JPH0992703A - Collet and transfer unit fixed with collet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To hold a product horizontally and to prevent the product from being shifted from the holding position at the time of transfer by forming a coating having high frictional coefficient to the sucking face of a collet for transferring an IC, while sucking, onto a processing stage. SOLUTION: The collet 1 comprises a three stage tube and a collet body 2 is formed at the thickest lower end part thereof. The thinnest upper end part serves as the fixing shaft 3 of the collet 1. The vacuum suction hole 4 in the collet 1 is enlarged at the part of the collet body 2. A coating 7 having high frictional coefficient is formed at the forward end of the collet body 2 thus forming a suction face 8. The coating 7 is formed by electrodepositing diamond particles having a grain size of 3 micron or #2000-3000 as thick as several mm. Consequently, the frictional coefficient of the coating 7 can be increased and an IC can be prevented from slipping on the suction face 8 even if its is transferred or turned while being sucked and the IC can be fed accurately to a predetermined position of the processing stage.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a collet, and more particularly to a cylindrical metal collet for vacuum-sucking a semiconductor device.

[0002]

2. Description of the Related Art Generally, as a tool for holding and transferring articles,
A cylindrical vacuum suction structure collet and a rubber suction pad are known. The cylindrical collet is used for bonding a semiconductor chip or mounting a semiconductor device. For example, a collet for holding a semiconductor chip is described in “Semiconductor Manufacturing Equipment Glossary” published by Nikkan Kogyo Shimbun, September 28, 1991, P215.

Rubber suction pads for holding semiconductor devices are also commercially available.

[0004]

DISCLOSURE OF THE INVENTION The present inventors
I have considered using a metal collet or rubber suction pad for the product pickup of an IC external dimension measuring machine that measures the external dimensions of semiconductor devices such as I and IC, but the following problems may occur. Do you get it.

The rubber suction pad has a strong suction force,
If you keep the package part of
If the portion of the package that is deviated from the center of gravity is held, the pad may be deformed and the semiconductor device may be tilted, which may prevent accurate transfer. Further, the rubber suction pad has a low conductivity of rubber and is charged, and an electrostatic breakdown accident may occur in the IC, which may damage the product. Further, the rubber suction pad is liable to deteriorate the rubber and shortens the life of the pad.

On the other hand, the metal collet can hold the IC horizontally because the collet does not deform even when a portion of the IC package deviated from the center of gravity of the package is vacuum-sucked. However, since the surface of the collet is made of metal and the coefficient of friction is small, when the arm that holds the collet is rotated, the IC slides sideways with respect to the metal collet, and the holding position shifts. As a result, there are cases where the IC cannot be accurately supplied to a predetermined position on the stage of the IC external dimension measuring machine.

It is an object of the present invention to provide a collet which can hold a product horizontally and which does not cause a shift in the product holding position during movement, and a transfer device to which the collet is attached.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0009]

The following is a brief description of an outline of typical inventions disclosed in the present application.

(1) An arm extending from the drive body and a collet made of a cylindrical metal attached to the tip of the arm, and driving the arm to produce a product (IC) on the supply stage. A transfer device for transferring the IC held in the collet onto a processing stage after vacuum holding the suction surface on the lower surface of the collet, and forming a film having a large friction coefficient on the suction surface of the collet. . The coating is a wear-resistant electrodeposition layer on which diamond particles are electrodeposited.

According to the means (1), since the collet (a) is made of a rigid body (metal), the product (I)
Even if the center of gravity of C) is deviated and the product is held by vacuum suction with a collet, the product will not tilt.

(B) Since the coating surface having a large friction coefficient is provided on the suction surface of the collet, when the arm is rotated or stopped, the IC does not slide sideways with respect to the collet, and the processing stage. The IC can be accurately supplied to the predetermined position.

(C) Since the coating provided on the suction surface of the collet is an electrodeposition layer of diamond particles having excellent wear resistance, the life of the collet is extended and the IC can be accurately measured over a long period of time. Can be supplied to the processing stage.

(D) Since the collet is made of metal and the coating provided on the attracting surface of the collet is also a conductor of diamond particles, the IC is not damaged by electrostatic breakdown.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

In all the drawings for describing the embodiments of the present invention, components having the same functions are denoted by the same reference numerals, and their repeated description will be omitted.

FIG. 1 is a perspective view showing a metal collet which is an embodiment of the present invention, and FIG. 2 shows a part of an IC external dimension measuring machine to which a metal collet which is an embodiment of the present invention is attached. Front view, FIG. 3 is a schematic plan view showing a part of the IC external dimension measuring machine of this embodiment, and FIG. 4 is an IC of this embodiment.
It is an enlarged view which shows a part of transfer apparatus of an external dimension measuring machine.

The collet 1, which is an embodiment of the present invention, is
As shown in FIG. 1, it has a cylindrical shape, for example, a cylindrical shape.
In the present embodiment, the collet 1 is a cylindrical body with three steps, and the thickest lower end portion forms the collet body 2. The thinnest upper end portion is the mounting shaft 3 of the collet 1. Further, the vacuum suction hole 4 inside the collet 1 is thick at the collet body 2 portion. The collet 1 is made of stainless steel, for example, and is a rigid body and a conductor.

At the tip (lower end) of the collet body 2,
The coating film 7 having a large friction coefficient is formed to form the adsorption surface 8. The coating 7 is an electrodeposition layer formed by electrodeposition of diamond particles, and has a thickness of, for example, several mm. The diameter of diamond particles is 3 μm (# 300
0) or # 2000 to # 3000 are used. As a result, the coefficient of friction of the coating film 7 becomes large unlike the conventional metal surface, and even if the collet is moved or rotated while the product is held by vacuum suction, the product remains on the suction surface 8 of the collet. No more skidding.

Next, an example in which the metal collet of the present embodiment is attached to the transfer device (pickup device) of the IC external dimension measuring machine will be described.

2 and 3 are schematic views showing the essential parts of the IC external dimension measuring machine, and the IC external dimension measuring section is omitted. The IC external dimension measuring machine has a structure in which a transfer device (pickup device) 11 is arranged at one corner of the machine base 10 and a processing stage 12 is provided in the center of the machine base 10.

The transfer device 11 has a drive main body 13 whose upper part can be controlled to move up and down, and an arm 1 extending from the drive main body 13.
4 and a collet 1 attached to the tip of the arm 14.

As shown in FIG. 4, the uppermost mounting shaft 3 of the collet 1 is inserted and fixed in the arm 14. The mounting shaft 3 protruding upward from the arm 14 meshes with the timing belt 15. The driven gear 16 is fixed.
The timing belt 15 is used for the drive motor 1
7 is in mesh with a drive gear 19 fixed to a rotary shaft 18. The drive motor 17 is disposed inside the drive body 13, and the tip of the rotary shaft 18 of the drive motor 17 is projected outside the drive body 13. The drive gear 19 is fixed to a portion of the rotary shaft 18 protruding outside the drive body 13.

As a result, by appropriately driving the drive motor 17, the collet 1 is rotated with respect to the arm 14 and the direction (orientation) of the product (IC) 20 vacuum suction-held on the suction surface 8 on the lower surface of the collet 1 is set. Can be modified to I
The C20 is composed of a rectangular package 21 formed of resin and a gull-wing type lead 22 protruding from the periphery of the package 21. The suction surface 8 of the collet 1 is brought into contact with the flat surface of the package 21, and holds the collet 1 by vacuum suction.

Further, as shown in FIG. 3, a supply stage 30 for supplying the IC 20 is arranged on one side of the machine base 10.

On the other hand, a pipe 31 connected to a vacuum suction system (not shown) is connected to the tip of the driving body 13 of the collet 1 fixed to the tip of the arm 14.
Therefore, by driving (turning on) a vacuum suction system (not shown), the suction surface 8 of the collet 1 is exposed to the IC.
20 can be held by vacuum suction. Further, when removing the IC 20 held by vacuum suction on the collet 1, the vacuum suction system may be turned off.

Such a transfer device 11 includes a drive body 13
IC2 on the supply stage 30 arranged on one side of the machine base 10 by the combination of the lifting operation and the rotating operation of the IC2.
0 is vacuum-held on the suction surface 8 on the lower surface of the collet 1,
Supply on the processing stage 12. At this time, the drive motor 17 is appropriately driven to control the rotation of the collet 1 and the directionality of the IC 20 supplied to the processing stage 12 can be corrected.

Therefore, the transfer device 1 according to the present embodiment
In the IC outside dimension measuring machine having
Since the IC 20 is accurately supplied to the predetermined position, the subsequent IC external dimension measurement can be performed accurately and efficiently.

The collet 1 and the transfer device 11 having the collet 1 of the present embodiment have the following effects.

(1) Even if the collet 1 is vacuum-sucked and held by the collet 1 at a portion deviated from the center of gravity of the IC 20 as a product, the collet 1 is formed of a metal body (rigid body), so that the collet 1 is deformed (bent). IC20 does not tilt and the IC2 is accurately placed at a predetermined position on the processing stage 12.
0 can be supplied.

(2) Since the suction surface 8 of the collet 1 is formed of the coating 7 having a large friction coefficient, when the arm 14 supporting the collet 1 is rotated or stopped, it is held by the collet 1. The IC 20 does not slide sideways with respect to the collet 1, and the IC 20 can be accurately supplied to the predetermined position of the processing stage 12.

(3) Since the coating film 7 provided on the adsorption surface 8 of the collet 1 is an electrodeposition layer of diamond particles having excellent wear resistance, the life of the collet 1 is long, and the collet 1 has a long life. IC20 accurately processes stage 12
Can be supplied to.

(4) Since the collet 1 is made of metal and the coating 7 provided on the attracting surface of the collet 1 is also a conductor of diamond particles, the IC 20 will not be damaged by electrostatic breakdown.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say, for example, in the above embodiment, the collet is made of stainless steel, but other metals such as iron and aluminum may be used as long as diamond particles can be electrodeposited. Further, the collet may be made of ceramic or the like to be a rigid body. In this case, a conductor paste may be printed and fired on the surface of the collet so that the diamond particles can be electrodeposited and the electrostatic breakdown of the IC can be prevented.

Further, in the above embodiment, the particle size of diamond particles is set to # 2000 to # 3000, but it is appropriately selected depending on the surface roughness of the product to be vacuum suction-held so that the vacuum suction-holding can be always performed. Just do it. As a result, highly reliable handling becomes possible.

FIG. 5 is a front view showing a part of a transfer device according to another embodiment of the present invention. In this embodiment, a plurality of collets 1 are arranged on the arm 14 so that a product 20 having a large surface area or a product 20 having a large weight is vacuum-sucked and held. Also in this embodiment, since the attracting surface of the collet 1 is formed of the coating 7 having a large friction coefficient, when the arm 14 is rotated or stopped, the product 20 held by the collet 1 is transferred to the collet 1. The product 20 can be accurately supplied to a predetermined position without slipping on the side.

In the above description, the case where the invention made by the present inventor is mainly applied to the IC external dimension measuring machine which is the field of application which is the background of the invention has been described, but the invention is not limited to this. INDUSTRIAL APPLICABILITY The present invention can be applied to various devices equipped with at least a cylindrical collet for vacuum-sucking a product.

[0038]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

(1) Since the collet is made of metal, the IC does not tilt even if the collet is vacuum sucked and held outside the center of gravity of the IC.

(2) Since the coating surface having a large friction coefficient is provided on the suction surface of the collet, when the arm is rotated or stopped, the IC does not slide sideways with respect to the collet, and the processing stage The IC can be accurately supplied to the predetermined position.

[Brief description of drawings]

FIG. 1 is a perspective view showing a metal collet according to an embodiment of the present invention.

FIG. 2 is a front view showing a part of the IC external dimension measuring machine to which the metal collet according to the embodiment of the present invention is attached.

FIG. 3 is a schematic plan view showing a part of the IC outside dimension measuring machine of the present embodiment.

FIG. 4 is an enlarged view showing a part of a transfer device of the IC external dimension measuring machine according to the present embodiment.

FIG. 5 is a front view showing a part of a transfer device according to another embodiment of the present invention.

[Explanation of symbols]

1 ... Collet, 2 ... Collet body, 3 ... Mounting shaft, 4 ... Vacuum suction hole, 7 ... Coating, 8 ... Suction surface, 10 ... Machine stand, 11 ...
Transfer device, 12 ... Processing stage, 13 ... Driving body, 14
... arm, 15 ... timing belt, 16 ... driven gear,
17 ... Drive motor, 18 ... Rotation shaft, 19 ... Drive gear, 20 ... Product (IC), 21 ... Package, 22 ... Lead, 30 ... Supply stage, 31 ... Pipe.

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Kaoru Usami 64 Naganuma Tennuma, Tenno-cho, Minami-Akita-gun, Akita Prefecture Akita Denshi Co., Ltd. In OSE

Claims (5)

[Claims] 1. A collet comprising a cylindrical rigid body having a suction surface for holding a product by vacuum suction, wherein a coating having a large friction coefficient is formed on the suction surface of the collet. 2. The collet according to claim 1, wherein the coating contains diamond particles. 3. The collet according to claim 1, wherein the collet is made of a conductor, and the coating film is an electrodeposition layer formed by electrodeposition. 4. An arm extending from a drive body, and a collet made of a cylindrical rigid body attached to the tip of the arm. The arm is driven to move the product on the supply stage to the lower surface of the collet. A transfer device for transferring a product held in a collet onto a processing stage after vacuum suction and holding on the suction surface, wherein a film having a large friction coefficient is formed on the suction surface of the collet. Transfer device. 5. The transfer device according to claim 4, wherein the collet is made of a conductor, and the coating is a wear-resistant electrodeposition layer on which diamond particles are electrodeposited.