JPH10132778A - Manufacture of silver-silver chloride electrode having silver chloride layer on surface of silver substrate - Google Patents

Manufacture of silver-silver chloride electrode having silver chloride layer on surface of silver substrate

Info

Publication number
JPH10132778A
JPH10132778A JP8292435A JP29243596A JPH10132778A JP H10132778 A JPH10132778 A JP H10132778A JP 8292435 A JP8292435 A JP 8292435A JP 29243596 A JP29243596 A JP 29243596A JP H10132778 A JPH10132778 A JP H10132778A
Authority
JP
Japan
Prior art keywords
silver
substrate
layer
chloride
lead wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8292435A
Other languages
Japanese (ja)
Inventor
Masami Suzuki
正美 鈴木
Mitsuo Ishikawa
光男 石川
Yoichiro Hatakei
洋一郎 畑井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Corrosion Engineering Co Ltd
Original Assignee
Nippon Corrosion Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Corrosion Engineering Co Ltd filed Critical Nippon Corrosion Engineering Co Ltd
Priority to JP8292435A priority Critical patent/JPH10132778A/en
Publication of JPH10132778A publication Critical patent/JPH10132778A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To manufacture a high-precision silver.silver chloride electrode by electrolytically oxidizing a silver substrate worked mechanically and polished chemically, in a solution containing chloride ions, and chloridizing the surface layer part of the silver substrate. SOLUTION: A silver substrate obtained by cutting a silver round bar of a diameter 10mm and a purity 99.9% into a length of 40mm for example, and degreasing, wet-polishing, and washing it, connecting a lead wire to its one side after that, and covering the periphery of the lead wire connected part with a thermally shrinking tube with an adhesive leaving a specified test surface as it is, and a silver plate as an electrode are prepared. This silver substrate with a lead wire is polished chemically by dissolving its surface, by dipping it in a mixed solution, in a agitated state, composed of 10% of saturated chromium oxide (valence VI) solution, 5% of hydrochloric acid, and the remaining of distilled water for about a minute. The silver substrate with a lead wire obtained by polishing and the silver plate are dipped in a 0.75N hydrochloric acid solution, and a current is caused to flow by a current density of 1.0mA/cm<2> for about one hour with the silver substrate with a lead wire as an anode and with the silver plate as a cathode. Consequently, it becomes possible to manufacture silver-silver chloride electrodes having silver chloride layers on the surfaces of silver substrates with lead wires.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、電解質中の金属
の電位や、電解質中に流れる電流の計測、または生体の
微小な電位変化の計測などに用いられる高精度の銀基体
の表面に塩化銀層を有する銀・塩化銀電極(以下、銀・
塩化銀電極という)の製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for measuring the potential of a metal in an electrolyte, the current flowing in the electrolyte, or the measurement of minute potential changes in a living body. Silver / silver chloride electrode (hereinafter referred to as silver / silver chloride
A silver chloride electrode).

【0002】[0002]

【従来の技術】海水などの電解質中における金属電位の
測定、電解質中に流れる電流の測定、または生体の微小
な電位変化の電気信号の計測のためのセンサーとして、
従来より銀・塩化銀電極が用いられている。この銀・塩
化銀電極を製造する方法として、機械加工して得られた
銀基体を塩化物イオンを含む溶液中で電解することによ
り銀基体表面に塩化銀層を形成する方法、あるいは銀基
体を溶融塩化銀に浸漬して銀基体表面に塩化銀層を形成
する方法などが知られている。
2. Description of the Related Art As a sensor for measuring a metal potential in an electrolyte such as seawater, measuring a current flowing in the electrolyte, or measuring an electric signal of a minute potential change of a living body,
Conventionally, silver / silver chloride electrodes have been used. As a method for producing the silver / silver chloride electrode, a method of forming a silver chloride layer on the surface of a silver substrate by electrolyzing a silver substrate obtained by machining in a solution containing chloride ions, or a method of forming a silver substrate. A method of forming a silver chloride layer on the surface of a silver substrate by immersion in molten silver chloride is known.

【0003】これら従来の銀・塩化銀電極の製造方法で
製造された銀・塩化銀電極の誤差は、通常、数百μV〜
数mVであり、一方、電解質中における金属の電位測定
において計測される電位は数百mVであるから、上記程
度の誤差は特に問題とはならない。またpHセンサーや
その他のイオン選択性センサーとの組み合わせによる電
位測定では標準液による校正操作が行われるので、この
場合も上記程度の誤差は特に問題とはならない。
[0003] The error of the silver / silver chloride electrode manufactured by the above-described conventional silver / silver chloride electrode manufacturing method is usually several hundreds of microvolts.
On the other hand, since the potential measured in measuring the potential of the metal in the electrolyte is several hundred mV, the above-mentioned error does not cause any particular problem. In addition, in the potential measurement using a combination with a pH sensor or another ion-selective sensor, a calibration operation using a standard solution is performed. Therefore, in this case, the above-described error does not cause any particular problem.

【0004】[0004]

【発明が解決しようとする課題】しかし、心電図や脳波
などの計測あるいは電解液中を流れる電流の計測などで
測定される電位差は数mV以下であるため、従来の方法
で製造された銀・塩化銀電極では十分な精度の計測が出
来ないという欠点があった。
However, since the potential difference measured by measuring an electrocardiogram, an electroencephalogram, or the like, or measuring a current flowing in an electrolytic solution is less than several mV, the silver / chloride produced by the conventional method is used. The silver electrode has a drawback that it is not possible to measure with sufficient accuracy.

【0005】[0005]

【課題を解決するための手段】そこで、本発明者らは、
かかる従来の方法で製造された銀・塩化銀電極の誤差要
因を解明すべく種々の試験研究を行った結果、(a)切
断や研磨などの機械加工を施して得られた銀基体には、
銀基体表面に微細な傷、加工変質層、組織変化などが生
じ、これら機械加工の影響が主たる誤差の原因である
が、切断や研磨などの機械加工を施して得られた銀基体
を化学研磨または電解研磨すると、機械加工により生じ
た銀基体表面の微細な傷、加工変質層、組織変化などが
除去され、これら化学研磨または電解研磨を施した銀基
体を塩化物イオンを含む溶液中で電解酸化し、銀基体の
表層部分を塩化して得られた銀・塩化銀電極は測定精度
が大幅に向上すると共に測定値のばらつきが大幅に減少
する、(b)前記銀基体の表面に形成される塩化銀層に
変換される銀基体表層部分の結晶粒径は微細であるほど
好ましく、微細な結晶粒を有する銀基体表層部分を得る
には、銀基体の表層部分を塩化して塩化銀層を形成し、
この塩化銀層を還元することにより得ることができる、
(c)この銀基体の表層部分を塩化して塩化銀層を形成
したのち、この塩化銀層を還元して銀層を形成する操作
は、繰り返し行うほど微細な結晶粒を有する銀基体表層
部分を得ることができる、(d)また、機械加工を施し
て得られた銀基体に化学研磨または電解研磨を施し、こ
の化学研磨または電解研磨を施した銀基体の表面に、メ
ッキ法、ドライプレーティング法などにより銀被覆層を
形成し、この銀被覆層の表層部分または全部を塩化して
を塩化銀層に変換することにより塩化銀層を形成し、か
かる塩化銀層を形成した銀・塩化銀電極は測定精度が大
幅に向上すると共に、銀・塩化銀電極による測定値のば
らつきを防止することが出来る、という研究結果が得ら
れたのである。
Means for Solving the Problems Accordingly, the present inventors have:
As a result of conducting various tests and researches to elucidate the error factors of the silver / silver chloride electrode manufactured by such a conventional method, (a) the silver substrate obtained by performing machining such as cutting and polishing includes:
Fine scratches, damaged layers, and structural changes occur on the surface of the silver substrate, and the effects of these machining processes are the main causes of errors.The silver substrates obtained by performing machining such as cutting and polishing are chemically polished. Alternatively, electropolishing removes fine scratches, deformed layers, and structural changes on the surface of the silver substrate caused by machining, and the silver substrate that has been subjected to chemical polishing or electrolytic polishing is electrolyzed in a solution containing chloride ions. The silver / silver chloride electrode obtained by oxidizing and chlorinating the surface layer of the silver substrate greatly improves the measurement accuracy and greatly reduces the dispersion of the measured values. (B) Formed on the surface of the silver substrate The crystal grain size of the silver substrate surface layer portion converted to the silver chloride layer is preferably as fine as possible. In order to obtain a silver substrate surface layer portion having fine crystal grains, the silver substrate surface layer portion is salified to obtain a silver chloride layer. To form
It can be obtained by reducing this silver chloride layer,
(C) After the surface layer of the silver substrate is salified to form a silver chloride layer, the operation of reducing the silver chloride layer to form a silver layer is repeated as the silver substrate surface layer has finer crystal grains. And (d) subjecting the silver substrate obtained by mechanical processing to chemical polishing or electrolytic polishing, and applying a plating method, dry plating to the surface of the chemically or electrolytically polished silver substrate. A silver coating layer is formed by a method or the like, and a silver chloride layer is formed by converting a surface portion or the entire surface of the silver coating layer to a silver chloride layer to form a silver chloride layer. Research results have shown that the electrodes can significantly improve the measurement accuracy and prevent variations in measured values due to silver / silver chloride electrodes.

【0006】この発明は、かかる研究結果に基づいて成
されたものであって、(1)機械加工して得られた銀基
体に化学研磨または電解研磨を施し、この化学研磨また
は電解研磨を施した銀基体を塩化物イオンを含む溶液中
で電解酸化して銀基体の表層部分を塩化する銀・塩化銀
電極の製造方法、(2)機械加工して得られた銀基体に
化学研磨または電解研磨を施し、この化学研磨または電
解研磨を施した銀基体を塩化物イオンを含む溶液中で電
解酸化して銀基体の表層部分を塩化することにより銀基
体の表面に塩化銀層を形成し、得られた銀基体表面の塩
化銀層を電解還元することにより微細な結晶粒を有する
銀層に変換し、この変換して得られた微細な結晶粒を有
する銀層を再び電解酸化して塩化銀層を形成する銀・塩
化銀電極の製造方法、(3)機械加工して得られた銀基
体に化学研磨または電解研磨を施し、この化学研磨また
は電解研磨を施した銀基体を塩化物イオンを含む溶液中
で電解酸化して銀基体の表層部分を塩化することにより
銀基体の表面に塩化銀層を形成し、得られた銀基体表面
の塩化銀層を電解還元することにより微細な結晶粒を有
する銀層に変換し、この塩化銀層を電解還元することに
より微細な結晶粒を有する銀層に変換する操作を2回以
上繰り返して一層微細な結晶粒を有する銀層を形成した
のち、得られた一層微細な結晶粒を有する銀層を電解酸
化して塩化銀層を形成する銀・塩化銀電極の製造方法、
に特徴を有するものである。
The present invention has been made on the basis of the above research results. (1) A silver substrate obtained by machining is subjected to chemical polishing or electrolytic polishing, and the chemical or electrolytic polishing is performed. A method for producing a silver / silver chloride electrode in which the surface of the silver substrate is chlorinated by electrolytically oxidizing the silver substrate thus obtained in a solution containing chloride ions, (2) chemically polishing or electrolytically polishing the silver substrate obtained by machining. Polishing, the silver substrate subjected to the chemical polishing or the electrolytic polishing is electrolytically oxidized in a solution containing chloride ions to form a silver chloride layer on the surface of the silver substrate by salting the surface layer portion of the silver substrate, The obtained silver chloride layer on the surface of the silver substrate is electrolytically reduced to be converted into a silver layer having fine crystal grains, and the silver layer having fine crystal grains obtained by the conversion is electrolytically oxidized again to obtain a chloride layer. How to make silver / silver chloride electrode to form silver layer (3) The silver substrate obtained by machining is subjected to chemical polishing or electropolishing, and the chemically or electropolished silver substrate is electrolytically oxidized in a solution containing chloride ions to form a surface layer of the silver substrate. A silver chloride layer is formed on the surface of the silver substrate by chlorinating the portion, and the silver chloride layer on the surface of the obtained silver substrate is electrolytically reduced to be converted into a silver layer having fine crystal grains. The operation of converting to a silver layer having fine crystal grains by electrolytic reduction is repeated twice or more to form a silver layer having finer crystal grains, and then the obtained silver layer having finer crystal grains is obtained. A method for producing a silver / silver chloride electrode for forming a silver chloride layer by electrolytic oxidation of
It is characterized by the following.

【0007】前述のように、切断や研磨などの機械加工
によって生じた微細な研削傷、加工変質層、組織変化な
どによる影響を及ぼさない新しい銀層を銀基体表面に形
成する必要があり、この新しい銀層を銀基体表面に形成
する手段としては電気メッキもしくは無電解メッキなど
のメッキ方法、または真空蒸着もしくはイオンプレーテ
ィングなどのドライプレーティング法により銀被覆層を
形成する方法が知られている。銀被覆層を形成する方法
としてドライプレーティング法よりもメッキ方法の方が
好ましく、メッキ方法の内の電気メッキ方法と無電解メ
ッキ方法を比べると、電気メッキ方法は電流密度および
メッキ液濃度により比較的自由に銀被覆層の結晶粒径を
微細にすることができるので、この発明の銀・塩化銀電
極の製造方法では電気メッキ方法で銀被覆層を形成する
ことか好ましい。
[0007] As described above, it is necessary to form a new silver layer on the surface of the silver substrate which is not affected by minute grinding flaws caused by machining such as cutting and polishing, a layer affected by processing, and a change in structure. As a means for forming a new silver layer on the surface of a silver substrate, a plating method such as electroplating or electroless plating, or a method of forming a silver coating layer by dry plating such as vacuum evaporation or ion plating is known. The plating method is more preferable than the dry plating method as a method of forming the silver coating layer. When comparing the electroplating method and the electroless plating method among the plating methods, the electroplating method has a relatively high current density and plating solution concentration. Since the crystal grain size of the silver coating layer can be freely reduced, it is preferable to form the silver coating layer by an electroplating method in the method for producing a silver / silver chloride electrode of the present invention.

【0008】従って、この発明は、(4)機械加工して
得られた銀基体を化学研磨または電解研磨したのち銀基
体表面に銀被覆層を形成し、この銀被覆層を形成した銀
基体を塩化物イオンを含む溶液中で電解酸化することに
より銀被覆層を塩化して銀基体表面に塩化銀層を形成す
る銀・塩化銀電極の製造方法、(5)機械加工して得ら
れた銀基体を化学研磨または電解研磨したのち電気メッ
キにより銀基体表面に銀被覆層を形成し、この銀被覆層
を形成した銀基体を塩化物イオンを含む溶液中で電解酸
化することにより銀被覆層を塩化して銀基体表面に塩化
銀層を形成する銀・塩化銀電極の製造方法、に特徴を有
するものである。
Accordingly, the present invention provides (4) a method of chemically polishing or electrolytically polishing a silver substrate obtained by machining, forming a silver coating layer on the surface of the silver substrate, and forming the silver substrate having the silver coating layer formed thereon. A method for producing a silver / silver chloride electrode for forming a silver chloride layer on the surface of a silver substrate by salifying a silver coating layer by electrolytic oxidation in a solution containing chloride ions, (5) silver obtained by machining After the substrate is chemically or electrolytically polished, a silver coating layer is formed on the surface of the silver substrate by electroplating, and the silver substrate having the silver coating layer formed thereon is electrolytically oxidized in a solution containing chloride ions to form a silver coating layer. And a method for producing a silver / silver chloride electrode for forming a silver chloride layer on the surface of a silver substrate by salification.

【0009】[0009]

【発明の実施の形態】直径10mm、純度:99.9%
の銀丸棒を40mmの長さに切断し、脱脂、湿式研磨、
洗浄した後、片側にリード線を接続し、所定の試験面を
残してリード線接続部周囲を接着剤付き熱収縮チューブ
で被覆した銀基体(以下、リード線付き銀基体と云う)
を用意した。さらに電極として銀板を用意した。
BEST MODE FOR CARRYING OUT THE INVENTION 10 mm in diameter, purity: 99.9%
Of silver round bar of 40mm length, degreasing, wet polishing,
After washing, a lead wire is connected to one side, and a silver base covered with a heat-shrinkable tube with an adhesive around the lead wire connection portion except for a predetermined test surface (hereinafter referred to as a silver base with a lead).
Was prepared. Further, a silver plate was prepared as an electrode.

【0010】実施例1 用意したリード線付き銀基体を、酸化クロム(VI価)飽
和溶液:10%、塩酸:5%、残部:蒸留水からなる混
合溶液に撹拌状態で1分間浸漬することにより表面を溶
解し化学研磨した。化学研磨して得られたリード線付き
銀基体と銀板を0.75N塩酸溶液に浸漬し、リード線
付き銀基体を陽極、銀板を陰極として1.0mA/cm
2 の電流密度で1時間通電することにより、リード線付
き銀基体表面に塩化銀層を有するNo.1〜No.5の
5試体の銀・塩化銀電極を製造した。
Example 1 A prepared silver substrate with a lead wire was immersed in a mixed solution of a saturated solution of chromium oxide (VI value): 10%, hydrochloric acid: 5%, and the balance: distilled water for 1 minute with stirring. The surface was dissolved and chemically polished. A silver substrate with a lead wire and a silver plate obtained by chemical polishing are immersed in a 0.75N hydrochloric acid solution, and the silver substrate with a lead wire is used as an anode, and the silver plate is used as a cathode at 1.0 mA / cm.
By energizing one hour 2 of current density, No. with silver chloride layer on the silver surface of the substrate with Leads 1 to No. Five silver specimens of silver / silver chloride were manufactured.

【0011】実施例2 実施例1で化学研磨して得られたリード線付き銀基体と
銀板を0.1N硝酸銀溶液に浸漬し、リード線付き銀基
体を陰極、銀板を陽極として1.0mA/cm 2 の電流
密度で3時間通電することによりリード線付き銀基体表
面に微細な結晶粒を有する銀メッキ層を形成した。この
銀メッキ層を形成したリード線付き銀基体および銀板を
0.75N塩酸溶液に浸漬し、リード線付き銀基体を陽
極、銀板を陰極として1.0mA/cm2 の電流密度で
1時間通電することにより銀メッキ層の表層部分を塩化
銀層に変換し、銀メッキ層の上に塩化銀層を形成するこ
とによりリード線付き銀基体表面に塩化銀層を有するN
o.1〜No.5の5試体の銀・塩化銀電極を製造し
た。
Example 2 A silver substrate with a lead wire obtained by chemical polishing in Example 1
Immerse the silver plate in 0.1N silver nitrate solution,
1.0 mA / cm with body as cathode and silver plate as anode TwoCurrent
Silver substrate with lead wire by energizing for 3 hours at density
A silver plating layer having fine crystal grains on the surface was formed. this
The silver substrate with the lead wire and the silver plate
Immerse in a 0.75N hydrochloric acid solution, and place the silver
1.0 mA / cm using a pole and a silver plate as a cathodeTwoAt the current density of
Apply electricity for 1 hour to chloride the surface of the silver plating layer
Convert to a silver layer and form a silver chloride layer on the silver plating layer.
And a silver substrate having a silver chloride layer
o. 1 to No. 5-5 sample silver / silver chloride electrodes were manufactured
Was.

【0012】実施例3 実施例1で化学研磨して得られたリード線付き銀基体と
銀板を0.1N硝酸銀溶液に浸漬し、リード線付き銀基
体を陰極、銀板を陽極として10mA/cm2の電流密
度で1時間通電することによりリード線付き銀基体表面
に銀メッキ層を形成した。この銀メッキ層を形成したリ
ード線付き銀基体と銀板を0.75N塩酸溶液に浸漬
し、リード線付き銀基体を陽極、銀板を陰極としてとし
て1.0mA/cm2 の電流密度で1時間通電し、リー
ド線付き銀基体表面の銀メッキ層を塩化することにより
塩化銀層を形成し、No.1〜No.5の5試体の銀・
塩化銀電極を製造した。
Example 3 A silver substrate with leads and a silver plate obtained by chemical polishing in Example 1 were immersed in a 0.1N silver nitrate solution, and the silver substrate with leads was used as a cathode and the silver plate was used as an anode at 10 mA / A. A silver plating layer was formed on the surface of the silver substrate with leads by applying a current at a current density of 1 cm 2 for 1 hour. The silver substrate with the lead wire and the silver plate on which the silver plating layer was formed were immersed in a 0.75N hydrochloric acid solution, and the silver substrate with the lead wire was used as an anode and the silver plate was used as a cathode at a current density of 1.0 mA / cm 2. For a period of time, and the silver plating layer on the surface of the silver substrate with the lead wire was salified to form a silver chloride layer. 1 to No. 5/5 sample silver
A silver chloride electrode was manufactured.

【0013】実施例4 用意したリード線付き銀基体を、エタノール:40%、
燐酸:40%、残部:蒸留水の混合溶液に浸漬し、リー
ド線付き銀基体を陽極として3.0mA/cm 2 の電流
密度で5分間通電し、リード線付き銀基体表面を溶解さ
せることにより電解研磨を行った。この電解研磨したリ
ード線付き銀基体および銀板を0.1N硝酸銀溶液に浸
漬し、リード線付き銀基体を陰極、銀板を陽極として
1.0mA/cm2 の電流密度で3時間通電し、リード
線付き銀基体表面に微細な結晶粒を有する銀メッキ層を
形成した。このようにして得られた銀メッキ層を有する
リード線付き銀基体と銀板を0.75N塩酸溶液に浸漬
し、リード線付き銀基体を陽極、銀板を陰極として1.
0mA/cm2 の電流密度で1時間通電し、リード線付
き銀基体表面の銀メッキ層の表層部分を塩化銀層に変換
することにより銀メッキ層の上に塩化銀層を形成し、リ
ード線付き銀基体表面に塩化銀層を有するNo.1〜N
o.5の5試体の銀・塩化銀電極を製造した。
Example 4 The prepared silver base material having a lead wire was prepared by adding ethanol: 40%,
Phosphoric acid: 40%, balance: dipped in a mixed solution of distilled water,
3.0 mA / cm using silver substrate with lead wire as anode TwoCurrent
Energize for 5 minutes at the density to dissolve the surface of the silver substrate with lead wires
Then, electrolytic polishing was performed. This electrolytically polished
Silver substrate with silver wire and silver plate in 0.1N silver nitrate solution
Immersion, silver base with lead wire as cathode, silver plate as anode
1.0mA / cmTwoWith a current density of 3 hours and lead
A silver plating layer with fine crystal grains is formed on the surface of the silver substrate with wires.
Formed. With the silver plating layer obtained in this way
Immerse silver substrate with lead wire and silver plate in 0.75N hydrochloric acid solution
The silver substrate with the lead wire was used as an anode and the silver plate was used as a cathode.
0mA / cmTwoWith current density of 1 hour, with lead wire
Convert the surface layer of the silver plating layer on the surface of the silver substrate to a silver chloride layer
To form a silver chloride layer on the silver plating layer.
No. 1 having a silver chloride layer on the surface of a silver substrate with a lead wire. 1 to N
o. Five silver specimens of silver / silver chloride were manufactured.

【0014】実施例5 用意したリード線付き銀基体を窒素ガス中において、2
00℃、3時間保持の焼鈍を行い、3N硝酸溶液中に1
時間浸漬してリード線付き銀基体表面を溶解させ、化学
研磨を行った。この化学研磨したリード線付き銀基体と
銀板を0.1N硝酸銀溶液に浸漬し、リード線付き銀基
体を陰極、銀板を陽極として1.0mA/cm2 の電流
密度で3時間通電し、リード線付き銀基体表面に微細な
結晶粒を有する銀メッキ層を形成した。このようにして
得られた銀メッキ層を有するリード線付き銀基体と銀板
を0.75N塩酸溶液に浸漬し、リード線付き銀基体を
陽極、銀板を陰極として1.0mA/cm2 の電流密度
で1時間通電し、リード線付き銀基体表面の銀メッキ層
の表層部分を塩化銀層に変換することにより銀メッキ層
の上に塩化銀層を形成し、リード線付き銀基体表面に塩
化銀層を有するNo.1〜No.5の5試体の銀・塩化
銀電極を製造した。
Example 5 A prepared silver substrate with a lead wire was placed in a nitrogen gas for 2 hours.
Anneal by holding at 00 ° C for 3 hours, and place in a 3N nitric acid solution for 1 hour.
It was immersed for a time to dissolve the surface of the silver substrate with lead wires, and was subjected to chemical polishing. The chemically polished silver substrate with the lead wire and the silver plate are immersed in a 0.1 N silver nitrate solution, and the silver substrate with the lead wire is used as a cathode and the silver plate is used as an anode at a current density of 1.0 mA / cm 2 for 3 hours. A silver plating layer having fine crystal grains was formed on the surface of the silver substrate with leads. The silver substrate with the lead wire having the silver plating layer and the silver plate thus obtained are immersed in a 0.75N hydrochloric acid solution, and the silver substrate with the lead wire is used as an anode, and the silver plate is used as a cathode and has a current of 1.0 mA / cm 2 . An electric current is applied for 1 hour at a current density, and a silver chloride layer is formed on the silver plating layer by converting the surface layer of the silver plating layer on the surface of the silver substrate with the lead wire into a silver chloride layer. No. 1 having a silver chloride layer. 1 to No. Five silver specimens of silver / silver chloride were manufactured.

【0015】実施例6 実施例1で化学研磨して得られたリード線付き銀基体と
銀板を0.75N塩酸溶液に浸漬し、リード線付き銀基
体を陽極、銀板を陰極として1.0mA/cm 2 の電流
密度で1時間通電し、リード線付き銀基体の表面層部を
塩化銀層に変換した。次に、極性を逆転させ、リード線
付き銀基体を陰極、銀板を陽極にして1.0mA/cm
2 の電流密度で1時間通電し、リード線付き銀基体の表
面層部の塩化銀層を還元処理することにより通常より微
細な結晶粒を有する銀層に変換した。さらにこの微細な
結晶粒を有する銀層を有するリード線付き銀基体と銀板
を0.75N塩酸溶液に浸漬し、リード線付き銀基体を
陽極、銀板を陰極として1.0mA/cm2 の電流密度
で1時間通電し、再度リード線付き銀基体表面の銀層を
塩化銀層に変換することにより銀基体表面に塩化銀層を
有するNo.1〜No.5の5試体の銀・塩化銀電極を
製造した。
Example 6 A silver substrate with a lead wire obtained by chemical polishing in Example 1
Immerse the silver plate in 0.75N hydrochloric acid solution,
1.0 mA / cm with body as anode and silver plate as cathode TwoCurrent
Energize for 1 hour at the density to remove the surface layer of the silver base with lead wire.
Converted to silver chloride layer. Next, reverse the polarity
1.0 mA / cm with silver substrate as cathode and silver plate as anode
TwoFor 1 hour at a current density of
By reducing the silver chloride layer in the surface layer,
It was converted to a silver layer with fine grains. Furthermore this fine
Silver substrate with lead wire and silver plate having silver layer with crystal grains
Immersed in 0.75N hydrochloric acid solution,
1.0 mA / cm using anode and silver plate as cathodeTwoCurrent density
For 1 hour, and re-clean the silver layer on the surface of the silver substrate with the lead wire.
By converting to a silver chloride layer, a silver chloride layer
No. 1 to No. 5/5 silver / silver chloride electrodes
Manufactured.

【0016】実施例7 実施例6で得られた表面に塩化銀層を形成したリード線
付き銀基体を、さらにリード線付き銀基体を陰極、銀板
を陽極にして1.0mA/cm2 の電流密度で1時間通
電し、リード線付き銀基体表面の塩化銀層を還元処理し
て実施例6で得られた銀層よりも結晶粒が一層微細な銀
層に変換した。この様にして得られた結晶粒が一層微細
な銀層を有するリード線付き銀基体をさらに銀板を0.
75N塩酸溶液に浸漬し、リード線付き銀基体を陽極、
銀板を陰極として1.0mA/cm2 の電流密度で1時
間通電し、再度リード線付き銀基体表面に塩化銀層を形
成することによりNo.1〜No.5の5試体の銀・塩
化銀電極を製造した。
[0016] The surface forming silver substrate with leads silver chloride layer obtained in Example 7 Example 6, further a cathode of silver base leaded, silver plate and the anode of 1.0 mA / cm 2 A current was applied for 1 hour at a current density, and the silver chloride layer on the surface of the silver substrate with leads was converted into a silver layer having smaller crystal grains than the silver layer obtained in Example 6. The silver substrate with a lead wire having a finer silver layer having a finer crystal grain obtained in this way was further added to a silver plate.
Dipped in a 75N hydrochloric acid solution, the silver substrate with the lead wire was used as an anode,
A silver plate was used as a cathode, a current was passed at a current density of 1.0 mA / cm 2 for 1 hour, and a silver chloride layer was formed again on the surface of the silver substrate with leads. 1 to No. Five silver specimens of silver / silver chloride were manufactured.

【0017】従来例1 用意したリード線付き銀基体をそのまま銀板と共に0.
75N塩酸溶液に浸漬し、リード線付き銀基体を陽極、
銀板を陰極として1.0mA/cm2 の電流密度で1時
間通電し、リード線付き銀基体表面に塩化銀層を形成す
ることによりNo.1〜No.5の5試体の銀・塩化銀
電極を製造した。
Conventional Example 1 The prepared silver base with lead wire was used together with a silver plate as it was.
Dipped in a 75N hydrochloric acid solution, the silver substrate with the lead wire was used as an anode,
A silver plate was used as a cathode, a current was passed at a current density of 1.0 mA / cm 2 for 1 hour, and a silver chloride layer was formed on the surface of a silver substrate with leads. 1 to No. Five silver specimens of silver / silver chloride were manufactured.

【0018】実施例1〜7および従来例1で得られた銀
・塩化銀電極ごとに任意の一試体をを基準電極(No.
1)とし選び、同一の方法で作製した他の銀・塩化銀電
極(No.2、No.3、No.4、No.5)とを
3.5%NaCl溶液中に浸漬し、浸漬1日後、浸漬1
5日後、浸漬30日後の3回電位を測定した。浸漬1日
後の測定電位を表1に、浸漬15日後の測定電位を表2
に、浸漬30日後の測定電位を表3にそれぞれ示した。
For each silver / silver chloride electrode obtained in Examples 1 to 7 and Conventional Example 1, an arbitrary sample was used as a reference electrode (No.
1), and dipped in a 3.5% NaCl solution with other silver / silver chloride electrodes (No. 2, No. 3, No. 4, No. 5) produced by the same method. After one day, soak 1
After 5 days, 30 days after immersion, the potential was measured three times. Table 1 shows the measured potential one day after immersion, and Table 2 shows the measured potential 15 days after immersion.
Table 3 shows the measured potential 30 days after the immersion.

【0019】[0019]

【表1】 [Table 1]

【0020】[0020]

【表2】 [Table 2]

【0021】[0021]

【表3】 [Table 3]

【0022】表1〜表3に示される結果から、従来例1
の基準電極との電位差の平均値および標準偏差は500
μV以上の値を示すものが多いが、実施例1、6、7の
基準電極との電位差の平均値および標準偏差は30μV
以下であり、その他の実施例の基準電極との電位差の平
均値および標準偏差は10μV以下であり、特に、実施
例3は、浸漬1日後を除けば1μV前後を示すことが多
く、非常に高い精度を示していることが分かる。
From the results shown in Tables 1 to 3, the conventional example 1
The average value and the standard deviation of the potential difference with respect to the reference electrode are 500
Although many of them show a value of μV or more, the average value and the standard deviation of the potential difference from the reference electrode in Examples 1, 6, and 7 are 30 μV.
The average value and the standard deviation of the potential difference from the reference electrode in other examples are 10 μV or less, and particularly, Example 3 often shows around 1 μV except for one day after immersion, which is very high. It can be seen that the accuracy is shown.

【0023】[0023]

【発明の効果】上述のように、この発明の方法による
と、従来の方法と比べて格段に精度の高い銀・塩化銀電
極を簡単に低価格で大量に提供することができ、産業上
優れた効果を奏するものである。
As described above, according to the method of the present invention, silver / silver chloride electrodes with extremely high precision can be easily provided in large quantities at low cost as compared with the conventional method. It has the effect that it has.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 機械加工して得られた銀基体に化学研磨
または電解研磨を施し、この化学研磨または電解研磨を
施した銀基体を塩化物イオンを含む溶液中で電解酸化し
て銀基体の表層部分を塩化することを特徴とする銀基体
の表面に塩化銀層を有する銀・塩化銀電極の製造方法。
A silver substrate obtained by machining is subjected to chemical polishing or electrolytic polishing, and the chemically or electrolytically polished silver substrate is electrolytically oxidized in a solution containing chloride ions to form a silver substrate. A method for producing a silver / silver chloride electrode having a silver chloride layer on the surface of a silver substrate, wherein the surface layer is salified.
【請求項2】 請求項1で得られた銀基体表面の塩化銀
層を電解還元することにより微細な結晶粒を有する銀層
に変換し、この変換して得られた微細な結晶粒を有する
銀層を再び電解酸化して塩化銀層を形成することを特徴
とする銀基体の表面に塩化銀層を有する銀・塩化銀電極
の製造方法。
2. The silver chloride layer on the surface of the silver substrate obtained in claim 1 is electrolytically reduced to be converted into a silver layer having fine crystal grains, and the silver layer has fine crystal grains obtained by the conversion. A method for producing a silver / silver chloride electrode having a silver chloride layer on the surface of a silver substrate, wherein the silver layer is electrolytically oxidized again to form a silver chloride layer.
【請求項3】 請求項1で得られた銀基体表面の塩化銀
層を電解還元することにより微細な結晶粒を有する銀層
に変換し、この塩化銀層を電解還元することにより微細
な結晶粒を有する銀層に変換する操作を2回以上繰り返
して一層微細な結晶粒を有する銀層を形成したのち、得
られた一層微細な結晶粒を有する銀層を電解酸化して塩
化銀層を形成することを特徴とする銀基体の表面に塩化
銀層を有する銀・塩化銀電極の製造方法。
3. The silver chloride layer on the surface of the silver substrate obtained in claim 1 is converted into a silver layer having fine crystal grains by electrolytic reduction, and the silver chloride layer is finely reduced by electrolytic reduction. The operation of converting into a silver layer having grains is repeated twice or more to form a silver layer having finer grains, and then the obtained silver layer having finer grains is electrolytically oxidized to form a silver chloride layer. A method for producing a silver / silver chloride electrode having a silver chloride layer on a surface of a silver substrate, characterized by being formed.
【請求項4】 機械加工して得られた銀基体を化学研磨
または電解研磨したのち銀基体表面に銀被覆層を形成
し、この銀被覆層を形成した銀基体を塩化物イオンを含
む溶液中で電解酸化することにより銀被覆層を塩化して
銀基体表面に塩化銀層を形成することを特徴とする銀基
体の表面に塩化銀層を有する銀・塩化銀電極の製造方
法。
4. A silver substrate obtained by machining is chemically or electrolytically polished, and then a silver coating layer is formed on the surface of the silver substrate. The silver substrate having the silver coating layer formed thereon is placed in a solution containing chloride ions. A method for producing a silver / silver chloride electrode having a silver chloride layer on the surface of a silver substrate, comprising forming a silver chloride layer on the surface of the silver substrate by chlorinating the silver coating layer by electrolytic oxidation.
【請求項5】 前記銀基体表面に形成された銀被覆層は
電気メッキにより形成されることを特徴とする請求項4
記載の銀・塩化銀電極の製造方法。
5. The silver coating layer formed on the surface of the silver substrate is formed by electroplating.
A method for producing a silver / silver chloride electrode as described in the above.
JP8292435A 1996-11-05 1996-11-05 Manufacture of silver-silver chloride electrode having silver chloride layer on surface of silver substrate Pending JPH10132778A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8292435A JPH10132778A (en) 1996-11-05 1996-11-05 Manufacture of silver-silver chloride electrode having silver chloride layer on surface of silver substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8292435A JPH10132778A (en) 1996-11-05 1996-11-05 Manufacture of silver-silver chloride electrode having silver chloride layer on surface of silver substrate

Publications (1)

Publication Number Publication Date
JPH10132778A true JPH10132778A (en) 1998-05-22

Family

ID=17781763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8292435A Pending JPH10132778A (en) 1996-11-05 1996-11-05 Manufacture of silver-silver chloride electrode having silver chloride layer on surface of silver substrate

Country Status (1)

Country Link
JP (1) JPH10132778A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006231150A (en) * 2005-02-23 2006-09-07 Ebara Corp Photocatalyst, method for manufacturing the same and method and apparatus for treating water by using the same
KR100989356B1 (en) 2010-03-17 2010-10-25 (주)지오데코 Method of manufacturing ecg electrode and the ecg electrode manufactured thereof
CN115863295A (en) * 2022-12-31 2023-03-28 江苏富乐华功率半导体研究院有限公司 Composite soldering lug structure for silver sintering and preparation method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006231150A (en) * 2005-02-23 2006-09-07 Ebara Corp Photocatalyst, method for manufacturing the same and method and apparatus for treating water by using the same
KR100989356B1 (en) 2010-03-17 2010-10-25 (주)지오데코 Method of manufacturing ecg electrode and the ecg electrode manufactured thereof
CN115863295A (en) * 2022-12-31 2023-03-28 江苏富乐华功率半导体研究院有限公司 Composite soldering lug structure for silver sintering and preparation method thereof
CN115863295B (en) * 2022-12-31 2023-10-24 江苏富乐华功率半导体研究院有限公司 Composite soldering lug structure for silver sintering and preparation method thereof

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