JPH10144836A - Cooling structure of semiconductor switch - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently cool down a semiconductor switch, and avoid electrolytic corrosion. SOLUTION: A semiconductor switch 3 fitted with cooling fins 10, 11 respectively on high and low pressure sides and a cooling fin 15 for cooling perfluorocarbon are fitted in a tank 13 internally containing the perfluorocarbon, so as to cool down the low pressure side cooling fin 11 and the perfluorocarbon cooling fin 15 by cooling water through the intermediary of water supply pipes 12, likewise the high pressure side cooling fin 10 by the perfluorocarbon 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for a semiconductor switch used in a pulse power supply for generating a short pulse of a high voltage and a large current.

[0002]

FIG. 3 is a circuit diagram of a conventional pulse power supply circuit. A capacitor 1 is initially charged by a high voltage DC power supply 2. The semiconductor switch 3 is controlled to be turned on according to the discharge cycle of the load 4. When the semiconductor switch 3 is turned on, the voltage of the capacitor 1 is applied to a series circuit of the magnetic switch 5 composed of a saturable reactor and the capacitor 6. By this voltage application, a current starts flowing through the magnetic switch 5 to charge the capacitor 6. This current excites the magnetic switch 5 and saturates above a certain value, causing the inductance to drop sharply. Due to this magnetic switch operation, the current from the capacitor 1 to the capacitor 6 rapidly rises,
, Pulse-compressed rapid charging is performed.

Similarly, the charge voltage of the capacitor 6 is pulse-compressed by the magnetic switch operation of the magnetic switch 7 to rapidly charge the capacitor 8, and the charge voltage of the capacitor 8 is pulse-compressed by the magnetic switch 9 to the load 4. Discharge.

When the semiconductor switch 3 is used in a pulse power supply circuit or the like as described above, the semiconductor switch 3
Therefore, cooling fins 10 and 11 are attached to the high and low pressure sides of the semiconductor switch 3, respectively, as shown in FIG.
1 was provided with a water pipe 12, and the cooling fins 11 and 12 were cooled by flowing water, thereby cooling the semiconductor switch 3.

[0005]

However, in the above-described conventional cooling structure for a semiconductor switch, if impure water is used, electrolytic corrosion occurs on the high pressure side of the semiconductor switch 3. Therefore, it is necessary to use pure water. However, it required a pure water facility and could not be used without the pure water facility.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a semiconductor switch cooling structure capable of effectively cooling a semiconductor switch without using pure water. Aim.

[0007]

According to a first aspect of the present invention, there is provided a cooling structure for a semiconductor switch, wherein perfluorocarbon is housed therein as a heat transfer medium, and cooling fins are mounted on a high pressure side and a low pressure side. The semiconductor switch and perfluorocarbon cooling fins are installed inside the tank, and the tank is introduced from outside the tank, and the low pressure side cooling fins of the semiconductor switch and the perfluorocarbon cooling fins are arranged outside the tank. And a water pipe through which the cooling water flows.

According to a second aspect of the present invention, there is provided a cooling structure for a semiconductor switch, wherein the cooling fins are mounted on the high and low pressure sides of the semiconductor switch, and are disposed on the cooling fins, and perfluorocarbon flows as a heat transfer medium. A flow pipe and a heat exchanger provided in the flow pipe to exchange heat between water and perfluorocarbon are provided.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 shows a cooling structure of a semiconductor switch according to a first embodiment, in which cooling fins 10 and 11 are provided on a high pressure side and a low pressure side, respectively.
The semiconductor switch 3 provided with the perfluorocarbon 1
4 (for example, Fluorinert, trade name, manufactured by Sumitomo 3M Limited) is appropriately fixed in a tank 13, and a cooling fin 15 for cooling perfluorocarbon is also fixed appropriately above the tank 13. The perfluorocarbon 14 is a liquid whose chemical formula is represented by C ₈ F ₁₈ or the like, does not contain hydrogen and chlorine atoms, and does not destroy the ozone layer. In addition, it is inert, has excellent insulating properties and thermal conductivity, and is optimal as a thermal conductive medium.

A water pipe 12 inserted into the tank 13 is provided on the cooling fin 11 on the low pressure side. The water pipe 12 is also provided on the cooling fin 15 and is led out of the tank 13.

In the above configuration, the low pressure side cooling fins 11
Is cooled mainly by water passing through the water pipe 12 (also cooled by the perfluorocarbon 14), whereby the low pressure side of the semiconductor switch 3 is also cooled. Further, the high-pressure side cooling fins 10 are cooled by the perfluorocarbon 14, whereby the high-pressure side of the semiconductor switch 3 is also cooled. On the other hand, since the temperature of the perfluorocarbon 14 also rises due to cooling, a water pipe 12 is provided to cool the perfluorocarbon 14 with water.

According to the first embodiment, since the high pressure side of the semiconductor switch 3 is cooled by the perfluorocarbon 14, no electrolytic corrosion occurs. Therefore, a pure water facility is not required.
Further, the perfluorocarbon 14 has good thermal conductivity like Freon, can efficiently cool the high pressure side of the semiconductor switch 3, and does not destroy the ozone layer.

Second Embodiment FIG. 2 shows a semiconductor switch cooling structure according to a second embodiment. Reference numeral 16 denotes a flow pipe for a perfluorocarbon 14 which is disposed continuously to each of the cooling fins 10 and 11. 16
Is provided with a heat exchanger 17 and a pump 18 for performing heat exchange between the perfluorocarbon 14 and water. The heat exchanger 17 is provided with a water pipe 19.

In the above configuration, the perfluorocarbon 14 circulates and flows through the flow pipe 16 by the drive of the pump 18, and the high-pressure side cooling fin 10 and the low-pressure side cooling fin 11
Is cooled by the perfluorocarbon 14. In the heat exchanger 17, heat exchange between the perfluorocarbon 14 flowing through the flow pipe 16 and the cooling water flowing through the water pipe 19 is performed, and the perfluorocarbon 14 is cooled.

According to the second embodiment, the cooling fins 10, 1
1 is cooled by the perfluorocarbon 14, and the high-pressure side and the low-pressure side of the semiconductor switch 3 are efficiently cooled. Also, no electrolytic corrosion occurs.

[0016]

As described above, according to the first aspect of the present invention, the high-pressure side,
A semiconductor switch having a cooling fin mounted on the low-pressure side is provided. The high-pressure side is efficiently cooled by perfluorocarbon, and no electrolytic corrosion occurs. The low-pressure side and the perfluorocarbon are cooled by cooling water through a water pipe.

According to the second aspect, the high-pressure side and the low-pressure side of the semiconductor switch are cooled by the perfluorocarbon cooled by the cooling water, so that the semiconductor switch is efficiently cooled and does not generate electrolytic corrosion.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a cooling structure of a semiconductor switch according to Embodiment 1 of the present invention.

FIG. 2 is a configuration diagram illustrating a cooling structure of a semiconductor switch according to a second embodiment.

FIG. 3 is a circuit diagram of a pulse power supply circuit.

FIG. 4 is a perspective view of a cooling structure of a conventional semiconductor switch.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 3 ... Semiconductor switch 10 ... High-pressure side cooling fin 11 ... Low-pressure side cooling fin 12,19 ... Water pipe 13 ... Tank 14 ... Perfluorocarbon 15 ... Perfluorocarbon cooling cooling fin 16 ... Flow pipe 17 ... Heat exchanger

Claims (2)

[Claims] A tank in which perfluorocarbon is housed as a heat transfer medium and cooling fins are mounted on a high pressure side and a low pressure side, respectively, and a cooling fin for cooling perfluorocarbon is provided inside; In addition to being introduced from the outside of the tank, the cooling switch is provided on the low-pressure side cooling fin of the semiconductor switch and the cooling fin for cooling the perfluorocarbon, and is provided outside the tank, and has a water pipe through which cooling water flows. Cooling structure for semiconductor switches. 2. Cooling fins respectively attached to the high pressure side and the low pressure side of the semiconductor switch, a flow pipe arranged in each cooling fin, through which perfluorocarbon flows as a heat transfer medium, and a flow pipe. A cooling structure for a semiconductor switch, comprising: a heat exchanger provided for performing heat exchange between water and perfluorocarbon.