JPH10133229A - Method and device for manufacturing liquid crystal panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent electrification and electrostatic destruction in a TFT (thin film transistor) in a production process of a liquid crystal panel. SOLUTION: A support part 7 of a transfer tool 6 supporting a glass substrate 2 with a TFT is made a conductive member, and the support part 7 consisting of this conductive member is grounded through the conductive transfer tool 6. When the glass substrate 3 with the TFT is transferred while from an instant when the transfer tool 6 rises, and lifts the glass substrate 3 with the TFT up to the end of the transferring, the support part 7 is in contact with the edge of the glass substrate 3 with the TFT, and static electricity caused by peeling the glass substrate 3 with the TFT from a plate 1 is set free to the ground through the conductive support member 7 and the transfer tool 6, and the electrification and electrostatic destruction in the TFT formed on the glass substrate 3 with the TFT are prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method and an apparatus for manufacturing a liquid crystal panel using thin film transistors (hereinafter referred to as “TFTs”) as switching elements.

[0002]

2. Description of the Related Art In recent years, a liquid crystal panel, particularly an active matrix type liquid crystal panel which drives a liquid crystal by using a TFT as a switching element, has been remarkably developed, and a liquid crystal panel manufacturing apparatus has been developed in order to improve the production yield as a liquid crystal panel. Improvements have been made. Here, in particular, as a factor of deteriorating the production yield of the liquid crystal panel, the problem of generation of static electricity in the production process and TFT destruction due to the generation of static electricity have been highlighted.

FIG. 2A is a plan view of a conventional liquid crystal panel manufacturing apparatus, and FIGS. 2B and 2C are side views showing the operation (conveyance) process. In FIG. 2, 1 is a plate,
2 is a transfer tool, 3 is a TFT on a glass substrate
The glass substrate 4 with TFT in a state in which is formed is a supporting portion made of an insulator which is provided on the transfer tool 2 and supports the glass substrate 3 with TFT at the time of transfer, and the reference numeral 5 is placed on the plate 1 of the glass substrate 3 with TFT. This is a position setting pin for setting the position.

[0004] This conventional liquid crystal panel manufacturing apparatus uses a TF.
From the state where the position of the glass substrate 3 with T is adjusted by the position adjusting pins 5 and is mounted and sucked on the vacuum suction type plate 1, the transfer tool 2 ascends as shown in FIG.
After the glass substrate with TFT 3 is lifted by the contact portion 4 of the transfer tool 2, it is transferred to the next process section as shown in FIG. 2C.

In this manufacturing apparatus, when the transfer tool 2 is lifted and the glass substrate 3 with TFT is lifted, static electricity is inevitably generated due to peeling of the glass substrate 3 with TFT from the plate 1, and this static electricity is discharged. As a result, an excessive current instantaneously flows through the TFT of the glass substrate 3 with the TFT,
Will be electrostatically damaged. As a countermeasure against this electrostatic destruction,
Thorough control of temperature and humidity in the process was performed, and static electricity was removed by ion blow installed in the vicinity.

[0006]

However, the above-mentioned conventional countermeasures against electrostatic breakdown can provide an effect on relatively small static electricity, but have a sufficient effect on static electricity enough to cause electrostatic breakdown. Could not be obtained. In addition, depending on the manufacturing apparatus, there is an apparatus in which an ion blow cannot be installed.

An object of the present invention is to provide a TF in a manufacturing process.
An object of the present invention is to provide a method and an apparatus for manufacturing a liquid crystal panel capable of preventing charging and electrostatic breakdown of T.

[0008]

A method of manufacturing a liquid crystal panel according to the present invention is a method of manufacturing a liquid crystal panel in which at least a glass substrate is lifted up from a plate holding a glass substrate on which a TFT is formed by a transfer tool and transferred. The grounding conductive member is brought into contact with the edge of the glass substrate when the glass substrate is lifted at least by the transfer tool.

According to this manufacturing method, when at least the glass substrate is lifted from above the plate by the transfer tool, the grounded conductive member is brought into contact with the edge of the glass substrate so that the glass substrate is transferred from the plate during the transfer of the glass substrate. Static electricity generated when the substrate is peeled off and charged on the glass substrate can be released from the conductive member to the ground, and the charging and electrostatic breakdown of the TFT formed on the glass substrate can be prevented.

An apparatus for manufacturing a liquid crystal panel according to the present invention includes a liquid crystal having at least a plate for holding a glass substrate on which a TFT is formed, and a transfer tool for supporting an end of the glass substrate and lifting and transferring the glass substrate from above the plate. A panel manufacturing apparatus, wherein a portion of a transfer tool supporting a glass substrate is formed of a conductive member, and the conductive member is grounded.

According to this structure, the portion of the transfer tool that supports the end of the glass substrate is made of a conductive member, and the conductive member is grounded, so that the glass substrate is peeled off from the plate when the glass substrate is transferred. The static electricity generated on the glass substrate during the operation can be released from the conductive member to the ground, and the TFT formed on the glass substrate can be prevented from being charged and electrostatically damaged.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1A is a plan view of an apparatus for manufacturing a liquid crystal panel according to an embodiment of the present invention.
(B) is a side view showing a process of the operation (conveyance).
In FIG. 1, reference numeral 1 denotes a vacuum suction type plate, 3 denotes a glass substrate with a TFT in which at least a TFT is formed on a glass substrate, and 5 denotes a position for defining a position of the glass substrate with a TFT 3 placed on the plate 1. The setting pin 6 is a rail-shaped conductive transfer tool that can transfer four glass substrates 3 with TFTs at a time.
It is a support portion made of a conductive member that supports the glass substrate 3 with T.

The apparatus for manufacturing a liquid crystal panel shown in FIG. 1 is a pre-curing furnace for an alignment film, in which no ion blow can be installed, four vacuum suction type plates 1 are provided, and no countermeasures against static electricity are taken. , Very large static electricity is generated on the glass substrate 3 with TFT. Therefore, in this embodiment, as a countermeasure against static electricity, the support 7 of the transfer tool 6 that supports the end of the glass substrate 3 with a TFT is made to be a conductive member, and the support 7 made of this conductive member is made to be conductive. It is grounded via the tool 6. In order to ground the transfer tool 6, a flexible ground wire may be used, or the transfer tool 6 may slide on a ground plate, for example.

According to this embodiment, during the transfer of the glass substrate 3 with the TFT, from the moment when the transfer tool 6 rises and lifts the glass substrate 3 with the TFT until the end of the transfer (that is, the support portion 7 is (While it is in contact with the glass substrate 3), the static electricity on the glass substrate 3 with TFT generated by peeling the glass substrate 3 with TFT from the plate 1 is transferred via the conductive support 7 and the transfer tool 6. The TFT can be released to the ground, and the TFT formed on the glass substrate with TFT 3 can be prevented from being charged and electrostatically damaged.

The charged glass substrate 3 with TFT is
Excessive current may flow through the TFT because it is in contact with the grounded support portion 7, but the portion that is in contact with the support portion 7 is an insulating glass substrate and is further away from the TFT. Since the TFTs are in contact at the edge of the glass substrate, no abrupt current flows through the TFT, and the TFT is not damaged.

In the above-described embodiment, the grounding of the support portion 7 made of a conductive material in contact with the glass substrate 3 with the TFT is performed via the conductive transfer tool 6, but the present invention is not limited to this. Needless to say, the same effect can be obtained if the unit 7 is grounded. Further, even if the supporting portion 7 is not grounded, at least when the glass substrate 3 with TFT is lifted from the plate 1, a grounded conductive member other than the supporting portion 7 is attached to the glass substrate end of the glass substrate 3 with TFT. The same effect can be obtained by contacting.

[0017]

According to the liquid crystal panel manufacturing method of the present invention, the grounding conductive member is brought into contact with the edge of the glass substrate when the glass substrate is lifted at least from the plate by the transfer tool, so that the glass substrate can be transferred during the transfer. The static electricity generated when the glass substrate is peeled off from the plate and charged on the glass substrate can be released from the conductive member to the ground, and the charging and electrostatic breakdown of the TFT formed on the glass substrate can be prevented. .

According to the liquid crystal panel manufacturing apparatus of the present invention, the portion of the transfer tool supporting the end of the glass substrate is formed of a conductive member, and the conductive member is grounded.
When the glass substrate is transported, the static electricity generated when the glass substrate is peeled off from the plate and charged on the glass substrate can be released from the conductive member to the ground, and the charging and electrostatic breakdown of the TFT formed on the glass substrate can be prevented. Can be prevented.

[Brief description of the drawings]

FIG. 1A is a plan view of an apparatus for manufacturing a liquid crystal panel according to an embodiment of the present invention, and FIG. 1B is a side view showing the operation (transportation) process.

FIG. 2A is a plan view of a conventional liquid crystal panel manufacturing apparatus, and FIGS. 2B and 2C are side views showing a process of the operation (conveyance).

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Plate 3 Glass substrate with TFT 5 Positioning pin 6 Conductive transfer tool 7 Support part (conductive member)

Claims (2)

[Claims] 1. A method of manufacturing a liquid crystal panel in which a glass substrate on which at least a thin film transistor is formed is held and lifted by a transfer tool to transfer the glass substrate from above a plate holding the glass substrate, wherein at least the glass substrate is lifted by the transfer tool. A method for manufacturing a liquid crystal panel, comprising: contacting a grounded conductive member with an end of the glass substrate. 2. A liquid crystal panel manufacturing apparatus comprising: a plate for holding at least a glass substrate on which a thin film transistor is formed; and a transfer tool for supporting an end of the glass substrate and lifting and transferring the glass substrate from above the plate. An apparatus for manufacturing a liquid crystal panel, wherein a portion of the transfer tool that supports the glass substrate is a conductive member, and the conductive member is grounded.