JPH10123376A - Optical data link and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the optical data link which is easily manufactured and high in mechanical reliability and has high performance. SOLUTION: A light emitting element LD is mounted on a converting element mount part 4 provided previously on a lead frame 2, and molded out of resin by using a metal mold. At this time, a condenser lens 26 which has its optical axis aligned with the main surface of the light emitting element LD and a coupling part 28 which engages a sleeve having a ferrule inserted are molded in one body at the same time. The sleeve holding an optical fiber is fitted in a recessed part 28a of the coupling part 28 and then the optical fiber and the main surface of the light emitting element LD are optically coupled with each other. At this time, the tip of the sleeve and the abutting part in the coupling part 28 are made to abut against each other and then the end surface of the optical fiber is aligned with the main surface of the light emitting element LD, so that the optical axes are securely aligned with each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical data link which is easy to manufacture, has high mechanical reliability and high performance, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventional optical data links include those disclosed in JP-A-4-211208, JP-A-7-177086, and JP-A-8-136767.

In the optical data link disclosed in Japanese Patent Application Laid-Open No. 4-211208, as shown in FIG. 2 and FIG.
b and a lead frame 30 having lead pins 23;
A metal optical connector 22 in which a light operating element (light emitting element, light receiving element) whose optical axis is aligned with an optical fiber is sealed in advance, and both the lead frame 30 and the optical connector 22 are integrally formed of resin. It has a structure to be molded.

In the optical data link disclosed in Japanese Patent Application Laid-Open No. 7-177086, as shown in FIGS. 3 and 4 of the accompanying drawings, a sleeve 31 and a link housing (side plate) 23 are integrally formed of a resin. The optical element (light-emitting element) 18 is mounted on a predetermined portion of the circuit board 20 separately from this, and the circuit board 20 is fitted into a predetermined portion of the link housing 20 to form the optical element 18. And the optical axis of the optical fiber in the sleeve 31 is aligned. Further, a lens 39 for condensing an optical signal transmitted from the optical element 18 at the incident end of the optical fiber is provided on the sleeve 31.
The lens 39 is provided inside, and is formed of a component different from the link housing 20.

In the optical data link disclosed in Japanese Patent Application Laid-Open No. 8-136767, as shown in FIGS. 2 and 3 of the accompanying drawings, a light-operating element (light-emitting diode, semiconductor (Laser) 2 to substrate (head) 4
6b, while the electronic circuit is mounted on another substrate (main body) 4
6a. Then, these substrates 46a, 4
6b is electrically connected using a flexible printed board 46c. Further, the optical axes of the optical fibers and the optical operating element 2 are aligned by inserting the optical operating elements 2 into the element insertion holes 5a and 5b formed in the sleeves 5 and 6, respectively.

[0006]

In an optical data link, it is extremely important to adjust the optical axis between the optical fiber and the light emitting element in the transmitting section and to adjust the optical axis between the optical fiber and the light receiving element in the receiving section.

Further, in an optical data link in which both the transmitting unit and the receiving unit are integrally assembled, it is important to adjust the position between the transmitting unit and the receiving unit. In other words, in the receiving section, while the optical axis alignment between the end of the optical fiber that emits the optical signal and the main surface of the light receiving element for receiving the optical signal is on the order of sub-milli-order, In the transmission unit, extremely high positioning accuracy on the order of submicrons is required for optical axis alignment between the main surface of the light emitting element that emits an optical signal and the end of the optical fiber for receiving the optical signal. As described above, since the positioning accuracy required for the transmission unit and the reception unit is greatly different, there has been a technical difficulty in realizing an optical data link in which the transmission unit and the reception unit are integrally assembled.

In recent ultra-high-speed optical data links, the light-receiving area of the light-receiving device tends to be reduced in order to satisfy high-speed response, and the optical axis alignment accuracy on the order of microns is required for the receiving unit. It is being done.

In order to perform this positioning adjustment, in the optical data link disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 4-211208, optical coupling between a light receiving element and an optical fiber and light emission in a metallic optical connector are previously performed. While actually monitoring the optical coupling between the element and the optical fiber, adjust the optical axis of each element and the optical fiber with submicron-order accuracy, and then mount the light receiving element and the light emitting element in a metal package with resin sealing. , The positioning between the optical axes of the transmitting and receiving sections has been performed. Therefore, the positioning accuracy between the optical axes of the transmitting / receiving units has been determined by the accuracy of the mold for resin sealing.

However, according to this positioning adjustment method, not only the metal package becomes expensive, but also a normally operating optical connector must be discarded when a defect occurs in the resin sealing step. However, there was a problem in yield and the like. In addition, it is necessary to use a W-bond for connection between the substrate on which the electronic circuit is mounted and the optical connector, and the distance is required to be several millimeters or more. Was also an obstacle.

In the optical data link disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 7-177086, a light receiving element and a light emitting element are also mounted on a substrate on which an electronic element for forming an electronic circuit is mounted. A mechanism is adopted in which the optical axis is adjusted at the same time by aligning the link housing with the macro.

However, in this mechanism, the positioning accuracy for mounting the light receiving element and the light emitting element on a predetermined portion of the substrate and the positioning accuracy for mounting the substrate on the housing, that is, the positioning accuracy for the two positions, cause the optical axis to be shifted. Is determined. Therefore, it is required that all the components are machined with extremely high precision, and there is a problem in yield and the like. Further, this mechanism does not include a means for finely adjusting the position between the sleeve holding the optical fiber and each of the light receiving element and the light emitting element.

Further, in this mechanism, a substrate is mounted on the housing, and a light receiving element and a light emitting element are mounted on the substrate. Therefore, two fine adjustments are basically performed with reference to the housing. . For this reason, at the time of use,
When an external force is applied to the housing to cause mechanical distortion in the reference housing itself, there is a possibility that the optical axis is shifted.

Further, since the light receiving element, the light emitting element, and the electronic element are mounted on the same substrate, the mounting area is limited by the volume of the housing, and a large number of electronic elements are mounted to achieve high functionality. There are problems such as obstacles when trying to achieve.

In the optical data link disclosed in Japanese Patent Application Laid-Open No. 8-136767, since the substrate on which the light receiving element and the light emitting element are mounted is separated from the substrate on which the electronic element is mounted, the number of electronic elements is not limited. It has become. However, since it is necessary to separately connect an electronic circuit composed of these electronic elements and the light receiving element and the light emitting element by electric wiring, high-speed operation is hindered by the influence of parasitic inductance of the electric wiring. There are issues. Also,
There is also a problem that the number of components is increased due to the separation of the above-mentioned substrates, and the productivity is reduced.

SUMMARY OF THE INVENTION The present invention has been made in view of such problems of the prior art, and provides an optical data link which is easy to manufacture, has high mechanical reliability and high performance, and a method of manufacturing the same. With the goal.

[0017]

SUMMARY OF THE INVENTION In order to achieve such an object, the present invention converts one of the signals between an optical signal transmitted by an optical fiber and a corresponding electric signal into the other signal. The conversion element (either or both of the light-emitting element and the light-receiving element) for output is mounted on a conversion element mounting portion of a lead frame having a lead pin electrically connected to one end of the conversion element, and the optical fiber is converted. The coupling part for optically coupling to the element and the condensing part whose optical axis coincides with the main surface of the conversion element are integrally molded with the conversion element mounting part with the first resin for sealing the conversion element. It is characterized by.

With this configuration, the optical axes of the optical fiber and the conversion element are adjusted by the coupling section integrally formed with the conversion element and the light collecting section using resin. Because of resin molding, mass production with high accuracy is easy.

Further, the lead frame further includes an electronic element mounting portion for mounting an electronic element constituting an electronic circuit, and an external lead pin for external connection. It may be sealed with a second resin that is separated from one resin and molded integrally with the electronic element mounting portion.

According to this, an electronic circuit can be formed near the conversion element. Therefore, high-speed response can be ensured and handling can be facilitated.

Further, the lead frame may be formed in a portion exposed between the first resin and the second resin so as to be formed into a crest-like bent portion with respect to the main surface of the second resin. A valley may be further provided.

Since the peaks or valleys have a function of absorbing a change in the distance between the first resin and the second resin,
Accuracy at the connection portion between the first resin and the optical fiber and at the connection portion between the second resin and the lead pin can be independently ensured.

The angle of the bent portion of the hook-shaped bent portion on the second resin side is preferably larger than 90 degrees. Thereby, the dimensional margin when fixing the second resin portion to the housing is increased, and the force applied to the bent portion can be reduced. Further, the length of the bent portion itself can be shortened.

Further, a sleeve for holding the optical fiber may be integrally formed of the first resin at the coupling portion. According to this, the positioning accuracy between the coupling portion and the optical fiber is further improved.

Here, the second resin may not have light transmittance. According to this, unnecessary light incidence on the electronic element on the electronic circuit is blocked.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the optical data link according to the present invention will be described below with reference to the drawings. Here, FIG. 1 is a perspective view of a lead frame portion of the optical data link, and FIG.
FIG.

As shown in FIGS. 1 and 2, the transmitting unit of the present invention comprises a transmitting unit MW1 and an electronic circuit unit MW2, each of which is individually molded with resin so as to sandwich the lead frame 2. The main surface of the electronic circuit unit MW2 is disposed slightly inclined with respect to a direction orthogonal to the main surface of the transmission unit MW1. On the front surface of the transmission unit MW1 (the surface opposite to the surface facing the electronic circuit unit MW2), there is provided a coupling unit 28 with a transmission optical fiber (not shown). That is, the emission direction of the light from the transmitting unit MW1 is orthogonal to the main surface of the transmitting unit MW1. Further, a condensing lens 26 is formed inside the coupling portion 28,
The light emitting element LD is arranged inside the light emitting element LD. The light emitting element LD is provided on the conversion element mounting portion 4 of the metal lead frame 2.
It is connected to the. The transmission unit MW1 and the electronic circuit unit MW
2 are connected by a plurality of lead pins 12 of the lead frame 2, and the lead pins 12 are bent in a hook shape to form a mountain portion between the two. These lead pins 12 are drawn out from the transmitting unit MW1 and the electronic circuit unit MW2 in directions parallel to their respective main surfaces. The angle formed by the first bent portion of the lead pin 12 drawn out from the electronic circuit portion MW2 with the main surface of the electronic circuit portion MW2 is larger than 90 degrees, and the angle formed by the bent portions of the other lead pins 12 is approximately 90 degrees. . Therefore, the electronic circuit unit MW2
Is mounted obliquely with respect to the optical axis of the light incident on the transmission unit MW1 as described above.

An electronic element mounting section 8 on which electronic elements forming an electronic circuit for the light emitting element LD are mounted is sealed in the electronic circuit section MW2. From the opposite side of the lead pin 12 of the electronic circuit unit MW2, a lead pin 16 for external connection,
18 is drawn out and bent in a direction substantially perpendicular to the main surface.

If a light receiving element PD is used instead of the light emitting element LD, a receiving unit can be manufactured. In the case of a transmission unit as an example, these transmission or reception units bend the lead pins 12 connecting the transmission unit MW1 and the electronic circuit unit MW2. Can be fine-tuned.

The transmitting unit and the receiving unit are fixed in the housings 32 and 40 together with a sleeve 30 for fixing a ferrule (not shown) into which an optical fiber is inserted, thereby forming an optical data link.

The electronic circuit unit MW2 includes a transmitting unit (receiving unit) MW
Since it is mounted obliquely with respect to 1, it can be easily fixed to the housing, the total length of the lead frame 12 can be shortened, and the stress applied to the lead frame 12 can be reduced.

Next, the manufacturing process of this device will be described. Here, the sending and receiving unit integrated with the sending unit
The manufacturing process of the receiving unit TRU will be described as an example.
FIG. 3 is a plan view showing a state before processing of a lead frame used for manufacturing the TRU, FIG. 4 is a plan view showing a state in which an unnecessary portion of the lead frame is removed during processing, and FIG. FIG. 11 is an explanatory diagram for further explaining a state in which the lead frame is being processed.

First, the configuration of the metal lead frame 2 before processing will be described with reference to FIG. The lead frame 2 has a first conversion element mounting section 4 on which a light emitting element LD is mounted and a second conversion element mounting section 6 on which a light receiving element PD is mounted.
A first electronic element mounting section 8 for mounting an electronic element forming an electronic circuit related to the light emitting element LD, and a second electronic element mounting for mounting an electronic element forming an electronic circuit related to the light receiving element PD A unit 10 is provided.

The first electronic element mounting section 8 is provided between the first conversion element mounting section 4 and the first electronic element mounting section 8.
A plurality (5 in this embodiment) for electrically connecting the electronic circuit formed above and the light emitting element LD.
The electronic circuit formed on the second electronic element mounting part 10 is provided between the second conversion element mounting part 6 and the second electronic element mounting part 10. A plurality of (three in this embodiment) lead pins 14 for electrically connecting the element PD are provided.

Next, a process of manufacturing an optical data link using the lead frame 2 having such a shape will be described with reference to the drawings.

In FIG. 3, a light emitting element LD is mounted on a predetermined portion of the first conversion element mounting portion 4 of the lead frame 2 and a light receiving element PD is mounted on a predetermined portion of the second conversion element mounting portion 6, respectively. The conversion elements LD and PD may be directly mounted on the conversion element mounting sections 4 and 6, respectively, or a ceramic insulating thin plate may be mounted on the conversion element mounting sections 4 and 6, respectively. Conversion element L on an insulating thin plate
D and PD may be placed respectively. Also, by connecting electronic devices such as a power supply bypass capacitor together at predetermined positions of the conversion element mounting sections 4 and 6, for example, at positions close to the power lines of the conversion elements LD and PD, and shortening the connection distance between the elements. It is preferable to take measures such as improvement of noise characteristics.

Then, a so-called bonding pad formed on the light emitting element LD and a predetermined connection contact of the lead pin 12 are electrically connected by wire bonding. The electrical connection is similarly made between the light receiving element PD and the lead pin 14.

The first and second electronic element mounting sections 8, 1
0, a wiring board or an electronic element having a predetermined wiring pattern is placed, and the first electronic element mounting portion 8 and each predetermined connection contact of the lead pin 12 are electrically connected by wire bonding. And the second electronic element mounting section 1
0 and the lead pin 14 are similarly electrically connected.

Next, a predetermined die is used to mold the area indicated by the dotted line W1 in FIG. 3 with the first resin, so that the bare chips LD, PD, bonding wires, etc. existing in the area are molded. Is resin-sealed integrally with the first and second conversion element mounting portions 4 and 6. Here, as the first resin, a resin having optical transparency with respect to an optical signal used in the optical data link is used. Although details will be described later, when molded with this mold, similarly to the transmission unit shown in FIG. 1 described above, the condenser lens 26 and the coupling portion 28 corresponding to the main surface of the light emitting element LD, Element P
The condensing lens 26 'corresponding to the main surface of D and the coupling portion 28' are integrally resin-molded to form the transmission / reception portion MW1.

Next, the dashed line W in FIG.
By molding the area indicated by 2 with the second resin, the electronic elements, bonding wires, and the like existing in the area are integrally resin-sealed with the first and second electronic element mounting portions 8 and 10. . Here, unlike the first resin, a resin having no light transmittance is used as the second resin, and it is preferable that the electronic element and the like be shielded from external light. Thus, an electronic circuit portion MW2 molded with resin is formed.

Here, the case where the molding with the first resin and the molding with the second resin are performed separately has been described. However, the molding may be performed simultaneously with one mold.

Although the case where the first resin and the second resin are different has been described, the first and second electronic element mounting portions 8 and 10 are also used for the first and second conversion element mounting portions 4 and 6. May be molded simultaneously with the first resin using the first resin. In this case, it is possible to perform the molding only once. However, the first resin needs to have light transmissivity in order to form the light condensing part 26 as described later. In this case, the first resin is not connected to the electronic element sealed in the electronic circuit part MW2. To prevent light from entering,
It is desirable that the electronic circuit unit MW2 be housed in a light-shielding housing or the like.

Here, the structures of the condenser lenses 26 and 26 'and the coupling portions 28 and 28' molded with the first resin in the transmitting / receiving section MW1 will be described with reference to FIG. A shape corresponding to the condenser lenses 26 and 26 'and the coupling portions 28 and 28' is formed in advance in a mold for molding of the transmitting and receiving unit MW1, and molding using this mold is performed. Thereby, the condenser lenses 26 and 26 'and the coupling portions 28 and 28' are molded on the conversion element LD and PD sides.

Since the condenser lenses 26 and 26 'and the coupling portions 28 and 28' have the same shape, they are shown together in FIG.

The condenser lens 26 has its optical axis aligned with the light emitting element L.
D is formed so as to coincide with the light emitting end (principal surface) of D.
8, a concave portion 28a having a conical inner wall whose inner diameter gradually decreases as approaching the condenser lens 26 is formed. Similarly, the condensing lens 26 'is molded so that its optical axis coincides with the light receiving end (principal surface) of the light receiving element PD.
The coupling portion 28 'is formed with a concave portion 28a' having a conical inner wall whose inner diameter gradually decreases as approaching the condenser lens 26 '. An optical fiber is connected by fitting a sleeve 30 described later into the concave portion 28a of the coupling portion 28 and the concave portion 28a 'of the coupling portion 28'.

Next, as shown in FIG.
Then, unnecessary portions are removed by cutting the lead frame protruding from the resin sealing portion of the electronic circuit portion MW2 at a predetermined portion, and the lead pins 12, 14 and the external lead pins 16, 18, 20 are individually separated.

Next, at three points parallel to the two-dot chain line A1 (see FIG. 5) orthogonal to the longitudinal direction of the lead pins 12, 14, the lead pins 12, 14 and the connecting portions 22, 2
4 is bent to convert the conversion element L as shown in FIG.
D, PD and condensing lens 2 molded corresponding to them
6, 26 'and the coupling parts 28, 28' are turned outward, and the transmitting / receiving unit MW1 is processed so as to be perpendicular to the electronic circuit unit MW2. Here, the lead pins 12, 14
The connection portions 22 and 24 form a valley with respect to the transmission / reception portion MW1 and the electronic circuit portion MW2. Further, the external lead pins 16, 18, and 20 are taken along the two-dot chain line A2 in FIG.
Is bent in a predetermined direction.

As described above, by performing predetermined molding on the lead frame 2 and performing bending and the like, the components molded on the first conversion element mounting portion 4 and the first electronic element mounting portion 8 are formed. , And a transmission / reception unit TRU including a reception unit composed of components molded on the second conversion element mounting unit 6 and the second electronic element mounting unit 10.

Next, as shown in FIG. 7, the optical fibers FL1, FL are respectively connected to the coupling sections 28, 28 'integrally formed with the transmission / reception section MW1 of the transmission / reception unit TRU.
2 are assembled with the distal ends 30a, 30a 'of the cylindrical sleeves 30, 30' fixing the ferrules 50, 50 'via ferrules 50, 50'.

FIG. 8 shows the structure of the sleeve 30 (30 '). FIG. 9A is an external perspective view of the same, and FIG. The sleeve 30 is a cylindrical component formed of a resin such as metal or plastic, and its tip portion 30a is fitted to the inner wall of each of the concave portions 28a, 28a 'of the coupling portions 28, 28'. It is shaped like a truncated cone whose outer diameter gradually decreases as it approaches the tip. Further, a lens 30c is provided in the center hole 30b formed along the longitudinal direction of the sleeve 30 on the side of the distal end portion 30a.
c, one end behind the optical fiber FL1 (FL)
2) The ferrule 50 (50 ') holding the center hole 30
A step 30d is formed for positioning the ferrule by abutting the tip of the ferrule when inserted into the ferrule.

The tip portion 30 of the sleeve 30
When a is inserted into the concave portion 28a of the coupling portion 28 on the transmitting portion side,
As shown in FIG. 9, the inner wall of the recess 28a and the tip 30
The main surface of the bare chip LD provided in the transmitting unit and the condensing lens 26
And the optical axis of the lens 30c coincide. As will be described later, when the ferrule 50 holding the optical fiber FL1 is inserted into the center hole 30b from the rear end (the right side in FIG. 9) of the sleeve 30, the light incident end of the optical fiber FL1 is aligned with the optical axis Q. Can be.

Similarly, the concave portion 2 of the coupling portion 28 'on the receiving portion side
By inserting the sleeve 30 ′ into 8 a ′, the main surface of the bare chip PD provided in the receiving section and the optical axis Q ′ of the condenser lens 26 ′ coincide with the optical axis of the lens 30 c ′, and the optical fiber FL 2 By inserting the holding ferrule 50 'into the center hole 30b from the rear end of the sleeve 30', the light emitting end of the optical fiber FL2 can be made to coincide with the optical axis Q '.

Thereafter, as shown in FIG. 10, the transmission / reception unit TRU and the sleeves 30 and 30 'are incorporated in the housing 32 of the optical data link. Inside the housing 32, a fitting portion that fits and fixes the sleeves 30 and 30 ', and an engaging portion that engages with a predetermined end of the transmission / reception unit TRU and a fitting portion that engages A mating portion is provided, and the transmitting / receiving unit TRU is
And the sleeves 30 and 30 ′ are fixed at predetermined positions in the housing 32. Further, a holder 3 having a predetermined shape fitted to the side walls of these sleeves 30 and 30 ′ and the inner wall of the housing 32.
4 is assembled into the housing 32, so that the sleeve 3
Further, the occurrence of mechanical displacement of 0, 30 'and the like is more reliably prevented.

The housing 32 includes sleeves 30, 3
Openings 36, 36 'are formed in advance on the side end on the rear end side (the side where the ferrules 50, 50' are inserted) of the 0 ', and the optical fiber FL1 is passed through the openings 36, 36' from outside the housing 32. , FL2 inserted ferrules 50,5
0 'can be inserted into the respective center holes of the sleeves 30, 30'. As a result, as described above, the signal light H _RX transmitted by the optical fiber FL1 can be received by the light receiving element PD, while the signal light H _TX emitted from the light emitting element LD can be transmitted by the optical fiber FL2. Become. A rectangular flat bottom plate 40 is provided on the bottom end of the housing 32.
The optical data ring is completed by fixing.

According to the optical data link having such a structure, the light emitting element LD and the light receiving element PD are molded integrally with the predetermined mounting portions 4, 6 of the lead frame, and at the same time, the sleeves 30, 30 'are fitted. Connecting portion 28 for
28 'is also integrally molded, so that the conversion element L
It is possible to reliably prevent the relative positions of D, PD and the coupling portions 28, 28 'from shifting. Further, sleeves 30 and 30 'are attached to the joints 28 and 28' thus integrally molded.
Are fitted to the housing 32 in a fitted state, so that the sleeves 30 and 30 ', the coupling portions 28 and 28' and the conversion element L
The positioning accuracy between the main surfaces of D and PD is improved. As a result, when the ferrule holding the optical fiber is fitted into these sleeves 30 and 30 ', optical coupling between each optical fiber and the main surface of each conversion element LD and PD is ensured, and mechanical displacement is caused. Can also be reliably prevented.

Also, condenser lenses 26 and 26 'formed corresponding to each of the conversion elements LD and PD, and a coupling portion 28,
Since 28 'is integrally molded with a resin having transparency to an optical signal, it is possible to receive the optical signal from the optical fiber and to send the optical signal to the optical fiber, which does not hinder the optical communication. .

Further, since the transmitting and receiving parts are collectively molded into the lead frame by the resin, the individual components are formed with high precision, and by combining these components, a high-precision optical data link is provided. As compared with the case of realizing the above, manufacturing becomes easier and productivity can be improved.

The transmitting / receiving unit TRU without the mechanically movable part is formed by collectively molding the transmitting / receiving unit with resin, and the integrated transmitting / receiving unit TRU is provided with a sleeve 30 and a sleeve 30. 30 'are fitted and assembled to the housing 32, so that these transmitting / receiving units TR
The positioning accuracy between the U and the sleeves 30 and 30 '
It is determined independently of 2. Therefore, even when the housing 32 is mechanically distorted by external force during use of the optical data link, the transmitting / receiving unit TRU and the sleeve 30,
The relative position with respect to 30 ′ is not affected by this mechanical strain, and the ferrule 5 inserted into the sleeves 30 and 30 ′ is not affected.
Optical coupling between the optical fibers FL1 and FL2 fixed in 0 and 50 'and the conversion elements LD and PD in the transmission / reception unit TRU is stably maintained, and high-quality optical communication can be realized. High performance optical data links can be provided.

In this embodiment, the sleeve 30 is formed separately from the transmitting / receiving unit TRU, and the transmitting / receiving unit TRU and the sleeve 30 are integrated into the housing 32 during the assembling process. As described above, when the transmission / reception unit MW1 is molded, a sleeve portion having the same structure as the sleeve 30 may be simultaneously molded at the same time.

FIG. 11 shows an example in which the sleeve portion is collectively molded with resin. That is, when molding within the range indicated by the dotted line W1 in FIGS. 3 and 5, the optical axis coincides with the main surface of the bare chip LD of the transmission unit using a mold having a predetermined shape and the first resin. A sleeve part 42 having a condenser lens 44 and a fitting hole 46 for fitting a ferrule.
Are integrally molded, and at the same time, a sleeve part 4 having a condenser lens 44 'whose optical axis coincides with the main surface of the bare chip PD of the receiving part, and a fitting hole 46' for fitting a ferrule.
2 'is integrally molded.

Then, the transmission / reception unit in which the sleeve portions 42 and 42 'for the transmission unit and the reception unit are integrally molded is assembled to the housing 32 as described with reference to FIG. Complete the data link.

According to this modification, the sleeve portions 44, 4
Since the 4 'is molded integrally with the transmission / reception unit, the positioning accuracy between the optical fiber of the ferrule inserted into these sleeve portions 44 and 44' and the respective main surfaces of the bare chips LD and PD is improved. Can be done. As a result, a high-performance optical data link capable of realizing high-quality optical communication can be provided. Further, simplification and simplification of the manufacturing process become possible, and productivity can be improved.

In the above description, the optical data link having both the receiving unit and the transmitting unit has been described. However, the present invention is not limited to the optical data link having such a structure, and at least the receiving unit and the transmitting unit Which includes any one of the above.

[0064]

As described above, according to the present invention, the light emitting element for the transmitting section, the light receiving element for the receiving section, or both of these elements are made of a resin having transparency to an optical signal.
Since the lead frame is molded, a high-performance optical data link with high mechanical reliability can be provided. Furthermore, since the molding facilitates the production, the productivity can be improved.

Further, since the coupling portion for optically coupling the optical fiber to the light emitting element and the light receiving element is integrally molded at the same time as the molding, the productivity can be improved in this respect as well as the mechanical reliability can be improved. An optical data link with high reliability and high performance can be provided.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of an optical data link according to an embodiment of the present invention.

FIG. 2 is a longitudinal sectional view of the device according to FIG. 1;

FIG. 3 is a plan view showing a shape before processing of a lead frame used for manufacturing the optical data link of one embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a shape of the lead frame according to FIG. 3 in the process of being processed;

FIG. 5 is a plan view showing a state where an unnecessary portion of the lead frame according to FIG. 3 is removed.

FIG. 6 is a cross-sectional view for further explaining a shape of the lead frame according to FIG. 3 in the process of being processed;

FIG. 7 is a perspective view of a transmission / reception unit of the device according to FIG. 3;

FIG. 8 is a perspective view and a sectional view of the sleeve shown in FIG. 7;

9 is a cross-sectional view of a main part showing a fitted state of the sleeve shown in FIG. 8 and the coupling part shown in FIG. 7;

FIG. 10 is a perspective view showing an assembled state of the optical data link of the present invention.

FIG. 11 is a sectional view of a main part showing a modification of the sleeve.

[Explanation of symbols]

2: Lead frame, 4, 6: Conversion element mounting part, 8, 1
0: electronic element mounting portion, 12, 14: lead pin, 26,
26 '... condenser lens, 28, 28' ... coupling part, 28a,
28a ': recess, 30, 30': sleeve, 42, 4
2 '... sleeve part, 50, 50' ... ferrule, 52,
56: fitting recess, LD: light emitting element, PD: light receiving element,
W1: range molded with the first resin, W2
… The area that is molded with the second resin, MW1…
Transmission / reception unit, MW2 ... electronic circuit unit.

Claims (14)

[Claims] 1. A conversion element for converting one of signals into an other signal between an optical signal transmitted by an optical fiber and an electric signal corresponding thereto, and outputting the converted signal, a conversion element mounting section mounting the conversion element, and A lead frame having a lead pin electrically connected to one end of the conversion element; a coupling portion for optically coupling the optical fiber to the conversion element; and a coupling having an optical axis coincident with a main surface of the conversion element. An optical data link, wherein the coupling part and the light condensing part are integrally molded with the conversion element mounting part with a first resin sealing the conversion element. . 2. A first conversion element for converting an optical signal transmitted through a first optical fiber into an electric signal, and a second converting element for converting the electric signal into an optical signal and sending the optical signal to a second optical fiber. A conversion element, a conversion element mounting portion for mounting the first and second conversion elements, and a lead pin electrically connected to one end of the first conversion element and one end of the second conversion element, respectively. A lead frame having: a first coupling portion for optically coupling the first optical fiber to the first conversion element; and a first assembly having an optical axis coincident with a main surface of the first conversion element. An optical unit; a second coupling unit that optically couples the second optical fiber to the second conversion element; and a second light-collecting unit whose optical axis coincides with a main surface of the second conversion element. And the first and second coupling portions and the first and second light collecting portions are provided with the first and second condensing portions. Optical data link, characterized in that formed by molding integrally with the conversion element mounting portion in a first resin for sealing the second transducer. 3. The lead frame further includes an electronic element mounting section for mounting an electronic element constituting an electronic circuit, and an external lead pin for external connection, wherein the electronic element is molded on the conversion element mounting section. 3. The light according to claim 1, wherein the light is sealed with a second resin which is separated from the first resin and molded integrally with the electronic element mounting portion. 4. Data link. 4. The crest portion of the lead frame, which is formed by bending a portion exposed between the first resin and the second resin into a hook shape with respect to a main surface of the second resin. 4. The optical data link according to claim 3, further comprising a valley. 5. An angle formed by a bent portion of the hook-shaped bent portion of the lead frame on the second resin side with the second resin is 9.
5. The optical data link according to claim 4, wherein the angle is greater than 0 degrees. 6. The optical data according to claim 1, wherein a sleeve for holding the optical fiber is integrally molded with the coupling portion using the first resin. Link. 7. The optical data link according to claim 3, wherein said second resin does not have optical transparency. 8. A method of manufacturing an optical data link for connecting an optical fiber and an electric signal line, wherein one of signals between an optical signal and an electric signal is transferred to a conversion element mounting portion provided at a predetermined position of a lead frame. A step of mounting a conversion element that converts the signal into a signal and outputs the signal, a sealing section that seals the conversion element with a first resin, and optically couples the optical fiber to the photoelectric conversion element; And a step of integrally molding a light-collecting portion having an optical axis coincident with the main surface of the conversion element on the conversion-element mounting portion. 9. A method for manufacturing an optical data link for interconnecting two sets of optical fibers for transmission and reception and an electric signal line, wherein an optical signal is supplied to a conversion element mounting portion provided at a predetermined position of a lead frame. Mounting a first conversion element for converting an electric signal and a second conversion element for converting an electric signal to an optical signal; sealing the first and second conversion elements with a first resin; And the first and second coupling portions for optically coupling the first and second optical fibers to the first and second conversion elements, respectively, and the optical axes are the first and second conversion elements, respectively. Molding the first and second light-condensing portions that coincide with the main surface of the conversion element mounting portion integrally with the conversion element mounting portion. 10. A step of mounting an electronic element on an electronic element mounting portion provided at a predetermined position of a lead frame exposed from the first resin; and sealing the electronic element with a second resin. The method for manufacturing an optical data link according to claim 8, further comprising: a step of integrally molding the conversion element mounting portion separately from the first resin. 11. The method according to claim 11, further comprising the step of bending the lead frame exposed between the first and second resins into a hook shape to form a peak or a valley. 11. The method for manufacturing an optical data link according to item 10. 12. The optical data according to claim 11, wherein an angle formed by a bent portion of the hook-shaped bent portion of the lead frame on the second resin side with the second resin is larger than 90 degrees. Link manufacturing method. 13. The method according to claim 1, wherein the molding of the first resin on the conversion element mounting portion and the molding of the second resin on the electronic mounting portion are performed simultaneously.
0. The method for manufacturing an optical data link according to item 0. 14. The optical data link according to claim 8, wherein a sleeve for holding the optical fiber is formed integrally with the coupling portion using the first resin. Method.