JPH10171100A - Production of mask protective device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To cover and solidify the chips of a cut end face and to prevent the generation of dust by the dislodgment of the chips, by cutting a small with cutting means, then applying a coating material at the cut end face of preventing the dislodgment of the chips adhering to the cut end faces, thereby covering and solidifying the cue end face. SOLUTION: This process for producing the mask protective device includes once taking the org. thin film 3 formed on a substrate to a temporally frame, then adhering this film to the one side end face of a pellicle film 1 and cutting the thin film 3 protruding from the edge of the outer side of this pellicle frame 1 with cutting means, such as a knife, laser beam, light and solvent. The coating martial, such as, for example adhesive 7 or polymer soln. is applied on the cut end face in order to prevent the dislodgment of the chips adhered to the cut end face. For example, a thermosetting type adhesive, UV setting type adhesive, etc., are used as the adhesive 7 used for the coating material. For example, cellulose, vinyl chloride-ester copolymer, etc., which are the same materials as the film material are used as the polymer soln.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mask and a reticle (hereinafter, referred to as a "mask") used in a photolithography process in an integrated circuit manufacturing process. The present invention relates to a method for manufacturing a mask protection device including a pellicle frame having a size surrounding a pattern and a transparent thin film stretched on one end surface of the frame.

[0002]

2. Description of the Related Art A mask protection device is usually formed by a spin coating method,
As shown in FIG. 1, an organic thin film such as nitrocellulose or ethylcellulose formed on a glass substrate by a pulling method of immersing in a solution and pulling up the pellicle frame 1
Once the temporary frame 2 has a larger size, the temporary frame 2 is pressed down by lowering the temporary frame 2 on one end surface of the pellicle frame 1 on which the adhesive is applied. After bonding, the thin film 3 protruding from the edge of the pellicle frame 1 is removed. Obtained by cutting. The method of cutting the thin film 3 includes a method of cutting with a knife, a method of cutting with a laser beam, a method of cutting with heat, and the like. In many cases, a method of cutting with a solvent, that is, as shown in FIG. A method of extracting the organic solvent that dissolves the organic thin film 3 from the needle 5 while moving the tip of 5 in contact with or approaching the outer edge of the frame and moving along the outer edge of the frame has been used ( JP-A-63-191819).

[0003] In either case, it is inevitable that chips are attached to the cut end face, and when they are mounted on a mask, they may fall off and cause dust. Therefore, conventionally, the cut end face has been wiped off with a solvent and finished, or chips have been removed using a double-sided adhesive tape. However, it has been difficult to completely remove the chips.

[0004]

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a mask protection device capable of preventing dust from being generated by chips.

[0005]

In the present invention, a cut end face after cutting is coated with a coating agent such as an adhesive or a polymer solution and solidified to prevent chips from falling off. That is, according to the present invention, an organic thin film formed on a substrate is once taken into a temporary frame, then adhered to one side end surface of the pellicle frame, and then the thin film protruding from the outer edge of the frame is knife, laser light, heat, solvent In a method of manufacturing a mask protection device that cuts by a cutting means such as, after cutting by the cutting means, a coating agent such as an adhesive or a polymer solution is applied to the cut end face to prevent the chips attached to the cut end face from falling off. It is characterized by covering.

As the adhesive used in the coating agent of the present invention, for example, a thermosetting adhesive, a UV-curing adhesive or the like is used. As the polymer solution, for example, the same cellulose or vinyl chloride copolymer as the film material is used. Coalescence or the like is used.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An adhesive is applied to a cut end face of a thin film 3 of a mask protection device obtained by the method shown in FIG.
The cut end face was covered and hardened. 2 shown in FIG. 2 indicates a solidified adhesive.

[0008]

According to the present invention, the chips on the cut end surface are covered with the coating agent and solidified, and dust generation due to the chips falling off can be prevented.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view showing a state in which a thin film taken in a temporary frame is stretched over a pellicle frame and then cut.

FIG. 2 is a cross-sectional view of a main part of a mask protection device in which an adhesive is applied to a cut end surface.

[Explanation of symbols]

 1. Pellicle frame 2. Temporary frame 3. Thin film 5. Needle 7. Adhesive

Claims (1)

[Claims] An organic thin film formed on a substrate is once taken into a temporary frame, then adhered to one end surface of a pellicle frame, and a thin film protruding from an outer edge of the frame is cut with a knife, a laser beam,
In a method of manufacturing a mask protection device that cuts by a cutting means such as heat or a solvent, a coating agent is applied to the cut end face and solidified to prevent chips attached to the cut end face from falling off after cutting by the cutting means. Manufacturing method of a mask protection device.