

[0027]

According to the three-dimensional molded circuit component and the method of manufacturing the same of the present invention, the plating catalyst is contained in the material resin of the primary molded body, so that the plating catalyst is formed after the molding of the primary molded body. Does not need to be provided. for that reason,
As in the case of the conventional method, it is possible to avoid the occurrence of uneven plating due to the chemical solution attached to the surface of the primary molded body, and to obtain a uniform conductor circuit. In addition, since a resin containing a plating catalyst is used as the primary molded body resin, and the second molded body is formed so as to cover the first molded body after the roughening treatment, the residue is removed before the plating treatment. The nucleus does not elute, and the occurrence of abnormal precipitation as in the prior art is avoided.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating an example of a three-dimensional molded circuit component of the present invention.

FIG. 2 is a diagram illustrating a manufacturing process of the three-dimensionally formed circuit component of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Primary molded resin, 2a, 2b ... Secondary molded resin, 3 ... Metal film (conductor circuit), 4 ... Through-hole.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Toyofusa Yoshimura 7-1-1, Omikacho, Hitachi City, Ibaraki Prefecture Within Hitachi Research Laboratory, Hitachi, Ltd. (72) Inventor Ryo Sato 5-chome, Hidakacho, Hitachi City, Ibaraki Prefecture No. 1-1 Hitachi Power Cable Co., Ltd. Power System Research Laboratories (72) Inventor Toshiyuki Oaku 5-1-1 Hidakacho, Hitachi City, Ibaraki Prefecture Hitachi Cable Co., Ltd. Hidaka Factory (72) Inventor Yoshiyuki Ando Ibaraki Prefecture 5-1-1, Hidaka-cho, Hitachi City Power System Research Laboratory, Hitachi Cable, Ltd.

Claims (2)

[Claims] 1. A primary molded body having a roughened surface, a secondary molded body formed other than a portion of the primary molded body that becomes a circuit, and a second molded body covered with the second molded body. A three-dimensional molded circuit part having a conductor circuit formed by plating on the primary molded body, wherein the primary molded body contains a plating catalyst, and the second molded body is A three-dimensional molded circuit component, which is formed by coating after a roughening treatment of a primary molded body. 2. A method for forming a primary molded body containing a plating catalyst, subjecting the primary molded body to a roughening treatment, and excluding a portion of the roughened primary molded body that becomes a circuit. Forming a conductive circuit by plating on the primary molded body which is not covered with the second molded body.