JPH10160943A - Mounting structure for printed circuit board for e/o converter - Google Patents

Mounting structure for printed circuit board for e/o converter

Info

Publication number
JPH10160943A
JPH10160943A JP8332786A JP33278696A JPH10160943A JP H10160943 A JPH10160943 A JP H10160943A JP 8332786 A JP8332786 A JP 8332786A JP 33278696 A JP33278696 A JP 33278696A JP H10160943 A JPH10160943 A JP H10160943A
Authority
JP
Japan
Prior art keywords
optical
circuit board
printed circuit
optical fiber
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8332786A
Other languages
Japanese (ja)
Inventor
Hiroaki Sasaki
博章 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ando Electric Co Ltd
Original Assignee
Ando Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ando Electric Co Ltd filed Critical Ando Electric Co Ltd
Priority to JP8332786A priority Critical patent/JPH10160943A/en
Publication of JPH10160943A publication Critical patent/JPH10160943A/en
Pending legal-status Critical Current

Links

Landscapes

  • Light Guides In General And Applications Therefor (AREA)
  • Optical Communication System (AREA)

Abstract

PROBLEM TO BE SOLVED: To expand a mounting area of electric parts on a printed circuit board by forming a hole on the printed circuit board and transferring optical fibers through the hole. SOLUTION: An optical connector 21, a PD 24 and an LD 25 are mounted on an area 2 of a surface 1A becoming a mounting surface of optical parts. A wire bundle part 2S circuiting the optical fiber 2A connecting between optical parts is mounted on the surface 1B becoming a pattern surface of an electric parts group. Then, the rectangle hole 10 is formed on the area 2, and the optical fiber 2A connecting between the optical parts is wound circularly in the shape circuiting. Then, it is bundled by a wire bundle jig to be mounted on the printed circuit board 1. In such a manner, by transferring the optical fiber 2A through the hole 10, and arranging the wire bundle part 2S on the pattern surface of the electric parts group, the mounting area of the electric parts group is secured widely. In such a case, the optical fiber 2A transferring through the hole 10 is held in the vicinity of the hole 10 within the range of curvature without changing a characteristic of light transmitting through the optical fiber 2A.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】 この発明は、E/O(電気
/光)変換器用のプリント基板の実装構造についてのも
のである。特に、電気信号を生成する電気部品群と、光
信号を出射する光コネクタを少なくとも含む光部品群を
もつプリント基板の実装構造についてのものである。
[0001] 1. Field of the Invention [0002] The present invention relates to a mounting structure of a printed circuit board for an E / O (electric / optical) converter. In particular, the present invention relates to a printed circuit board mounting structure including an optical component group that generates an electrical signal and an optical component group that includes at least an optical connector that emits an optical signal.

【0002】[0002]

【従来の技術】E/O変換器となるプリント基板には電
気部品と光部品が実装される。前述の電気部品は、電源
回路、光制御回路、バス制御回路に使用される抵抗、コ
ンデンサ、IC等から構成する。
2. Description of the Related Art An electric component and an optical component are mounted on a printed circuit board serving as an E / O converter. The above-mentioned electric components are composed of resistors, capacitors, ICs, and the like used in a power supply circuit, a light control circuit, and a bus control circuit.

【0003】光部品には、光信号を出射する光コネクタ
がある。また、これらの光部品には、アイソレータ、ビ
ームスプリッタ、フォトダイオード、半導体レーザ等が
あり、光部品間を光ファイバで接続する。なお、以下、
アイソレータをISO、ビームスプリッタをBS、フォ
トダイオードをPD、半導体レーザをLDと略称する。
[0003] Optical components include optical connectors for emitting optical signals. Further, these optical components include an isolator, a beam splitter, a photodiode, a semiconductor laser, and the like, and the optical components are connected by an optical fiber. Note that
The isolator is abbreviated as ISO, the beam splitter as BS, the photodiode as PD, and the semiconductor laser as LD.

【0004】次に、従来のプリント基板の実装構造の一
例を図3により説明する。図3のプリント基板11の領
域20には、光コネクタ21、ISO22、BS23、
PD24、LD25等の光部品群が実装される。領域3
0には、バス制御回路や光制御回路等の電気部品群が実
装される。領域20・30はプリント基板11の実装面
11Aであり、反対面はパターン面11Bとなる。
Next, an example of a conventional printed circuit board mounting structure will be described with reference to FIG. An optical connector 21, an ISO 22, a BS 23,
An optical component group such as the PD 24 and the LD 25 is mounted. Area 3
In 0, a group of electric components such as a bus control circuit and a light control circuit is mounted. The regions 20 and 30 are the mounting surface 11A of the printed board 11, and the opposite surface is the pattern surface 11B.

【0005】図3において、光部品間を接続する光ファ
イバ2Aは周回する形で円形に巻かれる。そして、束線
ジグ2Bにより束ねられ、プリント基板11に実装され
る。図3では、光ファイバ2Aを周回する束線部2Sが
2カ所存在する。
[0005] In FIG. 3, an optical fiber 2A connecting between optical components is wound in a circular shape in a circling manner. Then, they are bundled by the bundle jig 2 </ b> B and mounted on the printed circuit board 11. In FIG. 3, there are two bundled portions 2S circling the optical fiber 2A.

【0006】束線部2Sでは、光ファイバ2Aの最小曲
げ半径を考慮して、束線ジグ2Bの距離は、前記曲げ半
径の2倍以上となる。また、図4は束線ジグ2Bの断面
図である。図4アは光ファイバ2Aを束ねた状態であ
り、図4イは光ファイバ2Aを束ねる前の状態である。
In the bundle section 2S, the distance of the bundle jig 2B is at least twice the bending radius in consideration of the minimum bending radius of the optical fiber 2A. FIG. 4 is a sectional view of the bundle jig 2B. FIG. 4A shows a state in which the optical fibers 2A are bundled, and FIG. 4A shows a state before the optical fibers 2A are bundled.

【0007】[0007]

【発明が解決しようとする課題】図3では、光部品を実
装する領域20は、光ファイバ2Aの束線部2Sの占有
領域が大きい。光ファイバ2Aの線径が大きくなるのに
比例して、束線部2Sの占有領域は大きくなる。一方、
プリント基板の外形寸法と実装高さには制約がある場合
があり、プリント基板上の電気部品と光部品を制約のあ
る中で適正に配置する実装構造が求められている。
In FIG. 3, the area 20 where the optical component is mounted has a large area occupied by the bundled portion 2S of the optical fiber 2A. As the wire diameter of the optical fiber 2A increases, the area occupied by the bundle portion 2S increases. on the other hand,
There are cases where there are restrictions on the external dimensions and mounting height of the printed circuit board, and there is a need for a mounting structure that properly arranges electrical components and optical components on the printed circuit board under the restrictions.

【0008】この発明は、光部品と電気部品の実装面と
反対面に光ファイバの束線部を実装し、穴を介して光部
品を光ファイバで接続することにより、電気部品の実装
領域をより確保できるE/O変換器用プリント基板の実
装構造の提供を目的とする。
According to the present invention, a bundled portion of an optical fiber is mounted on a surface opposite to a mounting surface of an optical component and an electric component, and the optical component is connected by an optical fiber through a hole, thereby reducing a mounting area of the electric component. It is an object of the present invention to provide a mounting structure of a printed circuit board for an E / O converter which can be secured more.

【0009】[0009]

【課題を解決するための手段】この目的を達成するた
め、この発明は、電気信号を生成する電気部品群と、光
信号を出射する光コネクタ21を少なくとも含む光部品
群とをプリント基板1に実装し、電気信号を光信号に変
換するE/O変換器であって、プリント基板1の面1A
に電気部品群と少なくとも光コネクタ21を実装し、前
記光部品間を接続する光ファイバ2Aを周回する束線部
2Sを面1Aの反対面となる面1Bに実装し、プリント
基板1に穴10を形成し、穴10に光ファイバ2Aが往
来する。
In order to achieve this object, the present invention provides a printed circuit board 1 comprising a group of electrical components for generating an electrical signal and a group of optical components including at least an optical connector 21 for emitting an optical signal. An E / O converter that is mounted and converts an electric signal into an optical signal, and is a surface 1A of the printed circuit board 1.
, An electrical connector group and at least an optical connector 21 are mounted thereon, and a bundled portion 2S circling an optical fiber 2A connecting the optical components is mounted on a surface 1B opposite to the surface 1A. Is formed, and the optical fiber 2 </ b> A comes and goes in the hole 10.

【0010】[0010]

【発明の実施の形態】以下、図面を参照してこの発明の
一実施の形態を説明する。図1は、この発明の一実施の
形態による実装構造の構成を示す斜視図であり、図3に
示された従来の実装構造と共通部分には同一の符号を付
す。
An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a configuration of a mounting structure according to an embodiment of the present invention, and the same reference numerals are given to the same parts as those of the conventional mounting structure shown in FIG.

【0011】図1のプリント基板1の面1Aは、電気信
号を生成する電気部品群が実装される領域3と、光コネ
クタ21を少なくとも含む光部分群が実装される領域2
で構成される。
The surface 1A of the printed circuit board 1 shown in FIG. 1 has a region 3 on which a group of electric components for generating an electric signal is mounted and a region 2 on which a group of optical parts including at least the optical connector 21 is mounted.
It consists of.

【0012】光部品の実装面となる面1Aの領域2には
光コネクタ21、PD24、LD25が実装される。電
気部品群のパターン面となる面1Bには、前記光部品間
を接続する光ファイバ2Aを周回する束線部2Sが実装
される。そして、領域2には、矩形となる穴10が形成
される。
An optical connector 21, a PD 24, and an LD 25 are mounted in a region 2 on a surface 1A serving as a mounting surface of an optical component. On a surface 1B serving as a pattern surface of the electrical component group, a bundle portion 2S that circulates around an optical fiber 2A connecting the optical components is mounted. Then, a rectangular hole 10 is formed in the area 2.

【0013】図2は、プリント基板1の面1B側からみ
た図である。図2に示されるように、面1Bには比較的
実装高さの低いISO22とBS23が実装される。そ
して、光部品間を接続する光ファイバ2Aは周回する形
で円形に巻かれる。そして、束線ジグ2Bにより束ねら
れ、プリント基板1に実装される。
FIG. 2 is a view of the printed circuit board 1 as viewed from the surface 1B side. As shown in FIG. 2, ISO 22 and BS 23 having relatively low mounting height are mounted on the surface 1B. Then, the optical fiber 2A connecting the optical components is wound in a circular shape around the optical fiber. The bundle is bundled by the bundle jig 2 </ b> B and mounted on the printed circuit board 1.

【0014】このように、この発明では、プリント基板
1に穴10を形成し、穴10に光ファイバ2Aが往来
し、束線部2Sを電気部品群のパターン面に配置するこ
とにより、図1に示されるように電気部品群の実装領域
3を従来より広く確保できる。
As described above, according to the present invention, the holes 10 are formed in the printed circuit board 1, the optical fibers 2A come and go in the holes 10, and the bundled portions 2S are arranged on the pattern surface of the electric component group. As shown in (1), the mounting area 3 of the electric component group can be secured wider than before.

【0015】更に、実施の形態では、穴10の近傍に面
1A・1B共にガイドジグ2Cが配置される。光ファイ
バ2Aは、プリント基板1の穴10を介し、面1Aと面
1Bを往来できる。ガイドジグ2Cは、光ファイバ2A
に無理な力がかからないようにするために設けている。
Further, in the embodiment, the guide jig 2C is arranged near the hole 10 on both the surfaces 1A and 1B. The optical fiber 2A can move between the surface 1A and the surface 1B via the hole 10 of the printed circuit board 1. The guide jig 2C is an optical fiber 2A
It is provided to prevent excessive force from being applied.

【0016】ガイドジグ2Cの構造としては、プリント
基板1上に実装ができ、光ファイバ2Aを通すことがで
きる貫通穴をもつ。そして、光ファイバ2Aを通過する
光の特性が変わらない曲率範囲で穴10に往来する光フ
ァイバ2Aが穴10の近傍に保持される。穴10の縦幅
と横幅を適正に設定し、ガイドジグ2C間の距離を適正
に設定すれば、穴10の面積を最小にできる。
The structure of the guide jig 2C is such that it can be mounted on the printed circuit board 1 and has a through hole through which the optical fiber 2A can pass. Then, the optical fiber 2A coming and going to the hole 10 within the curvature range where the characteristics of the light passing through the optical fiber 2A does not change is held near the hole 10. If the vertical and horizontal widths of the hole 10 are properly set and the distance between the guide jigs 2C is properly set, the area of the hole 10 can be minimized.

【0017】なお、E/O変換器用のプリント基板の実
装構造を、この発明は提起したが、光コネクタ21を光
信号の受信用とするO/E(光/電気)変換器用のプリ
ント基板の実装構造についても、この発明の技術的思想
を逸脱するものでは無い。
Although the present invention has proposed a mounting structure of a printed circuit board for an E / O converter, a printed circuit board for an O / E (optical / electric) converter using the optical connector 21 for receiving an optical signal has been proposed. The mounting structure does not depart from the technical idea of the present invention.

【0018】[0018]

【発明の効果】この発明は、電気信号を生成する電気部
品群と、光信号を出射する光コネクタを少なくとも含む
光部品群とをプリント基板に実装し、電気信号を光信号
に変換するE/O変換器であって、前記プリント基板の
第1の面に電気部品群と少なくとも前記光コネクタを実
装し、前記光部品間を接続する光ファイバを周回する束
線部を前記第1の面の反対面となる第2の面に実装し、
前記プリント基板に穴を形成し、前記穴に前記光ファイ
バが往来するので、プリント基板上の電気部品の実装面
積を従来より拡張できる。
According to the present invention, an electronic component group for generating an electric signal and an optical component group including at least an optical connector for emitting an optical signal are mounted on a printed circuit board, and an E / E converter for converting the electric signal into an optical signal is provided. An O-converter, wherein an electrical component group and at least the optical connector are mounted on a first surface of the printed circuit board, and a bundled portion circling an optical fiber connecting the optical components is provided on the first surface. Mounted on the second side, which is the opposite side,
Since a hole is formed in the printed circuit board and the optical fiber flows to and from the hole, the mounting area of the electric component on the printed circuit board can be expanded more than before.

【図面の簡単な説明】[Brief description of the drawings]

【図1】この発明の一実施の形態によるプリント基板上
の実装構造図である。
FIG. 1 is a diagram showing a mounting structure on a printed circuit board according to an embodiment of the present invention.

【図2】図1の反対面から見た図である。FIG. 2 is a view as seen from the opposite side of FIG. 1;

【図3】従来技術よるプリント基板上の実装構造図であ
る。
FIG. 3 is a diagram showing a mounting structure on a printed circuit board according to the related art.

【図4】束線ジグ2Bの断面図である。FIG. 4 is a sectional view of a bundle jig 2B.

【符号の説明】[Explanation of symbols]

1 プリント基板 1A 面 1B 面 2 領域 2A 光ファイバ 2B 束線ジグ 2C ガイドジグ 2S 束線部 3 領域 21 光コネクタ 22 アイソレータ 23 ビームスプリッタ 24 フォトダイオード 25 半導体レーザ DESCRIPTION OF SYMBOLS 1 Printed circuit board 1A surface 1B surface 2 area | region 2A optical fiber 2B bundled jig 2C guide jig 2S bundled part 3 area 21 optical connector 22 isolator 23 beam splitter 24 photodiode 25 semiconductor laser

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 電気信号を生成する電気部品群と、光信
号を出射する光コネクタを少なくとも含む光部品群とを
プリント基板に実装し、電気信号を光信号に変換するE
/O変換器であって、 前記プリント基板の第1の面に電気部品群と少なくとも
前記光コネクタを実装し、 前記光部品間を接続する光ファイバを周回する束線部を
前記第1の面の反対面となる第2の面に実装し、 前記プリント基板に穴を形成し、 前記穴に前記光ファイバが往来することを特徴とするE
/O変換器用プリント基板の実装構造。
An electronic component group for generating an electrical signal and an optical component group including at least an optical connector for emitting an optical signal are mounted on a printed circuit board, and the electrical signal is converted to an optical signal.
/ O converter, wherein an electrical component group and at least the optical connector are mounted on a first surface of the printed circuit board, and a bundled portion circulating around an optical fiber connecting the optical components is provided on the first surface. The optical fiber is mounted on a second surface which is the opposite surface of the printed circuit board, a hole is formed in the printed circuit board, and the optical fiber is moved in and out of the hole.
Mounting structure of printed circuit board for / O converter.
【請求項2】 前記光ファイバを通過する光の特性が変
わらない曲率範囲で前記穴に往来する前記光ファイバが
前記穴の近傍に保持されることを特徴とする請求項1記
載のE/O変換器用プリント基板の実装構造。
2. The E / O according to claim 1, wherein said optical fiber coming and going to said hole is held in the vicinity of said hole in a curvature range where the characteristics of light passing through said optical fiber do not change. Mounting structure of printed circuit board for converter.
JP8332786A 1996-11-28 1996-11-28 Mounting structure for printed circuit board for e/o converter Pending JPH10160943A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8332786A JPH10160943A (en) 1996-11-28 1996-11-28 Mounting structure for printed circuit board for e/o converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8332786A JPH10160943A (en) 1996-11-28 1996-11-28 Mounting structure for printed circuit board for e/o converter

Publications (1)

Publication Number Publication Date
JPH10160943A true JPH10160943A (en) 1998-06-19

Family

ID=18258809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8332786A Pending JPH10160943A (en) 1996-11-28 1996-11-28 Mounting structure for printed circuit board for e/o converter

Country Status (1)

Country Link
JP (1) JPH10160943A (en)

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