JPH10173001A - Solder bump forming member, its manufacturing method, manufacturing method of board with solder bump and reproducing method for damaged solder bump of board with solder bump - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solder bump forming member, its manufacturing method, a manufacturing method for boards with solder bumps and a reproducing method for damaged solder bumps of boards with solder bumps capable of performing the reproduction of solder bumps, etc., on a MCM (multichip module) board for example at a low cost and with an excellent mass productivity. SOLUTION: A sheet of solder foil 13 is put on a coarsened base material 3 and is stuck by a press. Next, an epoxy dry film 15 is glued on the surface of the solder foil 13. Next, ultrasonic rays are emitted on sites where solder is to be left unremoved, and the epoxy dry film 15 is hardened. After that, etching resists 17 are formed by melting and removing unrequisite parts of the dry film 15. Next, unnecessary solders in parts uncovered by the etching resists 17 are melted and removed. Next, the base material 3 is dipped in acetone, and the etching resists 17 are removed from the upside of a solder preform 5, and a solder bump forming member 1 is completed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder bump forming member used for forming a solder bump on, for example, a resin wiring board having solder bumps such as a flip chip bonding board and a ball grid array board. The present invention relates to a method for manufacturing the same, a method for manufacturing a substrate with solder bumps, and a method for regenerating damaged solder bumps on a substrate with solder bumps.

[0002]

2. Description of the Related Art Conventionally, for example, when an integrated circuit chip is mounted on an integrated circuit board, a plurality of terminals are formed in a lattice or staggered pattern on a joint surface between the integrated circuit chip and the integrated circuit board. A method called a flip chip for joining the two is known.

[0003] Further, in joining an integrated circuit board on which an integrated circuit chip is mounted and a printed board (such as a motherboard), the other joining surface of the integrated circuit board (the joining surface opposite to the joining surface on which the integrated circuit chip is mounted) is connected. On the other hand, a method is known in which a plurality of terminals are formed in a grid pattern using high-melting solder or Cu balls for bonding on a surface, and the terminals are bonded to a printed circuit board. (BGA) substrate.

[0004] As a method for forming these solder bumps serving as lattice-shaped or staggered surface bonding terminals, for example, the following various methods are known. Solder paste printing method Solder paste is placed by printing on the underlying conductive pad formed on the substrate, and then heated to melt the solder paste, forming a hemispherical or spherical solder bump on the pad how to.

[0005] Solder preform mounting method A method of mounting a solder preform on a pad of a substrate and then heating and melting the solder preform to form a solder bump. Solder bonding method A method of forming solder bumps by applying solder to a substrate pad by bonding and then heating and melting the solder.

Ball mounting method A small amount of eutectic solder paste is applied on a pad of a substrate, and after mounting the ball thereon, the ball is fixed to the pad by heating and melting the eutectic solder paste to form a solder. A method of forming a bump.

[0007]

SUMMARY OF THE INVENTION
When the solder bumps are formed by the method described above, there are the following problems, and further improvement is required. For example, in the manufacture of a multi-chip module (hereinafter, referred to as an MCM substrate) by flip chip bonding, if a defect is found in some of a plurality of integrated circuit chips (semiconductor elements) mounted, only the defective semiconductor element is removed. removal,
Instead, mount a good semiconductor element again, but when removing the defective semiconductor element, a part of the solder that forms the solder bumps formed on the MCM substrate is removed together with the defective semiconductor element, so the semiconductor In order to mount the element, it is necessary to replenish the solder for each bump on the MCM substrate to re-form the solder bump.

In this case, since the other semiconductor element which has not been removed is mounted on the MCM substrate and is not flat, the conventional solder paste printing method cannot be applied. In addition, the solder preform mounting method and the ball mounting method have a high cost for solder mounting equipment, and the solder bonding method has poor mass productivity, and it is difficult to say that either method is the best.

The present invention provides a solder bump forming member, a method of manufacturing the same, a method of manufacturing a board with a solder bump, and a board with a solder bump, which can regenerate solder bumps on an MCM substrate at low cost and with good productivity. It is an object of the present invention to provide a method of reproducing a damaged solder bump.

[0010]

According to the first aspect of the present invention, there is provided a member for forming a solder bump, comprising: a base made of a material having low wettability to solder; And a solder material which is fixed so as to be separable from the substrate after heating and melting.

That is, in the present invention, since the base material used for the bump forming member is made of a material having low wettability to the solder (that is, it is difficult to adhere to the solder by reacting with the solder). Can be easily separated from the solder bumps (without the solder bumps adhering to the base material and falling off the substrate) after the solder bumps are formed on the pads of the substrate by heating and melting.

In the second aspect of the present invention, the solder material is fixed to the surface of the substrate at a position corresponding to a predetermined position where the solder bump is to be formed. Therefore, by disposing the solder material on the solder bump forming member at a predetermined position on the substrate (for example, by bringing the solder material into contact with or close to the pads of the substrate) and melting by heating,
Solder bumps can be formed at predetermined positions on the substrate.

In particular, when a large number of solder bumps are formed in a predetermined pattern on a substrate, a solder material is arranged on a member for forming a solder bump in accordance with the pattern, so that the pattern is heated and melted once. It is possible to form a large number of solder bumps in a shape.

According to a third aspect of the present invention, there is provided a member for forming a solder bump for forming a solder bump at a predetermined position on a surface of a substrate, wherein the member comprises a material having low wettability to solder. A material, and a solder material which is fixed at a position corresponding to a predetermined position on the surface of the substrate on the surface of the substrate so that solder can be transferred from the substrate to the surface of the substrate by heating and melting.

Therefore, the solder material of the solder bump forming member is arranged at a predetermined position on the substrate, and the solder is transferred by heating and melting the solder material to form a solder bump at the predetermined position on the substrate. Moreover, after the formation of the solder bumps, the base material can be easily removed from the solder bumps.

According to a fourth aspect of the present invention, a fixing position of the solder material on the surface of the base material;
Alternatively, the fixing position and the vicinity thereof are lower than the surrounding surface. That is, since the base material around the solder material is as high as a wall, the solder material does not shift during the heating and melting of the solder material, and the solder bump can be formed at an accurate position.

In the invention of a solder bump forming member according to claim 5, low wettability with respect to the solder is provided at least on the periphery of the fixing position of the solder material or on the periphery of the fixing position on the base material surface. It has a solder dam made of material.
In the present invention, as in claim 4, the periphery of the solder material is raised like a wall by the solder dam. Therefore, when the solder material is heated and melted, the solder material does not shift, and the solder material can be accurately positioned. A bump can be formed.

According to the invention of claim 6 of the present invention, the substrate is a sheet-shaped substrate. That is, since the base material is in a sheet shape, the operation of peeling the base material from the solder bumps after the formation of the solder bumps is facilitated.

In the invention of a solder bump forming member according to claim 7, the planar dimension of the surface of the substrate to which the solder material is fixed is the same as the planar dimension of the semiconductor element mounted on the substrate. It has been. Therefore, when a solder bump is formed on a substrate using the solder bump forming member, if the base material is aligned with reference to the planar dimension of the base material surface, the solder bump forming member can be positioned at a predetermined position on the substrate. Therefore, for example, solder bumps for connecting an integrated circuit chip can be easily formed.

In particular, when the dimensions and shape of the sheet-shaped base material are the same as those of the integrated circuit chip, for example, the members for forming the solder bumps are placed on the substrate by using an ordinary semiconductor device mounting machine. , The workability can be significantly improved.

According to the invention of claim 8 of the present invention, the top of the solder material is flat. When the top is flat as described above, the height of the solder top is increased when the solder material is melted, so that it is easy to come into contact with a solder bump pad or the like provided on the substrate, and the solder is securely transferred to the substrate. Side to form a solder bump.

In particular, when a flat solder material such as a solder foil is arranged at a predetermined position on the surface of the base material to form a solder material having a flat top, the height of the solder material is uniform.
Good coplanarity, easy contact with all pads on the substrate, and reliable formation of solder bumps.

According to a ninth aspect of the present invention, the solder material is fixed to the base material by a flux. Since the flux is solidified at low temperatures,
The solder material can be fixed to the base material. Moreover, when the solder material is melted, it prevents the solder from being oxidized and removes an oxide film such as solder, thereby helping the solder to be firmly soldered to a solder bump pad or the like provided on the substrate. I do.

In a tenth aspect of the present invention, the solder material is fixed to the substrate by pressure bonding. In this case, the solder can be easily separated from the base material having low wettability with respect to the solder simply by heating to melt the solder material, and can be transferred to the substrate.

For example, a material that can be fixed by pressure bonding, such as a solder foil or the like that is pressed and positioned at a predetermined position on the surface of the base material, can be used. The formation can be performed. In the invention of the member for forming a solder bump according to claim 11, of the surface of the base material,
At least the portion where the solder material is fixed is a rough surface.

That is, it is preferable that the surface of the base material is rough because the solder material is strongly fixed to the base material and the solder material hardly falls off during handling. The invention of a method for manufacturing a member for forming a solder bump according to claim 12 is a method for manufacturing a member for forming a solder bump for forming a solder bump at a predetermined position on a substrate surface, wherein the material has low wettability to solder. Pressure bonding a solder thin plate to the surface of a base material consisting of
Removing unnecessary portions of the thin solder plate other than portions corresponding to predetermined positions on the substrate surface.

Thus, solder bumps having a uniform height and a flat top can be formed at predetermined positions on the substrate surface. Further, in the case of the present invention, since it is sufficient to simply press-bond using, for example, a solder thin plate such as a solder foil, steps such as coating and melting when using a solder paste are unnecessary.

[0028] In the invention of the thirteenth aspect, the surface of the base material is rough. Therefore, it is difficult for the solder material to fall off from the surface of the base material during the manufacture of the solder bump forming member.

According to a fourteenth aspect of the invention, there is provided a method of manufacturing a member for forming a solder bump, wherein the step of removing an unnecessary portion of the solder thin plate includes the steps of: applying an etching resist on the solder thin plate; The method further includes a step of exposing and developing the unnecessary portion to expose the unnecessary portion, a step of removing the exposed unnecessary portion of the solder thin plate by etching, and a step of removing the remaining etching resist.

Thus, only the necessary portions of the solder thin plate can be accurately left, so that the solder bumps can be formed with high dimensional accuracy and position accuracy, and the solder bumps can be formed with a small size or a narrow pitch. Can be formed. The invention of a method for manufacturing a member for forming a solder bump according to claim 15 is a method for manufacturing a member for forming a solder bump for forming a solder bump at a predetermined position on a substrate surface, wherein the material has low wettability to solder. A step of applying a solder paste to a position corresponding to a predetermined position on the surface of the substrate, and a step of melting the solder paste by heating and then cooling it.

By doing so, the solder material can be formed at the desired position, and the solder volume of each solder material can be adjusted by adjusting the printing conditions and the opening of the mask. . In addition, by cooling after melting the solder paste, the solder material in which the flux contained in the solder paste has become substantially spherical is fixed to the substrate, so that special work for fixing is unnecessary. .

In the method of manufacturing a solder bump forming member according to the present invention, the fixing position of the solder material, or the fixing position and the vicinity thereof, on the surface of the base material are lower than the surrounding surface. Use a substrate that has In this way, even if the solder in the solder paste melts and agglomerates into a substantially spherical shape due to the heating, the solder material stops at a portion lower than the surroundings and is fixed to the base material. The displacement can be eliminated or reduced. Further, the position of the solder bump formed on the substrate does not shift.

In the method for manufacturing a solder bump forming member according to the present invention, at least the periphery of the fixing position of the solder material or the periphery of the fixing position and the vicinity thereof on the surface of the base material, A base material having a solder dam made of a material having low wettability is used. Therefore, the claim 16
In the same manner as described above, the displacement of the solder material can be eliminated or reduced, and the position of the solder bump will not be displaced.

Prior to the step of applying the solder paste, a solder dam made of a solder resist is formed on at least the periphery of the fixing position of the solder material or the periphery of the fixing position on the surface of the base material. The method for manufacturing a member for forming a solder bump according to claim 15 can be employed.

As described above, when a solder dam is formed, a solder resist (for example, OPSR-560 manufactured by Tokyo Ohka Co., Ltd.) is used.
When the solder dam is formed by 0), printing, drying, exposure,
An accurate pattern can be easily formed by development. An invention of a method for manufacturing a board with solder bumps according to claim 18, wherein the method for manufacturing a board with solder bumps, wherein solder bumps are formed at predetermined positions on the board surface using a member for forming solder bumps, wherein the solder material is A step of aligning the solder bump forming member so as to be in contact with or in proximity to a predetermined position on the substrate, and disposing the solder bump forming member on the substrate surface; and melting the solder material by heating to transfer the solder to the predetermined position on the substrate. And a step of cooling the substrate and removing the substrate from the surface of the substrate.

That is, a solder bump can be formed by melting a solder material on a solder bump forming member and transferring it to a substrate, for example, a solder bump pad. By doing so, the solder bump forming member is aligned and arranged on the substrate, and heated to transfer the solder all at once, forming the solder bump at a predetermined position on the substrate surface, and forming the solder bump. An attached substrate can be manufactured.

According to the invention of claim 19, in the heating and cooling step, the solder melted in the base material is cooled and solidified while being pressed against the surface of the substrate to form the solder bump. Flatten the top. This makes it possible to manufacture a substrate with solder bumps in which solder bumps having a flat top and low coplanarity are formed at predetermined positions on the substrate surface.

In this manner, there are advantages that the bonding property with, for example, an integrated circuit chip to be bonded to the solder bumps is improved, and that the bonding operation is simplified. In particular, when a rigid material such as glass or ceramic is used as the solder bump forming member, the degree of collapse of the top can be adjusted by its own weight or by applying weight.

According to a twentieth aspect of the invention of the method for manufacturing a substrate with solder bumps, the base material has a surface where the solder material is fixed, or the fixed position and the vicinity of the fixed position.
A base material that is lower than its surrounding surface, and at the time of the pressing, the surrounding surface of the base material is brought into contact with the surface of the substrate to increase the height from the substrate surface to the top of the solder bump. It is regulated by the depth from the peripheral surface of the base material to the fixing position of the solder material.

In this case, since the height of the top of the solder bump is regulated by the depth of the lower portion of the base material, the height of the top of the solder bump can be easily set by appropriately setting the depth. can do. In the method of manufacturing a board with solder bumps according to claim 21, in the step of arranging the solder bump forming member on the surface of the board, the protrusion provided on the board surface causes the solder bump forming member to Adjust the position by regulating the position.

Since the position of the solder bump forming member can be determined by the projection, the alignment can be performed easily and accurately, and the solder bump can be formed at an accurate position. 22. The method according to claim 21, wherein the position of the solder bump forming member is regulated by bringing the protrusion into contact with a side end of the solder bump forming member. Method can be adopted.

That is, the position of the solder bump forming member can be regulated by bringing the protrusion into contact with the side end of the solder bump forming member. In this case, the positioning can be easily performed, and the positioning accuracy can be increased to the positioning accuracy of the protrusion. 22. The solder bump according to claim 21, wherein the position of the solder bump forming member is regulated by inserting the protrusion into a through hole or a blind hole formed in the solder bump forming member. The manufacturing method of the attached substrate can also be adopted.

That is, the position of the solder bump forming member can be regulated by inserting the projection into a through hole or a blind hole formed in the solder bump forming member.
By doing so, the number of protrusions can be reduced, positioning is easy, and positioning accuracy can be increased.

According to a twenty-second aspect of the invention, there is provided a method of manufacturing a board with solder bumps, wherein the board has a solder bump formed at a predetermined position on a surface of the board, and at least a part of the formed solder bump. A substrate from which the solder has been removed is used. In other words, if for some reason at least a portion of the solder bumps once formed are removed, for example when an integrated circuit chip is mounted on this substrate, the solder bumps must be formed again, By using the above-described solder bump forming member, a solder bump can be easily formed even on such a substrate.

According to a twenty-third aspect of the present invention, at least one integrated circuit chip is formed of a solder bump on a portion other than a portion where a solder bump is formed by the solder bump forming member. Use the connected substrate. For example, when an integrated circuit chip is to be mounted on a substrate on which the integrated circuit chip has already been mounted, solder bumps need to be formed at the mounting position. In addition, it is difficult to form the solder bumps because the already mounted integrated circuit chip is in the way, and the other conventional methods have poor workability.

On the other hand, according to the present invention, the use of the above-described solder bump forming member allows solder bumps to be easily formed at, for example, a limited place where an integrated circuit chip is to be mounted. . In particular, when a solder bump forming member using a base material having the same plane size as an integrated circuit chip to be mounted is used, alignment is performed in the same manner as an integrated circuit chip, so that a solder bump forming member is formed on a substrate. Can be arranged, which is preferable.

According to a twenty-fourth aspect of the present invention, there is provided a method for regenerating a damaged solder bump on a substrate having a solder bump, wherein the connection with another substrate is made by the solder bump, and thereafter, the damaged solder bump on the substrate from which the other substrate has been removed is regenerated. A method of positioning the solder bump forming member on a substrate surface such that the solder material contacts or approaches a damaged solder bump on the substrate, and dissolving the solder material by heating. And transferring the solder to a predetermined position on the substrate and then cooling, and removing the substrate from the surface of the substrate.

For example, when the integrated circuit chip is removed from the substrate by heating, about 70% of the solder in the solder bumps is usually removed at the same time, resulting in a so-called damaged solder bump. Therefore, the integrated circuit chip is mounted again. In this case, the solder bumps must be formed in a normal shape by replenishing the removed solder.

In the present invention, by using the solder material of the solder bump forming member for such a damaged solder bump, the solder bump can be regenerated to a normal one. Therefore, in order to regenerate the solder bumps, it is preferable to use a solder bump forming member having a solder material having an amount of the removed solder.

According to a twenty-fifth aspect of the present invention, there is provided a method for regenerating a damaged solder bump on a substrate having solder bumps, wherein the substrate is a substrate to which at least one integrated circuit chip is connected by solder bumps. That is, when a plurality of integrated circuit chips are mounted on the substrate surface, for example, if one defective integrated circuit chip is removed, only the portion of the integrated circuit chip becomes a substrate with a space, and such a substrate is removed. In order to mount the integrated circuit chip again, solder bumps must be formed again in the narrow space, and it is difficult to apply, for example, a solder paste printing method.

Therefore, in the present invention, by using the above-described solder bump forming member, the solder bumps can be easily and efficiently regenerated in such a narrow space, and the non-defective integrated circuit chip is again produced. Can be mounted. still,
In the invention of each of the above claims, the following configuration can be adopted.

As the material of the base material, a material which reacts with the solder and hardly adheres is used, and these materials are materials which can withstand the temperature when heating the solder. For example,
Composite materials such as glass epoxy, silicone rubber, glass, ceramics such as alumina and silicon nitride, metals such as stainless steel and titanium, heat-resistant resins such as polyimide, polytetrafluoroethylene (Teflon; trademark), and epoxy can be used. In addition, when positioning is performed visually when forming the solder bumps, it is desirable to use a transparent material such as polyimide or glass.

As the solder of the solder material, in addition to Pb-Sn based soft solder, for example, Au used as a bump material is used.
It means a brazing material in a broad sense having a low melting point of 450 ° C. or less, such as —Sn based and Au—Si based. The solder material may contain a flux and the like in addition to the solder.

The melting temperature may be higher than the melting point of the solder paste or the like (that is, the melting point of the solder). For example, a temperature higher by 10 to 40 ° C. than the melting point can be adopted. -Examples of the substrate include a wiring substrate on which an integrated circuit chip is mounted (particularly, an MCM substrate on which a plurality of integrated circuit chips are mounted), and a printed circuit board bonded to the wiring substrate.

[0055]

Next, an example (embodiment) of an embodiment of the present invention will be described. (Example 1) Here, in a resin laminated substrate (multi-chip module substrate, hereinafter simply referred to as MCM substrate) on which a plurality of semiconductor elements (hereinafter, referred to as integrated circuit chips) are mounted face down, once mounted, then removed. An example will be described in which a solder bump is regenerated by using a solder bump forming member in order to mount a defective integrated circuit chip substitute on the MCM substrate again.

A) First, the structure of the member for forming a solder bump of this embodiment will be described. As shown in FIG. 1A, the solder bump forming member 1 of this embodiment is provided on one surface of a heat-resistant sheet-shaped base material 3 made of polytetrafluoroethylene (Teflon; trademark). A large number of disk-shaped solder preforms 5 made of crystal solder are fixed.

The base material 3 is 12 mm long × 17 mm wide ×
It has a thickness of 0.1 mm, and the surface of the substrate 3 is roughened so that the solder preform 5 can be easily fixed. The vertical and horizontal dimensions of the base material 3 are the same as the dimensions of the integrated circuit chips 9a to 9d (hereinafter, collectively referred to as 9) mounted on the MCM substrate 7 shown in FIG. The MCM substrate 7 shown in FIG. 1B has three integrated circuit chips 9a to 9c.
However, a defective integrated circuit chip (not shown) has been removed from one location at the lower right of the figure, and the damaged solder bump 11a with a reduced amount of solder has been exposed.

On the other hand, each solder preform 5 is formed.
At the position corresponding to the position of each solder bump 11 (see FIG. 3)
Are located. In other words, as described in detail below,
The member 1 for forming a tape on the MCM substrate 7
The solder bumps 11 are formed by
The arrangement pattern of the solder bump 11 is the arrangement pattern of the solder bump 11.
Is a symmetrical pattern. In addition, each solder pre-
The size of the form 5 is the volume required for the regeneration of the solder bump 11.
(5.75 × 10 solder volume of solder bump^-Fourmm ^ThreeOf 70
%) To secure φ0.1mm x thickness 0.05m
m. That is, the body of one solder bump 11
The product is usually 5.75 × 10^-Fourmm^ThreeBut the accumulation of defects
When removing the circuit chip, about 70% of the solder bump 11
Is removed together with the defective integrated circuit chip.
To regenerate step 11, add 70% of the removed
You can get it.

B) Next, a method of manufacturing the solder bump forming member 1 will be described. First, as shown in FIG. 2A, one side 3a of the substrate 3 which is a Teflon sheet having a thickness of 0.1 mm is attached to the solder preform 5 in order to enhance the adhesion with the solder preform 5. The surface is roughened by polishing (surface roughness Ra about 5 μm). Further, the adhesion strength can be further increased by etching the surface of the base material with potassium chromate or potassium permanganate to roughen the surface into fine irregularities. However, finally, since the base material 3 and the solder are separated, if the solder preform 5 after etching has a large area of, for example, φ50 μm or more,
Roughening by etching is not always necessary.

Next, as shown in FIG. 2 (b), a solder foil 13 having a thickness of 0.05 μm (to be a solder preform 5) is placed on the base material 3 and is pressed at 10 kg / cm by a press (not shown).
Crimping by applying pressure of ² . The inside of the press machine is evacuated to prevent poor pressure bonding due to air entrapment and oxidation of solder.

As shown in FIG. 2C, a negative type ultraviolet curing epoxy dry film 15 is attached to the surface of the solder foil 13 as shown in FIG. Next, FIG.
As shown in (2), the dry film 15 is cured by irradiating ultraviolet rays to the place where the solder is to be left, and then the unnecessary portion of the dry film 15 is dissolved and removed with a sodium carbonate solution. An etching resist 17 is formed.

Etching of Solder Foil 13 As shown in FIG. 2E, the solder foil 15
Is immersed in nitric acid to dissolve and remove unnecessary solder from portions not covered with the etching resist 17 to form a plurality of solder preforms 5 (in a state where the etching resist 17 is placed) arranged in a predetermined pattern. .

Removal of Etching Resist 17 As shown in FIG. 2F, the substrate 3 is immersed in acetone, and the etching resist 17 is removed from the solder preform 5. Through the above steps, the solder bump forming member 1 in which the solder preform 5 of eutectic solder is pressed on the Teflon base material 3 in a predetermined arrangement pattern is manufactured.

C) Next, a method of reproducing the damaged solder bump 11a using the solder bump forming member 1 will be described. For example, the 4C mounted on the MCM substrate 7 in FIG.
If one of the integrated circuit chips 9 (lower right portion in the drawing) is defective, the solder bumps 11 are melted by heating to remove the defective integrated circuit chip. Approximately 70% of the solder bump 11 is removed together with the defective integrated circuit chip, and the damaged solder bump 11a is left on the pad 19 (see FIG. 3) on the MCM substrate 7 side. Therefore, in order to mount the replacement non-defective integrated circuit chip 9d at that location, the solder bumps 11 must be reproduced on the pads 19. Hereinafter, the reproducing method will be described.

First, as shown in FIG. 3A, the solder bump forming member 1 of the present embodiment is placed such that the solder preform 5 on the base material 3 faces the MCM substrate 7 (ie, the pad 19 side). To place. At this time, the flux 14 is applied so as to cover the pads 19 of the substrate 7.

Then, as shown in FIG. 3B, the positions of the solder preforms 5 and the positions of the pads 19 are aligned so that the solder bump forming member 1 and the MCM are aligned.
The substrate 7 is overlaid. As a result, each solder preform 5 and the damaged solder bump 11a on each pad 19 come into contact with or approach each other. Although there is actually a damaged solder bump 11a on the pad 19, it is omitted in the figure (the same applies hereinafter).

In particular, in this embodiment, since the planar size of the substrate 3 is the same as that of the integrated circuit chip 9d, a known chip mounter used for mounting the integrated circuit chip 9d is used to form the solder bumps. The positioning of the member 1 can be performed. Next, the solder bump forming member 1 and the MCM
In a state in which the substrates 7 are superimposed on each other, the solder preforms 5 are passed through a far-infrared solder reflow furnace (not shown) to be heated at about 220 ° C. and melted. As a result, as shown in FIG.
The melted solder falls from the side of the base material 3 with low solder wettability and moves onto the pad 19 with high solder wettability. That is, since the base material 3 is Teflon, the wettability of the solder is low,
On the other hand, since the damaged solder bump 11a is on the pad 19 and the wettability of the solder is high, almost all of the molten solder is transferred to the pad 19 side. Therefore, the damaged solder bump 11a
And the volume of the transferred solder are combined to regenerate the solder bump 11 having a normal volume.

After that, as shown in FIG. 3D, the substrate 3 is peeled off after cooling, but the solder hardly adheres to the substrate 3. After that, the flux 14 is removed with a solvent. In this embodiment, since the base material 3 is thin and its weight is small,
The solder bumps 11 are not crushed and are substantially spherical except for the bottom.

Thereafter, the regenerated solder bumps 11 and non-defective integrated circuit chips 9d are joined by heating and cooling, thereby forming four integrated circuit chips 9a.
To 9d can be completed.
As described above, in this embodiment, when a part of the defective integrated circuit chip is removed from the MCM substrate 7 and the alternative integrated circuit chip 9d is mounted again, the necessary solder is formed by using the solder bump forming member 1. Reproduction of the bump 11 can be easily performed.

In particular, when the solder bumps 11 are reproduced only at predetermined positions on the MCM substrate 7, the other integrated circuit chips 9a to 9c cannot be used in the conventional solder paste printing method, and the conventional solder paste printing method cannot be used. However, the use of the solder bump forming member 1 of the present embodiment makes it possible to use a single integrated circuit chip 9d.
The solder bumps 11 of the arrangement pattern required for mounting the semiconductor device can be reproduced at a time, and the workability is excellent.

Further, the solder bump forming member 1 (base material 3)
Is aligned with the external shape of the integrated circuit chip 9d, so that it can be positioned using a chip mounter, and the workability is also high in that respect. When the integrated circuit chip 9d is mounted, the regenerated solder bump 11 is heated.
At that time, the solder bumps 11 joining the other non-defective integrated circuit chips 9a to 9c are also melted. It is desirable to mount the integrated circuit chip 9d after injecting an underfill), curing the resin, and molding the resin. (Embodiment 2) Next, Embodiment 2 will be described, but the description of the same parts as in Embodiment 1 will be omitted or simplified.

In this embodiment, a positioning projection of a member for forming a solder bump is provided on the surface of a resin-made MCM substrate. This positioning projection is disclosed in Japanese Patent Application No. Hei 8-16599.
As described in No. 2, it is for contacting the side edge of the outer periphery of the solder bump forming member to regulate the front-rear and left-right movement, and therefore, as shown in FIG. Numerals 27 are provided at a total of eight locations, two for each of the four sides on the outer periphery of the solder bump forming member 23.

Therefore, when reproducing the solder bumps 28 using the positioning projections 27, the following procedure is performed. First, as shown in FIG. 5A, a solder bump forming member 23 having a solder preform 22 on a substrate 21 is formed.
With the solder preform 22 facing downward (ie, facing the pad 26 of the MCM board 24) and a height of 0.1
It is arranged so as to be located between the positioning projections 27 mm. In FIG. 5, only the left and right positioning projections 27 are shown. When the solder bump 28 is reproduced, the pad 2
There are damaged solder bumps on 6, which are not shown.

Next, as shown in FIG. 5B, the solder bump forming member 23 is lowered between the positioning projections 27 and mounted on the MCM substrate 24. That is, the solder bump forming member 23 is placed between the four positioning projections 27 corresponding to the four sides of the solder bump forming member 23. Thus, the positions of the solder preforms 22 and the pads 26 coincide with each other, and they come into contact with or approach each other.

Next, as shown in FIG. 5C, a solder bump 28 is formed by heating to melt the solder preform 22. Thereafter, as shown in FIG. 5D, the substrate 21 is removed after cooling. As described above, in the present embodiment, the positioning of the solder bump forming member 23 can be performed using the positioning projections 27, so that the positioning can be easily performed manually without using a chip mounter. it can. That is, the solder bump forming member 23 only has to be placed between the positioning protrusions 27 formed at the positions of the four sides of the quadrangle, so that the work is extremely easy.

(1) The positioning projection 27 may be any projection that regulates the side end of the solder bump forming member 21, and the number, shape and material are not limited. The positioning projection 27 may be formed integrally when the MCM substrate 24 is manufactured, or the projection may be attached to the MCM substrate later by bonding or the like.

(2) In this embodiment, the positioning projection 27
Is configured to regulate the side end portion of the solder bump forming member 23. For example, a through hole or a concave portion into which a positioning projection is fitted is provided on the solder bump forming member side, thereby forming the solder bump forming member. Positioning may be performed.

(3) Conversely, positioning may be performed by providing a projection on the solder bump forming member side and providing a through hole or a concave portion on the MCM substrate side. (Embodiment 3) Next, Embodiment 3 will be described, but the description of the same parts as in Embodiment 1 will be omitted or simplified.

In this embodiment, a solder ball is once formed on the substrate of the member for forming a solder bump, and this solder ball is
The transfer to the M substrate side regenerates the solder bumps. a) First, a method for manufacturing a solder bump forming member will be described. First, as shown in FIG. 6A, a sheet-like thickness of 0.1 mm is used as the base material 32 of the solder bump forming member 31. lmm
Use a glass epoxy substrate. Incidentally, surface roughening is not particularly required.

Next, as shown in FIG. 6B, a metal mask 33 having a thickness of 0.05 mm is placed on the base material 32. This metal mask 33 has a eutectic solder paste 34
(That is, the part where the solder ball 36 is formed)
Is provided with an opening 37 of φ0.14 mm.

Next, as shown in FIG. 6C, the eutectic solder paste 34 is squeegee-printed, and the opening 37 of the metal mask 33 is filled with the eutectic solder paste 34. Fifty percent of the volume of the eutectic solder paste 34 is a flux component, and the remaining 50% is eutectic solder powder having a composition of 63Sn-37Pb. The volume of the opening 37 is determined by the solder bump 3
8 (see FIG. 7), the volume is set to 1.4 times the volume of the normal solder bump 38. In other words, the amount of eutectic solder required for regeneration is 70% of the amount of solder of the normal solder bumps 38. Therefore, when the amount of flux in the eutectic solder paste is taken into account, the amount is twice as large, ie, the volume of the normal solder bumps 38 It is set to 140%.

Next, as shown in FIG. 6D, the metal mask 33 is removed, and an arrangement pattern of the eutectic solder paste 34 corresponding to the arrangement pattern of the solder bumps 38 is formed. Next, as shown in FIG. 6E, the solder ball 36 is formed by heating at 220 ° C. in a far-infrared solder reflow furnace to melt the eutectic solder in the eutectic solder paste 34. That is, the eutectic solder powder is melted and agglomerated into a solder ball 36 by heating. Thereafter, when cooled, the flux 39 solidifies, and the solder ball 36 is fixed to the base material 32 by the flux 39.

By this step, the solder bump forming member 31 in which the solder balls 36 are fixed on the base material 32 is manufactured. b) Next, a method of reproducing a damaged solder bump using the solder bump forming member 31 will be described.

First, a flux 43 is applied uniformly on the MCM substrate 41 shown in FIG. 7A so as to cover the pads 42 as shown in FIG. 7B. The flux 43
Need not be applied because the flux 39 is present on the solder ball 36 side. For example, it is sufficient to apply a smaller amount than in the case of the first embodiment. Although there is a damaged solder bump on the pad 42, it is omitted as in the first and second embodiments.

Next, as shown in FIG. 7C, the solder bump forming member 31 is arranged with the solder balls 36 facing down, and the positions of the solder balls 36 and the pads 42 are aligned. Next, as shown in FIG. 7D, with the solder bump forming member 31 placed on the MCM substrate 41, the member is heated at 220 ° C. in a far-infrared solder reflow furnace. This allows
The flux 39 is liquefied again, and the solder balls 36 are peeled off from the base material 32, and the solder balls 36 are melted again, and are transferred from the base material 32 with low wettability to the pads 42 (ie, damaged solder bumps) with high wettability. Relocate. Therefore, the solder ball 36 and the damaged solder bump are melted and integrated to form a normal volume solder bump 38.

Next, as shown in FIG. 7 (e), after the solder was cooled and solidified to eutectic point of 183 ° C. or less, the base material 32 was cooled.
Peel off. Note that the flux 39 solidifies again at a temperature of 50 ° C. or less, and the base material 32 is hardly peeled off. After that, the flux 43 on the MCM substrate 41 is removed with a solvent.

Through this step, the solder bumps 38 can be reproduced on the MCM substrate 41. As described above, in this embodiment, since the solder balls 36 can be formed on the base material 32 by using the method of squeegee printing the eutectic solder paste 34, the manufacturing of the solder bump forming member 31 is simplified. The advantage is that Further, since the solder balls 36 are fixed to the base material 32 by the flux 39,
During the operation for forming the solder bumps 18, there is an effect that the solder balls 36 are hard to fall off. (Embodiment 4) Next, Embodiment 4 will be described, but the description of the same parts as in Embodiment 3 will be omitted or simplified.

In the present embodiment, a concave portion is provided in the base material of the solder bump forming member, and a solder ball is formed in the concave portion. Hereinafter, a method for manufacturing a member for forming a solder bump will be described. First, as shown in FIG. 8A, a drill, a laser, or the like is used on the surface of a base material 51 made of glass epoxy resin having a thickness of 0.2 mm in accordance with the arrangement pattern of the solder balls 52 to be formed. φ0.14mm, depth 0.02mm
Is formed.

Next, as shown in FIG. 8B, a solder ball 52 fixed by a flux 56 is formed at the position of the concave portion 53 by squeegee printing or the like as in the third embodiment, and a solder bump is formed. Member 54. As described above, in the solder bump forming member 54 of the present embodiment, the solder balls 5
2 is arranged so as to partially enter the concave portion 53 of the base material 51 and is fixed by the flux 56, so that the fixing position of the solder ball 52 does not shift and an accurate arrangement pattern can be formed. There is an advantage.

When the substrate 51 is a glass plate or a stainless steel plate, the concave portions can be formed by etching, and when the substrate is a ceramic plate, the concave portions can be formed also by laminating and firing perforated green sheets. (Embodiment 5) Next, Embodiment 5 will be described, but the description of the same parts as in Embodiment 3 will be omitted or simplified.

In this embodiment, a concave portion is formed by providing an annular convex portion on the surface of the base material of the solder bump forming member, and a solder ball is formed in the concave portion surrounded by the convex portion.
Hereinafter, a method for manufacturing a member for forming a solder bump will be described. First, a glass epoxy substrate having a thickness of 0.1 mm is used as a base material. In order to improve the adhesion between the solder resist and the substrate, the surface must be polished and the resin surface etched with potassium chromate or potassium permanganate to roughen the surface into fine irregularities. Is preferred.

Next, as shown in FIG. 9A, a negative photosensitive epoxy resin is
Printing is performed with a thickness of μm to form an epoxy resin layer 62.
Next, as shown in FIG. 9B, the epoxy resin layer 62 is exposed and developed to form a solder resist (solder dam) 63 having a pattern corresponding to the pad pattern on the MCM substrate (not shown). I do. That is, the columnar portion surrounded by the solder resist 63 corresponds to the solder ball 6.
The recess 66 determines the position of the fourth. In the case where the thickness of the base material 61 is small and the solder resist 63 is formed only on one side, the base material 61 warps. If the solder resist is formed on the entire back surface, the warpage can be suppressed.

Next, as shown in FIG. 9C, a metal mask 67 is placed on the solder resist 63 on the base material 61. The metal mask 67 is provided with an opening 68 at a location where the solder ball 64 is to be formed, that is, at the same location as the recess 66. Next, as shown in FIG. 9D, the eutectic solder paste 65 is squeegee-printed to form a metal mask 67.
Is filled with the eutectic solder paste 65 similar to that of the third embodiment. The total volume of the eutectic solder paste including the opening 68 and the concave portion 66 is set to 1.4 times the volume of a normal solder bump.

Next, as shown in FIG. 9E, the metal mask 67 is removed, and the eutectic solder paste 6
5 are formed. Next, as shown in FIG. 9 (f), it was heated at 220 ° C. in a far-infrared solder reflow furnace,
The eutectic solder is melted to form solder balls 64. At this time, the solder resist 63 dams the melted solder so that the melted solder does not shift from a position surrounded by the solder resist 63.

Thereafter, by cooling, the solder bump forming member 69 having the solder balls 64 fixed by the flux 67 is formed in the concave portion 66 on the base material 61. As described above, the solder bump forming member 69 according to the present embodiment is used.
Since the solder balls 64 are arranged so as to partially enter the recesses 66 in the same manner as in the fourth embodiment, the fixing position of the solder balls 64 does not shift and an accurate arrangement pattern can be formed. There is an advantage. (Embodiment 6) Next, Embodiment 6 will be described, but the description of the same parts as in Embodiment 3 will be omitted or simplified.

In this embodiment, the weight of the solder bump forming member is increased, and the top of the formed solder bump is made flat. For example, in Example 3, the weight of the base material is 0.02.
g, but in this embodiment, the base material is 12
Since a glass plate of mm × 17 mm × 2 mm thick is used, its own weight is as heavy as 1 g. The warpage of the substrate is less than 1 μm.

Hereinafter, a method for forming a solder bump using the member for forming a solder bump will be described. First, FIG.
As shown in FIG. 10B, a flux 73 is applied evenly on the MCM substrate 71 shown in FIG. Although there is a damaged solder bump on the pad 72, it is omitted.

Next, as shown in FIG. 10 (c), the solder bump forming member 74 having the structure shown in FIG. The solder balls 76 and the pads 72 are aligned with the 76 facing downward. Next, as shown in FIG. 10D, the solder bump forming member 74 is heated at 220 ° C. in a far-infrared solder reflow furnace in a state of being placed on the MCM substrate 71.
As a result, the flux 77 is again liquefied and the solder balls 76 are not fixed to the base material 78, and the solder balls 76 are melted again and the high wettability pad 72 (that is, the damaged solder) is removed from the low wettability base material 78. Move to the (bump) side. When the solder is melted, the molten solder is pressed by its own weight of the base material 78 to form a solder bump 79 having a flat top.

Next, as shown in FIG. 10E, the substrate 78 is peeled from the solder bumps 79 after cooling. Then M
The flux 73 on the CM substrate 71 is removed with a solvent. By this step, the solder bumps 79 can be reproduced on the MCM substrate 71, and at the same time, the tops of the solder bumps 79 can be flattened.

As described above, in the present embodiment, by pressing the top of the molten solder by using the heavy base material 78 of the solder bump forming member 74, for example, a height of 30 to 6
A 0 μm, 100 μm diameter solder bump 79 having a flat top can be formed.

Further, the flatness of the top and the small warpage of the base material 78 reduce the corporality to 10 μm.
It can be reduced below. Therefore, the solder bumps 79 can enhance the bonding with an integrated circuit chip (not shown). In the present embodiment, the top of the solder bump 79 is flattened by the weight of the base material 78 itself, but the height and flatness of the solder bump 79 are further increased by placing or pressing a weight on the base material 78. The size of the part can be adjusted. (Embodiment 7) Next, Embodiment 7 will be described, but the description of the same parts as in Embodiment 6 will be omitted or simplified.

In the present embodiment, the top of the solder bump to be formed is pressed and flattened by the member for forming the solder bump, but the height of the solder bump is defined by setting the depth of the concave portion. It is. Hereinafter, a method of forming a solder bump using the member for forming a solder bump will be described.

First, the MCM substrate 81 shown in FIG.
As shown in FIG. 11B, a flux 83 is uniformly applied to cover the pad 82. Although there are damaged solder bumps on the pads 82, they are omitted. Next, as shown in FIG. 11C, the solder balls 86 and the pads 82 are aligned with the solder bump forming member 84 with the solder balls 86 facing down.

The solder bump forming member 84 used here.
The base material 87 is made of, for example, a glass plate weighing 2 g, and has a surface (at the bottom of the figure) of φ0.14 mm × depth 30 μ
m recesses 88 are formed. The recess 88 may be formed by a drill or a laser as in the fourth embodiment, or may be surrounded by a protrusion made of an etching resist provided on a base material as in the fifth embodiment. 88 may be formed.

Next, as shown in FIG. 11D, the solder bump forming member 84 is heated at 220 ° C. in a far-infrared solder reflow furnace in a state of being placed on the MCM substrate 81.
As a result, the flux 89 is liquefied again, so that the solder balls 86 no longer adhere to the base material 87, and the solder balls 86 are melted again, and the high wettability pads 82 (that is, damaged solder Move to the (bump) side.

When the solder is melted, the base material 8
7 descends by its own weight and abuts on the MCM substrate 81 at the convex end 91 around the concave portion 88. As a result, the molten solder is pressed to flatten the top of the solder bump 92 to be formed. The height of the flat top of the solder bump 92 is determined by the depth of the concave portion 88.

Next, as shown in FIG. 11E, after cooling, the base material 87 is peeled off from the solder bumps 92. Then M
The flux 83 on the CM substrate 81 is removed with a solvent. As described above, in the present embodiment, the base material 8 having the concave portions 88 is formed.
By pressing the top of the molten solder using the solder bump forming member 84 provided with 7, the solder bump 92 having a flat top can be formed.

Further, by determining the depth of the concave portion 88, the height (30 μm) of the solder bump 92 can be set. Further, in this case, even if the solder is in a molten state,
7 does not descend more than a certain amount due to the end portion 91 abutting on the MCM substrate 81, so it is not necessary to determine the weight of the base material 87 so precisely.
The height of the solder bump 92 can be set accurately.

In this embodiment, the height of the solder bump 92 is set according to the depth of the concave portion 88. However, for example, when a flat base material having no concave portion is used, a predetermined height of the solder bump 92 is provided on the MCM substrate side. If the projections (projections having the same height as the desired solder bumps) are formed, the height of the solder bumps can be set similarly.

The present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes without departing from the gist of the present invention. (1) For example, in the above embodiment, an MCM substrate on which a plurality of integrated circuit chips are mounted has been described as an example, but the present invention can be applied to a substrate on which one integrated circuit chip is mounted.

(2) In the above-described embodiment, the case where the solder bump is reproduced is described as an example. However, the present invention is not limited to this, and can be applied to the case where the solder bump is formed on the pad for the first time. However, in this case, since the damaged solder bump does not exist on the pad, the amount of the solder material on the solder bump forming member side is set so that the volume of the solder bump is normal. For example, when using a solder foil, a solder preform having the same volume as the volume of the solder bump is formed. When a solder paste of 50% solder and 50% flux is used, the volume of each solder bump is 2%.
Double solder paste is placed at each position.

(3) In the above embodiment, the case where the solder bump for mounting the integrated circuit chip is formed has been described as an example. However, the present invention relates to the case where the substrate on which the integrated circuit chip is mounted is mounted on another printed circuit board. The present invention can also be applied to formation and reproduction of solder bumps such as BGA used for bonding.

(4) As the material of the substrate, ceramics such as alumina, AlN, mullite, glass ceramic and the like can be used in addition to resin. (5) The material of the solder material may be selected so that the material of the base material can withstand the melting temperature of the solder. For example, when ceramic is used for the base material, a high melting point solder such as 90% Pb solder, Any soft solder such as Au-Sn or Au-Ge, or solder containing Ag or In can be used. Also, the type of flux contained in the solder may be any of the R type, RMA type, and RA type (from the one having a small reducing property).

(6) As a method of forming the concave portion of the base material, in addition to the above-described embodiment, a method of attaching a stainless steel plate having a through hole corresponding to the concave portion to a flat stainless steel plate, or a method corresponding to the concave portion may be employed. Then, a method of laminating a ceramic green sheet provided with a through hole and a flat green sheet, followed by firing may be employed.

[0115]

As described above in detail, according to the first aspect of the present invention, the base material used for the bump forming member is made of a material having low wettability with respect to the solder. After heating and melting to form, for example, solder bumps on the pads of the substrate, the base material can be easily separated from the solder bumps.

According to the second aspect of the present invention, solder bumps can be formed at predetermined positions on the substrate by disposing the solder material on the members for forming solder bumps at predetermined positions on the substrate and melting by heating. . According to the third aspect of the present invention, the solder material of the member for forming the solder bump is arranged at a predetermined position on the substrate, and the solder material is transferred to a predetermined position on the substrate by heating and melting to form a solder bump. After the formation of the solder bumps, the base material can be easily separated from the solder bumps.

According to the fourth aspect of the present invention, since the periphery of the solder material is as high as a wall, when the solder material is heated and melted,
Solder bumps can be formed at accurate positions without displacement of the solder material. In the invention according to claim 5, as in claim 4, the periphery of the solder material is raised like a wall by the solder dam, so that when the solder material is heated and melted, the solder material does not shift and accurate. A solder bump can be formed at the position.

According to the sixth aspect of the present invention, since the base material is in the form of a sheet, the operation of peeling the base material from the solder bumps after the formation of the solder bumps becomes easy. According to the seventh aspect of the present invention, when a solder bump is formed on a substrate using the solder bump forming member, for example, a solder bump for connecting an integrated circuit chip can be easily formed.

According to the inventions of claims 8 to 10, solder bumps can be easily formed using the solder bump forming member. According to the eleventh aspect of the present invention, when the surface of the base material is rough, the solder material is strongly fixed to the base material, and the solder material hardly falls off.

According to the twelfth aspect of the present invention, since it is only necessary to perform pressure bonding using a thin solder plate, steps such as application and melting when using a solder paste are unnecessary. According to the thirteenth aspect of the present invention, it is difficult for the solder material to fall off from the surface of the base material when the solder bump forming member is manufactured.

According to the fourteenth aspect of the present invention, only the necessary portions of the solder thin plate can be accurately left, so that the accuracy of forming the solder bumps is improved. According to the fifteenth aspect, the solder bump can be formed at a predetermined position on the substrate surface.
Further, for example, by performing printing with a solder paste while masking an unnecessary portion, a solder material can be attached only to a necessary portion, and workability is high.

According to the sixteenth aspect of the present invention, the position of the molten solder material and thus the position of the solder bumps do not shift. According to the seventeenth aspect, similarly to the sixteenth aspect, the position of the molten solder material and thus the position of the solder bump do not shift.

According to the eighteenth aspect of the present invention, the solder material on the solder bump forming member can be melted and transferred to, for example, pads on the substrate. Thereby, a board with solder bumps in which solder bumps are formed at predetermined positions on the board surface can be manufactured. According to the nineteenth aspect of the present invention, it is possible to manufacture a board with solder bumps in which solder bumps having flat tops are formed at predetermined positions on the board surface.

According to the twentieth aspect, the height of the solder bump can be set by the lower depth of the base material. According to the twenty-first aspect, since the position of the solder bump forming member is determined by the projection, the alignment can be performed easily and accurately, and the solder bump can be formed at an accurate position.

According to the twenty-second and twenty-third aspects of the present invention, by using the above-described member for forming a solder bump, for example, a solder bump can be easily formed at a limited place where an integrated circuit chip is to be mounted. . According to the twenty-fourth aspect, by using the solder material of the solder bump forming member for the damaged solder bump, the solder bump can be easily regenerated to a normal one.

According to the twenty-fifth aspect of the present invention, by using the above-described member for forming a solder bump, it is possible to easily and efficiently form a solder bump even in a small space and mount a good integrated circuit chip again. Can be.

[Brief description of the drawings]

1A and 1B show a first embodiment, in which FIG. 1A is an enlarged perspective view showing a solder bump forming member, and FIG. 1B is a plan view showing an MCM substrate.

FIG. 2 is an explanatory view illustrating a method for manufacturing a solder bump forming member of Example 1.

FIG. 3 is an explanatory diagram illustrating a method of manufacturing the MCM substrate with solder bumps according to the first embodiment.

FIG. 4 is a plan view illustrating an arrangement of protrusions on an MCM substrate according to a second embodiment.

FIG. 5 is an explanatory view illustrating a method for manufacturing the MCM substrate with solder bumps according to the second embodiment.

FIG. 6 is an explanatory view illustrating a method for manufacturing a solder bump forming member of Example 3.

FIG. 7 is an explanatory diagram illustrating a method for manufacturing the MCM substrate with solder bumps according to the third embodiment.

FIG. 8 is an explanatory view illustrating a method for manufacturing a solder bump forming member of Example 4.

FIG. 9 is an explanatory view showing a method for manufacturing a member for forming a solder bump of Example 5.

FIG. 10 is an explanatory diagram illustrating a method of manufacturing the MCM substrate with solder bumps according to the sixth embodiment.

FIG. 11 is an explanatory view showing a method for manufacturing the MCM substrate with solder bumps of Example 7.

[Explanation of symbols]

1, 23, 31, 54, 69, 84: solder bump forming member 3, 21, 32, 51, 61, 78, 87: base material 5, 22: solder preform 7, 24, 41, 71, 81 ... Multi-chip module (MCM substrate) 9a, 9b, 9c, 9d, 9 ... Integrated circuit chip (semiconductor element) 11, 28, 38, 79, 92 ... Solder bump 11a ... Damaged solder bump 14, 39, 43, 56, 67 , 73,77,83,8
9 Flux 19, 26, 42, 72, 82 Pad 27 Positioning projection 36, 36, 52, 64, 76, 86 Solder ball 37, 65 Eutectic solder paste 53, 66, 88 recess

Claims (25)

[Claims] 1. A base material made of a material having low wettability with respect to solder, and a solder material fixed to the surface of the base material after heating and melting so as to be separable from the base material. For forming solder bumps. 2. The solder bump forming member according to claim 1, wherein the solder material is fixed at a position corresponding to a predetermined position on the surface of the substrate where the solder bump is formed. 3. A solder bump forming member for forming solder bumps at predetermined positions on a substrate surface, the substrate comprising a material having low wettability to solder, and the substrate surface on the substrate surface. A solder bump forming member comprising: a solder material formed by transferring and transferring solder from the base material to the surface of the substrate by heating and melting at a position corresponding to the predetermined position. 4. The fixing position of the solder material, or the fixing position and its vicinity, on the surface of the base material, is lower than the surrounding surface.
4. The member for forming a solder bump according to any one of 3. 5. A solder dam made of a material having low wettability to solder is provided at least on the periphery of the fixing position of the solder material or around the fixing position and the vicinity thereof on the surface of the base material. The member for forming a solder bump according to claim 1. 6. The solder bump forming member according to claim 1, wherein the substrate is a sheet-shaped substrate. 7. The semiconductor device according to claim 7, wherein a planar dimension of a surface of the base material to which the solder material is fixed is the same as a planar dimension of a semiconductor element mounted on the substrate. 7. The solder bump forming member according to any one of 2 to 6. 8. The solder bump forming member according to claim 1, wherein a top portion of the solder material is flat. 9. The member for forming a solder bump according to claim 1, wherein the solder material is fixed to the base material by a flux. 10. The member for forming a solder bump according to claim 1, wherein said solder material is fixed to said base material by pressure bonding. 11. The solder bump forming member according to claim 10, wherein at least a portion of the base material surface to which the solder material is fixed is a rough surface. 12. A method of manufacturing a solder bump forming member for forming a solder bump at a predetermined position on a substrate surface, comprising:
A method for manufacturing a member for forming a solder bump, comprising: a step of crimping a solder thin plate; and a step of removing an unnecessary portion of the thin solder plate other than a portion corresponding to a predetermined position on the substrate surface. 13. The method according to claim 12, wherein the surface of the base material is a rough surface. 14. A step of removing an unnecessary portion of the solder thin plate, a step of applying an etching resist on the solder thin plate, and exposing and developing the etching resist to expose the unnecessary portion. 14. The solder bump according to claim 12, further comprising: removing an unnecessary portion of the thin solder plate by etching, and removing the remaining etching resist. 15. A method for manufacturing a forming member. 15. A method of manufacturing a solder bump forming member for forming a solder bump at a predetermined position on a surface of a substrate, the method comprising the steps of: A method for manufacturing a member for forming a solder bump, comprising: a step of applying a solder paste to a position corresponding to a predetermined position on a surface; and a step of cooling the solder paste after melting the solder paste by heating. 16. The base material, wherein a fixing position of the solder material, or a fixing position and its vicinity in the surface of the base material are lower than the surrounding surface. 3. The method for manufacturing a member for forming a solder bump according to claim 1. 17. A base material having a solder dam made of a material having low wettability with respect to the solder at least around a position where the solder material is fixed or around the position where the solder material is fixed, on the surface of the base material. 16. A method according to claim 15, wherein:
3. The method for manufacturing a member for forming a solder bump according to claim 1. 18. A method for manufacturing a board with solder bumps, wherein a solder bump is formed at a predetermined position on the surface of a board using the member for forming solder bumps according to claim 1. Positioning the solder bump forming member on the substrate surface such that the solder bump forming member contacts or approaches a predetermined position on the substrate; and heating the solder material to melt the solder material, thereby transferring the solder to the predetermined position on the substrate. A method of manufacturing a board with solder bumps, comprising: a step of cooling after transferring to a substrate; and a step of removing the base material from the surface of the board. 19. The heating and cooling step, wherein the solder melted in the base material is cooled and solidified while being pressed against the surface of the substrate to flatten the top of the solder bump. 3. The method for manufacturing a substrate with solder bumps according to item 1. 20. The method according to claim 19, wherein the base material is a surface of the base material.
The fixing position of the solder material, or the fixing position and the vicinity thereof is a base material that is lower than the surrounding surface, and at the time of pressing, the surrounding surface of the base material is brought into contact with the surface of the substrate. The height from the substrate surface to the top of the solder bump is
20. The method for manufacturing a substrate with solder bumps according to claim 19, wherein the substrate is regulated by a depth from a peripheral surface of the base material to a fixing position of the solder material. 21. In the step of arranging the solder bump forming member on the surface of the substrate, positioning is performed by regulating the position of the solder bump forming member by a protrusion provided on the substrate surface. The method for manufacturing a substrate with solder bumps according to any one of claims 18 to 20, wherein: 22. A substrate wherein a solder bump is already formed at a predetermined position on the surface of the substrate and at least a part of the solder is removed from the formed solder bump. The method for manufacturing a substrate with solder bumps according to claim 18. 23. A substrate wherein at least one integrated circuit chip is connected by a solder bump to a portion other than a portion where a solder bump is formed by the solder bump forming member, as the substrate. Item 23. The method for manufacturing a substrate with solder bumps according to any one of Items 18 to 22. 24. A method of connecting to another substrate by means of a solder bump, and thereafter regenerating the damaged solder bump of the substrate from which the other substrate has been removed, wherein the solder material contacts the damaged solder bump of the substrate. Or a step of positioning the member for forming a solder bump according to any one of claims 1 to 11 so as to be close to the surface of the substrate, and melting the solder material by heating to form a solder on the substrate. A method of regenerating damaged solder bumps on a substrate with solder bumps, comprising: a step of cooling after transferring to a predetermined position; and a step of removing the substrate from the surface of the substrate. 25. The method according to claim 24, wherein the substrate is a substrate to which at least one integrated circuit chip is connected by solder bumps.