JPH10135282A - Probe card provided with wafer mounting means - Google Patents

Abstract

PROBLEM TO BE SOLVED: To quickly complete a preparing work which is performed for failure position analysis, in order to perform heat generating analysis, optical pumping current analysis, etc., to an integrated circuit chip in a wafer, by making the other side surface of the integrated circuit chip observable. SOLUTION: A wafer 5 is fixed on a wafer mounting card 4 with a clamper 7, together with a wafer chuck 6. As a matter of course, the fixing is so performed that the wafer 5 and the wafer chuck 6 can be moved by a fine adjustment equipment 9. The wafer mounting card 4 is set on a fixing adjustment equipment, and the fine adjustment equipment 9 is so operated that each pin electrode of a probe aggregate 3 coincides with the position of each electrode pad of an integrated circuit chip as an object of failure position analysis in the wafer 5 by using an optical system. After that, electrical contact of the probe aggregate 3 and electrode pads is ensured by using an elevating mechanism, and the preparing work is completed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a probe card used for failure location analysis performed on an integrated circuit chip in a wafer.

[0002]

2. Description of the Related Art Conventionally, a failure location of an integrated circuit chip is estimated by a light emission analysis using an emission microscope, a heat generation analysis using an infrared microscope, and the like, and an OBIC (Optical Beam induced Current) using a laser microscope. A technique such as current analysis is used. These methods utilize the fact that infrared light easily passes through the Si substrate of the integrated circuit chip, and can perform a failure position analysis from both the front surface and the back surface of the integrated circuit chip. However, in all of these methods, it is necessary to detect a current while applying a predetermined voltage to the integrated circuit chip, and it is essential to electrically connect the integrated circuit chip and the analyzer through pad electrodes of the integrated circuit chip. Condition. When performing a failure position analysis from the back surface, it is difficult to probe the pad electrode.Therefore, after performing a mold package, the back surface is polished to expose the Si substrate, and the failure position analysis may be performed on the polished surface. Is being done. With this method, failure position analysis in a wafer state cannot be performed. To solve such a problem, for example, Japanese Unexamined Patent Publication No. Hei 7-14898 discloses that an integrated circuit chip is electrically measured from the front surface while the wafer is in a wafer state, and light emission from the back surface and light irradiation to the back surface are performed. It describes observation of phenomena and the like caused by the phenomenon and a mechanism for realizing the observation.

Japanese Patent Application Laid-Open No. Hei 5-196666 discloses a probe card for testing an integrated circuit chip in a wafer, which facilitates replacement work which must be performed for each type of integrated circuit chip. For this reason, there is described a probe card composed of a mother card and an annular daughter card so that the annular daughter card can be easily attached to and detached from the mother card.

[0004]

However, when performing the above-described failure position analysis on a wide variety of wafers, preparation work for the failure position analysis device is required for each wafer, and the operation rate of the failure position analysis device is improved. It is a factor that hinders.

[0005]

A probe card provided with a wafer mounting means according to the present invention comprises: a probe assembly fixed to a substrate and electrically connected to a plurality of pad electrodes provided on one surface of an integrated circuit chip; A wafer mounting means for holding a wafer including the integrated circuit chip in a predetermined position at a predetermined position, and observing the other side of the integrated circuit chip. Further, the probe assembly is configured to be separable from the substrate.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 FIG. Hereinafter, a probe card provided with a wafer mounting means according to the present invention (hereinafter simply referred to as an analysis card)
The embodiment will be described with reference to the drawings. FIG. 1 is a structural view showing the analysis card in a front view and a cross-sectional view. FIG. 2 shows an optical system such as an optical microscope when the analysis card is set on a mounting adjustment device for mounting a wafer to be analyzed on the analysis card according to the present invention. FIG. 4 is a layout diagram showing a relationship between cards. In the figure,
1 is an analysis card, 2 is a mother card, 3 is a probe assembly having a plurality of needle-shaped electrodes mounted on the mother card 2, 4 is a wafer mounting card for holding the wafer 5 by sandwiching it in the wafer chuck 6, and The portion is provided with an opening 4 ′ for bringing the probe assembly 3 into contact with the electrode pad of the integrated circuit chip to be analyzed in the wafer 5. 7 is a wafer chuck 6 on which the wafer 5 is mounted.
Is attached to the wafer mounting card 4 and has an opening 7 'for observation in the center. 8 elevating mechanism for raising and lowering the wafer mounted card 4 against the mother card 2, 9 in the fine motion device for alignment of the wafer 5, the wafer 5 and the wafer chuck 6 and a push rod 9 ₁ and the spring 9 _second wafer mounted cards and fine movement device 9a for biasing to move in the axial direction with respect to 4, fine movement device 9a axially wafer 5 and the wafer chuck 6 with a screw rod 9 ₃ pass this placed on the axis of the , And two sets of fine movement devices 9b are provided in the two axial directions orthogonal to each other on the wafer mounting card 4. Two fine movement devices 9 in each axial direction
turning the b threaded rod 9 ₃ in the same direction the wafer 5 and the wafer chuck 6 can be finely moved in the axial direction, the wafer 5 and the wafer chuck 6 turning the the turning or two only one in opposite directions It can be finely moved in the rotation direction. Although not shown, the mother card 2 is provided with an electrical connector and the like for transmitting and receiving signals and the like to and from the failure position analysis device in addition to the above. 10 is an optical system, 2
Reference numeral 0 denotes an analysis card fixing base provided in the mounting adjustment device, and the analysis card 1 is mounted using fastening means such as screws.

Next, a procedure for setting an analysis target wafer on the analysis card 1 and performing an analysis operation will be described. The wafer 5 to be analyzed is mounted on the wafer mounting card 4 by the clamper 7 together with the wafer chuck 6. Needless to say, it is necessary to fix the wafer 5 and the wafer chuck 6 to such an extent that they can be moved by the operation of the fine movement device 9. This is set in the mounting adjustment device, and the optical system 10 moves the needle-shaped electrodes of the probe assembly 3 and finely adjusts them so that the positions of the electrode pads of the integrated circuit chip to be analyzed for the failure position in the wafer 5 are matched. The device 9 is operated. Thereafter, electrical contact between the probe assembly 3 and the electrode pads is secured by the lifting mechanism, and the process is completed. As described above, a wafer to be analyzed is set on the analysis card 1 and mounted on the failure position analysis device to perform a desired failure analysis. Although it has been described that the analysis target wafer is set on the analysis card 3 using the mounting adjustment device, it goes without saying that the wafer can be set on the analysis device.

In the above description, the probe assembly 3 is attached to the mother card 2. However, as shown in FIG. 3, a probe adapter 3 'to which the probe assembly 3 is attached is provided, and this is attached to the mother card 2. You may make it attach to. In this way, it is possible to deal with each type of integrated circuit chip by exchanging the probe adapter 3 'according to the type of integrated circuit chip.

Further, although the clamper 7 is used for fixing the wafer chuck 6 to the wafer mounting card 4, the clamper 7 may be omitted by utilizing a magnetic attraction force. For example, a permanent magnet may be provided on one of the contact surfaces of the wafer mounting card 4 and the wafer chuck 6, and the other may be made of a magnetic material. Of course, it is also possible to use electromagnets instead of permanent magnets. FIG. 4 shows an example of such a configuration.

[0010]

According to the present invention, there is provided a probe card provided with a wafer mounting means, comprising: a probe assembly fixed to a substrate and electrically connected to a plurality of pad electrodes provided on one surface of an integrated circuit chip; Having a wafer mounting means for holding the wafer including the integrated circuit chip at a predetermined position in a predetermined position and observing the other side of the integrated circuit chip so that the integrated circuit chip in the wafer can be analyzed for heat generation or the like. It is possible to quickly complete the preparation work performed on the failure position analysis device for performing the OBIC analysis and the like. Of course, like the integrated circuit chip compatible with LOC package, the electrode pad is located in the center, so that the probe blocks the observation field of view from the front side or blocks the light to the front side. Failure position analysis from the back side of an integrated circuit chip containing a large amount of material can be easily performed.

Further, since the probe assembly is configured to be separable from the substrate, it is possible to cope with various types of integrated circuit chips by exchanging the portion.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing an embodiment of a probe card provided with a wafer mounting means according to the present invention.

FIG. 2 is a layout diagram for explaining a method of using the probe card provided with the wafer mounting means shown in FIG.

FIG. 3 is a configuration diagram showing a modified example of the probe card provided with the wafer mounting means shown in FIG. 2;

FIG. 4 is a configuration diagram illustrating another modified example of the probe card including the wafer mounting unit illustrated in FIG. 2;

[Explanation of symbols]

1 Probe card with wafer mounting means 2
Mother card 3 Probe assembly 4 Wafer mounted card 5
Wafer 6 wafer chuck 7 clamper 8
Elevating mechanism 9 Fine movement device 10 Optical system 20
Card holder

Claims (2)

[Claims] A probe assembly fixed to a substrate and electrically connected to a plurality of pad electrodes provided on one surface of the integrated circuit chip; and a wafer including the integrated circuit chip at a predetermined position with respect to the substrate. A probe card having a wafer mounting means, comprising: a wafer mounting means for gripping the integrated circuit chip in a different posture, wherein the other side of the integrated circuit chip can be observed. 2. The probe card according to claim 1, wherein the probe assembly is configured to be separable from the substrate.