JPH10166068A - Production of lead frame with heat sink - Google Patents
Production of lead frame with heat sinkInfo
- Publication number
- JPH10166068A JPH10166068A JP8332415A JP33241596A JPH10166068A JP H10166068 A JPH10166068 A JP H10166068A JP 8332415 A JP8332415 A JP 8332415A JP 33241596 A JP33241596 A JP 33241596A JP H10166068 A JPH10166068 A JP H10166068A
- Authority
- JP
- Japan
- Prior art keywords
- plate portion
- heat sink
- lead frame
- thick plate
- thin plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ヒートシンク付リ
ードフレーム材の製造方法に関し、特に、半導体から発
せられる熱エネルギーを吸収するヒートシンク部を備
え、ヒートシンク部の４方向にリード部を有し、成型時
に薄板部での変形のない、高品質、かつ、生産性に優れ
たヒートシンク付リードフレーム材の製造方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a lead frame material with a heat sink, and more particularly, to a molding method having a heat sink portion for absorbing heat energy generated from a semiconductor, having lead portions in four directions of the heat sink portion, and molding. The present invention relates to a method for manufacturing a lead frame material with a heat sink, which does not sometimes deform in a thin plate portion, and is high in quality and excellent in productivity.
【０００２】[0002]
【従来の技術】近年、半導体の高出力化，高集積化に伴
い、熱放散性に優れたヒートシンクをパッケージ中に埋
め込んだ半導体装置が実用化されている。その種の半導
体装置に使用されるリードフレーム材は、ヒートシンク
部となる厚板部とリード部となる薄板部を一体化した異
形断面条から製造される。2. Description of the Related Art In recent years, a semiconductor device in which a heat sink having an excellent heat dissipation property is embedded in a package has been put to practical use with an increase in output and integration of a semiconductor. A lead frame material used for such a semiconductor device is manufactured from a modified cross-section in which a thick plate portion serving as a heat sink portion and a thin plate portion serving as a lead portion are integrated.
【０００３】この異形断面条では、薄板部は板幅方向の
片側または両側に設けられ、厚板部は他域または中央部
に設けられる。この異形断面条の製造方法としては、成
形方向に側面逃げ角を有する型溝を設けたＶ型ダイスお
よび平ロールによる成型法や、最終成型時の異形断面条
の各部の厚み比の断面を有する素材条を押出成形した後
に孔型ロールによって仕上げ圧延する方法や、圧延方向
に少しずつ形状を変えた複数の溝付ロールを順次配置
し、これらの溝付ロールにより異形断面条を圧延する方
法，等がある。In this irregularly shaped cross section, the thin plate portion is provided on one side or both sides in the width direction of the plate, and the thick plate portion is provided on the other area or the central portion. As a method of manufacturing the irregularly shaped section, there is a molding method using a V-die and a flat roll provided with a mold groove having a side clearance angle in the molding direction, or a section having a thickness ratio of each part of the irregularly shaped section at the time of final molding. A method in which a material strip is extruded and then subjected to finish rolling with a grooved roll, or a method in which a plurality of grooved rolls whose shapes are slightly changed in the rolling direction are sequentially arranged, and a deformed cross-section strip is rolled by these grooved rolls. Etc.
【０００４】しかし、板幅の片側または両側に薄板部が
ある異形断面条の場合、厚板部をヒートシンク部として
用い、薄板部をリード部として用いるものであるため、
リード部を１方向あるいは２方向にしか出すことができ
ず、多ピン数を必要とする近年の半導体装置の高集積化
に充分に対応することができない。However, in the case of an irregularly shaped strip having a thin plate portion on one or both sides of the plate width, the thick plate portion is used as a heat sink portion and the thin plate portion is used as a lead portion.
The lead portion can be provided only in one direction or two directions, and it cannot sufficiently cope with recent high integration of a semiconductor device requiring a large number of pins.
【０００５】そこで、ヒートシンク部を中心に４方向に
リード部を配した異形断面条によってリードフレーム材
を製造する方法が考えられている。その方法としては、
両側に薄板部がある異形断面条の厚板部を規定のピッチ
で切削し断続的に厚板部を残して切削部をリード部とし
て形成する切削法、規定のピッチで矩形の溝を設けたロ
ールと平ロールを用いた圧延により圧延方向に規定のピ
ッチで他の部分よりも厚いヒートシンク部を断続的に成
型する圧延法、あるいは、プレスにより厚板部を１ピー
スずつ加工するプレス法、等がある。[0005] Therefore, a method of manufacturing a lead frame material by a modified cross-section having leads arranged in four directions around a heat sink has been considered. As a method,
A cutting method in which a thick plate portion with an irregular cross section with thin plate portions on both sides is cut at a specified pitch and the cut portion is formed as a lead portion while leaving the thick plate portion intermittently, rectangular grooves are provided at a specified pitch A rolling method of intermittently forming a heat sink portion thicker than other portions at a specified pitch in the rolling direction by rolling using a roll and a flat roll, or a pressing method of processing a thick plate portion one by one by pressing, etc. There is.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、ヒート
シンク部を中心に４方向にリード部を配した従来のリー
ドフレーム材の製造方法によると、 （１）切削法では、素材を切削するため歩留りが悪く、
また、リードフレームの表面に切削傷が残るため品質上
リードフレーム材に適さないという問題がある。 （２）圧延法では、溝の部分から厚板部の材料が抜ける
ときに、ヒートシンク部のエッジを削ってしまうため、
所定の形状を得ることが難しく、また、リード部とヒー
トシンク部の板厚比が大きいと、加工度差が大きくなる
ため、薄板部に波打ちが発生したり、厚板部と薄板部の
境界にくびれ等の欠陥が発生し正常な圧延ができないと
いう問題がある。 （３）プレス法では、材料が素材の長手方向にも延びる
ため素材の板厚に変動があると伸び量が変動してしま
い、最終的にＩＣなどのリード部を打ち抜く際に長手方
向のピッチがずれてしまう。このため、連続的に製造す
ることができず、生産性が悪くなるという問題がある。However, according to the conventional method for manufacturing a lead frame material in which leads are arranged in four directions around a heat sink, (1) In the cutting method, the yield is poor because the material is cut. ,
In addition, there is a problem in that cutting flaws remain on the surface of the lead frame, so that it is not suitable for a lead frame material in terms of quality. (2) In the rolling method, when the material of the thick plate portion comes off from the groove portion, the edge of the heat sink portion is shaved.
If it is difficult to obtain a predetermined shape, and if the thickness ratio of the lead portion and the heat sink portion is large, the difference in the degree of processing becomes large, so that the thin plate portion may be wavy or may be formed at the boundary between the thick plate portion and the thin plate portion. There is a problem that defects such as constriction occur and normal rolling cannot be performed. (3) In the pressing method, since the material also extends in the longitudinal direction of the material, if the thickness of the material fluctuates, the amount of elongation will fluctuate. Is shifted. For this reason, there is a problem that it cannot be manufactured continuously and productivity is deteriorated.
【０００７】[0007]
【発明の目的】従って、本発明の目的は、ヒートシンク
部の４方向にリード部を有し、成型時に薄板部での変形
のない、高品質、かつ、生産性に優れたヒートシンク付
リードフレーム材の製造方法を提供することにある。SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a lead frame material with a heat sink which has leads in four directions of a heat sink and which is not deformed by a thin plate during molding, and which is excellent in productivity and excellent in productivity. It is to provide a manufacturing method of.
【０００８】[0008]
【課題を解決するための手段】本発明は、上記目的を実
現するために、リードフレームの基材となる所定厚の金
属条材を押圧加工して前記金属条材の片面にヒートシン
ク部となる厚板部を所定のピッチで島状に成形し、前記
厚板部の周囲にリード部となる薄板部を成形するヒート
シンク付リードフレーム材の製造方法において、凹溝を
有する複数の第１の金型を前記所定のピッチに応じた所
定の間隔をおいて配置し、前記複数の第１の金型との間
に前記薄板部の厚さに応じた所定の空間を有するように
平滑部を有した第２の金型を配置し、前記所定の空間に
前記金属条材を供給して前記複数の第１の金型および前
記第２の金型の押圧加工により前記厚板部を前記凹溝と
前記平滑部によって少なくとも２回加工および拘束して
前記厚板部および前記薄板部を成形することを特徴とす
るヒートシンク付リードフレーム材の製造方法を提供す
るものである。According to the present invention, in order to achieve the above-mentioned object, a metal strip having a predetermined thickness serving as a base material of a lead frame is pressed to form a heat sink portion on one surface of the metal strip. A method of manufacturing a lead frame material with a heat sink, wherein a thick plate portion is formed into an island shape at a predetermined pitch, and a thin plate portion serving as a lead portion is formed around the thick plate portion. A mold is arranged at a predetermined interval according to the predetermined pitch, and a smooth portion is provided between the plurality of first dies so as to have a predetermined space according to the thickness of the thin plate portion. The second metal mold is disposed, and the metal strip is supplied to the predetermined space, and the thick plate portion is formed by pressing the plurality of first metal molds and the second metal mold with the concave grooves. And processing and restraining at least twice by the smooth portion and the thick plate portion and There is provided a method for manufacturing a heat sink with lead frame member, characterized by forming the serial thin plate portion.
【０００９】以上の構成において、前記複数の第１の金
型は、金型間に材料の長手方向の伸びを吸収する間隙部
を有するように構成するのが望ましく、また、前記厚板
部は、前記金属条材の前記所定厚より大なる厚みを有す
るように構成するのが望ましい。In the above structure, it is preferable that the plurality of first dies have a gap between the dies to absorb the elongation of the material in the longitudinal direction. Preferably, the metal strip has a thickness greater than the predetermined thickness.
【００１０】[0010]
【発明の実施の形態】以下、本発明の実施の形態を添付
図面に基づき詳細に説明する。Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
【００１１】図１より図３は、本発明の第１の実施の形
態を示す。ここで、図１および図２は、本発明のヒート
シンク付リードフレーム材の製造方法を示す図であり、
図３（ａ）は、本発明の製造方法により製造されるリー
ドフレーム材の外観を示す斜視図であり、（ｂ）はリー
ドフレーム材の一部断面図である。FIGS. 1 to 3 show a first embodiment of the present invention. Here, FIGS. 1 and 2 are views showing a method of manufacturing a lead frame material with a heat sink according to the present invention.
FIG. 3A is a perspective view showing an appearance of a lead frame material manufactured by the manufacturing method of the present invention, and FIG. 3B is a partial cross-sectional view of the lead frame material.
【００１２】図１に示すように、条材３を上金型１と下
金型１０の間に所定のピッチで送り込み、図２に示すよ
うに、上金型１と下金型１０によって条材３をプレス加
工するう。これを繰り返し行うことにより、図３に示す
ように、厚板部３ａおよび薄板部３ｂを有するヒートシ
ンク付リードフレーム材５が製造される。As shown in FIG. 1, the strip material 3 is fed between the upper mold 1 and the lower mold 10 at a predetermined pitch, and as shown in FIG. Material 3 is pressed. By repeating this, as shown in FIG. 3, a lead frame member 5 with a heat sink having a thick plate portion 3a and a thin plate portion 3b is manufactured.
【００１３】ここで、上金型１と下金型１０は一対にな
って金型を構成し、この一対の金型は、適切な方法によ
ってプレス機（図示せず）に固定されて上下に開閉運動
を繰り返す。上金型１は複数個の金型で構成されてお
り、それぞれに図３に示す厚板部３ａの形状、即ち、最
終目標厚さの厚板部３ａの形状に合わせた凹溝２がピッ
チｐ1 で設けられている。なお、この凹溝２は、上金型
１あるいは下金型１０のどちらの金型に設けても良い。Here, the upper die 1 and the lower die 10 are paired to form a die, and the pair of dies is fixed to a press (not shown) by an appropriate method and Repeat the opening and closing movement. The upper die 1 is composed of a plurality of dies, each having a groove 2 corresponding to the shape of the thick plate portion 3a shown in FIG. 3, that is, the shape of the thick plate portion 3a having the final target thickness. It is provided in the p 1. The concave groove 2 may be provided in either the upper mold 1 or the lower mold 10.
【００１４】一方、上金型１の各金型間には、間隙ｇを
有する間隙部４が設けられている。この間隙部４は、条
材３の長手方向への逃げを吸収するための空間である。
即ち、加工時には条材３が塑性変形によって幅方向だけ
でなく長手方向にも流れるので、厚板部３ａのピッチｐ
2 が一定ではなくなってしまう。特に、厚板部３ａと薄
板部３ｂの板厚比が大きくなると、長手方向の伸びがよ
り大きくなるため、長手方向の伸びを吸収する必要があ
る。このために、この間隙部４によって、条材３を長手
方向に逃がしてその伸びを吸収するようにしている。On the other hand, a gap 4 having a gap g is provided between the dies of the upper mold 1. The gap 4 is a space for absorbing the escape of the strip 3 in the longitudinal direction.
That is, during processing, the strip 3 flows not only in the width direction but also in the longitudinal direction due to plastic deformation.
2 is no longer constant. In particular, when the thickness ratio between the thick plate portion 3a and the thin plate portion 3b is increased, the elongation in the longitudinal direction is further increased. Therefore, it is necessary to absorb the elongation in the longitudinal direction. For this purpose, the gaps 4 allow the strip 3 to escape in the longitudinal direction and absorb its elongation.
【００１５】以上の構成に基づいて、本発明の動作を以
下説明する。まず、図１の状態で、上金型１と下金型１
０の間にピッチｐ1 （＝ｐ2 ）の整数倍のピッチで条材
３を送り込み、図２に示すように、上金型１と下金型１
０によって条材３を静止させた状態でプレスする。プレ
スによって、条材３を規定の押し込み量まで加工した
後、再び上下の金型１，１０を開き図１の状態にする。
次に、前述したピッチで条材３を長手方向に送る。条材
３の送りは、前加工と次加工の間で条材３の拘束がない
間に行う。The operation of the present invention based on the above configuration will be described below. First, in the state of FIG.
2 , the strip 3 is fed at a pitch which is an integral multiple of the pitch p 1 (= p 2 ), and as shown in FIG.
Pressing is performed in a state where the strip material 3 is stationary by 0. After the strip 3 has been processed to a prescribed amount of indentation by pressing, the upper and lower dies 1, 10 are opened again to bring them into the state shown in FIG.
Next, the strip 3 is fed in the longitudinal direction at the pitch described above. The feed of the strip 3 is performed between the pre-processing and the next processing while the strip 3 is not restrained.
【００１６】また、条材３は、上金型１と下金型１０の
一対の金型により、少なくとも２回は拘束されるように
送る必要がある。複数回の拘束により、上金型に設けた
凹溝２で厚板部３ａを拘束し加工時の長手方向の伸びを
制御するためである。この実施の形態では、ピッチ２ｐ
1 で送ると、２回拘束され、ピッチｐ1 で送ると、３回
拘束される。The strip 3 must be fed at least twice by the pair of upper and lower dies 1 and 10 so as to be restrained. This is because the thick plate portion 3a is constrained by the concave groove 2 provided in the upper mold by a plurality of constrains, and the elongation in the longitudinal direction during processing is controlled. In this embodiment, the pitch 2p
Sending 1, it constrained twice, when sent at a pitch p 1, is constrained three times.
【００１７】以上のような方法により、図３（ａ）に示
すように、厚板部３ａのピッチｐ2の精度が良いヒート
シンク付リードフレーム材５を得ることができる。[0017] By the method described above, as shown in FIG. 3 (a), it is possible to obtain a heat sink with lead frame member 5 accuracy good pitch p 2 of the thick portion 3a.
【００１８】なお、全ての金型を同時に開閉する必要は
ない。例えば、上金型１のそれぞれの開閉のタイミング
をずらすようにしてもよい。しかし、材料がまだ加工さ
れていない厚い部分だけを先に加工してしまうと、その
部分で伸びが生じ、厚板部のピッチが合わなくなるので
考慮して行う必要がある。It is not necessary to open and close all the molds at the same time. For example, the timing of opening and closing the upper mold 1 may be shifted. However, if only a thick portion where the material has not yet been processed is processed first, elongation occurs at that portion, and the pitch of the thick plate portion does not match.
【００１９】次に、具体的な数値を上げて説明する。ま
ず、厚さｔ1 が０．４ｍｍの条材３を準備した。そし
て、図３（ａ）における最終目標の厚板部３ａの大きさ
を７ｍｍ×７ｍｍに、厚さｔ3 を０．５ｍｍとし、薄板
部３ｂの厚さｔ2 を０．２５ｍｍとした。次に、上金型
１を３つ用意し、上金型１の凹溝２の形状を図３（ａ）
の厚板部３ａの大きさと同じ大きさにした。Next, specific numerical values will be described. First, a strip 3 having a thickness t 1 of 0.4 mm was prepared. Then, the size of the thick plate portion 3a as the final target in FIG. 3A was 7 mm × 7 mm, the thickness t 3 was 0.5 mm, and the thickness t 2 of the thin plate portion 3b was 0.25 mm. Next, three upper molds 1 are prepared, and the shape of the concave groove 2 of the upper mold 1 is changed as shown in FIG.
Of the thick plate portion 3a.
【００２０】この際、凹溝２の内壁は、図３（ｂ）に示
すように、厚板部３ａのエッジ角度θが５度程度になる
ように傾いて形成されている。この傾斜角度は、厚板部
３ａの用途に応じて変更できるが、加工が終わったとき
に厚板部３ａが上下の金型１，１０の凹溝２から抜けや
すいように、適度な角度を設けるほうが望ましい。At this time, as shown in FIG. 3B, the inner wall of the concave groove 2 is formed so as to be inclined such that the edge angle θ of the thick plate portion 3a is about 5 degrees. This angle of inclination can be changed according to the use of the thick plate portion 3a, but an appropriate angle is set so that the thick plate portion 3a can easily fall out of the concave grooves 2 of the upper and lower molds 1 and 10 when processing is completed. It is desirable to provide.
【００２１】一方、厚板部３ａのピッチｐ2 を２５ｍｍ
になるように配置した。これにあわせて凹溝２のピッチ
ｐ1 も２５ｍｍとした。ここで、上金型１の各金型間の
間隔、即ち、間隙部４の間隔ｇが２ｍｍになるように上
金型１を配置した。従って、１ピース単位の幅は２３ｍ
ｍとなり、ピースとピースの間には２ｍｍの間隙部４が
できる。そこで、上金型１および下金型１０によって条
材３のプレス加工を行った。プレス加工によって、条材
３を規定の押し込み量まで押し込むと、条材３は凹溝２
の形状にあわせて厚さ方向に延びるとともに幅方向およ
び長手方向に延び、長手方向に延びた条材３は間隙部４
に逃げ部６を形成した。このようにして、条材３には、
大きさが７ｍｍ×７ｍｍで、厚さｔ3 が０．５ｍｍの厚
板部３ａと、厚さｔ2 が０．２５ｍｍの薄板部３ｂとが
成形された。On the other hand, the pitch p 2 of the thick plate portion 3a is 25 mm
It was arranged to become. Pitch p 1 of the groove 2 in accordance with the which was also the 25mm. Here, the upper mold 1 was arranged so that the interval between the respective dies of the upper mold 1, that is, the interval g of the gap 4 was 2 mm. Therefore, the width of one piece is 23m
m, and a gap 4 of 2 mm is formed between the pieces. Therefore, the strip 3 was pressed by the upper die 1 and the lower die 10. When the strip 3 is pushed to a specified pushing amount by press working, the strip 3 is
The strip 3 extending in the thickness direction and extending in the width direction and the longitudinal direction in accordance with the shape of
An escape portion 6 was formed in the first portion. In this way, the strip 3 has
A thick plate portion 3a having a size of 7 mm × 7 mm and a thickness t 3 of 0.5 mm and a thin plate portion 3b having a thickness t 2 of 0.25 mm were formed.
【００２２】そして、上金型１および下金型１０を開
き、条材３をピッチｐ1 あるいはピッチ２ｐ1 で長手方
向に送る。ここで、条材３の送りピッチを２５ｍｍとす
ると、上金型１の各金型により条材３が１回ずつ加工さ
れ、３回拘束されることになる。このように、複数の金
型を用いて厚板部３ａを成形しこの厚板部３ａのピッチ
ｐ2 を拘束しながら加工することにより、厚板部３ａの
ピッチｐ2 が正確なリードフレーム材を連続的に製造す
ることができる。[0022] Then, open the upper die 1 and lower die 10, and sends the elongated member 3 in the longitudinal direction at a pitch p 1 or pitch 2p 1. Here, assuming that the feed pitch of the strip 3 is 25 mm, the strip 3 is processed once by each die of the upper die 1 and is constrained three times. Thus, by forming the thick portion 3a with a plurality of molds by processing while restraining the pitch p 2 of the thick plate portion 3a, the pitch p 2 precise lead frame material plank section 3a Can be manufactured continuously.
【００２３】なお、一対の金型１，１０が閉じたときの
ギャップは、複数の金型のうち少なくとも１つ以上は薄
板部３ｂの厚さにする。しかし、厚板部３ａの板厚以上
では厚板部３ａを拘束できないため、厚板部３ａの板厚
以下にする必要がある。When the pair of dies 1 and 10 are closed, at least one of the plurality of dies has a thickness of the thin plate portion 3b. However, if the thickness of the thick portion 3a is greater than the thickness of the thick portion 3a, the thickness of the thick portion 3a cannot be restrained.
【００２４】図４は、本発明の第２の実施の形態を示
し、本発明のヒートシンク付リードフレーム材の製造方
法を複数列の長尺材に適用した例を示す。FIG. 4 shows a second embodiment of the present invention, and shows an example in which the method of manufacturing a lead frame material with a heat sink of the present invention is applied to a plurality of rows of long members.
【００２５】図１より図３においては、ヒートシンク付
リードフレーム材を一列に連続的に製造する例を示した
が、次工程の作業をより効率的にするには、複数列の長
尺材を用いた方が良い場合がある。その場合は、材料の
長手方向の伸びの他、幅方向の伸びも考慮しなければな
らない。特に、薄板部３ｂと厚板部３ａの比が大きと、
材料が逃げきれず、加工ができなかったり、薄板部３ｂ
が波打ったりすることもある。そこで、行および列方向
に配置される金型１のそれぞれの間に逃げ部６に相当す
る間隙を形成し、条材３を幅方向にも逃がす。これによ
って、幅方向に複数の厚板部３ａを形成できる。ここ
で、条材３の逃げ部６は、幅方向および長手方向のエッ
ジｅ1 〜ｅ3 に形成しなくても良い。条材３の送りなど
を考えると、幅の両側の部分ｅ1 ，ｅ2 には条材３の逃
げを設けない方が良い場合があるからである。FIGS. 1 to 3 show an example in which lead frame members with heat sinks are continuously manufactured in a line. However, in order to make the operation in the next step more efficient, a plurality of lines of long members must be used. It may be better to use. In that case, it is necessary to consider not only the elongation of the material in the longitudinal direction but also the elongation in the width direction. In particular, when the ratio between the thin plate portion 3b and the thick plate portion 3a is large,
The material cannot escape and cannot be processed, or the thin plate portion 3b
May be wavy. Therefore, a gap corresponding to the escape portion 6 is formed between each of the dies 1 arranged in the row and column directions, and the strip 3 is also escaped in the width direction. Thereby, a plurality of thick plate portions 3a can be formed in the width direction. Here, the relief 6 of the strip 3 does not have to be formed at the edges e 1 to e 3 in the width direction and the longitudinal direction. This is because, in consideration of the feeding of the strip 3, it may be better not to provide the relief of the strip 3 at the portions e 1 and e 2 on both sides of the width.
【００２６】なお、薄板部３ｂが薄い場合には、長手方
向の材料の伸びは大きくなるため、逃げ部６が座屈する
形で伸びが吸収される。このため、巻取時等に引っ張ら
れて座屈が戻り厚板部３ａのピッチがずれてしまう恐れ
がある。そこで、ピースにあらかじめＩＣとして樹脂で
封止する際に用いる基準孔（図示せず）を設けておき、
その基準孔を用いて打ち抜き等を行えば、伸びなどの影
響がなくなる。In the case where the thin plate portion 3b is thin, the elongation of the material in the longitudinal direction becomes large, so that the escape portion 6 is absorbed in the form of buckling. For this reason, there is a possibility that the buckling is returned due to being pulled at the time of winding or the like and the pitch of the thick plate portion 3a is shifted. Therefore, a reference hole (not shown) used for sealing the resin with resin as an IC is provided in advance,
If punching or the like is performed using the reference hole, the influence of elongation or the like is eliminated.
【００２７】なお、以上の実施の形態では具体的な数値
を上げて説明したが、この数値に限定されるものではな
い。Although the above embodiments have been described with specific numerical values, the present invention is not limited to these numerical values.
【００２８】[0028]
【発明の効果】以上述べたように、本発明のヒートシン
ク付リードフレーム材の製造方法によると、凹溝を有す
る複数の第１の金型を所定のピッチに応じた所定の間隔
をおいて配置し、この複数の第１の金型との間に薄板部
の厚さに応じた所定の空間を有するように平滑部を有し
た第２の金型を配置し、この所定の空間に金属条材を供
給して複数の第１の金型および第２の金型の押圧加工に
より凹溝と平滑部によって厚板部を少なくとも２回加工
および拘束して厚板部および薄板部を成形するようにし
たので、成型時に薄板部での変形のない、高品質、か
つ、生産性に優れたヒートシンク付リードフレーム材を
提供することができる。As described above, according to the method of manufacturing a lead frame material with a heat sink of the present invention, a plurality of first dies having concave grooves are arranged at predetermined intervals in accordance with a predetermined pitch. Then, a second mold having a smooth portion is arranged so as to have a predetermined space corresponding to the thickness of the thin plate portion between the plurality of first dies, and a metal strip is provided in the predetermined space. By supplying a material and pressing and processing a plurality of first molds and a second mold, the thick plate portion is processed and restrained at least twice by the concave groove and the smooth portion to form the thick plate portion and the thin plate portion. Therefore, it is possible to provide a high-quality, high-productivity lead frame material with a heat sink that does not deform at the thin plate portion during molding.
【図１】本発明のヒートシンク付リードフレーム材の製
造方法を示す図であり、上下の金型が開いて材料を長手
方向に送出する状態を示す。FIG. 1 is a view showing a method for manufacturing a lead frame material with a heat sink according to the present invention, showing a state in which upper and lower molds are opened and a material is sent out in a longitudinal direction.
【図２】本発明のヒートシンク付リードフレーム材の製
造方法を示す図であり、上下の金型をプレスして材料を
加工する状態を示す。FIG. 2 is a view showing a method of manufacturing a lead frame material with a heat sink according to the present invention, showing a state in which the upper and lower dies are pressed to process the material.
【図３】本発明の製造方法により製造されるヒートシン
ク付リードフレーム材の外観を示す斜視図である。FIG. 3 is a perspective view showing the appearance of a lead frame material with a heat sink manufactured by the manufacturing method of the present invention.
【図４】本発明のヒートシンク付リードフレーム材の製
造方法を複数列の長尺材に適用した例を示す図である。FIG. 4 is a diagram showing an example in which the method for manufacturing a lead frame material with a heat sink according to the present invention is applied to a plurality of rows of long members.
１ 上金型 ２ 溝 ３ 材料 ３ａ 厚板部 ３ｂ 薄板部 ４ 間隙 ５ ヒートシンク付リードフレーム材 ６ 材料逃げ部 １０ 下金型 DESCRIPTION OF SYMBOLS 1 Upper die 2 Groove 3 Material 3a Thick plate 3b Thin plate 4 Gap 5 Lead frame material with heat sink 6 Material escape 10 Lower die
───────────────────────────────────────────────────── フロントページの続き (72)発明者 大谷 忠男 茨城県土浦市木田余町3550番地 日立電線 株式会社システムマテリアル研究所内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tadao Otani 3550 Kida Yomachi, Tsuchiura-city, Ibaraki Pref.
Claims (3)
条材を押圧加工して前記金属条材の片面にヒートシンク
部となる厚板部を所定のピッチで島状に成形し、前記厚
板部の周囲にリード部となる薄板部を成形するヒートシ
ンク付リードフレーム材の製造方法において、 凹溝を有する複数の第１の金型を前記所定のピッチに応
じた所定の間隔をおいて配置し、 前記複数の第１の金型との間に前記薄板部の厚さに応じ
た所定の空間を有するように平滑部を有した第２の金型
を配置し、 前記所定の空間に前記金属条材を供給して前記複数の第
１の金型および前記第２の金型の押圧加工により前記厚
板部を前記凹溝と前記平滑部によって少なくとも２回加
工および拘束して前記厚板部および前記薄板部を成形す
ることを特徴とするヒートシンク付リードフレーム材の
製造方法。1. A metal strip having a predetermined thickness serving as a base material of a lead frame is pressed to form a thick plate portion serving as a heat sink portion on one surface of the metal strip at a predetermined pitch into an island shape. In a method for manufacturing a lead frame material with a heat sink for forming a thin plate portion to be a lead portion around a plate portion, a plurality of first dies having concave grooves are arranged at predetermined intervals according to the predetermined pitch. A second mold having a smooth portion is arranged between the plurality of first molds so as to have a predetermined space corresponding to the thickness of the thin plate portion, and the second mold is provided in the predetermined space. By supplying a metal strip and pressing and processing the plurality of first molds and the second molds, the thick plate portion is processed and restrained at least twice by the concave groove and the smooth portion to thereby form the thick plate. With a heat sink, characterized by forming the thin plate portion and the thin plate portion Method of manufacturing over lead frame material.
長手方向の伸びを吸収する間隙部を有する請求項１のヒ
ートシンク付リードフレーム材の製造方法。2. The method for manufacturing a lead frame material with a heat sink according to claim 1, wherein the plurality of first dies have a gap between the dies to absorb the elongation of the material in the longitudinal direction.
より大なる厚みを有する請求項１のヒートシンク付リー
ドフレーム材の製造方法。3. The method for manufacturing a lead frame material with a heat sink according to claim 1, wherein the thick plate portion has a thickness greater than the predetermined thickness of the metal strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33241596A JP3259648B2 (en) | 1996-12-12 | 1996-12-12 | Manufacturing method of lead frame material with heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33241596A JP3259648B2 (en) | 1996-12-12 | 1996-12-12 | Manufacturing method of lead frame material with heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10166068A true JPH10166068A (en) | 1998-06-23 |
| JP3259648B2 JP3259648B2 (en) | 2002-02-25 |
Family
ID=18254721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33241596A Expired - Fee Related JP3259648B2 (en) | 1996-12-12 | 1996-12-12 | Manufacturing method of lead frame material with heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3259648B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001246425A (en) * | 2000-03-03 | 2001-09-11 | Kyushu Sanei Kinzoku Kogyo Kk | Protruded part forming apparatus for metal sheet, manufacturing method for metal external case and metal external case using the method |
| KR100778022B1 (en) | 2006-07-14 | 2007-11-21 | 주식회사 일창프리시젼 | A heat sink manufacturing method for memory module |
-
1996
- 1996-12-12 JP JP33241596A patent/JP3259648B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001246425A (en) * | 2000-03-03 | 2001-09-11 | Kyushu Sanei Kinzoku Kogyo Kk | Protruded part forming apparatus for metal sheet, manufacturing method for metal external case and metal external case using the method |
| KR100778022B1 (en) | 2006-07-14 | 2007-11-21 | 주식회사 일창프리시젼 | A heat sink manufacturing method for memory module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3259648B2 (en) | 2002-02-25 |
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