JPH10158469A - Phenolic resin molding material - Google Patents

Phenolic resin molding material

Info

Publication number
JPH10158469A
JPH10158469A JP31676296A JP31676296A JPH10158469A JP H10158469 A JPH10158469 A JP H10158469A JP 31676296 A JP31676296 A JP 31676296A JP 31676296 A JP31676296 A JP 31676296A JP H10158469 A JPH10158469 A JP H10158469A
Authority
JP
Japan
Prior art keywords
molecular
phenolic resin
weight
molding material
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31676296A
Other languages
Japanese (ja)
Inventor
Chitoshi Yamashita
千俊 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP31676296A priority Critical patent/JPH10158469A/en
Publication of JPH10158469A publication Critical patent/JPH10158469A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain a resin molding material excellent in heat stability in a molten state in the cylinder in injection molding and curability in the mold by mixing a resol phenolic resin with a low-molecular-weight polyolefin compound, carnauba wax and a filler. SOLUTION: 100 pts.wt. resol phenolic resin is mixed with 0.1-10 pts.wt. low-molecular-weight polyolefin compound and 0.1-5 pts.wt. carnauba wax. The resole phenolic resin is not particularly limited. It is desirable that the low-molecular-weight polyolefin compound is low-molecular-weight polypropylene, low-molecular-weight polyethylene or the like and has a molecular weight of 300-3,000. The carnauba wax used is a common powdery one. The low- molecular-weight polyolefin and the carnauba wax function as lubricants in the cylinder, can reduce the heat generation resulting from shearing by the screw and the cylinder, inhibits the progress of cure and reduce the viscosity of the melt.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、熱安定性及び硬化
性に優れたフェノール樹脂成形材料に関するものであ
り、特に射出成形機のシリンダー内における熱安定性に
優れたフェノール樹脂成形材料を提供するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phenol resin molding material having excellent heat stability and curability, and more particularly to a phenol resin molding material having excellent heat stability in a cylinder of an injection molding machine. Things.

【0002】[0002]

【従来の技術】フェノール樹脂成形材料は耐熱性、電気
特性、機械的特性、寸法安定性などのバランスに優れ、
電気部品、機構部品を始めとして広範囲の分野に利用さ
れており、一般に射出成形により成形されるものであ
る。フェノール樹脂成形材料は、成形時射出成形機のシ
リンダー内で80〜120℃に加熱され溶融された状態
では、樹脂の硬化反応の進行によって粘度が増大し流動
性を失う性質を有している。このため、従来のフェノー
ル樹脂成形材料を射出成形する場合、射出成形機のシリ
ンダー内で溶融された成形材料は、熱安定性が良好であ
るとはいえず、成形のための適正な温度条件幅が狭いと
いう問題がある。
2. Description of the Related Art Phenolic resin molding materials have an excellent balance of heat resistance, electrical properties, mechanical properties, dimensional stability, etc.
It is used in a wide range of fields including electric parts and mechanical parts, and is generally formed by injection molding. The phenolic resin molding material has such a property that, when heated and melted in a cylinder of an injection molding machine at 80 to 120 ° C. during molding, the viscosity increases due to the progress of the curing reaction of the resin and the fluidity is lost. For this reason, when a conventional phenolic resin molding material is injection-molded, the molding material melted in the cylinder of the injection molding machine cannot be said to have good thermal stability. There is a problem that is narrow.

【0003】従来このような問題を解決するために、成
形材料の溶融粘度の低下、即ち流動性を良くするなどの
各種の方法が知られているが、これらの場合シリンダー
内での溶融状態において熱安定性を向上させると、金型
内での硬化が遅くなるので、成形サイクルが長くなり、
実用に供することは困難である。
Conventionally, various methods have been known to solve such a problem, such as reducing the melt viscosity of a molding material, that is, improving the fluidity. In these cases, however, the molten state in a cylinder is not sufficient. Improving thermal stability slows curing in the mold, lengthening the molding cycle,
It is difficult to put to practical use.

【0004】[0004]

【発明が解決しようとする課題】本発明は、これらの課
題を解決するため種々の検討の結果なされたものであ
り、その目的とするところは、射出成形時にシリンダー
内での溶融状態において熱安定性が優れ、かつ金型内で
の硬化性に優れたフェノール樹脂成形材料を提供すると
ころにある。
The present invention has been made as a result of various studies in order to solve these problems, and it is an object of the present invention to provide a method for thermally stabilizing a molten state in a cylinder during injection molding. It is an object of the present invention to provide a phenolic resin molding material having excellent curability and excellent curability in a mold.

【0005】[0005]

【課題が解決するための手段】本発明は、(a)レゾー
ル型フェノール樹脂、(b)低分子ポリオレフィン化合
物、(c)カルナバワックス及び(d)充填材を含有す
ることを特徴とするフェノール樹脂成形材料に関するも
のである。
The present invention provides a phenolic resin containing (a) a resole type phenolic resin, (b) a low molecular weight polyolefin compound, (c) a carnauba wax and (d) a filler. It relates to a molding material.

【0006】本発明において、(a)レゾール型フェノ
ール樹脂は通常のフェノール樹脂成形材料に使用されて
いるものであればよく、特に限定されない。
In the present invention, the resol type phenol resin (a) is not particularly limited as long as it is used in a usual phenol resin molding material.

【0007】(b)低分子ポリオレフィン化合物として
は、低分子ポリプロピレン、低分子ポリエチレンなどを
例示できる。(c)カルナバワックスは通常の成形材料
に用いられる粉末状のものが用いられる。
(B) Examples of the low molecular weight polyolefin compound include low molecular weight polypropylene and low molecular weight polyethylene. (C) As the carnauba wax, a powdery one used for a usual molding material is used.

【0008】(b)低分子ポリオレフィン及び(c)カ
ルナバワックスは、射出成形機のシリンダー内で加熱に
より成形材料が可塑化され計量される際に滑剤の作用を
し、スクリューとシリンダー壁から受ける剪断による発
熱を軽減し、硬化の進行を抑制して熱安定性を向上させ
るとともに、80〜120℃の溶融状態における粘度を
低減する作用を有する。また、150〜200℃の金型
温度ではフェノール樹脂成形材料の硬化を妨げない。
(c)低分子ポリオレフィンの分子量は、好ましくは3
00〜3000であり、前述の(a)成分100重量部
に対して、好ましくは0.1〜10重量部配合して用い
られる。0.1重量部より少ないと上述の作用が小さ
く、10重量部より多いと滑剤としての作用が大きすぎ
て可塑化計量が困難となる。(d)カルナバワックスは
前述の(a)成分100重量部に対して、好ましくは
0.1〜5重量部配合して用いられる。0.1重量部よ
り少ないと上述の作用が小さく、5重量部より多いと同
様に可塑化計量が困難となる。
[0008] The (b) low molecular weight polyolefin and (c) carnauba wax act as a lubricant when the molding material is plasticized and measured by heating in the cylinder of the injection molding machine, and the shear received from the screw and the cylinder wall. And has the effect of suppressing the progress of curing to improve the thermal stability and reducing the viscosity in the molten state at 80 to 120 ° C. At a mold temperature of 150 to 200 ° C., the curing of the phenolic resin molding material is not hindered.
(C) The molecular weight of the low molecular weight polyolefin is preferably 3
It is preferably from 0.1 to 10 parts by weight based on 100 parts by weight of the above-mentioned component (a). If the amount is less than 0.1 part by weight, the above-mentioned action is small, and if it is more than 10 parts by weight, the action as a lubricant is too large, and it is difficult to measure plasticization. (D) Carnauba wax is preferably used in an amount of 0.1 to 5 parts by weight based on 100 parts by weight of the component (a). When the amount is less than 0.1 part by weight, the above-mentioned action is small, and when the amount is more than 5 parts by weight, similarly, the plasticization measurement becomes difficult.

【0009】本発明のフェノール樹脂成形材料に用いら
れる(d)充填材としては、木粉、パルプ粉、各種織物
粉砕物、フェノール樹脂積層板や成形品の粉砕物などの
有機質のもの、シリカ、アルミナ、水酸化アルミニウ
ム、ガラス、タルク、クレー、マイカ、炭酸カルシウ
ム、カーボンなどの無機質の粉末のもの、ガラス繊維、
カーボン繊維などの無機質繊維などの1種以上を用いる
ことができる。本発明のフェノール樹脂成形材料中の配
合割合は、樹脂成分が20〜70重量%、充填剤が80
〜30重量%である。また、本発明のフェノール樹脂成
形材料には、更に滑剤、着色剤、硬化促進剤、難燃剤な
どの各種添加剤を適宜配合することができる。
As the filler (d) used in the phenolic resin molding material of the present invention, organic fillers such as wood powder, pulp powder, pulverized various fabrics, pulverized phenolic resin laminates and molded products, silica, Alumina, aluminum hydroxide, glass, talc, clay, mica, calcium carbonate, inorganic powders such as carbon, glass fiber,
One or more kinds of inorganic fibers such as carbon fibers can be used. The mixing ratio in the phenolic resin molding material of the present invention is such that the resin component is 20 to 70% by weight and the filler is 80%.
3030% by weight. Further, various additives such as a lubricant, a colorant, a curing accelerator, and a flame retardant can be appropriately blended into the phenolic resin molding material of the present invention.

【0010】本発明のフェノール樹脂成形材料は、樹脂
成分、充填材、その他の添加剤を配合し、ロールミル、
2軸混練機などで混練し、粉砕して製造することができ
る。また、(b)低分子ポリエチレン、(c)カルナバ
ワックスは必要に応じて、他の材料を混練粉砕した後に
添加混合しても良い。
[0010] The phenolic resin molding material of the present invention comprises a resin component, a filler, and other additives.
It can be manufactured by kneading with a twin-screw kneader or the like and pulverizing. If necessary, (b) low molecular polyethylene and (c) carnauba wax may be added and mixed after other materials are kneaded and pulverized.

【0011】本発明のフェノール樹脂成形材料は、
(a)レゾール型フェノール樹脂、(b)低分子ポリオ
レフィン化合物、(c)カルナバワックス及び(d)充
填材を配合している。かかるフェノール樹脂成形材料
は、射出成形のシリンダー内において、80〜120℃
での可塑化され溶融された状態において熱安定性が優れ
ており、150〜200℃の金型内での硬化性も優れて
いる。このことから、フェノール樹脂成形材料の射出成
形において、極めて連続成形性の良いものとなる。低分
子ポリオレフィン、カルナバワックスをそれぞれ単独で
配合した成形材料でも溶融状態での熱安定性を良くする
ことが可能ではあるが、良好な射出成形性、特に連続成
形性の付与には不十分であり、低分子ポリオレフィン及
びカルナバワックスを併用することにより熱安定性が大
きく向上する。
[0011] The phenolic resin molding material of the present invention comprises:
It contains (a) a resole type phenol resin, (b) a low molecular weight polyolefin compound, (c) carnauba wax, and (d) a filler. Such a phenolic resin molding material is heated at 80 to 120 ° C. in an injection molding cylinder.
It has excellent thermal stability in the plasticized and molten state of the above, and also has excellent curability in a mold at 150 to 200 ° C. For this reason, in the injection molding of the phenolic resin molding material, extremely good continuous moldability is obtained. Although it is possible to improve the thermal stability in the molten state even with a molding material containing a low-molecular-weight polyolefin and carnauba wax alone, it is insufficient for imparting good injection moldability, especially continuous moldability. By using a low molecular weight polyolefin and carnauba wax in combination, the thermal stability is greatly improved.

【0012】そして、本発明の成形材料は、100℃で
の溶融粘度が103 Pa・s以下となると、通常のフェノ
ール樹脂成形材料よりかなり低い溶融粘度であるので、
一般に熱可塑性樹脂の成形に用いられる射出成形機、即
ち1.5以上の圧縮比を有するスクリューまたは逆流防
止リング付きスクリューを備えた射出成形機に適用して
良好に射出成形することができる。
When the molding material of the present invention has a melt viscosity at 100 ° C. of 10 3 Pa · s or less, it has a much lower melt viscosity than a normal phenolic resin molding material.
It can be satisfactorily injection-molded by being applied to an injection molding machine generally used for molding a thermoplastic resin, that is, an injection molding machine equipped with a screw having a compression ratio of 1.5 or more or a screw with a backflow prevention ring.

【0013】[0013]

【実施例】以下実施例により本発明を説明する。配合に
おいて「部」は重量部である。表1に示す配合にて、加
熱ロールにより混練してフェノール樹脂成形材料を得、
溶融粘度を測定した。この成形材料を用いて射出成形を
行い、シリンダー内安定性及び硬化性を評価した。結果
を表1に併せて示す。
EXAMPLES The present invention will be described below with reference to examples. In the formulations, "parts" are parts by weight. With the composition shown in Table 1, kneaded with a heating roll to obtain a phenolic resin molding material,
The melt viscosity was measured. Injection molding was performed using this molding material, and the in-cylinder stability and curability were evaluated. The results are shown in Table 1.

【0014】(測定方法) 1.溶融粘度:島津フローテスター(島津製作所CFT
−500C)によって測定したものを示した。 2.シリンダー内安定性:60φ×4mmのテストピー
スを20ショット連続成形(シリンダー温度90℃、金
型温度175℃、以下、成形は同条件)した後、計量し
た状態で放置し、一定時間経過後に射出を行う。この放
置時間を変えて成形した時、溶融した材料が流動して金
型内に十分充填することができる最長の放置時間を求め
た。 3.硬化性:上記テストピースを成形する。射出成形機
にて金型に充填し30秒後に成型品を取り出し、更に1
0秒経過後のバーコル硬度を示した。
(Measurement method) Melt viscosity: Shimadzu flow tester (CFT, Shimadzu Corporation)
-500C). 2. In-cylinder stability: A test piece of 60φ × 4 mm was continuously molded for 20 shots (cylinder temperature 90 ° C., mold temperature 175 ° C .; hereinafter, molding is the same conditions), left in a weighed state, and injected after a certain period of time I do. When molding was performed by changing the standing time, the longest standing time at which the molten material could flow and sufficiently fill the mold was determined. 3. Curability: The test piece is molded. After filling the mold with an injection molding machine, the molded product was taken out 30 seconds later,
The barcol hardness after 0 seconds has elapsed.

【0015】[0015]

【表1】 [Table 1]

【0016】[0016]

【発明の効果】上記の実施例からも明らかなように、本
発明のフェノール樹脂成形材料は射出成形機のシリンダ
ー内における溶融状態での流動性と熱安定性に富み、金
型内での高温時の硬化性は従来のものと同程度に優れて
いるため、射出成形において極めて良好な成形性、特に
連続成形性を有している。また、本発明で得られるよう
な100℃での溶融粘度が103 Pa・s以下のフェノー
ル樹脂成形材料は、熱可塑性樹脂の成形に用いられる射
出成形機、即ち1.5以上の圧縮比を有するスクリュー
または逆流防止リング付きスクリューを備えた射出成形
機によって良好に射出成形することができる。
As is clear from the above examples, the phenolic resin molding material of the present invention is rich in fluidity and thermal stability in a molten state in a cylinder of an injection molding machine, and has a high temperature in a mold. Since the curability at the time is as excellent as the conventional one, it has extremely good moldability in injection molding, especially continuous moldability. A phenol resin molding material having a melt viscosity at 100 ° C. of 10 3 Pa · s or less as obtained in the present invention is an injection molding machine used for molding a thermoplastic resin, that is, a compression ratio of 1.5 or more. Injection molding can be favorably performed by an injection molding machine provided with a screw having a screw having a backflow prevention ring.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 (a)レゾール型フェノール樹脂、
(b)低分子ポリオレフィン化合物、(c)カルナバワ
ックス及び(d)充填材を含有することを特徴とするフ
ェノール樹脂成形材料。
(1) a resole type phenol resin,
A phenolic resin molding material comprising (b) a low molecular weight polyolefin compound, (c) carnauba wax and (d) a filler.
【請求項2】 (b)低分子ポリオレフィン化合物及び
(c)カルナバワックスが、(a)レゾール型フェノー
ル樹脂100重量部に対して、それぞれ0.1〜10重
量部及び0.1〜5重量部である請求項1記載のフェノ
ール樹脂成形材料。
2. A low-molecular-weight polyolefin compound (b) and carnauba wax (c) are used in an amount of 0.1 to 10 parts by weight and 0.1 to 5 parts by weight, respectively, based on 100 parts by weight of (a) a resole-type phenol resin. The phenolic resin molding material according to claim 1, which is:
JP31676296A 1996-11-27 1996-11-27 Phenolic resin molding material Pending JPH10158469A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31676296A JPH10158469A (en) 1996-11-27 1996-11-27 Phenolic resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31676296A JPH10158469A (en) 1996-11-27 1996-11-27 Phenolic resin molding material

Publications (1)

Publication Number Publication Date
JPH10158469A true JPH10158469A (en) 1998-06-16

Family

ID=18080649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31676296A Pending JPH10158469A (en) 1996-11-27 1996-11-27 Phenolic resin molding material

Country Status (1)

Country Link
JP (1) JPH10158469A (en)

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