JPH10126191A - Solid-state electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a circuit of the desired characteristic within a substrate with no effects due to magnetic field by placing a capacitor consisting of parallel flat plates at a position that is held between two spiral structures which construct the inductors respectively. SOLUTION: A substrate made of a mixture substance of magnetic and dielectric materials contains an inductor which has the spiral structures at its both sides. A capacitor is added at the center part between both spiral structures which construct the spirals inversely to each other. The magnetic fluxes inside of spirals are set in mutually parallel and oppositely directions to each other, and a magnetic closed circuit is formed as an entire substrate. Therefore, the magnetic field does not substantially affect the part of the capacitor which is placed at the center part between both spiral structures. Thus, the capacitor do not receive adverse effects due to the magnetic field and can show its expected characteristic as it is. Furthermore, the magnetic flux which leaks out of the substrate is very weak, and the magnetic field does not substantially affect the nearby electronic parts.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a solid-state electronic component in which an inductor and a capacitor are formed inside a substrate containing both a magnetic material and a dielectric material.

[0002]

2. Description of the Related Art Conventionally, EMI (Electro Magnetic) has been used as a measure against high frequency noise in electronic equipment.
Interference filter is used. Generally, an EMI filter is configured by combining individual elements of a capacitor and an inductor, and many types of EMI filters based on the combination of these individual elements have been proposed. As a typical example, for example, L which is a combination of one capacitor and one inductor
An EMI filter of a type and a π (pi) type EMI filter composed of a combination of two capacitors and one inductor are known, and these EMI filters take measures against noise in electronic devices.

As described above, when an EMI filter is configured by combining a capacitor and an inductor, each of which is an individual element, the entire EMI filter becomes large,
There is a problem that a large area is required to attach the MI filter to a circuit board or the like, and that it takes a lot of man-hours to combine individual elements. In recent years, there has been proposed a filter which solves these problems and incorporates a capacitor and an inductor in one chip (see JP-A-8-65080 and JP-A-8-148381).

[0004] These publications disclose that a conductive film acting as an inductor and a capacitor is formed on each of a plurality of layers made of a mixture of a dielectric material and a magnetic material, and the plurality of layers are laminated and fired. A chip-shaped filter component in which a filter is formed inside has been proposed.

[0005]

In each of the inductors formed in the filter component described in the above-mentioned publication, a linear conductor film is sandwiched between a mixture of a dielectric material and a magnetic material. It is difficult to obtain a large inductance in a limited size. In order to obtain a large inductance, a conductive film made of a mixture of a dielectric material and a magnetic material is formed on one layer to form a semi-circle or a circle, and the next layer is formed via a conductor in a through hole. Then, it is conceivable to form an inductor having a spiral structure over a plurality of layers, for example, making a further half turn or one turn on the layer. The present inventors have made a prototype based on such a concept, but when such an inductor having a spiral structure is simply formed in a mixed base, its magnetic force is adjacent to the inductor inside the base. There is a problem that the formed capacitor is adversely affected and characteristics are significantly deteriorated.

The present invention has been made in view of the above circumstances, and provides a solid-state electronic component in which an inductor having a spiral structure and a capacitor are formed in the same base, and the adverse effect on a capacitor due to a magnetic field generated by the inductor is suppressed. With the goal.

[0007]

According to the present invention, there is provided a solid-state electronic component comprising: a base containing both a magnetic material and a dielectric material; and a base formed inside the base and having a spiral structure. The magnetic fluxes are arranged side by side and connected to each other so that the magnetic fluxes are parallel to each other and opposite to each other.
It is characterized by comprising an inductor having two spiral structures, and a capacitor formed inside a base thereof and made of a parallel plane plate.

[0008] The solid-state electronic component of the present invention is provided with two inductors having a spiral structure so that the magnetic flux inside the spiral structure is parallel and opposite to each other. Even if you place the capacitor in a place other than the above, it is hardly affected by the magnetic field,
A circuit having desired characteristics can be formed in the base.

Here, in the solid electronic component of the present invention, it is preferable that the capacitor is formed at a position sandwiched between two spiral structures constituting the inductor. As described above, when the capacitor is formed at a position sandwiched between the two spiral structures, waste of space is omitted, which contributes to downsizing. Further, in the solid-state electronic component of the present invention, one of the parallel flat plates constituting the capacitor may be connected to an intermediate position of the inductor. Here, the intermediate position does not need to be at the center, but means somewhere in the middle of the inductor.

By connecting to the intermediate position in this way, a desired filter circuit can be formed.

[0011]

Embodiments of the present invention will be described below. FIG. 1 is an exploded perspective view of an embodiment of the solid-state electronic component of the present invention, FIG. 2 is an external view thereof, and FIG. 3 is an equivalent circuit diagram thereof. As shown in FIG. 1, a solid-state electronic component according to this embodiment has a conductor film 1 having a shape shown by hatching in FIG. 1 on each layer made of a mixture of a dielectric material and a magnetic material.
It is composed of four layers in which 2, 3, and 4 are formed. The conductor films constituting the adjacent layers are formed by the through holes 12a and 12a.
b; 23a, 23b; 34a, 34b.

In this case, the conductor films 1a, 1a,
2a, 3a, 4a; 1c, 2c, 3c, 4c form conductor films having a spiral structure, respectively, and form spirals in mutually opposite directions.
Further, they are connected to each other via a fourth-layer conductor film 4b. Further, the conductor films 1b, 2 in the central part of these four layers
A capacitor is formed by b, 3b, and 4b.
As a result, a multi-stage LC filter circuit shown in the equivalent circuit of FIG. 3 is formed as a whole.

Here, the ends of the spiral structure at both ends are:
The first-layer conductor films 1a and 1c are connected to the terminal electrodes 51 and 52, respectively, as shown in FIG. 2 by being exposed from the end surface of the base body on which the respective layers are stacked.
The conductor film 1b at the center of the layer and the conductor film 3b at the center of the third layer are
By being exposed from the side surface of the base, it is connected to the ground electrode 53 shown in FIG.

FIG. 4 is a schematic layout diagram of the filter circuit having the structure shown in FIG. 1, and FIG. 5 is a schematic diagram showing a magnetic field over two spiral structures. As shown in FIG. 4, the filter circuit having the structure shown in FIG. 1 includes inductors having a spiral structure on both sides, and includes a capacitor in the center of the two spiral structures. The two spiral structures form opposite spirals, so that the magnetic fluxes inside the two spiral structures are parallel and opposite to each other, forming a magnetically closed circuit as shown in FIG. 5 as a whole. . For this reason, the magnetic field hardly acts on the portions of the capacitors arranged in the center of the two spiral structures, and these capacitors are
The desired characteristics can be exhibited as they are without being adversely affected by the magnetic field.

Further, since a magnetic closed circuit is formed between the two spiral structures, the magnetic flux leaking out of the electronic circuit component is extremely weak. The magnetic field hardly acts on the circuit element. 6 to 14 are views showing each manufacturing process of the solid-state electronic component whose exploded perspective view is shown in FIG. (A) of each figure is a plan view, and (B) of each figure is a cross-sectional view along the arrow AA shown in FIG.

Here, for example, a magnetic material containing Ni—Zn ferrite as a main component is mixed, calcined, and pulverized to a suitable particle size, for example, PbTiO.
Dielectric material mainly composed of ₃ is mixed, calcined, and calcined dielectric powder pulverized to an appropriate particle size is mixed in an appropriate ratio, and dispersant, binder, plasticizer, solvent, etc. Is added to produce a dielectric magnetic material mixed paste, and the dielectric magnetic material mixed paste thus produced and the conductive paste containing Ag or Pd as a main component are alternately formed as described below. Are laminated while screen-printing them, and cut as necessary to form a green laminate. The laminated body is subjected to a binder removal treatment and further calcined to form a calcined body. The calcined body is subjected to terminal electrodes 51 and 52 and a ground electrode 53 ( 2), thereby completing the solid-state electronic component.

Hereinafter, each process of manufacturing the solid-state electronic component shown in FIG. 1 will be described with reference to the drawings. First, as shown in FIG. 6, a base substrate 100 made of the dielectric magnetic paste produced as described above is formed.
The first conductive film 1a,
1b and 1c are formed by screen printing (FIG. 7).
Further, a dielectric magnetic material mixed paste is screen-printed thereon so as to form the through holes 12a and 12b to form the dielectric magnetic material mixed layer 101 (FIG. 8).
Further, similarly, the second conductive films 2a, 2b, and 2c are formed by the conductive paste (FIG. 9). At this time,
The conductive paste is charged in the through holes 12a and 12b, and an electrical connection with the first conductive film is made. Further, a dielectric / magnetic mixed layer 102 is formed thereon so as to form through holes 23a and 23b (FIG. 1).
0), and third-layer conductor films 3a, 3b, 3c are formed thereon (FIG. 11). Furthermore, through holes 34
a, 34b so that the dielectric / magnetic material mixed layer 10 is formed.
3 (FIG. 12), and a fourth conductive film 4a,
4b and 4c are formed (FIG. 13), and a base substrate 104 is further formed thereon.

After forming such a laminated body, as described above, the laminated body is subjected to a binder removal treatment, and further baked to form a baked body, and the terminal electrodes 51, 5 shown in FIG.
2 and the ground electrode 53 are formed. Through such a manufacturing process, a solid-state electronic component having the structure shown in FIGS. 1 and 2 is manufactured.

Here, in the above manufacturing process, by repeating the process from the process shown in FIG. 8 to the process shown in FIG. 11, a multi-stage filter circuit can be formed.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Here, the structure of the comparative example will be described first, and then the embodiment of the structure shown in FIG. 1 will be compared with the comparative example described below. 15 is an exploded perspective view of a comparative example, FIG. 16 is a schematic layout diagram of a filter circuit of the comparative example, and FIG. 17 is a schematic diagram showing a magnetic field of a spiral structure for the comparative example shown in FIG. .

The comparative example shown in FIG. 15 differs from the solid-state electronic component shown in FIG. 1 in the pattern of the conductive film and one of the through holes. As a result, as shown in FIG. 16, an inductor having a spiral structure is formed in the center portion, and capacitors are formed on both sides. The appearance and the equivalent circuit are the same as the appearance (see FIG. 2) and the equivalent circuit (see FIG. 3) of the solid-state electronic component shown in FIG.

In the case of the structure shown in FIG. 15, as shown in FIG. 17, the magnetic field generated by the spiral-structured inductor directly affects the capacitor adjacent to the inductor. FIG. 18 shows a filter having two spiral winding structures (Example) shown in FIG.
FIG. 9 is a diagram showing experimental data of filter characteristics of a filter having a spiral structure with one center wound (comparative example) shown in FIG.

Here, the following experimental conditions were adopted. (A) Material composition; Ni-Zn-Cu ferrite: Pb
TiO ₃ dielectric = 6: 4 (b) conductive material; Ag / Pd (c) interlayer thickness; 12 μm (d) inductor; inner cross-sectional area 0.71 mm ² , line width 0.
20 mm (e) Capacitor; counter electrode area 0.64 mm ² (per layer) (f) During the above-described manufacturing process, the process shown in FIG.
Are repeated twice. That is, the second layer and the third layer shown in FIGS.

Under the above conditions, an embodiment of the structure shown in FIG. 1 and a comparative example of the structure shown in FIG.
As shown in FIG. 18, the attenuation coefficient was 37.1 dB / dec. In the case of the embodiment. 13. In the case of the comparative example
4 dB / dec. Thus, the characteristics could be greatly improved. This is considered to be because the influence on the capacitor was significantly reduced by forming the magnetically closed circuit.

[0025]

As described above, according to the present invention,
A solid-state electronic component having a built-in capacitor and a spiral-structured inductor that suppresses adverse effects on the capacitor is configured.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of one embodiment of a solid-state electronic component of the present invention.

FIG. 2 is an external view of an embodiment of the solid-state electronic component of the present invention.

FIG. 3 is an equivalent circuit diagram of one embodiment of the solid-state electronic component of the present invention.

FIG. 4 is a schematic layout diagram of a filter circuit having the structure shown in FIG. 1;

FIG. 5 is a schematic diagram showing a magnetic field straddling two spiral structures.

FIG. 6 is a diagram showing a first step in each manufacturing step of the solid-state electronic component whose exploded perspective view is shown in FIG. 1;

7 is a view showing a second step in each manufacturing step of the solid-state electronic component whose exploded perspective view is shown in FIG. 1;

FIG. 8 is a view showing a third step in each manufacturing step of the solid-state electronic component whose exploded perspective view is shown in FIG. 1;

FIG. 9 is a view showing a fourth step in each manufacturing step of the solid-state electronic component whose exploded perspective view is shown in FIG. 1;

10 is a diagram illustrating a fifth step in each manufacturing step of the solid-state electronic component whose exploded perspective view is illustrated in FIG. 1;

11 is a view showing a sixth step in each manufacturing step of the solid-state electronic component whose exploded perspective view is shown in FIG. 1;

FIG. 12 is a diagram illustrating a seventh step in each manufacturing step of the solid-state electronic component whose exploded perspective view is illustrated in FIG. 1;

13 is an exploded perspective view of FIG. 1, illustrating an eighth step in each manufacturing step of the solid-state electronic component.

FIG. 14 is a diagram illustrating a ninth step in each manufacturing step of the solid-state electronic component shown in the exploded perspective view of FIG. 1;

FIG. 15 is an exploded perspective view of a comparative example.

FIG. 16 is a schematic layout diagram of the comparative example shown in FIG.

17 is a schematic diagram illustrating a magnetic field having a spiral structure in the comparative example shown in FIG.

18 is a diagram showing experimental data of filter characteristics of the filter having a spiral structure having two windings on the left and right shown in FIG. 1 (Example) and the filter having a spiral structure having one winding on the center shown in FIG. 15 (Comparative Example).

[Explanation of symbols]

1, 1a, 1b, 1c, 2, 2a, 2b, 2c, 3, 3
a, 3b, 3c, 4, 4a, 4b, 4c Conductive film 12a, 12b, 23a, 23b, 34a, 34b
Through hole 51, 52 Terminal electrode 53 Earth electrode 100, 104 Base substrate 101, 102, 103 Dielectric / magnetic mixed layer

Claims (3)

[Claims] A substrate containing both a magnetic material and a dielectric material, and a magnetic flux formed inside the spiral structure inside a spiral structure are arranged side by side so as to be parallel and opposite to each other. A solid-state electronic component, comprising: an inductor having two spiral structures connected to each other; and a capacitor formed inside the base and formed of a parallel plane plate. 2. The solid-state electronic component according to claim 1, wherein said capacitor is formed at a position sandwiched between two spiral structures constituting said inductor. 3. The solid-state electronic component according to claim 1, wherein one of the parallel flat plates constituting the capacitor is connected to an intermediate position of the inductor.