JPH10106880A - Compound multilayered ceramic components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a compound multilayered ceramic component having large bonding strength, by restraining exfoliation of an interface between a low dielectric constant layer and a high dielectric constant layer or cracks in each of the layers, in a compound multilayered ceramic component wherein a conductor layer is formed on the lamination surface of the high dielectric constant layer and a low dielectric constant layer and laminated. SOLUTION: Low dielectric constant layer 1, 4 are composed of mixed material of ceramic powder and amorphous glass. At the time of baking, the layers 1, 4 are fluidized, softened and bonded to high dielectric constant layer 2, 3 and conductor layers 5, 6, 7, 8. Thereby exfoliation of interfaces and generation of cracks in each of the layers are restrained, and a stable compound multilayered ceramic component which has large bonding strength and high reliability can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite laminated ceramic component in which a low dielectric constant layer, a high dielectric constant layer, and a conductor layer are laminated and fired integrally.

[0002]

2. Description of the Related Art In recent years, as electronic devices have become smaller and more multifunctional, electronic components used therein have also been required to be lighter, thinner and shorter. For this purpose, a method of printing a resistor, a wiring pattern, and the like on a ceramic substrate having a limited area at a higher density, and integrating chip components at a higher density have been adopted.

[0003] However, the conventional method for increasing the density has limitations in miniaturizing components and the substrate on which the components are mounted. In particular, in the case of high-frequency components, when the wiring pattern is made dense, there is a problem that capacitance between nozzles and lines is likely to be generated, and as a result, quality is reduced.

[0004] Under these circumstances, a new composite multilayer ceramic component having a configuration in which a capacitor and a resonator are provided inside a substrate is being developed. As an example, a high dielectric constant layer for forming a capacitor or a resonator is sandwiched between low dielectric constant layers for forming a wiring pattern, and a conductor layer is provided on each laminated surface.

[0005]

However, in a composite laminated ceramic component obtained by integrally firing different kinds of laminates, the difference in the firing behavior and thermal expansion coefficient between the low dielectric constant layer and the high dielectric constant layer results in a difference between the two. There is a problem that peeling at the interface or deformation of the fired body substrate occurs, and cracks are easily generated in each layer due to distortion generated inside.

In order to prevent separation at the interface between the low dielectric constant layer and the high dielectric constant layer and cracks in each layer, for example, as shown in Japanese Patent Publication No. 5-13524, the By providing an intermediate layer made of a composite of materials, the aforementioned peeling and cracking were prevented.
In this method, an intermediate layer, which is originally unnecessary, must be formed in order to realize the function of the electronic component, so that the number of steps is increased, which is disadvantageous in terms of cost and is an obstacle to miniaturization. Met.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a composite multilayer ceramic component which eliminates the above-mentioned drawbacks of the prior art and does not cause peeling at the interface, cracks in each layer, and deformation without an intermediate layer. Things.

[0008]

In order to solve the above problems, the present invention provides a method of forming a conductive layer on a laminated surface of a high dielectric constant layer and a low dielectric constant layer, wherein the low dielectric constant layer is amorphous. It is composed of a material containing fine glass and ceramic powder.

With this configuration, it is possible to obtain a composite multilayer ceramic component which is free from peeling at the lamination interface between different kinds of materials, generation of cracks in each layer and deformation of the whole.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, a conductor layer is formed and laminated on a laminated surface of a high dielectric layer and a low dielectric layer, and the low dielectric layer is amorphous. It is composed of a mixture of glass and ceramic powder, and has the effect of preventing peeling at the interface, cracking of each layer and deformation of the entire layer even when integrally fired.

According to a second aspect of the present invention, the low dielectric constant layer is forsterite (Mg ₂ SiO ₄ ), zirconia (ZrO).
₂ ) It is composed of at least one ceramic powder of alumina (Al ₂ O ₃ ) and amorphous glass, and it is possible to more reliably eliminate peeling at the interface and generation of cracks in each layer. it can.

According to a third aspect of the present invention, the low dielectric constant layer has a relative dielectric constant of less than 15 and a volume resistivity of 1 × 10 ^12.
Ωcm or more. When a plurality of components are mounted on the low dielectric constant layer, there is an effect that unnecessary capacitance and noise generated between the components can be reduced.

According to a fourth aspect of the present invention, the mixing weight ratio of the ceramic powder and the amorphous glass is 30:70 by weight.
７０70: 30, which has the effect that the separation at the interface and the occurrence of cracks in each layer can be more reliably eliminated.

According to a fifth aspect of the present invention, the main component of the amorphous glass of the low dielectric constant layer is SiO ₂ —Al ₂ O ₃ —MO (M is at least one of Ba, Ca and Sr) -La. ₂ O ₃ −
It is made of B ₂ O ₃ , which can eliminate peeling at the interface and generation of cracks in each layer, and has sufficiently high adhesive strength at the interface between the high dielectric constant layer and the low dielectric constant layer. Has the effect of being able to

According to a sixth aspect of the present invention, the main component of the amorphous glass is 40 to 50% by weight of SiO _{2 and 0} to 50% by weight of Al ₂ O _3.
15% by weight, 0 to 10% by weight of B ₂ O ₃ , and (MO
(M is at least one of Ba, Ca and Sr) + La
₂ O ₃ ) in an amount of 40 to 50% by weight and La ₂ O _{3 of 0} to 15%
Wt%, which can reliably eliminate peeling at the interface and cracks in each layer, and further increase the adhesive strength at the interface between the high dielectric layer and the low dielectric layer. It has the action that can be.

According to a seventh aspect of the present invention, the conductive layer is made of silver, and has an effect of increasing the conductivity of the conductive layer.

According to the present invention, the total amount of the ceramic powder and the amorphous glass is 1 as a subcomponent of the low dielectric constant layer.
When the content is set to 00% by weight, silicon oxide, copper oxide, and manganese oxide are converted to SiO ₂ , CuO, and MnO ₂ from 0.05 to
2.0% by weight is added, so that the firing temperature of the low dielectric constant layer can be surely lowered to 950 ° C. or lower, and has an effect that silver can be used as a conductor layer.

According to a ninth aspect of the present invention, in the production of the mixed powder of the ceramic powder and the amorphous glass constituting the low dielectric constant layer, the average particle diameter of the mixed powder is 2.0 μm or less. Yes, the firing temperature of the low dielectric constant layer can be reliably reduced to 950 ° C. or lower, and has an effect of enabling silver to be used as a conductor layer.

According to a tenth aspect of the present invention, the relative dielectric constant of the high dielectric constant layer material is 15 or more, the product of the unloaded Q value and its resonance frequency (0.5 GHz to 5 GHz) is 500 or more, and the temperature of the resonance frequency is The absolute value of the rate of change is set to 50 ppm / ° C. or less, and the high dielectric constant layer can be used as a dielectric ceramic for microwaves. For example, a high performance laminated dielectric filter of a triplate type is incorporated. It has the effect of making it possible.

According to an eleventh aspect of the present invention, the high dielectric constant layer is made of a dielectric ceramic mainly composed of Bi ₂ O ₃ , CaO, and Nb ₂ O ₅ , and has a relative dielectric constant of 15 or more, The product of the load Q value and its resonance frequency (0.5 GHz to 5 GHz) is 500 or more, and the absolute value of the temperature change rate of the resonance frequency is 5
A microwave dielectric material capable of using silver as the internal conductor layer at 0 ppm / ° C. or lower and a firing temperature of 950 ° C. or lower can be reliably obtained.

According to a twelfth aspect of the present invention, the high dielectric constant layer is a dielectric ceramic material containing Bi ₂ O ₃ , CaO, Nb ₂ O ₅ as a main component, and the low dielectric constant of the second aspect. When alumina is contained in the ceramic powder of the layer, the content of the alumina is specified to be less than 50% by weight, so that separation at the interface and generation of cracks in each layer can be more reliably eliminated. It has the effect of being able to.

According to a thirteenth aspect of the present invention, the high dielectric constant layer is made of a dielectric ceramic containing Bi ₂ O ₃ , CaO, ZnO, CuO, and Nb ₂ O ₅ as main components.
Has the same function as.

According to a fourteenth aspect of the present invention, the high dielectric constant layer is a dielectric ceramic material containing Bi ₂ O ₃ , CaO, ZnO, CuO, and Nb ₂ O ₅ as main components. In the case where alumina is contained in the ceramic powder of the low dielectric constant layer, the content of the alumina is specified to be 50% by weight or more, and has the same effect as in claim 12.

According to a fifteenth aspect of the present invention, the high dielectric constant layer is made of a dielectric ceramic containing BaO, Nd ₂ O ₅ , TiO ₂ and glass as main components. Have.

The invention according to claim 16 provides a high dielectric constant layer.
Main component is BaO, Nd_TwoO_Five, TiO _TwoAnd mainly glass
3. A dielectric ceramic material as a component, and
Alumina is included in the ceramic powder of the low dielectric constant layer described in
The alumina content is 50% by weight.
It is configured to be less than
It has a similar effect.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view showing a composite multilayer ceramic component according to an embodiment of the present invention. In FIG. 1, a composite multilayer ceramic component with a built-in dielectric filter is shown as an example.

In FIG. 1, a conductor layer 8 as a shield electrode is formed on a low dielectric constant layer 4 containing a mixture of amorphous glass and ceramic powder as a main component. High dielectric constant layer 3 is provided. A conductor layer 7 as an electrode of a dielectric filter is formed on the high dielectric constant layer 3, and a high dielectric constant layer 2 is also provided thereon, and an upper surface of the high dielectric constant layer 2 serves as a shield electrode. The conductor layer 6 is formed.

On the high dielectric constant layer 2 on which the conductor layer 6 is provided, a low dielectric constant layer 1 mainly composed of a mixture of amorphous glass and ceramic powder is provided. Is formed with a land electrode for mounting components or an electrode conductor layer 5 for forming an inductance component, and a part of this conductor layer 5 penetrates the low dielectric layer 1 and the high dielectric layer 2. Are connected, and the through-hole conductors 9 and 10 are connected to the conductor layer 7 as an electrode for the dielectric filter, respectively.

These components are formed by batch firing a stack of green sheets. When these laminates are fired at one time, the low dielectric layers 1 and 4 flow and soften and bind to the high dielectric layers 2 and 3 and the conductor layers 5, 6, 7, and 8, thereby peeling off the interface or each layer. The composite ceramic component having a large adhesive strength can be obtained by suppressing the occurrence of cracks that occur in the composite ceramic component.

Here, a composite multilayer ceramic component with a built-in dielectric filter has been taken as an example.
A composite multilayer ceramic component incorporating various electronic components such as a ceramic filter can be formed, and a configuration in which a low dielectric layer and a high dielectric layer are alternately laminated is also possible.

Next, the materials of the high dielectric constant layer and the low dielectric constant layer, which are features of the present invention, will be described with reference to specific embodiments.

(Embodiment 1) The material used for the high dielectric constant layer is a system containing Bi ₂ O ₃ , CaO, and Nb ₂ O ₅ as main components (hereinafter, BCN), Bi ₂ O ₃ , CaO, ZnO, CuO, Nb
A system containing ₂ O ₅ as a main component (hereinafter referred to as BCZCN), BaO, N
_{d 2 O 5, TiO 2,} Sm 2 O 3, Bi 2 O 3 PbO to ceramic powder 90 wt% of a main component, B ₂ O _3, SiO ₂
(Hereinafter referred to as BNTG) composed of 10% by weight of a glass containing as a main component.

The electrical characteristics of BCN are as follows: dielectric constant εr = 5
8. The product fQ of the no-load Q value and the resonance frequency was fQ = 2800, and the temperature characteristic τf of the resonance frequency was +23 ppm / ° C. Also B
CZCN is εr = 100, fQ = 2200, τf = + 5
ppm / ° C, BNTG: εr = 55, fQ = 2350, τf
= +15 ppm / ° C.

500 g of these powders were added to a solution of 10 g of dibutyl phthalate and 25 g of polyvinyl butyral resin in 200 g of methyl ethyl ketone, and mixed with a ball mill for 24 hours. Dielectric green sheets of each composition having a thickness of 50 μm were prepared from the obtained slurry by a doctor blade method.

Here, the reason why BCN, BCZCN and BNTG dielectric materials were used for the high dielectric constant layer was that the firing temperature was 950 ° C. or less, and that simultaneous firing was performed using silver having high conductivity for the internal conductor layer. This is because it is possible and has excellent microwave characteristics as described above.

The glass used for the low dielectric constant layer is Si
O_Two, H_ThreeBO_Three, Al (OH)_Three, CaCO_Three, BaC
O_Three, SrCO_Three, La_TwoO_ThreeRaw materials such as platinum or platinum
Melted in a crucible, cooled and ground to produce glass powder.
Made. The obtained glass powder and forsterite (M
g_TwoSiO_Four), Zirconia (ZrO)_Two), Alumina (A
l_TwoO _Three) Powder in any weight ratio and zirconia
Powder, wet mixed, crushed and dried
A powder was prepared.

The average particle diameter of the low dielectric layer material powder was measured by a laser diffraction measurement method. After adding a polyvinyl alcohol aqueous solution to this powder as a binder and granulating,
A disk having a diameter of 13 mm and a thickness of 1 mm was formed by a die press, and the binder was scattered at 500 ° C., followed by firing at a temperature of 850 ° C. to 950 ° C. Au on the upper and lower surfaces of this fired body
An electrode was formed by -Cr vapor deposition, and the relative permittivity at 1 MHz was measured by an LCR meter, and the resistivity (500 Vdc, 1 minute) was measured by an insulation resistance meter.

500 g of the obtained low dielectric constant layer material powder was added to 300 g of methyl ethyl ketone in 25 g of dibutyl phthalate.
g of polyvinyl butyral resin and 50 g of the resin, and mixed with a ball mill for 24 hours. From the obtained slurry, a green sheet having a thickness of 50 μm was produced by a doctor blade method.

The high dielectric constant sheets produced by the above-described method were laminated and thermocompression-bonded at 60 ° C. to produce high dielectric constant layers 2 and 3 (each having a thickness of 500 μm). Similarly, low dielectric constant sheets were laminated and thermocompression bonded at 60 ° C. to produce low dielectric constant layers 1 and 4 (each having a thickness of 200 μm). These one
Through holes 9 and 10 were formed in the two layers to obtain conduction between the conductor layers, and filled with silver paste. Then,
Silver paste was printed on the four layers in a predetermined conductor pattern by a screen printing method to form conductor layers 5, 6, 7, and 8, respectively. Next, the respective layers 1 to 4 are sequentially positioned and laminated, and after thermocompression bonding at 80 ° C., the binder is removed at 500 ° C.
Thereafter, firing was performed at a temperature of 850 ° C. to 950 ° C. to form a composite multilayer ceramic component shown in FIG.

Hereinafter, specific embodiments 2 to 6 will be described. (Embodiment 2) A substrate obtained by firing and integrating a high dielectric constant layer material as in the first embodiment with glass having various compositions as a low dielectric constant layer material is used. The appearance of the fired state, such as the adhesive strength at the interface of the dielectric layer, peeling, and the presence or absence of undulation of the substrate, was determined from the appearance. The interfacial adhesive strength was evaluated by a tensile test. Furthermore, a dicer using a 0.2 mm thick blade
The presence or absence of cracks on the cut surface when each substrate was cut at a speed of mm / sec was observed. The coefficient of thermal expansion of the glass was determined by TMA measurement, and the softening point was determined by DTA (indicative thermal analysis) measurement.

[0041]

[Table 1]

SiO ₂ —Al ₂ O ₃ —B with a fixed component amount
to aO-CaO-B ₂ O ₃ based amorphous glass, forsterite, and a low dielectric constant material mixed by changing zirconia, a mixed amount of each ceramic powder alumina, BCN, B
Each of the high dielectric constant materials of CZCN and BNTG was used in Embodiment 1.
The evaluation results of the simultaneous co-firing based on Table 1 are shown in Sample Nos. 1 to 16 in (Table 1). The weight mixing ratio between the amorphous glass and the ceramic powder in the low dielectric constant layer was 50:50.

The low dielectric constant materials of Sample Nos. 1 to 5 are BCN,
Although the bonding strength between BNTG and the interface was slightly low, simultaneous firing was possible, but simultaneous firing with BCZCN was not possible, and the fired body was broken. The coefficient of thermal expansion of BCN is 93 × 10 ⁻⁷ / ° C.,
BNTG is 95 × 10 ^-7 / ° C, whereas BCZC
N is as low as 76 × 10 ⁻⁷ / ° C. Therefore, the coefficient of thermal expansion is 88
The low dielectric constant materials of Sample Nos. 1 to 5, which have relatively close thermal expansion to BCN and BNTG at ~ 93 × 10 ^-7 / ° C, can be co-fired with BCN and BNTG, but have a high dielectric constant for BCZCN. It is considered that the fired body was broken because a large compressive stress was applied to the layer.

In the low dielectric constant material of Sample No. 6, since the content of alumina increased and the coefficient of thermal expansion decreased, the BCZC
Simultaneous firing was also possible with N, but there was a large accumulation of internal stress, and the stress was released and cut when cut with a dicer.

In sample No. 7, the alumina content increased,
Since the coefficient of thermal expansion was further reduced, no crack was generated on the cut surface even when baked on BCZCN and cut with a dicer. However, as for BCN and BNTG, many cracks occurred in the high dielectric constant layer when the fired body was cut with a dicer. It is considered that the thermal expansion coefficient of the low dielectric constant layer was too small as compared with that of the high dielectric constant layer, so that a large tensile stress acted on the high dielectric constant layer to cause cracks.

As shown in sample 8, the amount of alumina increased,
When the coefficient of thermal expansion drops to 79 × 10 ⁻⁷ / ° C., BCN,
It cannot be fired at the same time as BNTG, and completely peels off at the interface.
On the other hand, it was possible to obtain a good fired body with slightly weaker adhesive strength to BCZCN.

In the case of Sample Nos. 9 to 16, the tendency is the same as that of 1 to 8. When the content of alumina becomes 50% or more and the coefficient of thermal expansion becomes small, simultaneous firing with BCZCN becomes possible, and the content of alumina becomes If the coefficient of thermal expansion increases below 50%, simultaneous firing with BCN and BNTG becomes possible.

From the above results, when the high dielectric constant layer is made of BCN and BNTG, the content of alumina in the ceramic mixed powder composed of forsterite, alumina and zirconia is preferably less than 50% by weight. When the high dielectric constant layer is made of BCZCN, the content of alumina is preferably 50% by weight or more.

(Embodiment 3) Subsequently, each component of the amorphous glass composition of the low dielectric constant layer was optimized.

[0050]

[Table 2]

Here, BCN was used as the high dielectric constant layer. The evaluation method is the same as in the second embodiment. Similarly to Sample No. 1 in (Table 1), the ceramic powder of the low dielectric constant layer was forsterite 100% by weight, and the weight mixing ratio between the amorphous glass and the ceramic powder was 50:50.

Sample Nos. 1 and 17 to 20 in Table 2 were obtained by examining the ratio between SiO ₂ and MO (M is Ba, Ca) in the amorphous glass. SiO ₂ is a glass-forming oxide and has a function of lowering the coefficient of thermal expansion of glass. Therefore, when the amount of SiO ₂ is too large (sample No. 20), the coefficient of thermal expansion of the low dielectric constant layer decreases,
Many cracks occurred in the high dielectric constant layer for the same reason as described above. On the other hand, if it is too small (Sample No. 17), the coefficient of thermal expansion becomes large and the fired body is broken. Therefore, SiO ₂
Is preferably 40 to 50% by weight.

Sample numbers 21 to 24 in (Table 2) are MO / L
The a ₂ O ₃ ratio was studied. Based on the amorphous glass of Sample No. 19, MO (M is Ba, Ca) was partially replaced with La ₂ O ₃ . Increasing the amount of La ₂ O ₃ causes BC
The reactivity between N and the low dielectric constant material is improved, and the bonding strength at the interface becomes strong. On the other hand, the coefficient of thermal expansion hardly changes. However, if the amount of La ₂ O ₃ is too large, the reaction between the low dielectric constant layer and BCN becomes too violent, and the entire fired body will undulate. From the results of sample numbers 17 to 24 (MO + La ₂ O ₃ )
Is preferably 40 to 50% by weight, and the amount of La ₂ O ₃ is preferably 15% by weight or less.

The sample numbers 25 to 39 in Table 2 were BaO /
CaO / SrO ratio, 40-42: SiO ₂ / B ₂ O ₃ ratio,
Reference numerals 43 to 46 are for optimizing the Al ₂ O ₃ / SiO ₂ ratio.

From the results of Sample Nos. 25 to 39, it is preferable that BaO is 10 to 40% by weight, CaO is 0 to 30% by weight, and SrO is 0 to 10% by weight. When the content of BaO and SrO becomes high, it shifts to the low expansion side, and when the content of CaO becomes high, it shifts to the high expansion side.

From the results of Sample Nos. 40 to 42, B ₂ O ₃
Is preferably 0 to 10% by weight. If the content exceeds 10% by weight, the softening point of the glass is too low, and the reaction with the high dielectric constant layer becomes intense, causing undulations in the fired body.

Further, from the results of sample numbers 43 to 46,
_If the amount of ₂ O ₃ exceeds 15% by weight, the thermal expansion becomes too large and cracks occur in the high dielectric constant layer, so the amount is preferably 0 to 15% by weight.

The present invention is not limited to the third embodiment, but includes SnO ₂ , P ₂ O ₅ , K ₂ O and the like as components which can be added to the amorphous glass of the low dielectric constant layer. it can.

(Embodiment 4) Next, the weight mixing ratio between the amorphous glass and the ceramic powder was examined. As the composition of the amorphous glass, the composition of Sample No. 21 was used from the result of Embodiment 3.

[0060]

[Table 3]

Sample Nos. 21 and 47 to 52 in Table 3
Uses forsterite as ceramic powder,
It is an evaluation result when the weight mixing ratio of the amorphous glass and the amorphous glass was changed. Sample numbers 53 to 59 are the results when alumina was used for the ceramic powder, and 60 and 61 were the results when zirconia was used.

Regardless of the type of the ceramic powder, the sinterability of the low dielectric constant layer material deteriorates when the weight ratio of the ceramic powder increases. When the weight mixing ratio of the ceramic powder and the amorphous glass becomes 75:25, the firing temperature becomes 95.
It cannot be fired even at 0 ° C., causing a decrease in insulation resistance. At a higher firing temperature, simultaneous firing with silver becomes impossible.

On the contrary, when the mixing ratio of the amorphous glass increases, the sinterability improves, but when the mixing ratio becomes 25:75, the reaction between the amorphous glass and the high dielectric constant layer becomes too vigorous, and Cause warping and swelling.

From the above results, the weight mixing ratio between the ceramic powder and the amorphous glass is preferably from 30:70 to 70:30.

(Embodiment 5) The effect of the pulverized average particle size of the low dielectric constant material on the low temperature firing of the low dielectric constant material was examined.

[0066]

[Table 4]

The weight ratio of the ceramic powder (forsterite) of sample number 51 in Table 3 to the amorphous glass was 7
When the ratio was 0:30, sintering was finally achieved at a firing temperature of 950 ° C., which is the limit of simultaneous firing with silver. The results obtained by lengthening the pulverization time of this low dielectric constant material, reducing the average particle diameter, and achieving low-temperature sintering are shown in Table 4 for sample numbers 63 and 63.
64. The average crushed particle diameter of low dielectric constant material is 2.0μ
m or less, the sintering temperature drops by 20 ° C. or more, and even if the composition is slightly inferior in sinterability as in Sample No. 51, a difference of 30 ° C. or more from the melting temperature of silver (about 960 ° C.) can be ensured.
Therefore, it is possible to prevent partial melting of the silver electrode and a decrease in the conductivity.

Therefore, the average particle diameter of the low dielectric constant material is preferably 2.0 μm or less.

(Embodiment 6) The effect of a subcomponent added to a low dielectric constant material on low temperature firing of the low dielectric constant material was examined.

Sample Nos. 65 to 67 in Table 4 contain silicon dioxide (SiO ₂ ) as an auxiliary component, Sample Nos. 68 to 70 contain copper oxide (CuO), and Sample Nos. 71 to 73 contain manganese dioxide (MnO ₂ ). It is an evaluation result in the case of doing.

In the case of any of the subcomponents, the firing temperature is lowered by 20 ° C. or more, and the effect of firing at a low temperature is recognized.
However, when the auxiliary component is silicon dioxide, the addition amount is 3.0% by weight.
Then, swelling occurs in the fired body. Further, when the added amount of copper oxide and manganese dioxide is 3.0% by weight, the insulation resistance of the low dielectric constant material is reduced, and
× 10 ¹² (Ωcm) or less.

From the above results, it is preferable to add 0.05 to 2.0% by weight of silicon dioxide, copper oxide, and manganese dioxide as subcomponents to the low dielectric constant material.

[0073]

From the above results, it can be seen that BCN, BCZC can be obtained by using a mixed material of amorphous glass and ceramic powder as the low dielectric constant layer material of the composite multilayer ceramic part of the present invention.
It is possible to co-fire with N or BNTG high dielectric constant dielectric ceramic material for microwave. Further, in this case, peeling of the fired body at the interface between the different materials and the generation of cracks in each layer can be suppressed. as a result,
A highly reliable and stable composite multilayer ceramic component can be obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a composite multilayer ceramic component according to the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 low dielectric constant layer 2 high dielectric constant layer 3 high dielectric constant layer 4 low dielectric constant layer 5 conductor layer (wiring pattern) 6 conductor layer (shield layer) 7 conductor layer (resonator) 8 conductor layer (shield layer) 9 through Hole conductor 10 Through-hole conductor

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI H05K 1/03 610 H05K 3/46 H 3/46 C04B 35/16 Z (72) Inventor Ryuichi Saito 1006 Okadoma, Kadoma, Osaka Address Matsushita Electric Industrial Co., Ltd. (72) Inventor Ryo Kimura 1006 Oji Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (16)

[Claims] 1. A composite multilayer ceramic component wherein a conductor layer is formed and laminated on a laminated surface of a high dielectric constant layer and a low dielectric constant layer, and said low dielectric constant layer is composed of a mixture of amorphous glass and ceramic powder. . 2. The method according to claim 1, wherein the low dielectric constant layer is forsterite (Mg ₂
SiO ₄ ), zirconia (ZrO ₂ ), alumina (Al ₂
O ₃ ) at least one ceramic powder;
The composite multilayer ceramic component according to claim 1, wherein the component is made of amorphous glass. 3. The composite monolithic ceramic component according to claim 2, wherein the low dielectric constant layer has a relative dielectric constant of less than 15 and a volume resistivity of 1 × 10 ¹² Ωcm or more. 4. The composite multilayer ceramic component according to claim 2, wherein the mixing weight ratio of the ceramic powder and the amorphous glass is 30:70 to 70:30. 5. The method according to claim 1, wherein the main component of the amorphous glass of the low dielectric constant layer is S.
_{iO 2 -Al 2 O 3 -MO (} M is Ba, Ca, at least one kind from Sr) composite multilayer ceramic part according to claim 2, wherein comprising a _{-La 2 O 3 -B 2 O 3} . 6. The main component of the amorphous glass is SiO._TwoIs 40
~ 50% by weight, Al_TwoO _ThreeIs 0 to 15% by weight, B_TwoO_ThreeIs 0
-10% by weight, and (MO (M is Ba, Ca, Sr
At least one or more) + La_TwoO_Three) 40 to 50 weight
% And La _TwoO_Three6. The composition according to claim 5, wherein
Composite multilayer ceramic parts. 7. The composite multilayer ceramic component according to claim 1, wherein the conductor layer is silver. 8. When the total amount of ceramic powder and amorphous glass is 100% by weight as subcomponents of the low dielectric constant layer,
Silicon oxide, copper oxide, and manganese oxide are converted to SiO ₂ , Cu
O, composite multilayer ceramic part according to claim 2, wherein comprising a material obtained by adding 0.05 to 2.0 wt% in terms of MnO _2. 9. The composite multilayer ceramic component according to claim 2, wherein in the production of the mixed powder of the ceramic powder and the amorphous glass constituting the low dielectric constant layer, the average particle diameter of the mixed powder is 2.0 μm or less. . 10. A high dielectric constant layer for a microwave having a relative dielectric constant of 15 or more, a product of an unloaded Q value and its resonance frequency of 500 or more, and an absolute value of a temperature change rate of the resonance frequency of 50 ppm / ° C. or less. The composite multilayer ceramic component according to claim 1, which is made of a dielectric material. 11. The high dielectric constant layer is made of Bi ₂ O ₃ , CaO, Nb.
Composite multilayer ceramic part according to claim 1, which is a dielectric ceramic material for the ₂ O ₅ as a main component. 12. The high dielectric constant layer is made of Bi ₂ O ₃ , CaO, Nb.
_{3. In the} case where the ceramic powder is a dielectric ceramic material containing ₂ O ₅ as a main component and the ceramic powder of the low dielectric constant layer according to claim 2 contains alumina, the alumina content is 5%.
The composite multilayer ceramic component according to claim 2, wherein the content is less than 0% by weight. 13. The high dielectric constant layer is made of Bi ₂ O ₃ , CaO, Zn.
O, CuO, composite multilayer ceramic part according to claim 1, which is a dielectric ceramic material mainly composed of Nb ₂ O _5. 14. The high dielectric constant layer is made of Bi ₂ O ₃ , CaO, Zn.
_3. A dielectric ceramic material containing O, CuO, and Nb ₂ O ₅ as main components, and when the ceramic powder of the low dielectric constant layer according to claim 2 contains alumina, the content of the alumina is 50% by weight. %. 15. The high dielectric constant layer is made of BaO, Nd ₂ O ₅ , Ti.
O ₂ and composite multilayer ceramic part according to claim 1 glass is a dielectric ceramic material composed mainly of. 16. The high dielectric constant layer is made of BaO, Nd ₂ O ₅ , Ti
3. When the ceramic powder of the low dielectric constant layer according to claim 2 is alumina, which is a dielectric ceramic material containing O ₂ and glass as main components, the alumina content is less than 50% by weight. The composite multilayer ceramic component according to claim 2.