JPH0994915A - Manufacture of composite laminate and manufacture of thermosetting sheet - Google Patents

Manufacture of composite laminate and manufacture of thermosetting sheet

Info

Publication number
JPH0994915A
JPH0994915A JP25588395A JP25588395A JPH0994915A JP H0994915 A JPH0994915 A JP H0994915A JP 25588395 A JP25588395 A JP 25588395A JP 25588395 A JP25588395 A JP 25588395A JP H0994915 A JPH0994915 A JP H0994915A
Authority
JP
Japan
Prior art keywords
thermosetting resin
manufacture
glass chopped
composite laminate
core material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25588395A
Other languages
Japanese (ja)
Inventor
Yasuhiro Murai
康裕 村井
Masanori Iizuka
正則 飯塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP25588395A priority Critical patent/JPH0994915A/en
Publication of JPH0994915A publication Critical patent/JPH0994915A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)

Abstract

PROBLEM TO BE SOLVED: To reduce a used amount of solvent by a method wherein settling of a filter is removed by using highly viscous resin for a core material layer of a composite laminate. SOLUTION: A thermosetting sheet 13 wherein a glass chopped strand is scattered is used as a core material, a prepreg 12 using a woven cloth as a base material is superimposed as a surface material on its both sides, and a copper foil 11 is arranged on the surface material, which is heated and pressurized. For the thermosetting sheet 13 wherein the glass chopped strand is scattered, the thermosetting resin wherein the glass chopped sheet is scattered is applied onto a film, which is heated to harden the thermosetting resin to a stage B.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明が属する技術分野】この発明は、プリント配線板
の基板となるコンポジット積層板の製造方法、及び、こ
のコンポジット積層板の芯材として好適な熱硬化性樹脂
シートの製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a composite laminated board which is a substrate for a printed wiring board, and a method for producing a thermosetting resin sheet suitable as a core material for the composite laminated board.

【0002】[0002]

【従来の技術】コンポジット積層板は、2種の基材、表
面材の基材として織布を、また、芯材の基材として不織
布又は紙を用いて構成された積層板である。現在は、エ
ポキシ樹脂をマトリックス樹脂とし、表面材としてガラ
ス織布を、また、芯材としてガラス不織布(ガラスペー
パー)が用いられたものが多く生産され、優れた電気特
性と常温打ち抜き性を有するので、プリント配線板の基
板として一分野を占めるに至っている。
2. Description of the Related Art A composite laminated plate is a laminated plate composed of two kinds of base materials, a woven cloth as a surface material, and a non-woven fabric or paper as a core material. Currently, many products are manufactured using epoxy resin as a matrix resin, glass woven fabric as the surface material, and glass non-woven fabric (glass paper) as the core material, because they have excellent electrical properties and room temperature punchability. , Has come to occupy one field as a substrate for printed wiring boards.

【0003】[0003]

【発明が解決しようとする課題】芯材の基材に含浸する
ワニスは、粘度が5〜300mPa・sであり、多量の
溶剤を使用している。ところが、芯材のマトリックス樹
脂には、フィラーを配合しているが、ワニスが低粘度で
あるため、フィラーが沈降しやすく、フィラーの分布が
不均一となることがある。その結果、ワニスの塗りむ
ら、それに起因するボイドやかすれなどの不良が発生す
る。ワニスの粘度を高くすれば、フィラーの沈降を防止
できるが、逆に、フィラーを均一に分散すること及び基
材への含浸が困難となる。
The varnish impregnated into the base material of the core material has a viscosity of 5 to 300 mPa · s and uses a large amount of solvent. However, the matrix resin of the core material contains a filler, but since the varnish has a low viscosity, the filler tends to settle and the distribution of the filler may become uneven. As a result, uneven coating of the varnish and defects such as voids and scratches caused by it occur. If the viscosity of the varnish is increased, sedimentation of the filler can be prevented, but on the contrary, it becomes difficult to uniformly disperse the filler and impregnate the base material.

【0004】本発明は、コンポジット積層板の芯材に高
粘度のワニスを用いるコンポジット積層板の製造方法、
及び、この製造方法に用いる樹脂シートの製造方法を提
供することを目的とするものである。
The present invention relates to a method for producing a composite laminate using a highly viscous varnish as a core material of the composite laminate,
It is also an object of the present invention to provide a method for producing a resin sheet used in this production method.

【0005】[0005]

【課題を解決するための手段】本発明は、ガラスチョッ
プドストランドを分散させた熱硬化性樹脂シート13を
芯材とし、その両側に表面材として織布を基材とするプ
リプレグ12を重ね、この表面材上に銅はく11を配し
て加熱加圧することを特徴とするコンポジット積層板の
製造方法である(図1参照)。
According to the present invention, a thermosetting resin sheet 13 in which glass chopped strands are dispersed is used as a core material, and a prepreg 12 having a woven fabric as a base material is superposed on both sides of the core material. This is a method for producing a composite laminate, which comprises arranging a copper foil 11 on a surface material and applying heat and pressure (see FIG. 1).

【0006】ガラスチョップドストランドを分散させた
熱硬化性樹脂シート13は、ガラスチョップドストラン
ド1を分散させた熱硬化性樹脂2をフィルム7上に塗布
し、加熱して熱硬化性樹脂をBステージまで硬化させる
ことによって製造される(図2参照)。
The thermosetting resin sheet 13 in which the glass chopped strands are dispersed is coated with the thermosetting resin 2 in which the glass chopped strands 1 are dispersed on the film 7 and heated to reach the B stage. It is manufactured by curing (see FIG. 2).

【0007】[0007]

【発明の実施の形態】ガラスチョップドストランドとし
ては、繊維径7〜12μm、カット長5〜15mmのも
のが適している。繊維径が12μmを超えると樹脂に分
散し難く、7μmより小さいと積層板としたときの電気
絶縁性が低下する。カット長が15mmを超えると繊維
同士が絡み合って同様に分散し難く、5mm未満では、
積層板成形時の樹脂流れが大きく板厚精度が悪くなる。
ガラスチョップドストランドの配合量は、熱硬化性樹脂
100部(重量部、以下同じ)に対して、10〜30部
とするのが好ましい。10部より少ないと、剛性が劣
り、30部を超えると分散し難い。
BEST MODE FOR CARRYING OUT THE INVENTION A glass chopped strand having a fiber diameter of 7 to 12 μm and a cut length of 5 to 15 mm is suitable. When the fiber diameter exceeds 12 μm, it is difficult to disperse in the resin, and when the fiber diameter is less than 7 μm, the electrical insulating property of a laminated plate is deteriorated. If the cut length exceeds 15 mm, the fibers are entangled with each other and it is difficult to similarly disperse. If the cut length is less than 5 mm,
The resin flow at the time of molding the laminated plate is large and the plate thickness accuracy is deteriorated.
The compounding amount of the glass chopped strands is preferably 10 to 30 parts with respect to 100 parts (parts by weight, the same applies hereinafter) of the thermosetting resin. If it is less than 10 parts, the rigidity is poor, and if it exceeds 30 parts, it is difficult to disperse.

【0008】フィラーとしては、従来公知のフィラーが
用いられる。配合量は、樹脂固形分に対して70〜15
0部とするのが好ましい。熱硬化性樹脂ワニスの粘度
は、フィラーを混合した状態で、1〜3Pa・sとなる
ように溶剤の配合量で調整する。
A conventionally known filler is used as the filler. The compounding amount is 70 to 15 with respect to the resin solid content.
It is preferably 0 part. The viscosity of the thermosetting resin varnish is adjusted by the compounding amount of the solvent so as to be 1 to 3 Pa · s in the state where the filler is mixed.

【0009】フィラーを混合した熱硬化性樹脂ワニス2
とガラスチョップドストランド1とを混練分散し、押出
し機3で連続走行するフィルム7の上に押出して塗布
し、次いで、溶剤による発泡がないように注意して加熱
し、樹脂をBステージまで硬化させる。加熱乾燥の条件
は、塗布量に応じ、特に、溶剤の揮発量に応じて温度及
び時間を調整する。コンポジット積層板の芯材厚みの樹
脂シートとなるように塗布するのが好ましいが、厚みが
大となると内部の溶剤が揮発し難くなるので、芯材厚み
より薄い樹脂シートを製造して何枚かを重ねるようにし
てもよい。乾燥炉は、低温の第1乾燥室4と高温の第2
乾燥室5を備えるようにするのが好ましい。第1乾燥室
で溶剤を除き、第2乾燥室で樹脂の硬化反応をBステー
ジまですすめる。乾燥室から出た樹脂シートを切断機6
で切断し、目的とする樹脂シート13を得る。
Thermosetting resin varnish 2 containing a filler
And the glass chopped strand 1 are kneaded and dispersed, and are extruded and applied onto the continuously running film 7 by the extruder 3. Then, the resin is hardened to the B stage while being careful to prevent foaming by the solvent. . The heating and drying conditions are such that the temperature and time are adjusted according to the coating amount, particularly according to the volatilization amount of the solvent. It is preferable to apply it so that it becomes a resin sheet with the core material thickness of the composite laminated board, but if the thickness is too large, it will be difficult for the internal solvent to evaporate, so some resin sheets thinner than the core material thickness should be manufactured. You may make it overlap. The drying oven has a low temperature first drying chamber 4 and a high temperature second drying chamber 4.
It is preferable to provide a drying chamber 5. The solvent is removed in the first drying chamber, and the curing reaction of the resin is advanced to the B stage in the second drying chamber. Cutting machine 6 for the resin sheet coming out of the drying room
Then, the desired resin sheet 13 is obtained.

【0010】[0010]

【実施例】エポキシ樹脂100部、水酸化アルミニウム
70部、タルク30部、繊維径10μm、カット長13
mmのガラスチョップドストランド12部に溶剤を加え
て混練りして粘度を1Pa・sとし、フィルム上に塗布
した。これを、150℃に保たれた長さ7mの第1乾燥
室、次いで、175℃に保たれた長さ8mの第2乾燥室
に、1.5m/minで送り、厚さ1.2mmの樹脂シ
ートを得た。この樹脂シートの両側に、厚さ0.2mm
のガラス織布を基材とするエポキシプリプレグを配し、
さらに、厚さ35μmの銅はくを配して、175℃、
2.5MPaで90分間加熱加圧して、厚さ1.6mm
のコンポジット積層板を得た。得られたコンポジット積
層板の外観には異常が認められず、また、厚みは、最大
1.53mm、最小1.46mm、偏差0.015mm
であった。常態、吸湿処理2時間後及び吸湿処理4時間
後に調べた耐熱性は、いずれも、ふくれやミーズリング
の発生がなかった。絶縁抵抗は、常態で5.0×1014
Ω、吸湿処理2時間後で5.7×1013Ω、吸湿処理4
時間後で5.2×1012Ωであった。
Example: Epoxy resin 100 parts, aluminum hydroxide 70 parts, talc 30 parts, fiber diameter 10 μm, cut length 13
A solvent was added to 12 parts of a glass chopped strand having a size of 8 mm and kneaded to have a viscosity of 1 Pa · s and applied onto a film. This was sent to a first drying chamber having a length of 7 m kept at 150 ° C. and then to a second drying chamber having a length of 8 m kept at 175 ° C. at a rate of 1.5 m / min and a thickness of 1.2 mm. A resin sheet was obtained. 0.2mm thick on both sides of this resin sheet
Place the epoxy prepreg based on the glass woven fabric of
Furthermore, arranging a 35 μm thick copper foil, 175 ° C.,
Heating and pressurizing at 2.5 MPa for 90 minutes, thickness 1.6 mm
A composite laminate of was obtained. No abnormality was found in the appearance of the obtained composite laminate, and the maximum thickness was 1.53 mm, the minimum was 1.46 mm, and the deviation was 0.015 mm.
Met. Regarding the heat resistance examined in the normal state, 2 hours after the moisture absorption treatment and 4 hours after the moisture absorption treatment, neither swelling nor measling occurred. Insulation resistance is 5.0 × 10 14 in normal state
Ω, moisture absorption treatment 2 hours later 5.7 × 10 13 Ω, moisture absorption treatment 4
After time, it was 5.2 × 10 12 Ω.

【0011】比較例 エポキシ樹脂100部、水酸化アルミニウム70部、タ
ルク30部に溶剤を加えたワニスを、厚さ0.2mmの
ガラス不織布に含浸乾燥してプリプレグを得た。このプ
リプレグ3枚を重ね、その両側に、厚さ0.2mmのガ
ラス織布を基材とするエポキシプリプレグを配し、さら
に、厚さ35μmの銅はくを配して、175℃、2.5
MPaで90分間加熱加圧して、厚さ1.6mmのコン
ポジット積層板を得た。得られたコンポジット積層板の
外観には異常が認められず、また、厚みは、最大1.5
1mm、最小1.42mm、偏差0.017mmであっ
た。常態、吸湿処理2時間後及び吸湿処理4時間後に調
べた耐熱性は、いずれも、ふくれやミーズリングの発生
がなかった。絶縁抵抗は、常態で6.0×1014Ω、吸
湿処理2時間後で8.0×1013Ω、吸湿処理4時間後
で8.7×1012Ωであった。
Comparative Example A prepreg was obtained by impregnating and drying a varnish obtained by adding a solvent to 100 parts of an epoxy resin, 70 parts of aluminum hydroxide and 30 parts of talc to a glass nonwoven fabric having a thickness of 0.2 mm. Three prepregs were superposed, epoxy prepregs having a thickness of 0.2 mm of glass woven fabric as a base material were arranged on both sides thereof, and copper foil having a thickness of 35 μm was further arranged at 175 ° C. and 2. 5
It was heated and pressed at 90 MPa for 90 minutes to obtain a composite laminate having a thickness of 1.6 mm. No abnormalities were found in the appearance of the obtained composite laminate, and the maximum thickness was 1.5.
It was 1 mm, the minimum was 1.42 mm, and the deviation was 0.017 mm. Regarding the heat resistance examined in the normal state, 2 hours after the moisture absorption treatment and 4 hours after the moisture absorption treatment, neither swelling nor measling occurred. The insulation resistance was 6.0 × 10 14 Ω in the normal state, 8.0 × 10 13 Ω after 2 hours of the moisture absorption treatment, and 8.7 × 10 12 Ω after 4 hours of the moisture absorption treatment.

【0012】[0012]

【発明の効果】本発明によれば、ガラスチョップドスト
ランドと熱硬化性樹脂とを混練することにより、高粘度
での処理が可能であり、熱硬化性樹脂に配合するフィラ
ーが沈降することもない。同時に、溶剤の使用量を少な
くできるので、経済的にも作業衛生上からも有益であ
る。
According to the present invention, by kneading the glass chopped strands and the thermosetting resin, it is possible to perform treatment with a high viscosity, and the filler compounded in the thermosetting resin does not sediment. . At the same time, the amount of solvent used can be reduced, which is economically and work hygiene beneficial.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例に関する、材料の構成を示す
断面図である。
FIG. 1 is a cross-sectional view showing a material structure according to an embodiment of the present invention.

【図2】樹脂シートの製造装置を説明する概略図であ
る。
FIG. 2 is a schematic view illustrating a resin sheet manufacturing apparatus.

【符号の説明】[Explanation of symbols]

1 ガラスチョップドストランド 2 熱硬化性樹脂 11 銅はく 12 織布を基材とするプリプレグ 13 熱硬化性樹脂シート 1 Glass Chopped Strand 2 Thermosetting Resin 11 Copper Foil 12 Prepreg Based on Woven Fabric 13 Thermosetting Resin Sheet

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 // B32B 27/04 B32B 27/04 Z ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 6 Identification number Office reference number FI technical display location // B32B 27/04 B32B 27/04 Z

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 ガラスチョップドストランドを分散させ
た熱硬化性樹脂シートを芯材とし、その両側に、表面材
として織布を基材とするプリプレグを重ね、この表面材
上に銅はくを配して加熱加圧することを特徴とするコン
ポジット積層板の製造方法。
1. A thermosetting resin sheet in which glass chopped strands are dispersed is used as a core material, and prepregs having a woven fabric as a surface material are laminated on both sides of the core material, and copper foil is arranged on the surface material. And a method of manufacturing a composite laminate, which comprises heating and pressing.
【請求項2】 ガラスチョップドストランドを分散させ
た熱硬化性樹脂をフィルム上に塗布し、加熱して熱硬化
性樹脂をBステージまで硬化させることを特徴とする熱
硬化性樹脂シートの製造方法。
2. A method for producing a thermosetting resin sheet, characterized in that a thermosetting resin having glass chopped strands dispersed therein is applied onto a film and heated to cure the thermosetting resin to the B stage.
JP25588395A 1995-10-03 1995-10-03 Manufacture of composite laminate and manufacture of thermosetting sheet Pending JPH0994915A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25588395A JPH0994915A (en) 1995-10-03 1995-10-03 Manufacture of composite laminate and manufacture of thermosetting sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25588395A JPH0994915A (en) 1995-10-03 1995-10-03 Manufacture of composite laminate and manufacture of thermosetting sheet

Publications (1)

Publication Number Publication Date
JPH0994915A true JPH0994915A (en) 1997-04-08

Family

ID=17284896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25588395A Pending JPH0994915A (en) 1995-10-03 1995-10-03 Manufacture of composite laminate and manufacture of thermosetting sheet

Country Status (1)

Country Link
JP (1) JPH0994915A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010111115A (en) * 2008-10-10 2010-05-20 Hitachi Chem Co Ltd Metal foil-clad laminate, double-sided metal foil-clad laminate, method of manufacturing the same, and printed wiring board
WO2024122586A1 (en) * 2022-12-07 2024-06-13 株式会社レゾナック Metal-clad laminated board, printed wiring board, and semiconductor package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010111115A (en) * 2008-10-10 2010-05-20 Hitachi Chem Co Ltd Metal foil-clad laminate, double-sided metal foil-clad laminate, method of manufacturing the same, and printed wiring board
WO2024122586A1 (en) * 2022-12-07 2024-06-13 株式会社レゾナック Metal-clad laminated board, printed wiring board, and semiconductor package

Similar Documents

Publication Publication Date Title
US4012267A (en) Process for producing pultruded clad composites
US4434023A (en) Method for producing plate heater
EP0792737A2 (en) Laminated board and process for production thereof
JPS626513B2 (en)
JPH0994915A (en) Manufacture of composite laminate and manufacture of thermosetting sheet
JPS63267524A (en) Method and apparatus for manufacturing metal clad laminated sheet
JPS6314825B2 (en)
JPS6189032A (en) Manufacture of laminate
KR20120078454A (en) Manufacturing method of prepreg
CN1424868A (en) Method for producing basalt fiber reinforced copper coated boards
JP2889474B2 (en) Composite laminate and method for producing the same
JP3347084B2 (en) Laminated plate and method of manufacturing the same
JPS6220882B2 (en)
JP3151402B2 (en) Prepreg for manufacturing metal foil-clad laminates
JP3129652B2 (en) Manufacturing method of laminated board
JP3207332B2 (en) Manufacturing method of laminated board
JPH0542648A (en) Method for continuously producing laminate and device therefor
JPH03167357A (en) Production of glass non-woven fabric for laminate and production of laminate
JPH06315998A (en) Production of laminated sheet
JPH0448330B2 (en)
JPS6312356B2 (en)
WO1999028126A1 (en) Prepreg for multilayer printed wiring boards and process for producing the same
JPH04101845A (en) Manufacture of laminated sheet
JPH093208A (en) Composite dielectric, printed wiring board and production of composite dielectric
JP4089089B2 (en) Laminate production method and laminate