JPH10124641A - Pad pair bit information card dealing with - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inexpensively supply a pad-bit correspondence information card capable of substantially making forgery or illegal use difficult by storing information in a pad pair as two-dimensional coordinates in addition to bit information. SOLUTION: An under pad pattern electrode (under pad) 2 is molded on the surface of a card substrate 1 by evaporation, sputtering, printing, etc., an insulating layer (resistor layer) 4 is applied to the surface of the electrode 2 so as to leave a detection electrode, an upper pad 3 is molded on a position opposed to the under pad 2 by a similar means and pad-bit correspondence information is stored. Data are recorded by a pad pair and data of which reading is made unnecessary are destructed by an electric or mechanical means to fix a bit state. Namely a circuit for impressing voltage to the pad pair and changing an electric signal is formed, an insulating state is detected and allowed to correspond to a binary number '1' (or '0') and a conductive state is allowed to correspond to '0' (or '1') to operate information.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric information card using a pad pair as a 1-bit information source, and has a function of recording and erasing information and a memory function, and prevents tampering, forgery, and unauthorized use. To a bit-to-bit correspondence information card.

[0002]

2. Description of the Related Art Conventionally, generally used information cards can be magnetically recorded on a magnetic layer of a magnetic card, and are manufactured on the premise of both data writing and data reading. For this reason, a falsified or forged fraudulent card is used, causing a huge amount of damage to a card issuing company and an operation system, and causing a decrease in the reliability of a credit mechanism, which has become a social problem. For this reason, the magnetic layer is coated two or three times, and camouflage is performed with a dummy signal to prevent tampering and forgery, and measures are taken to eliminate unauthorized use. At present, magnetic cards that cannot prevent the use of such cards are used.

However, as a further problem, in the conventional magnetic card, tampering and forgery can be performed easily and easily using the operating magnetic card reader / writer, so that it is difficult to detect the site. is there.

In order to improve this state, an electric condenser fuse system and the like have been proposed, but they have not been put to practical use.

Further, introduction of an IC card which is difficult to falsify, counterfeit, and illegally use is being studied. However, confidentiality can be expected, but it is expensive and is not suitable for disposable use like a magnetic card at present. Things.

[0006]

By the way, it is necessary to solve the problem of producing a magnetic card as described above which cannot be falsified, forged, or illegally used.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks, and adopts a fundamentally different electric system from the conventional magnetic card, so that tampering, forgery and unauthorized use are essentially difficult. The purpose is to supply a corresponding information card at a low price.

[0008]

SUMMARY OF THE INVENTION A put-to-bit information card according to the present invention covers all of the above disadvantages.

That is, a metal electrode layer corresponding to an underpad is formed on a card substrate by vapor deposition, sputtering, printing, or the like, and an insulating layer or a resistive layer is applied thereon while leaving a detection electrode. An upper pad is formed at a position facing the under pad by the same means as described above, and has a structure for holding information corresponding to a pad to bit which is significantly different from the conventional method. A pad pair allows data to be recorded, data to be read, and data that is no longer needed to be destroyed by thermal, electrical or mechanical means to fix the bit state. Since this information fixing state is performed inside the pad pair, it is impossible to return the insulating state again from the outside, and the used card cannot be falsified, forged, or illegally used.

However, according to the present invention, since the pad-to-bit correspondence information card manufactured by the above-described method holds information in two-dimensional coordinates in addition to the above-mentioned bit information, the position information of the detector Can also be used.

Of course, the insulating layer and the resistive layer may be formed by thermal, electric or mechanical destruction means such as thermal head, laser, light heating mounting, discharge destruction device, large current short-circuit or mechanical abrasion device. The purpose can be achieved by mounting.

[0012]

The pad-to-bit correspondence information card manufactured as described above operates as follows. That is, in the present invention, for example, in the case of the "claim 1" of the present invention, a circuit in which a voltage is applied to a pad pair to change an electric signal is provided, an insulation state is detected, and a binary number is detected. 1
Information can be manipulated by associating with (0) and by setting the conduction state to 0 (1). In this operation, the change in the information state is transient, and cannot be returned to the original state again.

When a large number of pat pairs are arranged, the storage means is different from that of the fuse ROM of the IC, but the operation may be analogized. If the fuse ROM is a storage medium having a micro structure, the pad-to-bit correspondence information card of the present invention is a storage medium having a macro structure.

As a further feature, this putt-to-bit information card has a lot of confidential matters and cannot be falsified or produced by an ordinary means due to economically extremely disadvantageous conditions.

[0015] Further, since the amount of information suitable for the purpose can be specified at the time of manufacturing the pat / bit correspondence information card produced as described above, it is difficult to modify the conditions at the time of issuance.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of a put-to-bit correspondence information card "claim 1" of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view of one embodiment of a pad pair.

FIG. 2 shows that the putt pair is destroyed by heat,
It is sectional drawing which shows the case where it became a conduction state.

FIG. 3 is a top view of an embodiment in which four putt pairs are formed into one block.

FIG. 4 is an equivalent circuit diagram for obtaining bit information when the pad-to-bit correspondence information card is used.

[0021]

[Embodiment 2] A preferred embodiment of a put-to-bit correspondence information card "claim 3" of the present invention will be described below with reference to the drawings.

FIG. 5 is a top view of an embodiment in which four coil pad pairs are formed into one block.

FIG. 6 is a sectional view of one embodiment of the coil pad pair.

As is apparent from the above description, the put-to-bit information card according to the present invention can construct an extremely economical card system, and the used card cannot be tampered with, and the reliability of the card system can be reduced. This is a significant increase.

[Brief description of the drawings]

FIG. 1 is a diagram showing one embodiment of the present invention.

FIG. 2 is a cross-sectional view of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Card board 2 Under pad pattern electrode 3 Opposite upper pad pattern electrode 4 Insulating layer (resistive layer) 5 Pad pair 6 Coil pad pair 7 Detection terminal 8 Resistance 9 Electronic circuit

[Procedure amendment]

[Submission date] November 7, 1997

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Brief description of drawings

[Correction method] Change

[Correction contents]

[Brief description of the drawings]

FIG. 1 is a diagram showing one embodiment of the present invention.

FIG. 2 is a sectional view of the present invention.

FIG. 3 is a top view of one embodiment in which four pat pairs are formed into one block.

FIG. 4 is an equivalent circuit diagram for obtaining bit information when a pat-to-bit correspondence information card is used.

[Description of Signs] 1 Card substrate 2 Under pad pattern electrode 3 Counter upper pad pattern electrode 4 Insulating layer (resistance layer) 5 Pad pair 6 Coil pad pair 7 Detection terminal 8 Resistance 9 Electronic circuit

Claims (5)

[Claims] A metal electrode layer corresponding to an underpad is formed on a card substrate by means of vapor deposition, sputtering, printing, or the like, and an insulating layer is applied so as to expose a detection electrode on the surface, and a position facing the underpad. This is an information card that has a pair of pats on which an upper pat is molded in the same manner as described above, and that can handle bits. A pat-to-bit correspondence information card in which a pat pair is energized and the insulation state is set to 1 (0) in binary system, and the continuity state in which insulation has been broken down by thermal, electric or mechanical means is set to 0 (1). 2. A metal electrode layer corresponding to an underpad is formed on a card substrate by means of vapor deposition, sputtering, printing, or the like, a resistive layer is applied, and an upper pad is placed at a position facing the underpad. This is an information card having a pad pair molded in the same manner as in the above. When the pad pair is energized, the electrical state corresponding to the resistance value defined by the conditions at the time of card production is set to 1 (0) in binary system, and the conductive state in which the resistance layer is broken by thermal, electric or mechanical means is set to 0 ( 1) Corresponding pat-bit correspondence information card 3. A surface-pattern coil-shaped metal electrode layer corresponding to an underpad is formed on a card substrate by means of vapor deposition, sputtering, printing, or the like, an insulating layer is applied, and at a position facing the underpad, This is an information card having a coil pad pair in which a surface coil metal layer is formed by molding an upper pad in the same manner as described above. A high-frequency current is applied to the pad pair, and the electrical state generated by the change in impedance corresponding to the inductance defined by the conditions at the time of card production due to the mutual inductance is converted into a binary 1 (0) by heat,
A coil pad / bit correspondence information card in which a coil is destroyed by electric or mechanical means or a pad pair is short-circuited so that a no-inductance state corresponds to 0 (1). 4. A pat-to-multi-bit information card having a plurality of pat-pairs arranged on a card to form a pattern having a large number of bits and changing the state order of the pat-pairs to record, identify, and erase information. 5. The pad-to-multi-bit information card according to claim 4, wherein one of the pad pairs is cut in advance, and the insulating layer, the resistive layer, or the coil is destroyed by heat, electric or mechanical means. Also has a function of maintaining the initial state. For this reason, a specific pad pair does not change the state, so that a function of maintaining the state is generated, and information such as an ID card, date of issue, etc. can be fixed in advance, and tamper, forgery, and unauthorized use of pat-to-multi-bit can be prevented. Information card.