JPH10132685A - Pressure sensor - Google Patents
Pressure sensorInfo
- Publication number
- JPH10132685A JPH10132685A JP29250996A JP29250996A JPH10132685A JP H10132685 A JPH10132685 A JP H10132685A JP 29250996 A JP29250996 A JP 29250996A JP 29250996 A JP29250996 A JP 29250996A JP H10132685 A JPH10132685 A JP H10132685A
- Authority
- JP
- Japan
- Prior art keywords
- pressure sensor
- main body
- body case
- package
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体圧力センサ
本体および回路基板を本体ケースに内装してなる圧力セ
ンサに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure sensor in which a semiconductor pressure sensor main body and a circuit board are housed in a main body case.
【０００２】[0002]
【従来の技術】図７に、従来の上記圧力センサの一例が
示されている。この圧力センサにおいては、回路基板３
の表面に半導体圧力センサ本体２を搭載してその接続端
子１１を回路パターンにハンダ付け接続し、この半導体
圧力センサ本体２のパッケージ５から上下に突設した圧
力導入部１２，１３を、ベースケース１ａに形成した接
続孔１６、およびこれに上方から組付けけられる図示し
ないカバーケースに形成した接続孔にシールリング１８
を介して気密状に圧入するとともに、ベースケース１ａ
に回路基板３を接着等によって固定する構造となってい
る。2. Description of the Related Art FIG. 7 shows an example of a conventional pressure sensor. In this pressure sensor, the circuit board 3
The semiconductor pressure sensor main body 2 is mounted on the surface of the semiconductor pressure sensor, and its connection terminals 11 are soldered and connected to a circuit pattern. 1a, and a seal ring 18 in a connection hole formed in a cover case (not shown) assembled from above into the connection hole 16.
And airtightly press-fit through the base case 1a.
The circuit board 3 is fixed by bonding or the like.
【０００３】[0003]
【発明が解決しようとする課題】上記構造によると、使
用環境の変化による構成部材の膨張・収縮によって半導
体圧力センサ本体が浮き上がり、本体ケースの接続孔と
圧力導入部との間での気密性が低下し、漏気不良を起こ
すおそれがあった。According to the above structure, the semiconductor pressure sensor main body is lifted by expansion and contraction of the constituent members due to a change in the use environment, and the airtightness between the connection hole of the main body case and the pressure introducing portion is reduced. This may cause a decrease in air leakage.
【０００４】また、使用環境の変化による構成部材の膨
張・収縮によって初期の組付け状態から部品位置が変化
した時に、そのストレスを受ける接続端子に歪みが発生
し、内部素子と接続端子とをつなぐワイヤが伸縮して特
性変動がもたらされることがある。更に、過酷な条件で
使用されると、繰り返し応力によってワイヤ切れが発生
してセンサ機能が損なわれる事態に陥る可能性もあっ
た。Further, when the component position changes from the initial assembled state due to expansion and contraction of the constituent members due to a change in the use environment, distortion occurs in the connection terminal receiving the stress, and the internal element and the connection terminal are connected. In some cases, the wire expands and contracts, causing a change in characteristics. Further, when used under severe conditions, there is a possibility that the wire may break due to repeated stress and the sensor function may be impaired.
【０００５】本発明は、このような点に着目してなされ
たものであって、半導体圧力センサ本体の取り付け構造
に改良を加えることで、構成部材の膨張・収縮に対する
耐久性の向上を図ることを目的としている。The present invention has been made in view of such a point, and aims to improve the durability against expansion and contraction of constituent members by improving the mounting structure of the semiconductor pressure sensor body. It is an object.
【０００６】[0006]
【課題を解決するための手段】請求項１に係る発明は、
半導体圧力センサ本体のパッケージから突設した接続端
子を回路基板に接続するとともに、パッケージに連設し
た取付け部を本体ケースに直接固定してあることを特徴
とする。The invention according to claim 1 is
A connection terminal protruding from a package of the semiconductor pressure sensor main body is connected to a circuit board, and a mounting portion connected to the package is directly fixed to a main body case.
【０００７】また、請求項２に係る発明は、請求項１に
係る発明において、前記回路基板に前記取付け部を通過
させる開口を形成し、この開口を通して取付け部を本体
ケースに固定するとともに、回路基板をその裏面側で本
体ケースに固定してあることを特徴とする。According to a second aspect of the present invention, in the first aspect of the present invention, an opening for passing the mounting portion is formed in the circuit board, and the mounting portion is fixed to the main body case through the opening. The substrate is fixed to the main body case on the back surface side.
【０００８】また、請求項３に係る発明は、請求項１ま
たは２に係る発明において、前記パッケージのセンサ本
体取付け方向側の面に圧力導入部を設け、この圧力導入
部と本体ケースの圧力ポートとをシールリングを介して
気密状に連通接続してあることを特徴とする。According to a third aspect of the present invention, in the first or second aspect of the present invention, a pressure introducing portion is provided on a surface of the package on the sensor body mounting direction side, and the pressure introducing portion and a pressure port of the main body case are provided. Are connected in an airtight manner through a seal ring.
【０００９】また、請求項４に係る発明は、請求項３に
係る発明において、前記圧力導入部を前記パッケージか
ら突設し、この圧力導入部を前記圧力ポートに連通した
接続孔にシールリングを介して気密状に圧入してあるこ
とを特徴とする。According to a fourth aspect of the present invention, in the third aspect, the pressure introducing portion protrudes from the package, and a seal ring is provided in a connection hole communicating the pressure introducing portion with the pressure port. It is characterized in that it is press-fitted in an airtight manner.
【００１０】また、請求項５に係る発明は、請求項１〜
４のいずれか一つの発明において、前記取付け部を本体
ケースに熱カシメ固定してあることを特徴とする。[0010] The invention according to claim 5 is the invention according to claims 1 to 5.
4. The invention according to any one of the aspects 4, wherein the mounting portion is fixed by heat caulking to the main body case.
【００１１】請求項１に係る発明の構成によると、パッ
ケージから連設した取付け部を介して本体ケースに直接
固定された半導体圧力センサ本体は、構成部材の膨張や
収縮を受けても本体ケースから浮き上がることなく強固
に本体ケースに支持される。According to the structure of the first aspect of the present invention, the semiconductor pressure sensor main body directly fixed to the main body case via the mounting portion provided continuously from the package can receive the semiconductor pressure sensor main body from the main body case even when the component members expand or contract. It is firmly supported by the body case without being lifted.
【００１２】請求項２に係る発明の構成によると、回路
基板の表面に接続される半導体圧力センサ本体は、回路
基板の開口を通して本体ケースに直接固定されるととも
に、回路基板自体も本体ケースに固定されるので、半導
体圧力センサ本体の回路基板に対する変位が発生しにく
く、両者を接続する接続端子に働くストレスは少ないも
のとなる。According to the second aspect of the present invention, the semiconductor pressure sensor main body connected to the surface of the circuit board is directly fixed to the main body case through the opening of the circuit board, and the circuit board itself is also fixed to the main body case. Therefore, displacement of the semiconductor pressure sensor main body with respect to the circuit board is less likely to occur, and stress acting on the connection terminal connecting the two is reduced.
【００１３】請求項３に係る発明の構成によると、半導
体圧力センサ本体が本体ケースに直接固定されるので、
シールリングの弾性反発力で半導体圧力センサ本体が本
体ケースに対して変位することが阻止される。According to the third aspect of the present invention, since the semiconductor pressure sensor main body is directly fixed to the main body case,
The elastic repulsive force of the seal ring prevents the semiconductor pressure sensor main body from being displaced relative to the main body case.
【００１４】請求項４に係る発明の構成によると、半導
体圧力センサ本体から突設した圧力導入部が本体ケース
側の接続孔にシールリングを介して圧入されるので、圧
力導入部が接続孔に対して圧入方向に多少変位したとし
ても、その気密性は確実に維持される。According to the structure of the present invention, the pressure introducing portion protruding from the semiconductor pressure sensor main body is press-fitted into the connection hole on the main body case side via the seal ring, so that the pressure introducing portion is inserted into the connection hole. On the other hand, even if it is slightly displaced in the press-fitting direction, its airtightness is reliably maintained.
【００１５】請求項５に係る発明の構成によると、振動
や衝撃に対しても確実に半導体圧力センサ本体を本体ケ
ースの固定保持することができる。According to the configuration of the fifth aspect of the invention, the semiconductor pressure sensor main body can be securely fixed to the main body case even against vibration and impact.
【００１６】[0016]
【発明の実施の形態】図１〜図６に、本発明に係る圧力
センサの一つの実施の形態が示されている。図５および
図６に示すように、この圧力センサの本体ケース１は、
箱形のベースケース１ａと、これに上方から外嵌装着さ
れるカバーケース１ｂとからなり、そのベースケース１
ａに、例えば静電容量式の半導体圧力センサ本体２を搭
載した回路基板３が組み込まれるとともに、回路基板３
から立設されたリード端子４群がカバーケース１ｂから
突出されている。1 to 6 show one embodiment of a pressure sensor according to the present invention. As shown in FIGS. 5 and 6, the main body case 1 of this pressure sensor
The base case 1a comprises a box-shaped base case 1a and a cover case 1b externally fitted to the base case 1a.
a, a circuit board 3 on which a capacitance type semiconductor pressure sensor body 2 is mounted, for example, is incorporated.
Lead terminals 4 erected from the cover case 1b protrude from the cover case 1b.
【００１７】前記半導体圧力センサ本体２のパッケージ
５からは左右に突出する取付け部６が連設されるととも
に、前記回路基板３には取付け部６を通過させる大きさ
の開口７が形成され、ベースケース１ａの底面に設けら
れた支持台８に前記取付け部６が直接搭載されるととも
に、この支持台８の左右に突設した連結ピン９が取付け
部に形成した連結孔１０に貫通され、その貫通端が熱カ
シメされて半導体圧力センサ本体２がベースケース１ａ
に固定される。また、半導体圧力センサ本体２の前後か
ら突設された接続端子１１群が回路基板３の上面に形成
した所定の回路パターンにハンダ付け接続される。A mounting portion 6 projecting from the package 5 of the semiconductor pressure sensor main body 2 to the left and right is continuously provided, and an opening 7 large enough to pass the mounting portion 6 is formed in the circuit board 3. The mounting portion 6 is directly mounted on a support 8 provided on the bottom surface of the case 1a, and connection pins 9 protruding to the left and right of the support 8 penetrate through connection holes 10 formed in the mounting portion. The penetrating end is thermally caulked and the semiconductor pressure sensor main body 2 becomes the base case 1a.
Fixed to Further, a group of connection terminals 11 projecting from the front and rear of the semiconductor pressure sensor main body 2 is connected to a predetermined circuit pattern formed on the upper surface of the circuit board 3 by soldering.
【００１８】半導体圧力センサ本体２の上下面には、圧
力導入部１２，１３がそれぞれ突出されるとともに、ベ
ースケース１ａとカバーケース１ｂには圧力ポート１
４，１５に連通する接続孔１６，１７がそれぞれ形成さ
れ、各圧力導入部１２，１３が各接続孔１６，１７にシ
ールリング１８を介して気密状に圧入接続される。On the upper and lower surfaces of the semiconductor pressure sensor main body 2, pressure introducing portions 12 and 13 are respectively protruded, and a pressure port 1 is provided on the base case 1a and the cover case 1b.
Connection holes 16 and 17 communicating with the connection holes 4 and 15 are formed, and the pressure introduction portions 12 and 13 are press-fitted and connected to the connection holes 16 and 17 via the seal ring 18 in an airtight manner.
【００１９】回路基板３は、ベースケース１ａ内の適所
に立設したピン１９により位置決めされた状態で、前記
支持台８、および、ケース隅部に設けた基板支持部２０
に搭載されて熱カシメやネジ止めなどにより固定され
る。The circuit board 3 is positioned by the pins 19 erected at appropriate places in the base case 1a, and the support base 8 and a board support section 20 provided at the corner of the case are provided.
It is fixed by heat caulking or screwing.
【００２０】本発明の圧力センサは以上のように構成さ
れており、両圧力ポート１４，１５に参照圧力と測定圧
力を印加してその差圧を計測したり、両圧力ポート１
４，１５の一方に測定圧力を印加し、他方を大気に開放
することで測定圧力をゲージ圧として計測することがで
きるのである。The pressure sensor of the present invention is configured as described above. The reference pressure and the measurement pressure are applied to the two pressure ports 14 and 15 to measure the pressure difference therebetween.
The measurement pressure can be measured as a gauge pressure by applying the measurement pressure to one of the four and 15 and releasing the other to the atmosphere.
【００２１】なお、上記実施の形態では、取付け部６を
熱カシメによりベースケース１ａに固定しているが、ネ
ジ止めにより半導体圧力センサ本体２をベースケース１
ａに固定してもよい。In the above embodiment, the mounting portion 6 is fixed to the base case 1a by heat caulking, but the semiconductor pressure sensor main body 2 is screwed to the base case 1a.
a.
【００２２】[0022]
【発明の効果】以上の説明から明らかなように、本発明
に係る圧力センサは、半導体圧力センサ本体をそのパッ
ケージから連設した取付け部を介して本体ケース側に直
接固定するようにしたので、使用環境の変化により構成
部材が膨張・収縮しても、本体ケース側に強固に固定さ
れた半導体圧力センサ本体が浮き上がることはなく、本
体ケースの接続孔と圧力導入部との間での気密性が低下
し、漏気不良を起こすことがなくなる。As is apparent from the above description, in the pressure sensor according to the present invention, the semiconductor pressure sensor main body is directly fixed to the main body case side via the mounting portion continuously provided from the package. Even if the components expand and contract due to changes in the usage environment, the semiconductor pressure sensor body firmly fixed to the main body case does not rise, and the airtightness between the connection hole of the main body case and the pressure introducing section does not rise. And the occurrence of poor air leakage does not occur.
【００２３】また、回路基板を本体ケースに固定するこ
とで、半導体圧力センサ本体とこれを搭載接続した回路
基板を共に強固に本体ケースに保持させることができる
ので、構成部材が膨張・収縮しても接続端子に作用する
ストレスを極めて少なくして特性変動を抑制できるとと
もに、内部素子と接続端子とをつなぐワイヤが繰り返し
応力により切断されるのを防止して、耐久性を高めるこ
とが可能となった。Further, by fixing the circuit board to the main body case, both the semiconductor pressure sensor main body and the circuit board on which the semiconductor pressure sensor is mounted and connected can be firmly held in the main body case. In addition, it is possible to minimize the stress acting on the connection terminal and suppress the characteristic fluctuation, and also to prevent the wire connecting the internal element and the connection terminal from being repeatedly cut by the stress, and improve the durability. Was.
【図１】本発明に係る圧力センサの縦断正面図である。FIG. 1 is a vertical sectional front view of a pressure sensor according to the present invention.
【図２】本発明に係る圧力センサの縦断側面図である。FIG. 2 is a vertical side view of a pressure sensor according to the present invention.
【図３】本発明に係る圧力センサの下ケースを示す平面
図である。FIG. 3 is a plan view showing a lower case of the pressure sensor according to the present invention.
【図４】本発明に係る圧力センサの要部を示す分解斜視
図である。FIG. 4 is an exploded perspective view showing a main part of the pressure sensor according to the present invention.
【図５】本発明に係る圧力センサ全体の分解斜視図であ
る。FIG. 5 is an exploded perspective view of the entire pressure sensor according to the present invention.
【図６】本発明に係る圧力センサ全体の外観を示す斜視
図である。FIG. 6 is a perspective view showing the external appearance of the entire pressure sensor according to the present invention.
【図７】従来の圧力センサの要部を示す分解斜視図であ
る。FIG. 7 is an exploded perspective view showing a main part of a conventional pressure sensor.
１ 本体ケース ２ 半導体圧力センサ本体 ３ 回路基板 ５ パッケージ ６ 取付け部 ７ 開口 １２ 圧力導入部 １４ 圧力ポート １７ 接続孔 １８ シールリング DESCRIPTION OF SYMBOLS 1 Main body case 2 Semiconductor pressure sensor main body 3 Circuit board 5 Package 6 Mounting part 7 Opening 12 Pressure introduction part 14 Pressure port 17 Connection hole 18 Seal ring
Claims (5)
突設した接続端子を回路基板に接続するとともに、パッ
ケージに連設した取付け部を本体ケースに直接固定して
あることを特徴とする圧力センサ。1. A pressure sensor wherein a connection terminal protruding from a package of a semiconductor pressure sensor main body is connected to a circuit board, and a mounting portion connected to the package is directly fixed to a main body case.
る開口を形成し、この開口を通して取付け部を本体ケー
スに固定するとともに、回路基板をその裏面側で本体ケ
ースに固定してある請求項１記載の圧力センサ。2. An opening through which the mounting portion passes is formed in the circuit board, the mounting portion is fixed to the main body case through the opening, and the circuit board is fixed to the main body case on the back surface side. A pressure sensor as described.
側の面に圧力導入部を設け、この圧力導入部と本体ケー
スの圧力ポートとをシールリングを介して気密状に連通
接続してある請求項１または２記載の圧力センサ。3. A pressure introducing portion is provided on a surface of the package on the sensor body mounting direction side, and the pressure introducing portion and a pressure port of the main body case are air-tightly connected to each other via a seal ring. Or the pressure sensor according to 2.
設し、この圧力導入部を前記圧力ポートに連通した接続
孔にシールリングを介して気密状に圧入してある請求項
３記載の圧力センサ。4. The pressure sensor according to claim 3, wherein the pressure introducing portion protrudes from the package, and the pressure introducing portion is hermetically press-fitted into a connection hole communicating with the pressure port via a seal ring. .
定してある請求項１〜４のいずれか一つに記載の圧力セ
ンサ。5. The pressure sensor according to claim 1, wherein the mounting portion is fixed to the main body case by heat caulking.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29250996A JP3409109B2 (en) | 1996-11-05 | 1996-11-05 | Pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29250996A JP3409109B2 (en) | 1996-11-05 | 1996-11-05 | Pressure sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10132685A true JPH10132685A (en) | 1998-05-22 |
| JP3409109B2 JP3409109B2 (en) | 2003-05-26 |
Family
ID=17782743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29250996A Expired - Lifetime JP3409109B2 (en) | 1996-11-05 | 1996-11-05 | Pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3409109B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005069481A (en) * | 2003-08-20 | 2005-03-17 | Eaton Corp | Electric fluid-pressure servo valve and its manufacturing method |
| JP2006523013A (en) * | 2004-01-30 | 2006-10-05 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Electronic components in substrate elements |
| JP2013057512A (en) * | 2011-09-07 | 2013-03-28 | Nidec Copal Electronics Corp | Pressure sensor |
| CN104101459A (en) * | 2014-07-30 | 2014-10-15 | 东南大学 | Wind-pressure-resistant barometric sensor packaging structure |
-
1996
- 1996-11-05 JP JP29250996A patent/JP3409109B2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005069481A (en) * | 2003-08-20 | 2005-03-17 | Eaton Corp | Electric fluid-pressure servo valve and its manufacturing method |
| JP4665226B2 (en) * | 2003-08-20 | 2011-04-06 | イートン コーポレーション | Electric fluid pressure servovalve and manufacturing method thereof |
| JP2006523013A (en) * | 2004-01-30 | 2006-10-05 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Electronic components in substrate elements |
| JP2013057512A (en) * | 2011-09-07 | 2013-03-28 | Nidec Copal Electronics Corp | Pressure sensor |
| CN104101459A (en) * | 2014-07-30 | 2014-10-15 | 东南大学 | Wind-pressure-resistant barometric sensor packaging structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3409109B2 (en) | 2003-05-26 |
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