JPH10183361A - Three-dimensionally molded circuit parts and their production - Google Patents
Three-dimensionally molded circuit parts and their productionInfo
- Publication number
- JPH10183361A JPH10183361A JP34133496A JP34133496A JPH10183361A JP H10183361 A JPH10183361 A JP H10183361A JP 34133496 A JP34133496 A JP 34133496A JP 34133496 A JP34133496 A JP 34133496A JP H10183361 A JPH10183361 A JP H10183361A
- Authority
- JP
- Japan
- Prior art keywords
- molded body
- plating
- primary
- resin
- primary molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
Landscapes
- Chemically Coating (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】この発明は、立体形状の樹脂
成形体の表面に導体回路を有する立体成形回路部品およ
びその製造方法に関する。The present invention relates to a three-dimensional molded circuit component having a conductor circuit on the surface of a three-dimensional resin molded product, and a method of manufacturing the same.
【0002】[0002]
【従来の技術】従来から、立体形状の樹脂成形体の表面
に導体回路を有する立体成形回路部品を作製する方法と
しては、プラスチック一次成形品を形成してその全面を
粗化した後、該一次成形体表面に例えばバラジウム、
金、銀、白金などによるめっき触媒付与を行い、該めっ
き触媒が付与された一次成形体を所定部分を露出させた
状態でプラスチック材料で被覆して二次成形品を形成
し、その一次成形品の露出部分にめっき処理を行って金
属皮膜(導体回路)を形成する方法(特開昭64−46
997号公報)が知られている。2. Description of the Related Art Conventionally, as a method of producing a three-dimensional molded circuit component having a conductor circuit on the surface of a three-dimensional resin molded product, a plastic primary molded product is formed, and the entire surface thereof is roughened. For example, palladium,
Applying a plating catalyst using gold, silver, platinum, or the like, forming a secondary molded product by coating the primary molded body provided with the plating catalyst with a plastic material while exposing a predetermined portion, and forming the primary molded product. For forming a metal film (conductor circuit) by performing plating treatment on the exposed part of
997).
【0003】また、立体成形回路部品を形成する他の方
法として、めっきのための触媒を含む無定形の熱可塑性
樹脂コンパウンドを使って第一絶縁形状を形成し、その
周りに第二絶縁形状を形成して表面に第一形状が露出し
た一体物品を作り、その一体物品の表面領域だけを粗化
処理して、上記一体物品の第一形状からなる表面部分に
金属を析出させて導体回路を形成する方法(特開昭63
−50482号公報)が知られている。As another method of forming a three-dimensional molded circuit component, a first insulating shape is formed using an amorphous thermoplastic resin compound containing a catalyst for plating, and a second insulating shape is formed around the first insulating shape. Forming an integrated article with the first shape exposed on the surface, roughening only the surface area of the integrated article, depositing metal on the surface portion of the integrated article having the first shape to form a conductor circuit Forming method (JP-A-63
No. -50482) is known.
【0004】[0004]
【発明が解決しようとする課題】ところで、めっき作業
を行う環境では、塩酸や硫酸、クロム酸などの酸、また
は水酸化ナトリウムや水酸化カリウム、過マンガン酸カ
リウム溶液などのアルカリ溶液など、様々な薬液を使用
している。このような環境において作業を行っていくと
きに、これらの薬液などの飛散などにより成形体に薬液
が付着することがある。第一の従来の方法(特開昭64
ー46997号公報)では一次成形品を粗化した後に触
媒を付与するようにしており、この触媒付与作業におい
てこのような薬液が付着することが起こり得る。付着し
た薬液はめっきにとっての触媒毒となり、このためめっ
き終了後には金属が析出しないなどのつきむらの問題が
生じることがある。By the way, in an environment in which a plating operation is performed, various kinds of acids such as hydrochloric acid, sulfuric acid, and chromic acid, and alkali solutions such as sodium hydroxide, potassium hydroxide, and potassium permanganate solution are used. You are using chemicals. When working in such an environment, the chemical liquid may adhere to the molded body due to scattering of the chemical liquid or the like. The first conventional method (Japanese Unexamined Patent Publication No.
No. 46997), a catalyst is applied after the primary molded article is roughened, and such a chemical solution may adhere during the catalyst application operation. The adhering chemical solution becomes a catalyst poison for plating, which may cause unevenness such as no deposition of metal after plating.
【0005】また、第二の従来の方法(特開昭63ー5
0482号公報)においては、粗化処理中に粗化あるい
は溶出した成形体樹脂あるいはめっき触媒などが、粗化
処理後に成形体の絶縁部分に残渣物として残ってしまう
ため、これを核にして銅核が成長し異常析出といわれる
絶縁部分への銅の析出が起きてしまうことがあった。さ
らに、第二の従来の方法では、二次成形品形成後に一次
成形品樹脂を粗化処理するため、二次成形品に使用する
樹脂にはこの粗化処理に影響を受けない樹脂を選むこと
が必要であり、使用できる樹脂の選択肢に制限があっ
た。A second conventional method (Japanese Patent Laid-Open No. 63-5 / 1988)
No. 0482), the resin or plating catalyst roughened or eluted during the roughening treatment remains as a residue on the insulating portion of the molded body after the roughening treatment. In some cases, nuclei grew and copper was deposited on insulating portions, which was called abnormal deposition. Furthermore, in the second conventional method, the primary molded article resin is subjected to a roughening treatment after the secondary molded article is formed. Therefore, for the resin used for the secondary molded article, a resin which is not affected by the roughening treatment is selected. And the choice of resins that can be used is limited.
【0006】本発明は、上記のような立体形状の樹脂成
形体の表面に導体回路を有する立体成形回路部品および
その製造方法が持つ不都合を解消することを目的として
おり、より具体的には、めっきのつきむらが発生するこ
とのない、また、絶縁部分への銅などの異常成長が発生
することのない立体成形回路部品およびその製造方法を
提供することを目的とする。本発明はまた、第二次成形
体に使用できる樹脂の選択肢を大きくすることのできる
立体成形回路部品およびその製造方法を提供することを
目的とする。An object of the present invention is to eliminate the disadvantages of a three-dimensional molded circuit component having a conductor circuit on the surface of a three-dimensional resin molded product as described above and a method of manufacturing the same. An object of the present invention is to provide a three-dimensional molded circuit component that does not cause uneven plating and does not cause abnormal growth of copper or the like on an insulating portion and a method for manufacturing the same. Another object of the present invention is to provide a three-dimensional molded circuit component capable of increasing the choice of resins that can be used for the secondary molded body, and a method for manufacturing the same.
【0007】[0007]
【課題を解決するための手段】このような課題を解決す
る手段として、本発明では、表面が粗化された第一次成
形体と、該第一次成形体の回路となる部分以外に形成さ
れた第二次成形体と、該第二成形体で覆われていない前
記第一次成形体上にめっきにより形成された導体回路と
を有する立体成形回路部品であって、前記第一次成形体
はめっき触媒を含有したものであり、前記第二成形体は
前記第一次成形体の粗化処理後に被覆形成されたもので
あることを特徴とする立体成形回路部品を提供する。According to the present invention, as a means for solving the above-mentioned problems, a primary molded body having a roughened surface and a part of the primary molded body other than a portion which becomes a circuit are formed. A three-dimensional molded circuit component having a formed secondary molded body, and a conductor circuit formed by plating on the primary molded body that is not covered with the second molded body, The three-dimensional molded circuit component is characterized in that the body contains a plating catalyst, and the second molded body is formed by coating after the roughening treatment of the primary molded body.
【0008】また、このような立体成形回路部品を製造
する方法として、めっき触媒を含有した第一次成形体を
形成し、該第一次成形体に粗化処理を施し、該粗化処理
を施した第一次成形体の回路となる部分以外に第二次成
形体を形成し、該第二の成形体で覆われていない前記第
一次成形体上に導体回路をめっきにより形成することを
特徴とする立体成形回路部品の製造方法を提供する。[0008] As a method of manufacturing such a three-dimensionally formed circuit component, a primary molded body containing a plating catalyst is formed, and the primary molded body is subjected to a roughening treatment. Forming a secondary molded body other than the part to be a circuit of the applied primary molded body, and forming a conductor circuit by plating on the primary molded body not covered with the second molded body The present invention provides a method for manufacturing a three-dimensional molded circuit component characterized by the following.
【0009】本発明において、第一次成形体及び第二次
成形体に使用できる物質には、絶縁性熱硬化性樹脂及び
熱可塑性樹脂、さらには、無機繊維、例えばガラス繊維
やチタン酸カリウム繊維、炭酸カルシウム、ケイ酸カル
シウムなどを含む絶縁性熱硬化性樹脂及び熱可塑性樹脂
が挙げられる。[0009] In the present invention, substances that can be used for the primary molded article and the secondary molded article include insulating thermosetting resins and thermoplastic resins, and inorganic fibers such as glass fibers and potassium titanate fibers. , Calcium carbonate, calcium silicate, etc., and insulating thermosetting resins and thermoplastic resins.
【0010】熱可塑性樹脂としては、アセタール樹脂、
アクリル酸メチルのようなアクリル酸系樹脂、エチルセ
ルローズ、アセチルセルローズ、プロピオニルセルロー
ズ、アセチルブチルセルローズ、ニトロセルローズのよ
うなセルローズ系樹脂、及び類似物、ポリエーテル類、
例えばポリフェニレンエーテル、ナイロン、ポリスチレ
ン、アクリロニトリルスチレン及び共重合体、またアク
リロニトリル−ブタジエン−スチレン共重合体のような
スチレンブレンド、ポリカーボネイト類、ポリクロルト
リフルオルエチレン、及び酢酸ビニル、ビニルアルコー
ル、ビニルブチラール、塩化ビニル、塩化ビニル−酢酸
ビニル共強重合体、塩化ビニリデン及びビニルホルマー
ルのようなビニル重合体及び共重合体がある。また、ポ
リエーテルイミド、ポリスルフォン、ポリアリレート、
ポリエチレンテレフタレート、ポリエーテルスルホン、
ポリフェニレンサルファイド、ポリフェニレンオキシ
ド、ポリエーテルエーテルケトン、液晶ポリマーなども
用いることができる。As the thermoplastic resin, acetal resin,
Acrylic resins such as methyl acrylate, ethyl cellulose, acetyl cellulose, propionyl cellulose, acetyl butyl cellulose, cellulose resins such as nitrocellulose, and the like, polyethers,
For example, polyphenylene ether, nylon, polystyrene, acrylonitrile styrene and copolymers, styrene blends such as acrylonitrile-butadiene-styrene copolymer, polycarbonates, polychlorotrifluoroethylene, and vinyl acetate, vinyl alcohol, vinyl butyral, chloride There are vinyl polymers and copolymers such as vinyl, vinyl chloride-vinyl acetate copolymer, vinylidene chloride and vinyl formal. Also, polyetherimide, polysulfone, polyarylate,
Polyethylene terephthalate, polyether sulfone,
Polyphenylene sulfide, polyphenylene oxide, polyether ether ketone, liquid crystal polymer, and the like can also be used.
【0011】熱硬化性樹脂としては、フタル酸アリル、
フラン、メラミン−ホルムアルデヒド、フェノールホル
ムアルデヒド及びフェノールフルフラル共重合体、単独
ないしはブタジエンアクリロニトリル共重合体ないしは
アクリロニトリル−ブタジエン−スチレン共重合体との
組合せ、ポリアクリル酸エステル、シリコン類、尿素ホ
ルムアルデヒド、エポキシ樹脂、アリル樹脂、フタル酸
グリセリン、ポリエステル類、ポリイミド樹脂、ポリア
ミド樹脂がある。第一次成形体に使用できる物質として
は、ポリエーテルスルホンや液晶ポリマーのようなもの
が好ましく、第二次成形体に使用できる物質としては、
ポリフェニレンサルファイドや液晶ポリマーが好まし
い。双方は同じであってもよい。また、ここに挙げた樹
脂はその一例であり、これに限定されるものではない。As the thermosetting resin, allyl phthalate,
Furan, melamine-formaldehyde, phenol formaldehyde and phenolfurfural copolymer, alone or in combination with butadiene acrylonitrile copolymer or acrylonitrile-butadiene-styrene copolymer, polyacrylate, silicones, urea formaldehyde, epoxy resin, There are allyl resin, glycerin phthalate, polyesters, polyimide resin and polyamide resin. As a substance that can be used for the primary molded body, a substance such as polyether sulfone or a liquid crystal polymer is preferable, and as a substance that can be used for the secondary molded body,
Polyphenylene sulfide and liquid crystal polymers are preferred. Both may be the same. The resins listed here are only examples, and the present invention is not limited thereto.
【0012】第一次成形体の成形に際して、素材中に含
有させるフィラーにめっき触媒を付着させて樹脂中に含
有させ、押し出し成形、射出成形などのような方法によ
り成形処理を行う。めっき触媒は、バラジウム−すずコ
ロイドや金属銅コロイドなどの通常の無電解銅めっき触
媒を用いることができる。次に、成形された第一次成形
体の表面に対して粗化処理を行う。粗化処理は第一次成
形体樹脂に使用される樹脂を処理する従来法と同じでよ
く、例えば、第一次成形体樹脂にポリエーテルスルフォ
ンを使用した場合には、N、N’−ジメチルホルムアル
デヒドなどの有機溶剤やクロム酸と硫酸の混合溶液など
を使用したり、液晶ポリマーを使用したときにはアルカ
リ溶液を使用したりする。At the time of molding the primary molded body, a plating catalyst is attached to a filler to be contained in the material to be contained in the resin, and a molding treatment is performed by a method such as extrusion molding, injection molding or the like. As the plating catalyst, a usual electroless copper plating catalyst such as a barium-tin colloid or a metal copper colloid can be used. Next, a roughening treatment is performed on the surface of the formed primary molded body. The roughening treatment may be the same as the conventional method for treating the resin used for the primary molded body resin. For example, when polyether sulfone is used for the primary molded body resin, N, N′-dimethyl An organic solvent such as formaldehyde, a mixed solution of chromic acid and sulfuric acid, or the like is used. When a liquid crystal polymer is used, an alkaline solution is used.
【0013】表面粗化を行った第一次成形体に対して、
配線パターンが成形品表面に形成されるように該第一次
成形体樹脂の周りに第二次成形体を形成する。そのよう
に成形された一体成形品に対して、めっき処理により第
二の成形体で覆われていない前記第一次成形体上に導体
回路ほ形成する。このとき、必要に応じてめっき処理前
に脱脂処理を行ってもよい。めっき処理としては従来の
無電解めっき処理を使用することができる。[0013] For the primary molded body subjected to surface roughening,
A second molded body is formed around the first molded body resin so that a wiring pattern is formed on the surface of the molded article. A conductor circuit is formed on the thus-formed integral molded product on the primary molded body that is not covered with the second molded body by plating. At this time, if necessary, a degreasing treatment may be performed before the plating treatment. As the plating treatment, a conventional electroless plating treatment can be used.
【0014】本発明によれば、第一次成形体の素材樹脂
中にめっき触媒が含まれているために、従来のように第
一次成形体の成形後にめっき触媒を付与することを必要
としない。そのために、従来法における場合にように、
第一次成形体表面に付着した薬液によりめっきのつきむ
らが生じることは回避でき、均一なめっき層、すなわ
ち、導体回路を得ることができる。According to the present invention, since the plating catalyst is contained in the material resin of the primary molded body, it is necessary to apply the plating catalyst after the molding of the primary molded body as in the prior art. do not do. Therefore, as in the conventional method,
The occurrence of uneven plating due to the chemical solution attached to the surface of the primary molded body can be avoided, and a uniform plating layer, that is, a conductive circuit can be obtained.
【0015】また、第一次成形体樹脂にめっき触媒入り
樹脂を使用し、かつ、粗化処理後の第一次成形体に第二
成形体を被覆形成するようにしたので、めっき処理前に
残渣物の核となる物が溶出することはなく、従来のよう
な異常析出が発生することは回避される。さらに、粗化
処理後の第一次成形体樹脂に第二次成形体を形成するこ
とから、第二次成形体に使用する樹脂の選択肢に格別の
制限を要しない。本発明により製造される立体成形回路
部品は、例えば、小型携帯用端末機器やプリンターヘッ
ド部分などの回路部品として有効に用いることができ
る。[0015] Further, since a resin containing a plating catalyst is used as the primary molded body resin and the second molded body is coated on the primary molded body after the roughening treatment, the resin is formed before the plating treatment. The nucleus of the residue is not eluted, and the occurrence of abnormal precipitation as in the prior art is avoided. Further, since the secondary molded body is formed on the primary molded body resin after the roughening treatment, no particular limitation is required on the choice of the resin used for the secondary molded body. The three-dimensional molded circuit component manufactured by the present invention can be effectively used as a circuit component of a small portable terminal device, a printer head portion, or the like, for example.
【0016】[0016]
【実施例】以下、本発明の実施例について詳細に説明す
る。しかし本発明はこれに限定されるものではない。 〔実施例1〕図1に示すように、第一次成形体1の回路
となる部分以外に第二次成形体2a、2bが被覆され、
該回路となる部分上には導体回路としての金属皮膜3を
持つ立体成形回路部品を、図2に示す手順で作成した。
なお、4はスルーホールである。Embodiments of the present invention will be described below in detail. However, the present invention is not limited to this. Embodiment 1 As shown in FIG. 1, secondary molded bodies 2a and 2b are coated on portions other than a part of the primary molded body 1 which becomes a circuit,
A three-dimensional molded circuit component having a metal film 3 as a conductor circuit on a portion to be the circuit was prepared by the procedure shown in FIG.
4 is a through hole.
【0017】第一次成形体樹脂には、めっき触媒として
パラジウム塩を含有させたポリエーテルサルホンを用
い、射出成形により第一次成形体1を作成した(図2
a)。このときの射出成形温度は360℃、金型温度は
150℃とした。次に、この第一次成形体1をクロム酸
/硫酸混合溶液により粗化処理を行った(図2b)。そ
の後この第一次成形体1の周りに、回路部分が露出する
ように第二次成形体2a、2bを射出成形により作成し
た(図2c)。このときの第二次成形体樹脂にはポリフ
ェニレンサルファイドを用い、射出成形温度は300
℃、金型温度は150℃とした。そして以下に示す組成
の無電解銅めっき液に6時間浸漬させて、銅の膜厚(金
属皮膜3)を約30μm析出した(図2d)。The primary molded body resin was prepared by injection molding using polyether sulfone containing a palladium salt as a plating catalyst as the primary molded body resin.
a). At this time, the injection molding temperature was 360 ° C, and the mold temperature was 150 ° C. Next, the primary compact 1 was subjected to a roughening treatment with a mixed solution of chromic acid / sulfuric acid (FIG. 2B). Thereafter, secondary molded bodies 2a and 2b were formed around the primary molded body 1 by injection molding so that the circuit portion was exposed (FIG. 2c). At this time, polyphenylene sulfide was used for the secondary molded resin, and the injection molding temperature was 300.
° C and the mold temperature were 150 ° C. Then, it was immersed in an electroless copper plating solution having the following composition for 6 hours to deposit about 30 μm of a copper film (metal film 3) (FIG. 2d).
【0018】 硫酸銅・五水和物 10 g/l エチレンジアミン四酢酸 30 g/l ポリエチレングリコール (Mw600) 0.8 g/l 2、2’−ジピリジル 30ml/l 37%ホルムアルデヒド 3ml/l pH(水酸化ナトリウムで調整) 12.5 液温 70℃ 以上のようにして作成したこの立体成形回路部品の外観
を観察したところ、第一次成形体表面にめっきのつきむ
らはなく、配線パターン間や絶縁部分に銅の異常析出は
認められなかった。また、スルーホール4の内面も均一
なめっき層をなしていた。Copper sulfate pentahydrate 10 g / l Ethylenediaminetetraacetic acid 30 g / l Polyethylene glycol (Mw600) 0.8 g / l 2,2′-dipyridyl 30 ml / l 37% formaldehyde 3 ml / l pH (water 12.5 Liquid temperature 70 ° C. Observation of the appearance of this three-dimensional molded circuit component produced at a temperature of 70 ° C. or more revealed that there was no plating unevenness on the surface of the primary molded body, and there was no wiring pattern or insulation problem. No abnormal precipitation of copper was observed in the portion. The inner surface of the through hole 4 also formed a uniform plating layer.
【0019】〔実施例2〕実施例1において、第一次成
形体の樹脂をパラジウム塩を含有させた無機充填剤50
重量%を含む「めっきグレード」液晶ポリマー(ポリプ
ラスチック社製ベクトラC・820)を用いた。また、
このときの第一次成形体の射出成形温度は320℃、金
型温度は100℃とした。この第一次成形体を、50℃
の水酸化ナトリウム水溶液(150g/l)に30分浸
漬して粗化処理を行った。次に実施例1と同様にして第
二次成形体を形成し、配線パターン(金属皮膜3)を形
成した。Example 2 In Example 1, the resin of the primary molded body was replaced with an inorganic filler 50 containing a palladium salt.
A "plating grade" liquid crystal polymer (Vectra C.820, manufactured by Polyplastics) containing weight% was used. Also,
At this time, the injection molding temperature of the primary molded body was 320 ° C., and the mold temperature was 100 ° C. This primary molded body is heated at 50 ° C.
For 30 minutes in an aqueous sodium hydroxide solution (150 g / l) to perform a roughening treatment. Next, a secondary molded body was formed in the same manner as in Example 1, and a wiring pattern (metal film 3) was formed.
【0020】以上のようにして作成したこの立体成形回
路部品の外観を観察したところ、第一次成形体表面にめ
っきのつきむらはなく、配線パターン間や絶縁部分に銅
の異常析出は認められなかった。また、スルーホール4
の内面も均一なめっき層をなしていた。Observation of the appearance of the three-dimensionally formed circuit component produced as described above revealed that there was no uneven plating on the surface of the primary molded body, and that abnormal deposition of copper was observed between the wiring patterns and between the insulating portions. Did not. In addition, through hole 4
Also formed a uniform plating layer.
【0021】〔実施例3〕実施例2において、第二次成
形体の樹脂にエポキシ樹脂(東芝ケミカル社製EP-20
05)を用いた。またこの時の射出成形温度は80℃、
金型温度は170℃とした。以上のこと以外は実施例2
と同様にした。以上のようにして作成したこの立体成形
回路部品の外観を観察したところ、第一次成形体表面に
めっきのつきむらはなく、配線パターン間や絶縁部分に
銅の異常析出は認められなかった。また、スルーホール
4の内面も均一なめっき層をなしていた。Example 3 In Example 2, an epoxy resin (EP-20 manufactured by Toshiba Chemical Co., Ltd.) was used as the resin of the secondary molded body.
05) was used. The injection molding temperature at this time is 80 ° C,
The mold temperature was 170 ° C. Example 2 except for the above
Same as. Observation of the appearance of the three-dimensionally formed circuit component produced as described above revealed that there was no uneven plating on the surface of the primary molded body, and no abnormal precipitation of copper was observed between the wiring patterns or on the insulating portion. The inner surface of the through hole 4 also formed a uniform plating layer.
【0022】〔比較例1〕第一成形体の成形材料には無
機充填剤50重量%を含む「めっきグレード」液晶ポリ
マー(ポリプラスチック社製ベクトラC・820)を用
いた。この時の射出成形温度は330℃で、金型温度は
100℃とした。Comparative Example 1 A "plating grade" liquid crystal polymer (Vectra C.820 manufactured by Polyplastics) containing 50% by weight of an inorganic filler was used as a molding material for the first molded body. At this time, the injection molding temperature was 330 ° C., and the mold temperature was 100 ° C.
【0023】次に、この第一成形体を実施例2と同様に
粗化処理しめっき触媒(HS−101B;(株)日立化
成製)を塗布した後、第一次成形体の回路部分が露出す
るように、第二次成形体を第一次成形体の周りに射出成
形により形成し、一体物品の成形体を作成した。この時
第二次成形体の材料にはポリフェニレンサルファイドを
用いた。この時の射出成形温度は280℃で、金型温度
は120℃とした。Next, the first compact was roughened in the same manner as in Example 2 and a plating catalyst (HS-101B; manufactured by Hitachi Chemical Co., Ltd.) was applied. A secondary molded body was formed around the primary molded body by injection molding so as to be exposed, thereby producing a molded body of an integrated article. At this time, polyphenylene sulfide was used as a material of the secondary molded body. At this time, the injection molding temperature was 280 ° C., and the mold temperature was 120 ° C.
【0024】この成形体を実施例1と同様の粗化処理液
で処理をし、実施例1と同様の無電解銅めっき液に6時
間浸漬した。以上のようにして作成したこの立体成形回
路部品の外観を観察したところ、第一次成形体の表面に
めっき銅が析出していない箇所(めっきのつきむら)が
見られた。This compact was treated with the same roughening solution as in Example 1 and immersed in the same electroless copper plating solution as in Example 1 for 6 hours. Observation of the appearance of the three-dimensionally formed circuit component produced as described above revealed that a portion where plated copper was not deposited (uneven plating) on the surface of the primary molded body.
【0025】〔比較例2〕第一成形体の成形材料には無
機充填剤50重量%を含む「めっきグレード」液晶ポリ
マー(ポリプラスチック社製ベクトラC・820)に触
媒(パラジウム塩)を混入したものを用いた。この時の
射出成形温度は330℃で、金型温度は100℃とし
た。次に、この第一成形体の回路部分が露出するよう
に、第二次成形体を第一次成形体の周りに射出成形によ
り形成し、一体物品の成形体を作成した。このときの第
二次成形体の材料にはポリフェニレンサルファイドを用
いた。このときの射出成形温度は280℃で、金型温度
は120℃とした。Comparative Example 2 A catalyst (palladium salt) was mixed into a "plating grade" liquid crystal polymer (Vectra C.820 manufactured by Polyplastics) containing 50% by weight of an inorganic filler in the molding material of the first molded body. Was used. At this time, the injection molding temperature was 330 ° C., and the mold temperature was 100 ° C. Next, a secondary molded body was formed around the primary molded body by injection molding so that the circuit portion of the first molded body was exposed, thereby producing a molded body of an integrated article. At this time, polyphenylene sulfide was used as a material of the secondary molded body. At this time, the injection molding temperature was 280 ° C., and the mold temperature was 120 ° C.
【0026】この成形体を実施例2と同様の粗化処理液
で処理をし、実施例2と同様の無電解銅めっき液に6時
間浸漬した。以上のようにして作成したこの立体成形回
路部品の外観を観察したところ、配線パターン間や絶縁
部分に銅の異常析出があることが分かった。その大きさ
は約1μm〜40μm程度のものがあり、場所によっては
配線パターン間が短絡している箇所もあった。This compact was treated with the same roughening solution as in Example 2 and immersed in the same electroless copper plating solution as in Example 2 for 6 hours. Observation of the appearance of the three-dimensionally formed circuit component produced as described above revealed that abnormal deposition of copper was found between wiring patterns and in the insulating portion. Its size is about 1 μm to 40 μm, and there are some places where the wiring patterns are short-circuited depending on the places.
【0027】[0027]
【発明の効果】本発明による立体成形回路部品とその製
造方法によれば、 第一次成形体の素材樹脂中にめっき
触媒が含まれているために、第一次成形体の成形後にめ
っき触媒を付与することを必要としない。そのために、
従来法における場合にように、第一次成形体表面に付着
した薬液によりめっきのつきむらが生じることは回避で
き、均一な導体回路を得ることができる。また、第一次
成形体樹脂にめっき触媒入り樹脂を使用し、かつ、粗化
処理後の第一次成形体に第二成形体を被覆形成するよう
にしたので、めっき処理前に残渣物の核となる物が溶出
することはなく、従来のように異常析出が発生すること
は回避される。According to the three-dimensional molded circuit component and the method of manufacturing the same of the present invention, the plating catalyst is contained in the material resin of the primary molded body, so that the plating catalyst is formed after the molding of the primary molded body. Does not need to be provided. for that reason,
As in the case of the conventional method, it is possible to avoid the occurrence of uneven plating due to the chemical solution attached to the surface of the primary molded body, and to obtain a uniform conductor circuit. In addition, since a resin containing a plating catalyst is used as the primary molded body resin, and the second molded body is formed so as to cover the first molded body after the roughening treatment, the residue is removed before the plating treatment. The nucleus does not elute, and the occurrence of abnormal precipitation as in the prior art is avoided.
【図1】本発明の立体成形回路部品の一例を説明する
図。FIG. 1 is a diagram illustrating an example of a three-dimensional molded circuit component of the present invention.
【図2】本発明の立体成形回路部品の製造工程を説明す
る図。FIG. 2 is a diagram illustrating a manufacturing process of the three-dimensionally formed circuit component of the present invention.
1…第一次成形体樹脂、2a、2b…第二次成形体樹
脂、3…金属皮膜(導体回路)、4…スルーホール。DESCRIPTION OF SYMBOLS 1 ... Primary molded resin, 2a, 2b ... Secondary molded resin, 3 ... Metal film (conductor circuit), 4 ... Through-hole.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 吉村 豊房 茨城県日立市大みか町七丁目1番1号 株 式会社日立製作所日立研究所内 (72)発明者 佐藤 亮 茨城県日立市日高町五丁目1番1号 日立 電線株式会社パワーシステム研究所内 (72)発明者 大阿久 俊幸 茨城県日立市日高町五丁目1番1号 日立 電線株式会社日高工場内 (72)発明者 安藤 好幸 茨城県日立市日高町五丁目1番1号 日立 電線株式会社パワーシステム研究所内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Toyofusa Yoshimura 7-1-1, Omikacho, Hitachi City, Ibaraki Prefecture Within Hitachi Research Laboratory, Hitachi, Ltd. (72) Inventor Ryo Sato 5-chome, Hidakacho, Hitachi City, Ibaraki Prefecture No. 1-1 Hitachi Power Cable Co., Ltd. Power System Research Laboratories (72) Inventor Toshiyuki Oaku 5-1-1 Hidakacho, Hitachi City, Ibaraki Prefecture Hitachi Cable Co., Ltd. Hidaka Factory (72) Inventor Yoshiyuki Ando Ibaraki Prefecture 5-1-1, Hidaka-cho, Hitachi City Power System Research Laboratory, Hitachi Cable, Ltd.
Claims (2)
一次成形体の回路となる部分以外に形成された第二次成
形体と、該第二成形体で覆われていない前記第一次成形
体上にめっきにより形成された導体回路とを有する立体
成形回路部品であって、前記第一次成形体はめっき触媒
を含有したものであり、前記第二成形体は前記第一次成
形体の粗化処理後に被覆形成されたものであることを特
徴とする立体成形回路部品。1. A primary molded body having a roughened surface, a secondary molded body formed other than a portion of the primary molded body that becomes a circuit, and a second molded body covered with the second molded body. A three-dimensional molded circuit part having a conductor circuit formed by plating on the primary molded body, wherein the primary molded body contains a plating catalyst, and the second molded body is A three-dimensional molded circuit component, which is formed by coating after a roughening treatment of a primary molded body.
成し、該第一次成形体に粗化処理を施し、該粗化処理を
施した第一次成形体の回路となる部分以外に第二次成形
体を形成し、該第二の成形体で覆われていない前記第一
次成形体上に導体回路をめっきにより形成することを特
徴とする立体成形回路部品の製造方法。2. A method for forming a primary molded body containing a plating catalyst, subjecting the primary molded body to a roughening treatment, and excluding a portion of the roughened primary molded body that becomes a circuit. Forming a conductive circuit by plating on the primary molded body which is not covered with the second molded body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34133496A JPH10183361A (en) | 1996-12-20 | 1996-12-20 | Three-dimensionally molded circuit parts and their production |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34133496A JPH10183361A (en) | 1996-12-20 | 1996-12-20 | Three-dimensionally molded circuit parts and their production |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10183361A true JPH10183361A (en) | 1998-07-14 |
Family
ID=18345261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP34133496A Pending JPH10183361A (en) | 1996-12-20 | 1996-12-20 | Three-dimensionally molded circuit parts and their production |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH10183361A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005148666A (en) * | 2003-11-20 | 2005-06-09 | Hitachi Maxell Ltd | Optical component |
JP2006219752A (en) * | 2005-02-14 | 2006-08-24 | Canon Inc | Production method of structure |
-
1996
- 1996-12-20 JP JP34133496A patent/JPH10183361A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005148666A (en) * | 2003-11-20 | 2005-06-09 | Hitachi Maxell Ltd | Optical component |
JP4632657B2 (en) * | 2003-11-20 | 2011-02-16 | 日立マクセル株式会社 | Optical components |
JP2006219752A (en) * | 2005-02-14 | 2006-08-24 | Canon Inc | Production method of structure |
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