JPH10180726A - Manufacture of particle board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacture of a particle board which lessens released formaldehyde. SOLUTION: After a compound which reacts with formaldehyde is sprayed beforehand on chips of wood, in this manufacture of a particle board, an adhesive having no formaldehyde is applied thereon and the chips are subjected to forming and thermal pressing. By this method, the formaldehyde is lessened in a stage of material even when recycle chips or woody scraps of building in a factory or the kind of tree such as yellow lauan from which the formaldehyde is much produced by heating is used for the chips of wood.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a particle board that emits less formaldehyde.

[0002]

2. Description of the Related Art An adhesive made of a thermosetting resin such as a urea resin or a melamine resin is applied to a piece of wood and formed.
There is a particle board that is hot pressed in a plate shape, and is widely used for furniture and building materials.

[0003]

However, since this particle board is manufactured with an adhesive containing formaldehyde, formaldehyde which has an adverse effect on the human body is emitted. Therefore, it has been proposed to use a phenol resin or an isocyanate resin having no formaldehyde as the adhesive, and the emission of formaldehyde from the adhesive composition was certainly reduced.

[0004] However, if wood chips such as recycled chips in a factory or building waste wood, and wood chips such as Yellow Lawan, which generates a lot of formaldehyde by heating, are used as wood pieces, a low formalin board can be obtained only by changing the adhesive. Was difficult.

[0005]

According to a first aspect of the present invention, a compound which reacts with formaldehyde is sprayed on a piece of wood in advance, and then an adhesive having no formaldehyde is applied to form the product, followed by hot pressing. It is characterized by doing.

According to the present invention, since a compound that reacts with formaldehyde is sprayed on a piece of wood in advance, a wood chip such as a recycled chip in a factory or waste wood from building materials is used for the piece of wood, and a kind of wood such as Yellow Lawan which generates a lot of formaldehyde by heating is used for the piece of wood. However, since formaldehyde is reduced at the raw material stage, and subsequently, an adhesive having no formaldehyde is applied and hot-pressed, a particle board containing extremely little formaldehyde can be obtained.

[0007]

DETAILED DESCRIPTION OF THE INVENTION Recycled chips and waste wood from buildings are used as wood chips, and tree species such as yellow lauan, which often generate formaldehyde when heated, can be used. These raw materials have formaldehyde.

Before applying an adhesive to these chips,
A compound that reacts with formaldehyde to reduce formaldehyde is applied in advance. Compounds include ammonia, sodium chloride, and sodium sulfate. These compounds are used in an amount of 0.0003 to 0.00
Spray 3 g and dry.

Subsequently, an adhesive is applied to the piece of wood and hot-pressed. An adhesive having no formaldehyde is used as the adhesive. For example, a phenol resin or an isocyanate resin is used. The application amount is about 7 to 13% based on the absolute dry weight of a piece of wood. Incidentally, wax and other additives may be added in advance to the adhesive to improve various performances of the particle board.

[0010] Hot pressing is based on conventional methods. Forming a piece of wood coated with adhesive and hot pressing at a temperature of 180 ~
200 ° C, time 10-20 minutes, pressure 15-25kg / c
hot-press molding with m2 to obtain the desired particle board.

[0011]

According to the present invention, since a compound that reacts with formaldehyde is sprayed on a piece of wood in advance, wood chips such as recycled chips or waste wood from buildings in a factory, and a kind of wood such as Yellow Lawan, which generates a lot of formaldehyde when heated on a piece of wood. Formaldehyde is reduced at the material stage even if is used,
Subsequently, an adhesive having no formaldehyde is applied and hot-pressed, so that a particle board containing extremely little formaldehyde can be obtained.

Claims (1)

[Claims] 1. A method for producing a particle board, comprising spraying a compound which reacts with formaldehyde on a piece of wood in advance, applying an adhesive having no formaldehyde thereto, forming the same, and hot pressing.