JPH101547A - Abrasive - Google Patents
AbrasiveInfo
- Publication number
- JPH101547A JPH101547A JP15657696A JP15657696A JPH101547A JP H101547 A JPH101547 A JP H101547A JP 15657696 A JP15657696 A JP 15657696A JP 15657696 A JP15657696 A JP 15657696A JP H101547 A JPH101547 A JP H101547A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- powder
- abrasive
- resin composition
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は無機質充填材及び又
は有機質充填材を含有するエポキシ樹脂硬化物粉末を熱
可塑性樹脂に加熱混練して得た樹脂組成物を粉砕又はペ
レット化して得る研磨材に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an abrasive obtained by pulverizing or pelletizing a resin composition obtained by heating and kneading an epoxy resin cured product powder containing an inorganic filler and / or an organic filler into a thermoplastic resin. .
【０００２】[0002]
【従来の技術】従来の樹脂質研磨材は熱硬化性樹脂の硬
化物を粉砕したものか、又は熱可塑性樹脂を粉砕又はペ
レット化したものであった。熱硬化性樹脂研磨材は塗装
剥離、金型の研掃、電気部品のバリ取り等に使用されて
いるが、硬度が低いことから研磨力として充分な特性を
有していない。2. Description of the Related Art A conventional resinous abrasive is obtained by pulverizing a cured product of a thermosetting resin or pulverizing or pelletizing a thermoplastic resin. Thermosetting resin abrasives are used for stripping paints, cleaning molds, deburring electrical parts, etc., but do not have sufficient abrasive power due to low hardness.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、無機質充填
材又は有機質充填材を含むエポキシ樹脂硬化物粉末を熱
可塑性樹脂に加熱混練して得た樹脂組成物を粉砕又はペ
レット化して良好な研磨材を得るものである。SUMMARY OF THE INVENTION The present invention relates to a method for grinding a resin composition obtained by heating and kneading an epoxy resin cured product powder containing an inorganic filler or an organic filler into a thermoplastic resin, or pulverizing or pulverizing the resin composition to obtain good polishing. To get the material.
【０００４】[0004]
【課題を解決するための手段】本発明は、無機質充填材
及び又は有機質充填材を均一に混合したエポキシ樹脂か
らなるエポキシ樹脂組成物を加熱硬化した硬化物の粉末
を熱可塑性樹脂に加熱混練して得た樹脂組成物を粉砕又
はペレット化してなる研磨材に関するものである。SUMMARY OF THE INVENTION According to the present invention, a powder of a cured product obtained by heating and curing an epoxy resin composition comprising an epoxy resin in which an inorganic filler and / or an organic filler is uniformly mixed is heated and kneaded with a thermoplastic resin. The present invention relates to an abrasive obtained by pulverizing or pelletizing the resin composition obtained as described above.
【０００５】本発明においてエポキシ樹脂に配合する無
機質充填材としてはシリカ粉末、アルミナ粉末、マイカ
粉末、ガラス繊維等であり、有機質充填材としては木
粉、プラスチック粉末等である。そして、成形性や外観
を良くするために可塑剤、着色剤等が適宜配合される。
エポキシ樹脂と充填材との配合割合は、通常エポキシ樹
脂１０〜５０重量部、無機質充填材４０〜９０重量部、
又は有機質充填材０〜５０重量部である。In the present invention, the inorganic filler to be mixed with the epoxy resin is silica powder, alumina powder, mica powder, glass fiber and the like, and the organic filler is wood powder, plastic powder and the like. Then, a plasticizer, a coloring agent, and the like are appropriately blended in order to improve moldability and appearance.
The mixing ratio of the epoxy resin and the filler is usually 10 to 50 parts by weight of the epoxy resin, 40 to 90 parts by weight of the inorganic filler,
Or 0 to 50 parts by weight of the organic filler.
【０００６】本発明でエポキシ樹脂硬化物を加熱混練す
る熱可塑性樹脂としてはポリエチレン樹脂、ポリプロピ
レン樹脂、塩化ビニル樹脂、スチレン樹脂、ポリアミド
樹脂、アクリル樹脂、ポリカーボネート樹脂等である。
エポキシ樹脂は充填材等との接着性が良好であり、充填
材を均一に配合して硬化させたエポキシ樹脂組成物は緻
密な樹脂組成物である。[0006] In the present invention, the thermoplastic resin for heating and kneading the cured epoxy resin includes polyethylene resin, polypropylene resin, vinyl chloride resin, styrene resin, polyamide resin, acrylic resin, polycarbonate resin and the like.
The epoxy resin has good adhesiveness with a filler or the like, and the epoxy resin composition obtained by uniformly blending and curing the filler is a dense resin composition.
【０００７】エポキシ樹脂硬化物粉末と熱可塑性樹脂の
割合は研磨材として求められる品質が多岐にわたるため
特に制限されるものではないが、一般的には硬化物の割
合が１５％以下では研磨材としての硬化物の特徴である
硬度アップの効果が少なく、７０％以上では緻密な樹脂
組成物が得にくくなる。硬化物粉末と熱可塑性樹脂はニ
ーダー、ロール、押出し機等で加熱溶融混合することに
より均一組成の複合樹脂組成物を得ることができる。[0007] The ratio of the epoxy resin cured product powder to the thermoplastic resin is not particularly limited because the quality required for the abrasive varies widely, but in general, when the ratio of the cured material is 15% or less, the abrasive is used as an abrasive. The effect of increasing the hardness, which is a characteristic of the cured product, is small, and if it is 70% or more, it becomes difficult to obtain a dense resin composition. The composite resin composition having a uniform composition can be obtained by heating and melting and mixing the cured product powder and the thermoplastic resin with a kneader, a roll, an extruder, or the like.
【０００８】樹脂研磨材の粒度は一般に２００〜２００
０μｍ程度が多用されており、本発明において、研磨材
に分散されるエポキシ樹脂硬化物粉末の粒径は１５０μ
ｍ以下が良好である。エポキシ樹脂の硬化物は、上記の
組成に調整して混合し加熱硬化してもよいが、成形作業
を行う際に成形材料から発生するスプルー・ランナー又
は成形不良品又は使用済成形品等を使用することができ
る。これらのものは性能的にも良好であり、本来不要品
として廃棄されていたものをリサイクル利用するので、
資源の有効利用をはかることができ、産業廃棄物の削減
及び環境対策ともなるものである。The particle size of the resin abrasive is generally from 200 to 200.
About 0 μm is frequently used, and in the present invention, the particle size of the epoxy resin cured product powder dispersed in the abrasive is 150 μm.
m or less is good. The cured product of the epoxy resin may be adjusted to the above composition and mixed and then heat-cured.However, a sprue / runner generated from the molding material during molding work or a defective molded product or used molded product is used. can do. These products are also good in performance, and what is originally discarded as unnecessary products is recycled and used.
Resources can be effectively used, and industrial waste can be reduced and environmental measures can be taken.
【０００９】エポキシ樹脂硬化物粉末を混合する熱可塑
性樹脂としては単独組成のものの他に従来再生使用が困
難であった熱可塑性樹脂複合シート又は多層フィルムの
端材等を使用することができ、本来不要品として廃棄さ
れていたものをリサイクル使用することにより、資源の
有効利用、産業廃棄物の削減及び環境対策ともなるもの
である。As the thermoplastic resin to be mixed with the epoxy resin cured product powder, besides having a single composition, it is possible to use a thermoplastic resin composite sheet or a scrap of a multi-layer film, which has been difficult to recycle. By recycling what was discarded as unnecessary products, effective use of resources, reduction of industrial waste, and environmental measures can be achieved.
【００１０】[0010]
【実施例】以下、実施例により本発明を説明する。The present invention will be described below with reference to examples.
【００１１】実施例 （配合） クレゾールノボラック型エポキシ樹脂 ２０重量部 フェノールノボラック樹脂 １０ シリカ ７０ カーボンブラック ０.３ ワックス ０.５Examples (Blending) Cresol novolak type epoxy resin 20 parts by weight Phenol novolak resin 10 Silica 70 Carbon black 0.3 Wax 0.5
【００１２】上記配合のエポキシ樹脂成形材料の成形時
に生じる不要物であるスプルー・ランナーを粉砕して平
均粒径８０μｍの粉末とした。この粉末４０重量部とポ
リアミド樹脂６０重量部を押出し機にて加熱混練し１．
０ｍｍφのダイを通して押出し、長さ１．０ｍｍにカッ
トして１．０ｍｍφ×１．０ｍｍの研磨材とした。この
研磨材を利用してアクリル樹脂成形品のバリ取りをドラ
イブラストにて行った。この研磨材はエポキシ樹脂を含
まないポリアミド樹脂研磨材に比較して、耐久性として
問題なく、ポリアミド樹脂のみでは除去困難な厚バリも
容易に除去可能であった。The sprue / runner, which is an unnecessary substance generated during molding of the epoxy resin molding material having the above composition, was pulverized into powder having an average particle diameter of 80 μm. 40 parts by weight of this powder and 60 parts by weight of the polyamide resin were heated and kneaded by an extruder.
It was extruded through a 0 mmφ die and cut to a length of 1.0 mm to obtain a 1.0 mmφ × 1.0 mm abrasive. Using this abrasive, deburring of an acrylic resin molded product was performed by drive blast. This abrasive had no problem in durability as compared with a polyamide resin abrasive containing no epoxy resin, and it was also possible to easily remove thick burrs which were difficult to remove with the polyamide resin alone.
【００１３】[0013]
【発明の効果】実施例からも明らかなように、本発明の
研磨材は研磨力が優れ、耐久性も良好であった。また本
発明は従来廃棄されていたスプルー・ランナー等の不要
品をリサイクル利用することができ、産業廃棄物の削減
及び環境対策にもなるものである。As is clear from the examples, the abrasive of the present invention has excellent abrasive power and good durability. Further, the present invention can recycle unnecessary products such as sprues and runners which have been discarded in the past, thereby reducing industrial wastes and environmental measures.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ２９Ｂ 17/00 ＺＡＢ Ｂ２９Ｂ 17/00 ＺＡＢ Ｃ０８Ｋ 3/00 Ｃ０８Ｋ 3/00 Ｃ０８Ｌ 63/00 ＮＨＮ Ｃ０８Ｌ 63/00 ＮＨＮ ＮＫＴ ＮＫＴ Ｃ０９Ｋ 3/14 ５５０ Ｃ０９Ｋ 3/14 ５５０Ｌ ５５０Ｚ // Ｂ２９Ｋ 63:00 101:12 105:16 105:26 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code Agency reference number FI Technical display location B29B 17/00 ZAB B29B 17/00 ZAB C08K 3/00 C08K 3/00 C08L 63/00 NHN C08L 63 / 00 NHN NKT NKT C09K 3/14 550 C09K 3/14 550L 550Z // B29K 63:00 101: 12 105: 16 105: 26
Claims (4)
一に混合したエポキシ樹脂からなるエポキシ樹脂組成物
を加熱硬化して得た硬化物を粉砕し、熱可塑性樹脂に配
合し加熱混練し、得られた樹脂組成物を粉砕して粉粒体
とするか、あるいは押出し機を用いて小径ノズルから押
出し裁断して角柱状又は円柱状にペレット化してなるこ
とを特徴とする研磨材。1. A cured product obtained by heating and curing an epoxy resin composition comprising an epoxy resin in which an inorganic filler and / or an organic filler is uniformly mixed, is pulverized, blended with a thermoplastic resin, and heat-kneaded to obtain a cured product. An abrasive, characterized in that the obtained resin composition is pulverized into powder or granules, or extruded from a small-diameter nozzle using an extruder, cut and pelletized into a prismatic or cylindrical shape.
キシ樹脂成形材料を使用して成形する際に生じるスプル
ー・ランナー又は成形不良品又は使用済成形品等である
請求項１記載の研磨材。2. The polishing material according to claim 1, wherein the cured product of the epoxy resin composition is a sprue / runner, a defective molded product, a used molded product, or the like generated when molding using an epoxy resin molding material.
混合する熱可塑性樹脂が、熱可塑性樹脂複合シート又は
多層フィルムの端材である請求項１又は２記載の研磨
材。3. The abrasive according to claim 1, wherein the thermoplastic resin mixed with the cured product powder of the epoxy resin composition is an end material of a thermoplastic resin composite sheet or a multilayer film.
μｍ以下である請求項１、２又は３記載の研磨材。4. The cured resin powder has an average particle size of 150.
The abrasive according to claim 1, 2 or 3, which has a diameter of not more than μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15657696A JPH101547A (en) | 1996-06-18 | 1996-06-18 | Abrasive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15657696A JPH101547A (en) | 1996-06-18 | 1996-06-18 | Abrasive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH101547A true JPH101547A (en) | 1998-01-06 |
Family
ID=15630790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15657696A Pending JPH101547A (en) | 1996-06-18 | 1996-06-18 | Abrasive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH101547A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5470564U (en) * | 1977-10-28 | 1979-05-19 | ||
| JP2002346932A (en) * | 2001-05-21 | 2002-12-04 | Sumitomo Bakelite Co Ltd | Guranular thermosetting resinous abrasive material and manufacturing method thereof |
| US6495260B1 (en) | 1999-06-15 | 2002-12-17 | Sumitomo Bakelite Company Limited | Method of producing epoxy for molding semiconductor device, molding material, and semiconductor device |
| JP2003306664A (en) * | 2002-04-12 | 2003-10-31 | Mitsuboshi Belting Ltd | Resin composite abrasive material |
| KR100539483B1 (en) * | 2002-07-24 | 2005-12-28 | 주식회사 유진폴리텍크 | Tape For Sewing |
| JP2013053262A (en) * | 2011-09-06 | 2013-03-21 | Takayasu Co Ltd | Nylon resin composition |
| CN103509519A (en) * | 2013-04-06 | 2014-01-15 | 连新兰 | Epoxy resin abrasive paste |
| JP2018020500A (en) * | 2016-08-04 | 2018-02-08 | Ａｃａ株式会社 | Production method of regenerated filling fine particle |
-
1996
- 1996-06-18 JP JP15657696A patent/JPH101547A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5470564U (en) * | 1977-10-28 | 1979-05-19 | ||
| US6495260B1 (en) | 1999-06-15 | 2002-12-17 | Sumitomo Bakelite Company Limited | Method of producing epoxy for molding semiconductor device, molding material, and semiconductor device |
| JP2002346932A (en) * | 2001-05-21 | 2002-12-04 | Sumitomo Bakelite Co Ltd | Guranular thermosetting resinous abrasive material and manufacturing method thereof |
| JP2003306664A (en) * | 2002-04-12 | 2003-10-31 | Mitsuboshi Belting Ltd | Resin composite abrasive material |
| KR100539483B1 (en) * | 2002-07-24 | 2005-12-28 | 주식회사 유진폴리텍크 | Tape For Sewing |
| JP2013053262A (en) * | 2011-09-06 | 2013-03-21 | Takayasu Co Ltd | Nylon resin composition |
| CN103509519A (en) * | 2013-04-06 | 2014-01-15 | 连新兰 | Epoxy resin abrasive paste |
| JP2018020500A (en) * | 2016-08-04 | 2018-02-08 | Ａｃａ株式会社 | Production method of regenerated filling fine particle |
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